KR100679285B1 - A Prefabricated Combi-card and method for making the same - Google Patents

Abstract

The present invention relates to a combination IC card manufacture that can be used in contact or contactless,

More specifically, in the fabrication of the prefabricated combi card, the hot melt tape 111 improves the adhesion between the COB 100 and the card body 70 and the antenna coil conductive fiber terminal 33 and the COB 100 terminal 104 of the inlay layer. ) And each laminated sheet punched into a suitable shape.

The structure of the inlay layer of the combination IC card is that the antenna terminal 33 is formed of conductive fibers, and the terminal 33 and the COB 100 terminal 104 are electrically conductive by the conductive adhesive 108. In accordance with the present invention, the durability of the hot-melt tape 111 is improved according to the improvement of the adhesive strength of the prefabricated combi card, and the excellent adhesiveness between the card body 70 and the COB 100 is maintained and the terminal-to-terminal conduction is maintained, as well as bending. Even if various deformations such as twisting or torsion occur, there is an effect of maintaining excellent electrical conductivity.

Assembly Card, Conductive Adhesive, COB, Lamination, Direct Bonding, Conductive Fiber, Hot-melt Tape

Description

Prefabricated Combi-card and method for making the same             

1 is a process chart showing a conventional combination card manufacturing process,

Figure 2 is a plan view showing the form of each component sheet required to manufacture a prefabricated combination card according to the present invention

Figure 3 is a plan view showing the form of manufacturing the combination card in a laminated configuration of the prefabricated combination card according to the present invention

Figure 4 is a plan view showing a prefabricated combination card according to the present invention

5 is a cross-sectional view showing a COB applied to the combination card

6 is a cross-sectional view showing a state in which the COB and the hot melt tape is bonded according to the present invention

7 is a cross-sectional view illustrating a state in which the conductive adhesive is pretreated to the COB to which the hot melt tape of FIG. 5 is bonded in the present invention.

Figure 8 is a cross-sectional view of one embodiment for the bonding of the COB and the antenna coil insertion layer according to the present invention

Figure 9 is a cross-sectional view of one embodiment for the laminated assembly of COB and each sheet layer according to the present invention

10 is a plan view of another embodiment of a COB assembly frame according to the present invention;

11 is a cross-sectional view of another embodiment of a COB assembly frame according to the present invention;

12 is a cross-sectional view of another embodiment of a COB assembly frame according to the present invention;

13 is a plan view of another embodiment for a COB assembly frame according to the present invention;

[Explanation of symbols on the main parts of the drawings]

10: lower protective layer 20: lower printed layer

30: antenna coil insertion layer 31: antenna coil

32: position through part 33: antenna terminal (conductive fiber)

34: antenna terminal (coil) 35: thickness control layer

37: COB dam position penetrating portion 40: upper printing layer

42: COB position penetrating portion of the upper printing layer

50: upper protective layer 52: COB position penetrating portion of the upper protective layer

70: card body 72: groove formed on the card body

100: COB 101: COB external terminal

103: COB base layer 104: COB terminal

108: conductive adhesive 111: hot melt tape

210: pin bar 220: insertion groove

The present invention relates to a combination IC card manufacture that can be used in contact or contactless,

More specifically, the COB to which the antenna terminal is formed and the COB to which the hot-melt tape is added are pretreated by using a heating head or the like to attach the COB to the antenna coil insertion layer, and then punch to fit the COB. The present invention relates to a prefabricated combi card and a method for manufacturing the combi card by stacking the upper printed sheet and the protective film and the lower printed sheet and the lower protective film.

That is, in the present invention, the COB terminal 104 to which the hot melt tape 111 is attached is treated with the conductive adhesive 108 and connected to the inlay layer 30 having the dam position penetrating portion 32 formed therein as the conductive fiber terminal of the antenna coil. The antenna coil insertion layer 30 having the antenna terminal 33 as a contact is pre-processed and bonded using a heating head or the like, and then punched at the position of the COB to form the upper printed layer 40 and the upper protective layer 50 formed therethrough. ) Is laminated in accordance with the COB, and the bottom of the thickness control layer 35 having the COB dam position penetrating portion 37 is suitably aligned, and the lower printed layer 20 and the lower protective layer 10 are laminated and assembled. Thermal bonding at 180 ° C and proper pressure 5Kg / ㎠ ~ 25Kg / ㎠ at a proper temperature to form a laminate and punching to complete the card to maintain excellent adhesion to hot-melt tape Glue bucket is excellent It relates to a prefabricated combination card and its manufacturing method characterized in that the malleability is maintained.

Commonly used smart card types include a contact IC card (integrated circuit card) that transmits and receives data through contacts exposed on the surface, and a contactless RF card that transmits and receives data wirelessly using a built-in antenna coil. There is a non-contact card.

Currently, a combination card that can be both contact and contactless is required due to its ease of use and compatibility. The combination card is equipped with both a contact IC card contact and an antenna coil of a contactless RF card. .

In general, the combination card is a card made of transparent or opaque synthetic resin sheets such as PVC, ABS, PC, PETG, PET, and the lower protective layer, the lower printed layer, the antenna coil insertion layer in which the antenna coil is placed, the upper printed layer, and the upper card protection. The layers have a structure in which they are sequentially stacked from bottom to top.

1 shows a conventional combination card manufacturing process.

Referring to the conventional combination card manufacturing method with reference to this, first, the antenna coil 31 is wound around the edge of the antenna coil insertion layer 30, and a portion of the antenna coil terminal 34 connected to the antenna coil is formed. .

Then, each card lower protective layer 10, lower printed layer 20, the antenna coil insertion layer 30, the upper printed layer 40 and the card upper protective layer 50 are sequentially stacked, and then one Pressed to form a laminated plate of the pressurized heat and pressure is applied by compressing and punching to configure the card body (70).

Then, the groove portion 72 is formed in the portion of the card body 70 where the terminal of the antenna coil 31 is located, and the antenna coil terminal 34 of the antenna coil 31 exposed into the groove portion 72. After applying the viscous conductive adhesive 108), the rectangular COB 100 having the IC chip and the IC terminal mounted thereon is inserted into the recess 72.

Then, by applying heat and pressure on the COB 100, the hot melt tape 111 and the card body 70 treated on the COB 100 are bonded for a short time, and at the same time, the antenna coil (by curing the conductive adhesive 108). When the terminal 34 of 31 and the terminal 104 of the COB 100 are connected to be electrically connected, one combination card is completed.

However, in the combination card manufactured in this manner, when bending or torsion is applied, elongation and elastic modulus of the card material and the adhesion of the hot melt tape 111 used to bond the card body 70 and the COB 100 are short-lived. As a result, the adhesive force is insufficient and the antenna coil terminal 34 is impregnated in the card body 70 so that the adhesive function of the conductive adhesive 108 is weakened or the breakage at the adhesive surface is weak. As a crack occurred at the adhesive site, a contact failure occurred between the terminal 104 of the COB and the antenna coil terminal 34 of the card body 70.

This is a problem occurring in the structure of the conventional combination card manufacturing process, the antenna coil terminal 34 impregnated in the card body 70 is affected by physical properties such as elongation and elastic modulus of the card body 70, and the COB terminal ( 104 is affected by the physical properties of the base layer 103 constituting the COB 100, and due to the lack of adhesion of the hot melt tape 111 connecting the two layers and aging and fatigue of the conductive adhesive 108 Due to the deterioration of the function, many defects are currently occurring.

In order to solve the above problems, Korean Patent Publication No. 10-385660 (registered on May 16, 2003) is designed to have a large structure that can be impregnated into the card body on the outside of IC chip module, and a suitable laminated sheet is formed thereon. A method of manufacturing a card is disclosed.

In the above invention, the impregnation of the IC chip module to the card body is effective, but the structure of the IC chip module requires special design and manufacture of the IC chip module and all the equipment related to the IC chip module. In addition, the IC chip module is not attached to the adhesive could not solve the problem in various durability and there was a problem that the production cost increases.

Therefore, the present invention overcomes the problems shown in the conventional combination card manufacturing process described above, and provides a simple manufacturing process while increasing the reliability of the card product market due to various defects and poor durability prefabricated combination type IC The purpose is to provide the card.

Prefabricated combination card according to the present invention for achieving the above object is shown an example of another way to bond the COB to the card body as shown in FIG.

First, looking at each layer constituting the card body as follows.

There is an upper protective layer with a penetrating portion at the top, followed by an upper printed layer with a penetrating portion.

Antenna coil insertion layer capable of RF function is bonded by COB and hot melt tape and the bonding method is as follows.

Pretreat the hot melt tape to the COB using a heating head, etc., and then weld it. Then, place the hot melt tape on the COB insertion groove of the COB assembly mold of FIG. 10 so that the hot melt tape rises up, and then add a conductive adhesive to the COB terminal. After matching the antenna coil insertion layer formed in the dam position penetrating portion formed in the pressure and heat is bonded.

In this case, the antenna coil insertion layer terminal may have a conductive fiber terminal 33 capable of slight movement to add reliability.

Underneath, the antenna coil thickness adjusting layer 35 having the COB chip position penetrating portion 37 is suitably fitted, and is composed of a lower printed layer 20 and a lower protective layer 10.

In order to prevent each lamination sheet from shaking and moving with a tool, it is fixed by bonding with heat, etc., and then laminated with a proper heat and pressure to make a unit, and then punched in place to complete the combination card.

A plan view of a card made in this manner is shown in FIG.

This combination card is characterized by producing a combination card by a prefabricated method in which the bonding between the COB and the antenna coil insertion layer is made by hot melt tape and the electrical conductivity is maintained by the conductive adhesive 108.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Here, the same components as in the prior art will be described using the same names and symbols as in the prior art.

FIG. 5 is a cross-sectional view of a general COB 100. In the present invention, the hot melt tape 111 is welded to the COB 100 using a heating head or the like as shown in FIG. After the conductive adhesive 108 is added to the terminal 104 of the 100 through a syringe, the hot melt tape 111 and the conductive adhesive 108 in the COB insertion groove 220 of the COB assembly frame 200 shown in FIG. 10. After placing it in the up position, as shown in the cross-sectional view of FIG. 8, the insertion layer 30 of the antenna coil 31 having the penetrating portion 32 formed in the dam 106 formed on the COB 100 is matched, and then pressure and heat are applied. In addition, the COB is bonded to the antenna coil insertion layer.

At this time, the antenna terminal 33 of the insertion layer 30 of the antenna coil 31 may add electrical conductivity by using a coil, a conductive fiber terminal, a metal foil, and the like, and all may be applied, but the conductive fiber terminal may be the most reliable part. Excellent.

Conductivity is added to the antenna terminal 33 of the antenna coil insertion layer 30 by conductive fiber terminals, and the shape of the terminal is Φ 2 mm to 5 mm in a circular or horizontal length of 2 mm to 4 mm and a length of 2 mm. It consists of geometric shapes, such as a square of -4 mm.

And underneath, as shown in the cross-sectional view of FIG. 9, the antenna coil thickness control layer 35, the lower printed layer 20, and the lower protective layer 10, in which the COB chip position penetrating portion 37 is formed, are suitably aligned. To prevent them from shaking, use a tool to glue them together with heat, fix them, and then make a laminate with proper heat and pressure to integrate them, then punch them in place to complete the combi card.

The card body 70 applied to the combination card includes upper and lower printed layers 40 and 20, an antenna coil insertion layer 30 in which the antenna coil 31 is positioned, and upper and lower protective layers 50 and 10. It consists of transparent or opaque synthetic resin sheets such as PC, PETG, PET, and ABS.

The hot melt tape 111 applied to the Combi card uses a thermoplastic resin such as an acryl series, an amide series, and a thermosetting resin such as an Acrylonitrile series or an epoxy series, but the thermosetting resin was more excellent.

In the present invention, the structural characteristic is that the connection between the COB 100 and the antenna terminal 33 is not sufficient adhesive force due to the short adhesion time in the bonding in the conventional milling method, but the bonding in the prefabricated hot melt tape due to sufficient heat and pressure The adhesive force of the 111 is excellent so that the chip is not separated from the card, but rather the adhesive force is maintained so that the card is destroyed, and the flexibility of the conductive fiber terminal 33 of the antenna coil insertion layer 30 is achieved. It is characterized in that the excellent electrical conductivity is maintained by the breakage phenomenon of).

Hereinafter will be described in detail through preferred embodiments of the present invention, but is not limited to the following embodiments.

Example 1

For in-situ bonding between the COB 100 and the antenna coil insertion layer 30 having a thickness of 100 µm to 250 µm, a rounded pin bar (within 5 mm in diameter and 5 mm in height), as shown in the plan view of FIG. 210, the COB-shaped insertion groove 220 is formed in the bottom of the template to a depth of 160㎛ ~ 230㎛ and the hot melt tape 111 is pre-treated in the insertion groove 220 of the COB (100) After inserting the hot melt tape 111 in the up position, the conductive adhesive 108 is added to the terminal 104 of the COB 100 through a needle, and then the antenna coil insertion layer is formed using the pin bar 210. After the dam position penetrating portion 32 of the (30) is aligned so that the COB 100 is welded to the antenna coil insertion layer 30 through a predetermined heat and pressure to form a comb cost antenna coil insert sheet Perform.

The upper printed layer 40 having a thickness of 100 μm to 250 μm and the upper protective layer 50 having a thickness of 50 μm to 100 μm as the upper layer and the COB (100) as the lower side while being welded in the process of forming a comb antenna antenna insert sheet. 100 μm to 250 μm thick control layer 35 suitable for the thickness of the dam 106, the lower printed layer 20 having a thickness of 100 μm to 200 μm, and the lower protective layer 10 having a thickness of 50 μm to 100 μm. After aligning, remove static electricity to prevent movement between the laminated sheets, and then adhere them by soldering with a soldering iron, etc., and then weld each layer between the mirror plates. Then, in the laminator with 140 ~ 180 heat and 5 ~ 25kg / ㎠ pressure The process of forming a laminate is performed.

After the laminated plate is formed, the punching machine is punched in place so that the position of each contact point of the external terminal 101 of the COB 100 is in the position defined by ISO7816-2 (KSX6507-2; dimensions and position of the contact point), so that durability and excellent electricity flow are possible. Manufacture this excellent combination card.

Example 2

As shown in the plan view shown in FIG. 3, the lower protective layer 10 having a thickness of 50 μm to 100 μm from the bottom, the lower printed layer 20 having a thickness of 100 μm to 200 μm, and the COB dam position penetrating portion 37 are formed. 100 μm to 250 μm thick antenna coil insertion layer 30 having a thickness control layer 35 having a thickness of 250 μm to 250 μm, and a COB dam position through portion 32 formed thereon, and having an antenna terminal 33. The upper printed layer 40 having a thickness of 100 μm to 200 μm on which 42 is formed and the upper protective layer 50 having a thickness of 50 μm to 100 μm on which the COB position penetrating portion 52 is formed are matched. After removal using a roller and a suitable amount of conductive adhesive 108 is discharged through a needle to the antenna terminal 33, which is an antenna conductive fiber formed in the groove portion 72 in which the COB 100 is to be placed, and the hot melt tape 111 The COB 100 and the card body 70 through the predetermined heat and pressure after inserting the The sheet with the property of some heat and pressure is performed in contact with the process.

Then, it is sandwiched between the mirror plates in the welded state to perform a process of forming a laminated plate with a heat of 140 ~ 180 and a pressure of 5 ~ 25kg / ㎠ in a laminator.

Then, the punching machine is punched in place so that the position of each contact point of the external terminal 101 of the COB 100 is in the position defined by ISO7816-2 (KSX6507-2; dimensions and position of the contact point), so that the durability and excellent conductance are excellent. The combi card is manufactured.

As described above, in the prefabricated combi card according to the present invention, the COB and the antenna coil insertion layer are bonded by hot melt tape, and the antenna terminal of the antenna coil insertion layer is made of conductive fiber to add flexibility, and the conductive property of the COB terminal and the conductive adhesive is applied. It is characterized in that to maintain, in the general method is not enough adhesive force is maintained because it adds a serious problem in electrical conductivity, but in the prefabricated method is to make the adhesive strength of the hot melt tape is excellent.

The present invention provides an effect of maintaining excellent electrical conductivity between the COB terminal and the antenna terminal even in various deformations such as bending and torsion simply because of excellent adhesion holding force.

Claims (10)

A plurality of sheets constituting the card body 70 are stacked, and the assembled combi-type IC bonded so that the COB 100 terminal and the antenna terminal 33 of the antenna coil insertion layer 30 having a thickness of 100 μm to 200 μm are energized. In the card, Combi card, characterized in that the antenna terminal 33 of the antenna coil insertion layer 30 is bonded and energized with the COB (100) terminal 104 using a hot melt tape 111 and a conductive adhesive (108). The antenna terminal 33 of the antenna coil insertion layer 30 is electrically conductive by the conductive fiber terminal, and the shape of the antenna terminal 33 has a circular or horizontal length of 2 mm to 5 mm. Combi card, characterized in that configured in the form of a square of 2mm to 4mm, the length of 2mm to 4mm. (delete) In order to connect the COB 100 and the antenna coil insertion layer 30 to the right position, the rounded pin bar 210 is erected on the metal template, and the insertion groove 220 having the COB shape is formed on the bottom of the template. After the hot melt tape 111 is pre-treated on the 220 and the hot melt tape 111 of the COB 100 attached thereto is inserted upward, the conductive adhesive 108 is injected into the terminal 104 of the COB 100. After quantitative discharging through the pin bar 210, the dam position penetrating portion 32 of the antenna coil insertion layer 30 is aligned using the pin bar 210, and then the COB 100 is inserted through the predetermined heat and pressure. Forming a comb cost antenna coil insertion sheet in contact with the layer 30; The thickness control layer suitable for the thickness of the upper printing layer 40 and the upper protective layer 50 in the upper layer, and the dam 106 of the COB 100 in the lower portion in the state where the comb antenna antenna insert sheet is welded. (35) and the lower printed layer (20) and the lower protective layer (10) to match and then remove the static electricity so as not to move between each laminated sheet, and then adhered by a soldering iron or the like, and after each layer is welded between mirror plates Putting it into a laminator to form a laminate with heat and pressure; Method of manufacturing a prefabricated combination card, characterized in that the punching position of the position of each contact of the outer terminal 101 of the COB (100) in a punching machine after the laminated plate is formed. The lower protective layer 10, the lower printed layer 20, the thickness control layer 35 having the COB dam position penetrating portion 37 formed therefrom, and the COB dam position penetrating portion 32 formed from the bottom thereof, and the antenna terminal 33 The formed antenna coil insertion layer 30, the upper printed layer 40 having the COB position penetrating portion 42, and the upper protective layer 50 having the COB position penetrating portion 52 are matched to prevent air and static electricity between the layers. After removal using a roller, a suitable amount of conductive adhesive 108 is discharged through a needle to the antenna terminal 33 formed in the recess 72 in which the COB 100 is to be positioned, and the hot melt tape 111 is pretreated and attached. Inserting the COB 100 in position and then welding the sheet constituting the COB 100 and the card body 70 together with a slight heat and pressure through a predetermined heat and pressure; Placing the laminate between the mirror plates in a welded state to form a laminate by heat and pressure in a laminator; Method of manufacturing a prefabricated combination card, characterized in that punching the position of each contact point of the external terminal 101 of the COB (100) in the punching machine. The upper and lower printed layers 40 and 20 having a thickness of 100 µm to 200 µm and the antenna coil 31 having a thickness of 100 µm to 250 µm according to claim 4 or 5, respectively. In addition to the antenna coil insertion layer 30, the thickness control layer 35 of 100㎛ ~ 250㎛ thickness and the upper and lower protective layers (50, 10) of 50㎛ ~ 100㎛ thickness and the like as a sheet layer that can be added Method of manufacturing a prefabricated combination card, characterized in that made. The method of manufacturing a prefabricated combination card according to claim 4 or 5, wherein the laminate is formed between the mirror plates after the temporary welding and is formed at a laminator with a heat of 140 to 180 ° C. and a pressure of 5 to 25 kg / cm 2. The combination according to claim 4 or 5, wherein the upper protective layer 50, the upper printed layer 40, the COB 100, and the antenna coil insertion layer 30 are bonded to each other by using the pin bar 210 of the template. A method of manufacturing a prefabricated combination card, comprising a step of gluing the antenna coil insertion sheet for the card, and the lower printed layer 20 and the lower protective layer 10 on a template so as not to move sequentially. The method according to claim 4, wherein in the in-situ joining of the COB 100 and the antenna coil insertion layer 30, a rounded pin bar (within 5 mm in diameter and within 5 mm in height, 210) is erected on the metal template. The method of manufacturing a prefabricated combination card, characterized in that the groove portion of the COB (100) form to form a multi-sided portion with a depth of 160㎛ ~ 230㎛. 7. The method of manufacturing a prefabricated combination card according to claim 6, wherein the component of the sheet is composed of a transparent or opaque synthetic resin sheet such as PVC, PC, PETG, PET, or ABS.

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