KR100254261B1 - Method of translating CAD data into data for part mounter - Google Patents

Abstract

PURPOSE: A method for converting CAD data into data for a component mounting device is provided to convert CAD data into teaching data for component mounting device by designing a printed circuit board by the CAD. CONSTITUTION: A GeomAscii file is read among artwork files. A shape coordinate field such as an Xminpi, an Xmaxpi, an Yminpi, and an Ymaxpi of a pad by component mounting positions are calculated. A shape coordinate such as an Xfcn, an Yfcn corresponded to an origin of each standard mark are calculated(S111). A neutral file is read among the artwork files. A position coordinate Xcpij and an Ycpij are calculated. In addition, a position coordinate Xbfn, an Ybfn corresponded to the origin of each standard mark are calculated(S112). The Xminpi, the Xmaxpi, the Yminpi and the Ymaxpi are added to the position coordinates. A position coordinate field such as an Xmincij, an Xmaxcij, an Ymincij, and an Ymaxcij of each pad are calculated(S12). The Xfcn and the Yfcn are added to the Xbfn and the Ybfn. A position coordinate Xbfcn and an Ybfcn are calculated(S13). A central position coordinate Xci and an Yci of each component mounting position are calculated using the maximum position coordinate Xmaxci and Ymaxci and the minimum position coordinate(S2). The Xbcfn and the Ybcfn are compared with the Xmaxci and the Ymaxci, the Xminci, and the Yminci(S3).

Description

Method of translating CAD data into data for part mounter

The present invention relates to a method for converting CAD data generated by designing a printed circuit board by CAD into teaching data for a component mounter.

1 is a schematic perspective view of a typical component mounter. As shown in FIG. 1, a general component mounter includes a conveyor 11 for transporting a printed circuit board; A front feeder 121 and a rear feeder 122 (not shown) for supplying parts to be mounted; Heads 13 for adsorbing components with nozzles in the feeders 121 and 122 and then moving to a designated mounting position on the printed circuit board to mount the components which have been adsorbed. Where reference numeral 14 denotes a vision monitor for displaying an image signal from a camera attached between the heads 13; 15 and 16 are keyboard 16 and programming monitor 15 used for programming the operator; 17, a teaching pad for inputting teaching data from an operator; 18 is an operating panel provided with various operation switches; And 19, a floppy disk drive for the main controller (not shown) to read data stored in the floppy disk and to store data from the main controller in the floppy disk. The teaching data herein refers to position data of components to be mounted on a printed circuit board.

In order to control such a component mounter, conventionally, the operator inputs the teaching data to the main control unit with the teaching pad 17 while watching the vision monitor 14, and the mounting conditions and the mounting sequence with the keyboard 16. ) Is entered into the main control unit. That is, conventionally, there is no method for converting CAD data generated by designing a printed circuit board by CAD into teaching data for component mounting. Therefore, the conventional control method by the programming of the operator has the following problems. First, it takes a lot of time for the operator to enter the teaching data and the mounting sequence into the main control unit. Second, optimized mounting conditions are not reflected. And thirdly, since the mounting sequence is determined according to the operator's judgment, it is impossible to optimize the mounting sequence, which takes a lot of mounting time.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method for converting CAD data generated by designing a printed circuit board by CAD into teaching data for a component mounter.

1 is a schematic perspective view of a typical component mounter.

2 is a schematic flowchart illustrating a method according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a printed circuit board to assist in understanding the method of FIG. 2.

In order to achieve the above technical problem, the method of converting CAD data into component mounting data according to the present invention is a method of converting CAD data generated by designing a printed circuit board by CAD into teaching data for component mounting. S1) reading the CAD data to obtain a position coordinate system of each reference mark and a position coordinate system of each pad for each component mounting position; (S2) obtaining center position coordinates of each component mounting position using the maximum position coordinates and the minimum position coordinates in the position coordinate system of each pad; And (S3) comparing the position coordinates of the respective reference marks obtained in the step S1 with the maximum position coordinates and the minimum position coordinates obtained in the step S2, and setting a pair having a minimum difference value as a corresponding pair. .

In step S1, (S11) the CAD data is read, and the shape coordinates of the origin of each reference mark, the shape coordinate system of the pad for each component mounting position, the position coordinates of the origin of each pad for each component mounting position, and each reference Obtaining a position coordinate with respect to the origin of the mark; (S12) obtaining the position coordinate system of each pad by adding the shape coordinate system of the pad to the position coordinates of the origin of each pad; And (S13) adding shape coordinates of the origin of each reference mark to position coordinates of the origin of each reference mark to obtain the position coordinates of the respective reference marks.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

CAD systems for designing printed circuit boards vary, and accordingly, an appropriate conversion method is required according to their artwork file structure. CAD data by a general artwork file includes the shape coordinate system of each pad for each component mounting position, the shape coordinate of each reference mark, the position coordinate with respect to the center point of each pad, and the position coordinate with respect to the center point of each reference mark. The CAD system applied to this embodiment is a Mentor CAD system for workstations. There are several types of substrate artwork files created by the Mentor CAD system. Among them, files related to this embodiment are GeomAscii files and Neutral files. The Geo ASCII file is a kind of library file for defining the shape of each pad and reference mark for each mounting position of each component. The neutral file is a file for indicating the center position coordinates and the mark center position coordinates of each component mounting position.

2 is a schematic flowchart illustrating a method according to an embodiment of the present invention. FIG. 3 is a schematic diagram of a printed circuit board to assist in understanding the method of FIG. 2. As shown in FIG. 3, the board design drawing made by the mentor CAD system includes a component mounting area 31 in the printed circuit board 3, a pad 311 on which the pins of the component are to be placed, and a reference for guiding the component mounting direction. The mark 32 is designed. The conversion method of this embodiment will be described with reference to FIGS. 2 and 3.

First, the Geo ASCII file is read from the substrate artwork file created by the Mentor CAD system, and the shape coordinate system Xminpi, Xmaxpi, Yminpi, Ymaxpi of the pad for each component mounting position 31, and each reference mark (321, 322, 323, 324). The shape coordinates Xfcn and Yfcn with respect to the origin of () are obtained (step S111). Here i represents the serial number of the component mounting position 31, and n represents the serial number of each reference mark 321, 322, 323, 324. As shown in FIG. For example, when the shape of the pad 311 at the i-th component mounting position 31 is a rectangle having a width of 1.4 mm (millimeter) and a width of 2.0 mm, Xminpi =-0.7 mm, Xmaxpi = 0.7 mm, Yminpi = -1.0 mm, Ymaxpi = 1.0 mm. In addition, when the shape of the n-th reference mark 321 is circular, it has data of Xfcn = 0.0mm and Yfcn = 0.0mm.

Next, the neutral file is read from the substrate artwork file created by the Mentor CAD system, and the position coordinates Xcpij, Ycpij and the respective reference marks 321, 322, and 323 with respect to the origin of each pad 311 for each component mounting position 31 are read. (324), the position coordinates Xbfn and Ybfn with respect to the origin point are obtained (step S112). Here, j represents the serial number of each pad 311 for each component mounting position 31. FIG.

Next, the shape coordinate systems Xminpi, Xmaxpi, Yminpi, and Ymaxpi of the pad 311 are added to the position coordinates of the origin of the pads 311, and the position coordinate systems Xmincij, Xmaxcij, Ymincij, and Ymaxcij of the pads 311 are added. Is obtained (step S12). Expressed by the formula, Xmincij = Xminpi + Xcpij, Xmaxcij = Xmaxpi + Xcpij, Ymincij = Yminpi + Ycpij, Ymaxcij = Ymaxpi + Ycpij. For example, the shape coordinate system of the pad at the i-th component mounting position is Xminpi =-0.7, Xmaxpi = 0.7 mm, Yminpi =-1.0, Ymaxpi = 1.0, and the position coordinate with respect to the origin of the eighth pad at the i-th component mounting position. If Xcpi8 = 75.8825, Ycpi8 = 43.4975, the position coordinate system of the eighth pad is Xminci8 = Xminpi + Xcpi8 = -0.7 + 75.8825 = 75.1825, Xmaxci8 = Xmaxpi + Xcpi8 = 0.7 + 75.8825 = 76.5825, Yminci8 = Yminpi + Ycpi8 -1.0 + 43.4975 = 42.4975, Ymaxci8 = Ymaxpi + Ycpi8 = 1.0 + 43.4975 = 44.4975.

Next, shape coordinates Xfcn and Yfcn with respect to the origin of the respective reference marks 321, 322, 323, and 324 are added to position coordinates Xbfn and Ybfn with respect to the origin of the respective reference marks 321, 322, 323, and 324. Then, the position coordinates Xbfcn, Ybfcn of the respective reference marks 321, 322, 323, and 324 are obtained (step S13). For example, if the shape coordinates of the origin of the second reference mark 322 are Xfc2 = 0.0, Yfc2 = 0.0, and the position coordinates of the origin of the second reference mark 322 are Xbf2 = 262.5725, Ybf2 = 107.6325, The position coordinates of the second reference mark 322 are Xbfc2 = Xfc2 + Xbf2 = 0.0 + 262.5725 = 262.5725, Ybfc2 = Yfc2 + Ybf2 = 0.0 + 107.6325 = 107.6325.

Next, the center position coordinates Xci and Yci of each component mounting position 31 are obtained using the maximum position coordinates Xmaxci, Ymaxci and the minimum position coordinates Xminci, Yminci in the position coordinate systems Xmincij, Xmaxcij, Ymincij and Ymaxcij of the respective pads. (Step S2). Here, X-axis center position coordinate Xci is calculated | required by the formula of Xci = (Xminci + Xmaxci) / 2. In addition, Y-axis center position coordinate Yci is calculated | required by the formula of Yci = (Yminci + Ymaxci) / 2.

Next, the position coordinates Xbfcn, Ybfcn of the respective reference marks 321, 322, 323, and 324 obtained in the step S13 are compared with the maximum position coordinates Xmaxci, Ymaxci and the minimum position coordinates Xminci, Yminci obtained in the step S2, and the difference The pair having the minimum value is set to the corresponding pair (step S3). Here, when the maximum position coordinates Xmaxci, Ymaxci and the minimum position coordinates Xminci, Yminci are used, the corner coordinates (Xmaxci, Ymaxci), (Xminci, Ymaxci), (Xmaxci, Yminci), (Xminci, Yminci) for each component mounting position 31 ) Is obtained. That is, since each reference mark 321, 322, 323, 324 is at the corner of the component mounting position, the respective corner coordinates (Xmaxci, Ymaxci), (Xminci, Ymaxci), (Xmaxci, Yminci), (Xminci, Yminci) Is compared with the position coordinates Xbfcn and Ybfcn of the respective reference marks 321, 322, 323, and 324, and a pair having a minimum difference value is set as a corresponding pair.

Therefore, by performing the above method, the CAD data can be converted into the teaching data for the component mounter.

As described above, according to the method for converting the CAD data into the component mounting data according to the present invention, since the CAD data can be recognized by the component mounting machine, it is possible to reduce the individual programming time and the total mounting time of the operator by using the CAD. have.

The present invention is not limited to the above embodiments, but may be modified and improved by those skilled in the art within the spirit and scope of the invention as defined in the claims.

Claims (8)

A method of converting CAD data generated by designing a printed circuit board by CAD into teaching data for a component mounter, (S1) reading the CAD data to obtain a position coordinate system of each reference mark and a position coordinate system of each pad for each component mounting position; (S2) obtaining center position coordinates of each component mounting position using the maximum position coordinates and the minimum position coordinates in the position coordinate system of each pad; And (S3) converting the position coordinates of the respective reference marks obtained in the step S1 with the maximum position coordinates and the minimum position coordinates obtained in the step S2, and setting a pair having a minimum difference value as a corresponding pair. Way. The method of claim 1, wherein step S1, (S11) The CAD data is read, and the shape coordinates of the origin of each reference mark, the shape coordinate system of the pad for each component mounting position, the position coordinates of the origin of each pad for each component mounting position, and the origin of each reference mark Obtaining position coordinates; (S12) obtaining the position coordinate system of each pad by adding the shape coordinate system of the pad to the position coordinates of the origin of each pad; And (S13) converting the coordinates of the origin of each reference mark to the position coordinates of the origin of each reference mark to obtain the position coordinates of the respective reference marks. The method of claim 2, wherein the CAD data, Conversion method generated by the Mentor CAD system for workstations. The method of claim 3, wherein step S11, Read the geo-ascii file from the substrate artwork file created by the mentor CAD system to determine the shape coordinate system Xminpi, Xmaxpi, Yminpi, Ymaxpi of the pad for each component mounting position, and the shape coordinates Xfcn and Yfcn for the origin of each reference mark. Obtaining; And The neutral file is read from the substrate artwork file created by the mentor cad system, and the position coordinates Xcpij, Ycpij and the position coordinates Xbfn and Ybfn with respect to the origin of the respective reference marks are obtained. A conversion method comprising the steps. The method of claim 4, wherein step S12, If the position coordinate system of each pad is Xmincij, Xmaxcij, Ymincij, Ymaxcij, the conversion method performed by the formula Xmincij = Xminpi + Xcpij, Xmaxcij = Xmaxpi + Xcpij, Ymincij = Yminpi + Ycpij, Ymaxcij = Ymaxpi + Ycpij. The method of claim 5, wherein step S13, And the position coordinate of each reference mark is Xbfcn, Ybfcn, wherein the conversion method is performed by the following equation: Xbfcn = Xfcn + Xbfn, Ybfcn = Yfcn + Ybfn. The method of claim 6, wherein step S2, If the maximum position coordinates are Xmaxci, Ymaxci, the minimum position coordinates are Xminci, Yminci, the X-axis center position coordinates of the respective component mounting positions are Xci, and the Y-axis center position coordinates of the respective component mounting positions are Yci, Xci = A conversion method performed by the formula (Xminci + Xmaxci) / 2, Yci = (Yminci + Ymaxci) / 2. The method of claim 7, wherein the step S3, Corner coordinates (Xmaxci, Ymaxci), (Xminci, Ymaxci), (Xmaxci, Yminci), (Xminci, Yminci) for each component mounting position by using the maximum position coordinates Xmaxci, Ymaxci and the minimum position coordinates Xminci, Yminci obtained in the step S2. Obtaining; And The corner coordinates (Xmaxci, Ymaxci), (Xminci, Ymaxci), (Xmaxci, Yminci), (Xminci, Yminci) are compared with the position coordinates Xbfcn, Ybfcn of each reference mark obtained in step S13, and the difference value is Setting the minimum pair to the corresponding pair.