JPH05210712A - Method for correcting packaged data - Google Patents

Abstract

PURPOSE:To obtain highly accurate packaged coordinates without being affected by the deviation in the fixed position of a printed circuit board at the time of correcting the packaged data by executing the correcting operation of a packaged point position based upon a reference mark position. CONSTITUTION:The printed circuit board is fixed on an XY table 4, the table 4 is moved by operating a main operation board 1 and the position of a reference mark is indicated by positioning the mark just under a recognition camera 5 (on a center line) to obtain the XY coordinates of the mark. Then the coordinates of the reference mark are updated based upon the XY coordinates and stored in a control part 7. Then the packaged point is positioned just under the camera (on the center line) by moving the table 4 with the operation of the board 1 to indicate the packaged point and obtain the XY coordinates of the packaged point. The XY coordinates of the packaged point are corrected based upon the positional deviation variable of the reference mark, the packaged data are updated based upon the corrected result and the updated data are stored in a control part 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of correcting mounting data automatically created by CAD design data or created by a mounting data creation machine in accordance with a state of actually mounting electronic components on a board. Is.

[0002]

2. Description of the Related Art With the recent progress in electronics, products are becoming lighter, thinner, smaller and smaller, and as a result, higher precision is required for automatic electronic component mounters as well, so that the mounting data can be matched to the actual mounting state. It has become necessary to make corrections based on the corrected mounting data.

A conventional example will be described below with reference to FIGS.

FIG. 2 shows a schematic structure of an electronic component automatic mounting machine. In FIG. 2, 1 is a main operation panel and 2 is a rear operation panel. 3 is a component mounting head, 4 is an X for positioning the board
A Y table, 5 is a recognition camera for recognizing a reference mark or the like formed on the substrate, 6 is a component supply unit, and 7 is a control unit. Further, in FIG. 3 showing the printed circuit board, 8 is a reference mark, 9 is a land, a large number of sets of lands 9 are provided on an actual printed circuit board, and the center of the land 9 of each set is a mounting point.

The mounting operation on the printed circuit board by this electronic component automatic mounting machine will be described. The printed circuit board is fixed to the XY table 4, and the recognition camera 5 recognizes the position of the reference mark 8 to know the position of the printed circuit board.
Next, during the mounting operation of the electronic component, after the two reference marks 8 are image-processed to detect the position of the printed circuit board, the printed circuit board is moved by the XY table 4 and sequentially positioned at the mounting point. The component supply unit 6 at the mounting head 3
The electronic components taken out from are mounted on a printed circuit board.
The coordinates of the reference mark 8 and the coordinates of each mounting point are stored in the control unit 7 as mounting data.

Next, a flow chart of FIG. 4 shows a method for automatically creating the CAD design data and correcting the mounting position data created in advance by the mounting data creating machine in accordance with the actual electronic component automatic mounting machine and the printed circuit board. Will be described. First, the substrate is fixed to the XY table 4 (step # 11), and then the main operation panel 1 is operated to move the XY
The position of the mounting point is taught by moving the table 4 to position the mounting point just below the recognition camera 5 (on the center line), and the XY coordinates thereof are obtained (steps # 12, # 13).
Next, the mounting data is updated based on the XY coordinates and stored in the controller 7 (step # 14). After that, through the determination of step # 15, the correction process of the mounting data is ended after the correction of all necessary mounting points is repeated.

[0007]

However, in the mounting data correction method as described above, it is assumed that the amount of deviation when fixing the printed circuit board to the XY table in the electronic component automatic mounting machine is zero. Although only the coordinate is corrected, since it is not zero in reality, there is a problem that an accurate relative position of the mounting point with respect to the reference mark cannot be obtained, resulting in poor accuracy during mounting.

In view of the above-mentioned conventional problems, the present invention eliminates the influence of the displacement of the fixed position of the printed circuit board when correcting the mounting data in the electronic component automatic mounting machine or the mounting data creating machine, and the accurate mounting point It is an object to provide a mounting data correction method for obtaining coordinates.

[0009]

A mounting data correction method of the present invention comprises a step of teaching a reference mark position formed on a substrate on which an electronic component is to be mounted, a step of teaching a mounting position of the electronic component, And a step of correcting the mounting position with reference to the reference mark position.

[0010]

According to the present invention, by the above configuration, the deviation amount from the reference position of the stored mounting data can be known by teaching the reference mark of the substrate fixed on the XY table, and the mounting position on the substrate can be determined. After teaching, the displacement amount of the mounting position is corrected and calculated in consideration of the displacement amount of the reference position, so that the accurate mounting position can be obtained without the influence of the displacement of the fixed position of the substrate.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A mounting data correction method according to an embodiment of the present invention will be described below with reference to FIGS.

The description of the schematic configuration diagram of the electronic component automatic mounting machine shown in FIG. 2 and the conceptual diagram of the printed circuit board shown in FIG. Omit it.

FIG. 1 shows a flowchart of a mounting data correction process in this embodiment. In FIG. 1, first, in step # 1, the printed circuit board is fixed to the XY table 4, then the main operation panel 1 is operated to move the XY table 4, and the reference mark 8 is placed immediately below the recognition camera 5 (on the center line). The position of the reference mark 8 is taught by positioning, and the XY
Obtain coordinates (steps # 2, # 3). Next, the coordinates of the reference mark 8 are updated based on the XY coordinates and stored in the controller 7 (step # 4). This is repeated for the two reference marks 8 through the judgment in step # 5. As a result, the amount of deviation between the printed circuit board fixed on the XY table 4 and the reference position of the currently stored mounting data can be known.

Next, by operating the main operation panel 1, the XY table 4 is moved to position the mounting point immediately below the recognition camera 5 (on the center line), the mounting point is taught, and the XY is determined.
Obtain coordinates (steps # 6, # 7). Next, the XY coordinates are corrected and calculated based on the displacement amount of the reference mark 8 (step # 8), the mounting data is updated based on the calculation result, and stored in the control unit 7 (step # 9). After that, through the determination of step # 10, the correction is repeatedly repeated for all the required mounting points.

As described above, by providing the reference mark position teaching step, the mounting point position teaching step, and the mounting point position correction calculation step with the reference mark position as a reference,
Highly accurate mounting coordinates can be obtained without being affected by the displacement of the fixed position of the printed circuit board when the mounting data is corrected.

In the above embodiment, the operator determines in step # 3 whether or not the reference mark is located directly below the recognition camera, and in step # 7 whether or not the mounting point is located directly below the recognition camera. Although the example in which the determination is performed is shown, the control unit 7 may perform the determination through image recognition processing.

Further, in the above embodiment, the electronic component automatic mounting machine is taken as an example, but the present invention can be similarly applied to the mounting data creating machine.

[0018]

According to the present invention, the steps of teaching the reference mark position of the board, the steps of teaching the mounting position of the electronic component, and the step of correcting the mounting position based on the reference mark position are described above. Therefore, it is possible to obtain the coordinates of the mounting position with high accuracy without being affected by the displacement of the fixed position of the board in the mounting data correction, and it is possible to realize the mounting with high accuracy.

[Brief description of drawings]

FIG. 1 is a flowchart of a mounting data correction process according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of an electronic component automatic mounting machine in the embodiment.

FIG. 3 is a conceptual diagram of a printed circuit board in the example.

FIG. 4 is a flowchart of a mounting data correction process in a conventional example.

[Explanation of symbols]

 4 XY table 5 Recognition camera 7 Control unit

Claims (1)

[Claims] 1. A step of teaching a reference mark position formed on a substrate on which an electronic component is to be mounted, a step of teaching a mounting position of an electronic component, and a correction calculation of the mounting position based on the reference mark position. A mounting data correction method comprising: