KR100726414B1 - A combi-card and method for making the same - Google Patents

Abstract

The present invention relates to the manufacture of a combination IC card that can be used in contact or contactless, and more specifically formed in the penetrating portion of the COB terminal position of the chip on board (hereinafter referred to as "COB") formed grooves Pre-process the antenna coil insertion layer with the connection contact with the antenna coil using a heating head, etc., and then fold it and punch it at the position of the COB. The lower printed layer and lower protective layer are formed to suit the thickness control layer formed with the COB chip position penetrating portion, so that the structural characteristics improve durability, and the COB is impregnated into the card body, thereby providing a structural effect between the card body and the COB. Maintains excellent adhesion according to shape, and depends on bending and torsion or deterioration of adhesive material Even if the weakening of the adhesion occurs relates to the combination of card and a method characterized in that the excellent electrical conductivity between the antenna coil terminal and the terminal holding COB.

In the present invention, the COB assembly template 200 has a pin bar 210 with a rounded end, in which the COB 110 and the antenna coil insertion layer 30 are bonded in position. A COB insertion groove 220 in the form of a COB 110 is formed on a multi-sided part, and a punched COB 110 pretreated with a hot-melt adhesive 112 is placed in the COB insertion groove 220, and a pin bar 210 is installed. And assembling the antenna coil insertion layer 30 in-situ using < RTI ID = 0.0 >) and then < / RTI > bonding the COB 110 and the antenna coil insertion layer 30 in-situ using a thermal head. It is.

Combi card, insert groove, recess groove, COB, lamination, direct bonding

Description

Combi card and its manufacturing method {A combi-card and method for making the same}             

1 is a process chart showing a conventional combination card manufacturing process.

2 is a plan view schematically showing another example of a conventional combination card.

Figure 3 is a cross-sectional view showing a separate groove and COB formed in the card body to explain another example of a conventional combination card.

Figure 4 is a plan view showing the form of each configuration sheet required to manufacture a combination card according to the present invention.

5 is a plan view showing a combination card according to the present invention.

6 is a cross-sectional view showing a COB applied to a conventional combination card.

Figure 7 is a cross-sectional view showing a COB formed groove portion according to the present invention.

8 is a cross-sectional view for explaining the method of assembling the card in the present invention.

Figure 9 is a cross-sectional view of the combination card made through the COB 100 and the combination card manufacturing process in which the recess 102 is formed in accordance with the present invention.

10 is a plan view of one embodiment for a COB assembly mold according to the present invention.

Figure 11 is a cross-sectional view of one embodiment for a COB assembly template according to the present invention.

12 is a cross-sectional view of another embodiment of a COB assembly template according to the present invention.

13 is a plan view of another embodiment of a COB assembly die according to the present invention;

[Explanation of symbols on the main parts of the drawings]

10: lower protective layer 20: lower printed layer

30: antenna coil insertion layer 31: antenna coil

32: antenna coil terminal 33: COB dam position through portion of the antenna coil insertion layer

34: junction of antenna coil terminal and COB

35: thickness control layer 37: COB dam position through portion of the thickness control layer

40: upper printed layer 42: COB position penetrating portion of the upper printed layer

50: upper protective layer 52: COB position through portion of the upper protective layer

53: card connection reinforcement 70: card body

72: groove formed in the card body

100: COB 101: COB external terminal

102: groove portion formed in the COB 103: COB base layer

104: COB terminal 106: Dam formed in COB

108: conductive adhesive 110: general COB

112: Hot-Melt Adhesive with COB 114: Conductive Tape

200: COB assembly template 210: pin bar

220: COB insertion groove

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of a combined IC card which can be used as a contact or non-contact type. More specifically, a COB terminal of a chip on board (hereinafter referred to as "COB") having a recess is formed. The antenna coil insertion layer having the connection contact with the antenna coil formed in the penetrating portion of the position is pre-processed and grafted using a heating head or the like, and then punched at the position of the COB, and the upper print layer and the upper protective layer having the penetrating portion formed on the COB By laminating accordingly, the thickness control layer with the COB chip position penetrating part is appropriately aligned, and the lower printing layer and the lower protective layer are formed to improve the durability due to its structural characteristics, and have the same effect as the COB is impregnated into the card body. Maintains excellent adhesion according to the structural shape between the body and the COB, and can bend, twist or bond The present invention relates to a combination card and a method of manufacturing the same, wherein excellent electrical conductivity is maintained between the antenna coil terminal and the COB terminal even when a weakening of the adhesive force occurs due to a decrease in function.

Commonly used card types include a contact IC card (integrated circuit card) that transmits and receives data through contacts exposed on the surface, and a contactless RF card that transmits and receives data wirelessly using an internal antenna coil. -contact card).

Currently, a combination card that can be both contact and contactless is required due to its ease of use and compatibility. The combination card is equipped with both a contact IC card contact and an antenna coil of a contactless RF card. .

In general, a combination card is a card made of synthetic resin sheets such as polyvinylchloride (PVC), polycarbonate (PC), and glycol modified polyethylene terephthalate (PETG). The layer and the card upper protective layer are sequentially stacked from the bottom to the top.

1 shows a conventional combination card manufacturing process.

Referring to the conventional combination card manufacturing method with reference to this, first, the antenna coil 31 is wound around the edge of the antenna coil insertion layer 30, and a part of the contact 32 is formed to be connected to the antenna coil.

Then, each card lower protective layer 10, the lower printed layer 20, the antenna coil insertion layer 30, the upper printed layer 40 and the card upper protective layer 50 are sequentially stacked, and then one Pressed to form a laminated plate of the pressurized heat and pressure is applied by compressing and punching to configure the card body (70).

Then, a recess 72 is formed in a portion of the card body 70 where the contact 32 of the antenna coil 31 is located, and the contact of the antenna coil 31 exposed into the recess 72 is formed. After applying the viscous conductive adhesive 108 to 32, a rectangular COB 110 on which the IC chip and the IC terminal are mounted is inserted into the recess 72.

Then, the hot-melt adhesive 112 and the card main body 70 are bonded to the COB 110 by applying heat and pressure on the COB 110, and at the same time, by curing the conductive adhesive 108, the antenna coil ( When the contact 32 of 31 and the terminal 104 of the COB 110 are connected so as to be electrically connected, one combination card is completed.

FIG. 2 is a plan view showing the recess 72 formed in the card body 70 and the COB 110 adhered thereto by the above process.

3 is a cross-sectional view showing the bonding of the COB 110 and the card body 70 bonded by the above process.

Combi card manufactured in this manner is a hot-Melt adhesive 112 and the antenna coil contacts used to bond the elongation and elastic modulus of the card material and the card body 70 and COB 110 when bending or torsion is applied The cracks are generated at the adhesive part of the conductive adhesive 108 due to the difference in physical properties between the 32 and the conductive adhesive 108 that makes the electrical connection between the COB terminal 104 and the COB terminal 104. There was a problem in that contact failure occurred between the antenna coil terminals 32.

This is a problem that occurs in the structure of the conventional combination card manufacturing process antenna terminal 32 impregnated in the card body 70 is affected by physical properties such as elongation and elastic modulus of the card body 70, COB terminal 104 ) Is affected by the physical properties of the base layer 103 constituting the COB (110), so that the degradation of the function due to aging and fatigue of the hot-melt adhesive 112 and the conductive adhesive 108 connecting the two layers As a result, many defects are currently occurring.

In order to solve the above problems, Korean Patent Registration No. 10-385660 (registered on May 16, 2003) has a large structure that can be impregnated into the card body on the outside of IC chip module, and a suitable laminated sheet is installed therein. A method of manufacturing a combination card is disclosed.

However, in the above invention, the impregnation of the IC chip module into the card body is effective, but the structure of the IC chip module requires special design and manufacture of the IC chip module and all the equipment related to the IC chip module. In addition, the IC chip module is not attached to the adhesive could not solve the problem in various durability and there was a problem that the production cost increases.

Therefore, the present invention overcomes the problems shown in the conventional combination card manufacturing process described above, and provides a manufacturing process according to the design structure of the IC chip module while increasing the reliability of the card product market due to various defects and poor durability, cheap and reliable The purpose is to provide this added combination IC card.

Combi card according to the present invention for achieving the above object is shown an example of another way to bond the COB 100 to the card body 70 as shown in FIG.

First, looking at each layer constituting the card body 70 as follows.

There is an upper protective layer 50 having a through portion 52 for structural coupling with the COB 100 having the recess 102 formed on the uppermost layer, and then an upper printed layer having the through portion 42 formed thereon. There is 40).                         

Pretreatment of the COB 100 having the recess 102 and the guiding coil insertion layer 30 having the antenna coil 31 with the dam 106 formed therethrough 32 formed therein into the COB After adhering with the hot-melt adhesive 112, the upper protective layer 50 and the upper printed layer 40 are laminated in accordance with the recess 102 of the COB 100, and the COB chip position penetrating portion ( 37 is suitably fitted to the formed antenna coil thickness control layer 35 and consists of a lower printed layer 20 and a lower protective layer 10.

In addition, each lamination sheet is fixed by adhesive bonding with heat, etc. using a tool so as not to shake, and then the lamination is made and integrated by appropriate heat and pressure, and then punched in place to complete the combi card.

A plan view of a card made in this manner is shown in FIG.

This combination card is characterized in that the recess 102 of the COB 100 is impregnated in the upper protective layer 50 of the card body (70).

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The same components as in the prior art will be described using the same names and symbols as in the prior art.

The first element constituting the combination card in the present invention is the production of a specially designed COB 100, the figure is characterized by the formation of the groove portion 102 as shown in FIG.

The picture of the general COB 110 is shown in FIG. 6, but there is no difference in content, but the difference between whether the recess 102 is formed in appearance, but the recess 102 is simply the center of the general COB 110 manufacturing process. The recess 102 is designed to form a COB 100 having a special structure.

FIG. 8 illustrates the position of the dam 106 formed in the COD of the COB 100 in which the recess 102 is formed according to the position of the COB dam position penetrating portion 33 of the antenna coil insertion layer 30. After bonding using a thermal head, etc., the COB 100 is fixed to the antenna insertion coil layer 30 with the hot-melt adhesive 112 pretreated on the COB, and then the COB terminal 104 and the antenna coil insertion layer 30 A cross-sectional view of a structure in which the COB 100 and the antenna coil insertion layer 30 of the combination card are formed in which a structural junction is formed so that the antenna coil terminal 32 is directly bonded 34 to maintain maximum electrical conductivity from physical shock.

9 is a cross-sectional view of the combination card made through the COB 100 and the combination card manufacturing process in which the groove portion 102 according to the present invention.

As shown in FIG. 8, in the state where the COB 100 having the recess 102 formed therein and the antenna coil terminal 32 of the antenna coil insertion layer 30 are bonded to the COB terminal, the conductive tape 114 is attached to the junction 34. After finishing the process with no gap, the upper printing layer 40 having the COB position penetrating portion 42 and the upper protective layer 50 having the COB position penetrating portion 52 formed thereon, and the COB dam below The thickness adjusting layer 35 having the position penetrating portion 37, the lower printed layer 20, and the lower protective layer 10 are assembled and laminated to form a combination card.

The COB position penetrating portion 52 and the recess 10 may be connected to the reinforcement portion 53 is formed in the I-shape as shown in Figure 4 to provide the most stable state, but I-shaped as well as geometrically diverse It can form.

The COB position penetrating portion 52 is formed integrally with the upper protective layer 50 to improve the strength.

The card body 70 applied to the combination card includes upper and lower printed layers 40 and 20, an antenna coil insertion layer 30 in which the antenna coil 31 is positioned, and upper and lower protective layers 50 and 10. It consists of synthetic resin sheets such as polyvinylchloride (PC), polycarbonate (PC), glycol modified polyethylene terephthalate (PETG), polyethylene terephthalate (PET), and acrylonitrile butadiene styrene (ABS).

In the present invention, the groove 102 formed in the COB 100 has a width of 1 mm to 5.5 mm and a depth of 20 μm to 80 μm, so that the COB position penetrating portion of the upper protective layer 50 is formed. The film formed on the 52 wraps around the outside of the recess 102 formed in the COB 100 to improve durability due to its structural characteristics, and exhibits the same effect as the COB 100 is impregnated into the card body 70. It maintains excellent adhesion between the card body 70 and the COB 100 according to the structural shape, and the antenna coil terminal 32 and the COB terminal 104 are reduced even if the adhesion is weakened due to bending and twisting or deterioration of the adhesive material. It is characterized in that excellent electrical conductivity is maintained between.

The COB dam position penetrating portion 33 of the antenna coil insertion layer 30 suitably formed with the position of the dam 106 of the COB 100 in which the recess 102 is formed, and then the COB is bonded to the thermal head. The antenna coil terminal 32 of the COB terminal 104 and the antenna coil insertion layer 30 after the 100 is fixed to the COB 100 by the hot-melt adhesive 112 pretreated to the COB 100 in the antenna coil insertion layer 30. Direct bonding (34) to maintain maximum electrical conductivity from physical shocks. Ultrasonic bonding, soldering, diffusion bonding, hot press bonding or heat of 10-75KHz Thermo-compression bonding.

In addition, the pin bar 210 having a rounded end on the COB assembly template 200, which is a metal template, for the in-situ bonding between the COB 100 and the antenna coil insertion layer 30 having the recess 102 formed therein, has a diameter of 0.2. 5 mm to 5 mm in height and 0.2 mm to 5 mm in height), and a COB insert groove 220 having a COB shape is formed at a depth of 160 μm to 230 μm at the bottom of the template to fix the COB 100 to the recess. After inserting the position, the dam position penetrating portion 33 of the antenna coil insertion layer 30 is aligned using the pin bar 210 so as to be aligned, and then the COB 100 is inserted into the antenna coil insertion layer 30 through a predetermined heat and pressure. ).

The COB terminal 104 and the antenna coil terminal 32 of the antenna coil insertion layer are subjected to ultrasonic bonding, soldering, diffusion bonding, hot press bonding, or thermocompression bonding at 10 to 75 KHz. It is directly bonded by the method such as (Thermo-compression bonding), and the conductive tape 114 and the thermoplastic elastomer or UV (ultraviolet) resin are applied to protect the adhesive part from the external environment such as corrosion and to fill the gap. Low styrene-butadiene copolymer (SBR), PE (Polyethylene), PP (Polypropylene), polyester, polyurethane, etc., UV resin is epoxy acrylate, urethane acrylate, polyester acrylate, unsaturated Polyester acrylate and the like.

In addition, the terminal 104 of the COB 100 in which the recess 102 is formed after the COB 100 is temporarily fixed by being welded to the COB 100 with the hot-melt adhesive 112 pretreated with the COB 100 in the antenna coil insertion layer 30. ) And the antenna coil terminal 32 of the antenna coil insertion layer 30, and in the bonded state, the upper printed layer 40 and the upper protective layer 50 in the upper layer of the COB 100 After matching the thickness control layer 35, the lower printed layer 20, and the lower protective layer 10 suitable for the thickness of the dam 106, the static electricity is removed and adhered so as not to move between the laminated sheets, and then adhesively bonded with a soldering iron or the like. After each layer is welded, it is interposed between the mirror plates to form a laminate in a laminator under a heat of 150 ° C. to 180 ° C. and a pressure of 5 to 15 kg / cm 2.

Then, by punching in place so that the position of each contact point of the external terminal 101 of the COB 100 is in the position specified by ISO7816-2 (KSX6507-2; dimensions and position of the contact point) in the punching machine, it is excellent in durability and excellent in current conduction. Combi card is manufactured.

As described above, the combination card according to the present invention is not only has excellent adhesion between the card body and the COB due to the durability is improved because the adhesion is made in the state COB is impregnated in the card body, as well as bending or twisting or Even if various deformations such as physical property changes occur, there is an effect of maintaining excellent electrical conductivity.

Claims (10)

In the combination card in which a plurality of sheets constituting the card body 70 are laminated and bonded so that the COB 100 and the antenna coil terminal 32 of the antenna coil insertion layer 30 are energized, A recess 102 is formed in a portion of the COB outer terminal 101, and the COB 100 is inserted into the COB position penetrating portion 52 of the upper protective layer 50 through the recess 102. Combi card, characterized in that a plurality of sheets are laminated in a prefabricated manner, the COB 100 is integrally impregnated in the card body (70). The combination card according to claim 1, wherein the concave portion (102) formed in the COB (100) has an I shape. The upper and lower printed layers 40 and 20, the antenna coil insertion layer 30 in which the antenna coil 31 is positioned, and the upper and lower protective layers 50 and 10, respectively. A combination card comprising a synthetic resin sheet such as PVC (Polyvinylchloride), PC (Polycarbonate), PETG (Glycol modified Polyethylene Terephthalate), PET (Polyethylene Terephthalate), ABS (Acrylonitrile Butadiene Styrene). The combination card according to claim 1, wherein the COB position penetrating portion (52) of the upper protective layer (50) is punched out to be uneven. The combination card according to claim 1, wherein the COB position penetrating portion (52) is integrally connected with the upper protective layer (50). The combination card according to claim 1, wherein the groove portion (102) has a width of between 1 mm and 5.5 mm and a depth of between 20 m and 80 m. The COB assembly template 200 has a rounded pin bar 210 in the end position bonding between the COB 110 and the antenna coil insertion layer 30, and the COB 110 at the bottom of the COB assembly template 200. A multi-sided portion of the COB insertion groove 220 is formed, and the punched COB 110 pre-treated with the hot-melt adhesive 112 is placed in the COB insertion groove 220, and the pin bar 210 is installed. Fabrication of the combination card, comprising the step of assembling the antenna coil insertion layer 30 in place and then in-situ bonding the COB 110 and the antenna coil insertion layer 30 using a column head or the like. Way. 8. The antenna coil terminal 32 of the COB terminal 104 and the antenna coil insertion layer 30 is directly bonded after the end of the in-situ bonding between the COB 100 and the antenna coil insertion layer 30. Method of manufacturing a combination card characterized in that it comprises a step of preventing the deformation of the junction portion when the thermal compression by closing the conductive tape 114 to match the shape of the junction portion 34 The method of claim 7, wherein the bonding bonding is fixed to the bonding sheet of the upper protective layer 50, the upper printed layer 40 and the COB 110 and the antenna coil insertion layer 30 using the pin bar 210, and the lower A method of manufacturing a combination card, comprising a step of adhering the printing layer (20) and the lower protective layer (10) on a template so as not to move sequentially. According to claim 7, COB assembly mold 200 has a diameter (Ø) of the pin bar 210 has a value of 0.2mm to 5mm, the height is 0.2mm to 5mm, COB insertion groove 220 is 160㎛ ~ 230 Process for producing a combination card, characterized in that molded to a depth of ㎛.

Images