JPWO2019043835A1 - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use a refrigerant whose phase changes between a liquid phase refrigerant and a gas phase refrigerant, and even when a plurality of heating elements are mounted on a circuit board along the vertical direction, the upper side in the vertical direction. To provide an electronic device capable of cooling a heating element more efficiently. A container 100 is for enclosing a refrigerant COO that undergoes a phase change between a liquid phase refrigerant and a gas phase refrigerant. The circuit board 200 is provided in the container 100 so that the main surface 201 extends along the vertical direction G. The plurality of heating elements 300 are mounted on the circuit board 200 along the vertical direction G so as to be immersed in the liquid phase refrigerant. The plurality of straightening vanes 400 are formed of a heat conductive member and are arranged so as to overlap each other along the vertical direction G with a gap. The plurality of straightening vanes 400 are provided so as to extend toward the surface side of the inner surface of the container 100 facing the main surface 201 of the circuit board 200.

Description

The present invention relates to an electronic device, for example, an electronic device for cooling a heating element.

In recent years, in electronic devices (for example, communication devices such as mobile phone base stations and servers) installed in environments where dust and the like exist (for example, outdoors (especially coastal areas) and factories), dust is contained in the devices. Sealed structures tend to be adopted to prevent infiltration. In electronic devices that employ a closed structure, heat tends to be trapped inside the device, and it is an issue to efficiently cool the heating element.

As a technique for cooling a heating element, an electronic device capable of cooling the heating element using a dielectric coolant is known (for example, Patent Document 1).

The electronic device described in Patent Document 1 circulates a dielectric coolant between a container and a heat exchanger to cool a heating element (operating component) in the container. The heat exchanger is provided on the outside of the container. The heating element is mounted on a circuit board (motherboard). Dielectric coolant is stored in the container. Further, the circuit board on which the heating element is mounted is immersed in the dielectric coolant in the container. The dielectric coolant is circulated in the vessel and between the heat exchangers by the power of the pump.

The electronic device described in Patent Document 1 operates as follows. First, the heat of the heating element is endothermic by the dielectric coolant in the vicinity of the heating element. The dielectric coolant that has absorbed the heat of the heating element is supplied to the heat exchanger by the power of the pump. The heat exchanger receives the heat of the heating element absorbed by the dielectric coolant and dissipates it to the outside air. The dielectric coolant is cooled by the heat exchanger and supplied again to the heating element in the container. As described above, in the electronic device described in Patent Document 1, the dielectric coolant is circulated between the container and the heat exchanger to cool the heating element in the container.

Here, in the electronic device described in Patent Document 1, a plurality of heating elements are mounted on the circuit board along the vertical direction. Also, a plurality of pin-shaped fins are mounted on each of the plurality of heating elements. The plurality of fins receive the heat of the heating element directly from the heating element itself and transfer the heat of the heating element to the dielectric coolant. The dielectric coolant used in the electronic device described in Patent Document 1 is a refrigerant that does not change phase between a liquid phase refrigerant (liquid phase refrigerant) and a gas phase refrigerant (gas phase refrigerant). It is used. Therefore, the vapor-phase refrigerant generated by the phase change of the liquid-phase refrigerant due to the heat of the heating element did not adhere to the heating element or the fins.

Registered Utility Model No. 3163213

However, when a refrigerant that undergoes a phase change between the liquid phase refrigerant and the gas phase refrigerant is applied to the electronic device described in Patent Document 1, the liquid phase refrigerant boils due to the heat of each heating element, so that the vapor phase refrigerant becomes each. It occurs around the heating element. The vapor-phase refrigerant flows upward in the vertical direction in the liquid-phase refrigerant stored in the container from the vicinity of each of the plurality of heating elements. Therefore, on the surface of the heating element and the fin on the upper side in the vertical direction, in addition to the vapor-phase refrigerant generated on the surface of the heating element and the fin on the upper side in the vertical direction, the heating element on the lower side in the vertical direction and the surface of the fin. The vapor-phase refrigerant generated on the surface of the fin adheres.

In particular, since the fins are pin-shaped, air bubbles in the heating element on the lower side in the vertical direction and the vapor-phase refrigerant generated on the surface of the fins pass between the pin-shaped fins on the heating element on the upper side in the vertical direction. However, it adheres to the entire surface of the fins on the heating element on the upper side in the vertical direction. As the amount of bubbles in the vapor-phase refrigerant covering the surfaces of the heating element and fins increases, the contact area between the surfaces of the heating element and fins and the liquid-phase refrigerant decreases, and the cooling efficiency of the electronic device decreases.

That is, when the bubbles of the vapor phase refrigerant are not attached to the surface of the heating element or fin, the heat of the heating element is directly transferred from the surface of the heating element or fin to the liquid phase refrigerant. On the other hand, when the bubbles of the vapor phase refrigerant are attached to the surface of the heating element or fin, the heat of the heating element is transferred from the surface of the heating element or fin to the bubbles of the vapor phase refrigerant, but directly. It is not transmitted to the liquid phase refrigerant. As described above, the case where the bubbles of the vapor-phase refrigerant are attached to the surface of the heating element or the fin is more than the case where the bubbles of the vapor-phase refrigerant are not attached to the surface of the heating element or the fin. Cooling efficiency is reduced.

Therefore, there is a problem that the heating element on the upper side in the vertical direction cannot be sufficiently cooled due to the further adhesion of the heating element on the lower side in the vertical direction and the vapor-phase refrigerant generated on the surface of the fins.

The present invention has been made in view of such circumstances, and an object of the present invention is to use a refrigerant whose phase changes between a liquid phase refrigerant and a gas phase refrigerant, and a plurality of heating elements are arranged along the vertical direction. An object of the present invention is to provide an electronic device capable of more efficiently cooling a heating element on the upper side in the vertical direction even when it is mounted on a circuit board.

The electronic device of the present invention includes a container for encapsulating a refrigerant that undergoes a phase change between a liquid phase refrigerant and a vapor phase refrigerant, and a circuit provided in the container so that the main surface extends along the vertical direction. It is formed by a substrate, a plurality of heating elements mounted on the circuit substrate along the vertical direction so as to be immersed in the liquid phase refrigerant, and a heat conductive member, and is formed through a gap along the vertical direction. A plurality of inner surfaces of the container, which are provided so as to extend toward the surface side of the circuit board facing the main surface and attached to at least one of the plurality of heating elements. It is equipped with a rectifying plate.

According to the electronic device according to the present invention, even when a plurality of heating elements are mounted on the circuit board along the vertical direction by using a refrigerant whose phase changes between the liquid phase refrigerant and the gas phase refrigerant. , The heating element on the upper side in the vertical direction can be cooled more efficiently.

It is a transmission side view which shows the structure of the electronic device in 1st Embodiment of this invention through. It is a transmission front view which shows the structure of the electronic device in 1st Embodiment of this invention through. It is a transmission side view which shows through the structure of the 1st modification of the electronic device in 1st Embodiment of this invention. It is a transmission front view which shows through the structure of the 1st modification of the electronic device in 1st Embodiment of this invention. It is a transmission side view which shows the structure of the 2nd modification of the electronic device in 1st Embodiment of this invention through. It is a front view which shows the structure of the 2nd modification of the electronic device in 1st Embodiment of this invention. It is a transmission side view which shows the structure of the electronic device in 2nd Embodiment of this invention through. It is a transmission front view which shows through the structure of the electronic device in 2nd Embodiment of this invention. It is a transmission side view which shows the structure of the electronic device in 3rd Embodiment of this invention through. It is a transmission front view which shows through the structure of the electronic device in 3rd Embodiment of this invention. It is a perspective view which shows the structure of the rectifying member. It is a perspective view which shows the structure of the 1st modification of a rectifying member. It is a top view which shows an example of a straightening vane. It is a top view which shows an example of a straightening vane. It is a top view which shows an example of a straightening vane. It is a top view which shows an example of a straightening vane. It is a top view which shows an example of a straightening vane. It is a perspective view which shows the structure of the 2nd modification of a rectifying member. It is a transmission side view which shows the structure of the electronic device in 4th Embodiment of this invention through. It is a transmission front view which shows through the structure of the electronic device in 4th Embodiment of this invention. It is a transmission top view which shows through the structure of the electronic device in 4th Embodiment of this invention. It is a top view which shows an example of a straightening vane.

<First Embodiment>
The configuration of the electronic device 1000 according to the first embodiment of the present invention will be described. FIG. 1A is a transmission side view showing the configuration of the electronic device 1000 through transmission. FIG. 1B is a transmission front view showing the configuration of the electronic device 1000 through the electronic device 1000, and is a diagram showing the configuration seen through the electronic device 1000 in the direction of arrow AA in FIG. 1A. In addition, in FIG. 1A and FIG. 1B, the vertical direction G is shown for convenience of explanation. The electronic device 1000 can be used, for example, in a communication device or an electronic device such as a server.

As shown in FIGS. 1A and 1B, the electronic device 1000 includes a container 100, a circuit board 200, a plurality of heating elements 300a and 300b, and a plurality of straightening vanes 400a to 400e. In the following description, when it is not necessary to distinguish between the heating elements 300a and 300b, the heating elements 300a and 300b are collectively referred to as the heating element 300. When it is not necessary to distinguish the straightening vanes 400a to 400e, the straightening vanes 400a to 400e are collectively referred to as the straightening vane 400.

As shown in FIGS. 1A and 1B, the container 100 is formed in a box shape. The inside of the container 100 is hollow. The container 100 is prepared for encapsulating a refrigerant (Coolant: hereinafter referred to as COO) described in detail later. A thermally conductive member (for example, aluminum, aluminum alloy, or stainless steel) is used as the material of the container 100. The container 100 is provided with a lid. This lid is a plate that constitutes one surface of the container 100 (for example, the surface on the upper side in the vertical direction G), and is removable. Here, it is assumed that the container 100 is completed by combining the lid and the main body of the container 100. The lid is fixed to the main body of the container 100 by, for example, screwing. At this time, a rubber-like packing or the like is interposed between the lid and the main body of the container 100. As a result, it is possible to prevent the refrigerant COO from leaking from between the lid and the main body of the container 100.

The container 100 is filled with the refrigerant COO. The refrigerant COO includes a liquid-phase refrigerant (Liquid-Phase Coolant: hereinafter referred to as LP-COO) and a vapor-phase refrigerant (Gas-Phase Coolant: GP). -A refrigerant that changes phase between (referred to as COO)) is used. The refrigerant COO is confined in the container 100 in a sealed state. Therefore, by injecting the liquid phase refrigerant LP-COO into the container 100 and then evacuating the container 100, the inside of the container 100 is always maintained at the saturated vapor pressure of the refrigerant.

1A and 1B show the gas phase refrigerant GP-COO and the liquid phase refrigerant LP-COO enclosed in the container 100. The gas phase refrigerant GP-COO is located in the gas phase space formed above the liquid surface of the liquid phase refrigerant LP-COO. Further, the bubble vapor phase refrigerant GP-COO is generated around the heating element 300 when the liquid phase refrigerant LP-COO undergoes a phase change to the vapor phase refrigerant GP-COO due to the heat of the heating element 300 described later. The refrigerant COO includes all liquid phase refrigerant LP-COO and all gas phase refrigerant GP-COO in the container 100.

As the refrigerant COO, for example, hydrofluorocarbon (HFC: Hydro Fluorocarbon), hydrofluoroether (HFE: Hydro Fluoroether), or the like can be used as a low boiling point refrigerant.

As shown in FIGS. 1A and 1B, the circuit board 200 is formed in a plate shape. The circuit board 200 is provided in the container 100 so that the main surface 201 extends along the vertical direction G. The circuit board 200 is fixed in the container 100 by a holding member (not shown). For the holding member, for example, screws, bolts, nuts, or the like can be used. A plurality of heating elements 300 are mounted on the circuit board 200. The circuit board 200 is provided in the container 100 so that at least the heating element 300 is immersed in the liquid phase refrigerant LP-COO. As a result, the heating element 300 can be cooled by the liquid phase refrigerant LP-COO. More preferably, the circuit board 200 is provided in the container 100 so that substantially the entire circuit board 200 is immersed in the liquid phase refrigerant LP-COO. As a result, the entire circuit board 200 can be cooled by the liquid phase refrigerant LP-COO.

The circuit board 200 is, for example, a printed wiring board. The printed wiring board is configured by laminating a plurality of insulator boards and conductor wiring. In addition, conductive pads for mounting electronic components are formed on the front surface and the back surface of the printed wiring board. The electronic components are fixed to the pads by soldering. For example, a glass epoxy resin is used as the material of the substrate of the insulator. Conductor wiring and pads are made of, for example, copper foil.

The plurality of heating elements 300 are mounted on the circuit board 200 along the vertical direction G so as to be immersed in the liquid phase refrigerant LP-COO. The heating element 300 is an electronic component that generates heat when operated, and is, for example, a central processing unit (CPU) or an integrated circuit (Multi-chip Module: MCM). The heating element 300 is the main cooling target of the electronic device 1000. The heating element 300 is fixed to the circuit board 200 by soldering or the like.

The plurality of straightening vanes 400a to 400e are attached to at least one of the plurality of heating elements 300a and 300b. In FIGS. 1A and 1B, the plurality of straightening vanes 400a to 400e are attached to both the plurality of heating elements 300a and 300b.

As shown in FIGS. 1A and 1B, the plurality of straightening vanes 400a to 400e are arranged so as to overlap each other along the vertical direction G with a gap. Further, each of the plurality of straightening vanes 400a to 400e is provided so as to extend toward the surface side of the inner surface of the container 100 facing the main surface 201 of the circuit board 200. More specifically, each of the plurality of straightening vanes 400a to 400e has a vertical distance between the main surface 201 of the circuit board 200 and the straightening vanes 400a to 400b in the direction perpendicular to the main surface 201 of the circuit board 200. It is attached to the heating element 300 so that it gradually increases toward the upper side of the direction G.

At this time, the end portion of the straightening vane 400 on the circuit board 200 side is fixed to the main surface of the heating element 300 with, for example, an adhesive. The straightening vane 400 may be fixed on the heating element 300, for example, by being inserted into a groove (not shown) provided in the heating element 300. Further, a hooking claw may be provided on the rectifying plate 400, and the rectifying plate 400 may be fixed to the heating element 300 by using the hooking claw.

The straightening vane 400 is formed of a heat conductive member. As the material of the straightening vane 400, for example, a metal material (for example, aluminum, an aluminum alloy, or stainless steel) is used.

Next, a method of manufacturing the electronic device 1000 will be described.

First, the circuit board 200 to which the heating elements 300a and 300b are attached is prepared. Then, the plurality of straightening vanes 400 are fixed to the heating elements 300a and 300b.

Next, the circuit board 200 is fixed in the container 100 by a holding member (not shown). The circuit board 200 is fixed in the container 100 so that the main surface 201 is parallel to the vertical direction G. At this time, it is preferable that a predetermined gap (for example, several mm or more) is provided between the straightening vane 400 and the inner wall of the container 100. Then, the container 100 is filled with the refrigerant COO.

The method of filling the container 100 of the electronic device 1000 with the refrigerant COO is as follows. First, the refrigerant COO is injected into the container 100 with the lid of the container 100 open. The lid is fixed to the main body of the container 100. An opening hole is formed in the lid. Air is removed from the inside of the container 100 through the opening hole by using a vacuum pump (not shown) or the like. Then, the opening hole is closed. In this way, the refrigerant COO is sealed in the container 100. As a result, the pressure in the container 100 becomes equal to the saturated vapor pressure of the refrigerant COO, and the boiling point of the refrigerant COO sealed in the container 100 becomes close to room temperature.

As described above, the manufacturing method of the electronic device 1000 has been described.

Next, the operation of the electronic device 1000 will be described.

When the electronic device 1000 is activated, the heating element 300 starts operating. As a result, the heating element 300 generates heat. When the heating element 300 generates heat, the heat of the heating element 300 is transferred to the straightening vane 400 and the liquid phase refrigerant LP-COO. Further, the liquid phase refrigerant LP-COO in the container 100 is boiled by the heat of the heating element 300 on the surface of the heating element 300 or the rectifying plate 400, and the phase changes to the gas phase refrigerant GP-COO. In this way, latent heat exchange is performed around the surface of the heating element 300 or the straightening vane 400, and bubbles of the gas phase refrigerant GP-COO are generated as shown in FIG. 1A. Note that FIG. 1B does not show bubbles of the gas phase refrigerant GP-COO for convenience of drawing. The heat generated by the heating element 300 is dissipated by the heat of vaporization (latent heat) generated by this phase change. As a result, the heating element 300 is cooled.

The gas-phase refrigerant GP-COO passes through the liquid-phase refrigerant LP-COO toward the upper side in the vertical direction G along each rectifying plate 400, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further in the vertical direction G. Heading upwards. Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 300 is cooled by coming into contact with the inner wall surface of the container 100, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the container 100 below the vertical direction G, accumulates on the lower side of the container 100 in the vertical direction G, and is used again for cooling the heating element 300.

Here, as shown in FIGS. 1A and 1B, the plurality of straightening vanes 400a to 400e are arranged so as to overlap each other along the vertical direction G with a gap. Further, each of the plurality of straightening vanes 400a to 400e is provided so as to extend toward the surface side of the inner surface of the container 100 facing the main surface 201 of the circuit board 200.

Therefore, the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the inner surface of the container 100 of the circuit board 200. The inside of the liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201. Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are suppressed from flowing toward the heating element 300a on the upper side in the vertical direction G. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G adhere to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Is suppressed.

The bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300a on the upper side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the inner surface of the container 100 of the circuit board 200. The inside of the liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201.

The operation of the electronic device 1000 has been described above.

As described above, the electronic device 1000 according to the first embodiment of the present invention includes a container 100, a circuit board 200, a plurality of heating elements 300, and a plurality of straightening vanes 400. The container 100 is for enclosing the refrigerant COO that undergoes a phase change between the liquid phase refrigerant LP-COO and the gas phase refrigerant GP-COO. The circuit board 200 is provided in the container 100 so that the main surface 201 extends along the vertical direction G. The plurality of heating elements 300 are mounted on the circuit board 200 along the vertical direction G so as to be immersed in the liquid phase refrigerant LP-COO. The plurality of straightening vanes 400 are formed of a heat conductive member. Further, the plurality of straightening vanes 400 are arranged so as to overlap each other along the vertical direction G with a gap. Further, the plurality of straightening vanes 400 are provided so as to extend toward the surface side of the inner surface of the container 100 facing the main surface 201 of the circuit board 200. Further, the plurality of straightening vanes 400 are attached to at least one of the plurality of heating elements 300.

As described above, the plurality of straightening vanes 400 are attached to at least one of the plurality of heating elements 300, and are formed of a heat conductive member. As a result, the plurality of straightening vanes 400 can receive the heat of the heating element 300 and transfer it to the liquid phase refrigerant LP-COO. Further, the plurality of straightening vanes 400 are arranged so as to overlap each other along the vertical direction G with a gap between them, and extend toward the inner surface of the container 100 facing the main surface 201 of the circuit board 200. It is provided as follows.

Therefore, the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the inner surface of the container 100 of the circuit board 200. The inside of the liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201. Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are suppressed from flowing toward the heating element 300a on the upper side in the vertical direction G. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G adhere to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Is suppressed.

Therefore, the bubbles of the vapor phase refrigerant GP-COO adhere to the surfaces of the heating element 300 and the rectifying plate 400, so that the contact area between the surfaces of the heating element 300 and the rectifying plate 400 and the liquid phase refrigerant LP-COO becomes small. Can be suppressed. As a result, the heating element 300 can be efficiently cooled.

As described above, according to the electronic device 1000 according to the present embodiment, the plurality of heating elements 300 are moved in the vertical direction G by using the refrigerant COO whose phase changes between the liquid phase refrigerant LP-COO and the gas phase refrigerant GP-COO. Even when mounted on the circuit board 200 along the line, the heating element 300 on the upper side in the vertical direction G can be cooled more efficiently.

Here, when the bubbles of the vapor-phase refrigerant GP-COO are attached to the surface of the heating element 300 or the rectifying plate 400, and the bubbles of the vapor-phase refrigerant GP-COO are attached to the surface of the heating element 300 or the rectifying plate 400. The cooling efficiency of the heat of the heating element 300 will be described with reference to the case where the heating element is not used.

When the bubbles of the vapor phase refrigerant GP-COO are not attached to the surface of the heating element 300 or the rectifying plate 400, the heat of the heating element 300 is directly from the surface of the heating element 300 or the rectifying plate 400 to the liquid phase refrigerant LP. -Transferred to the COO. At this time, latent heat exchange is performed on the surface of the heating element 300 or the rectifying plate 400 by changing the phase of the liquid phase refrigerant LP-COO to the vapor phase refrigerant GP-COO by the heat of the heating element 300.

On the other hand, when bubbles of the vapor-phase refrigerant GP-COO are attached to the surface of the heating element 300 or the rectifying plate 400, most of the heat of the heating element 300 is from the heating element 300 or the rectifying plate 400. Only the bubbles of the refrigerant GP-COO can be transmitted. At this time, on the surface of the heating element or fin, the bubbles of the vapor-phase refrigerant adhering to these surfaces receive the heat of the heating element, so that the actual heat exchange is performed. When the heat of the heating element 300 is transferred to the bubbles of the gas phase refrigerant GP-COO, the bubbles of the vapor phase refrigerant GP-COO expand. Since the buoyancy of the bubbles of the vapor-phase refrigerant GP-COO is larger than the surface tension of the bubbles, the bubbles of the vapor-phase refrigerant GP-COO are separated from the surface of the heating element 300 or the rectifying plate 400. Then, immediately, the bubbles of another gas phase refrigerant GP-COO adhere to the place where the bubbles of the gas phase refrigerant GP-COO are separated. At this time, the same bubbles of the vapor-phase refrigerant GP-COO adhere to the surface of the heating element 300 or the straightening vane 400 for a short time, and are sequentially replaced with new bubbles. Therefore, only a small amount of heat of the heating element 300 is transferred to the liquid phase refrigerant LP-COO through the bubbles of the gas phase refrigerant GP-COO.

Further, the convection heat transfer coefficient due to the temperature change (sensible heat) of the gas phase refrigerant GP-COO is smaller than the evaporation heat transfer coefficient due to the phase change (latent heat) from the liquid phase refrigerant LP-COO to the gas phase refrigerant GP-COO. .. Therefore, when the bubbles of the vapor-phase refrigerant GP-COO are attached to the surface of the heating element 300 or the rectifying plate 400, the bubbles of the vapor-phase refrigerant GP-COO are attached to the surface of the heating element 300 or the rectifying plate 400. The cooling efficiency of the heating element 300 is lower than that in the case where it is not attached.

Therefore, the heat of the heating element 300 can be cooled more efficiently by suppressing the bubbles of the vapor-phase refrigerant GP-COO from adhering to the surface of the heating element 300 or the rectifying plate 400.

As described above, the bubbles of the vapor-phase refrigerant GP-COO are not attached to the surface of the heating element 300 or the rectifying plate 400, and the bubbles of the vapor-phase refrigerant GP-COO are attached to the surface of the heating element 300 or the rectifying plate 400. The cooling efficiency of the heat of the heating element 300 was explained with reference to the case where there was no such case.

Further, in the electronic device 1000 according to the first embodiment of the present invention, each of the plurality of straightening vanes 400 is the main surface 201 of the circuit board 200 and each straightening vane in the direction perpendicular to the main surface 201 of the circuit board 200. It is attached to the heating element 300 so that the distance between the 400s gradually increases as it goes upward in the vertical direction G.

As a result, the bubbles of the vapor-phase refrigerant GP-COO move upward in the vertical direction G and away from the main surface 201 of the circuit board 200. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G are transferred to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Adhesion can be suppressed more reliably.

<First modification of the electronic device of the first embodiment>
The configuration of the electronic device 1000A, which is a first modification of the electronic device 1000 according to the first embodiment of the present invention, will be described. FIG. 2A is a transmission side view showing the configuration of the electronic device 1000A. FIG. 2B is a transmission front view showing the configuration of the electronic device 1000A through the electronic device 1000A, and is a diagram showing the configuration seen through the electronic device 1000A in the direction of the arrowhead BA of FIG. 2A.

As shown in FIGS. 2A and 2B, the electronic device 1000A includes a container 100, a circuit board 200, a plurality of heating elements 300a and 300b, and a plurality of straightening vanes 400a to 400e.

Here, the electronic device 1000A and the electronic device 1000 are compared. The electronic device 1000A differs from the electronic device 1000 in that it has a plurality of heat radiation fins 500.

As shown in FIGS. 2A and 2B, the plurality of heat radiation fins 500 are attached to the outside of the upper plate of the container 100 (the plate on the upper side of the paper in FIGS. 2A and 2B).

The plurality of heat radiation fins 500 may be integrated with the container 100 or may be separate bodies. As the material of the plurality of heat radiation fins 500, for example, a metal material (for example, aluminum, an aluminum alloy, or stainless steel) is used.

By attaching the plurality of heat radiating fins 500 to the outer surface of the container 100 in this way, the heat of the heating element 300 received by the container 100 can be more efficiently radiated to the outside air.

In particular, the bubbles of the vapor-phase refrigerant GP-COO flow along the straightening vane 400, and when they cross the tip of the straightening vane 400, they go upward in the vertical direction G. Therefore, when the straightening vane 400 is not close to the surface of the inner surface of the container 100 facing the main surface 201 of the circuit board 200, most of the bubbles of the gas phase refrigerant GP-COO are on the inner surface of the container 100. Then, it collides with the inner surface of the upper plate (the plate on the upper side of the paper in FIGS. 2A and 2B) rather than the surface of the circuit board 200 facing the main surface 201.

Therefore, when the straightening vane 400 is not close to the inner surface of the container 100 facing the main surface 201 of the circuit board 200, the upper plate of the container 100 (the upper plate of the paper in FIGS. 2A and 2B). By attaching a plurality of heat radiating fins 500 to the outside of the container 100, the heat of the heating element 300 received by the container 100 can be radiated to the outside air more efficiently.

When the straightening vane 400 is close to the surface of the inner surface of the container 100 facing the main surface 201 of the circuit board 200, for example, the main surface of the circuit board 200 is the inner surface of the container 100. This refers to a case where the distance between the surface facing 201 and the tip of the straightening vane 400 is within several mm to several cm.

<Second variant of the electronic device of the first embodiment>
The configuration of the electronic device 1000B, which is a second modification of the electronic device 1000 according to the first embodiment of the present invention, will be described. FIG. 3A is a transmission side view showing the configuration of the electronic device 1000B through. FIG. 3B is a side view showing the configuration of the electronic device 1000B, and is a diagram showing a configuration in which the appearance of the electronic device 1000B is viewed in the direction of the arrow CA in FIG. 3A.

As shown in FIGS. 3A and 3B, the electronic device 1000B includes a container 100, a circuit board 200, a plurality of heating elements 300a and 300b, and a plurality of straightening vanes 400a to 400e.

Here, the electronic device 1000B and the electronic device 1000 are compared. The electronic device 1000B differs from the electronic device 1000 in that it has a plurality of heat radiation fins 600.

As shown in FIGS. 3A and 3B, the plurality of heat radiation fins 600 are attached to the outside of the side surface of the container 100, which faces the main surface 210 of the circuit board 200.

The plurality of heat radiation fins 600 may be integrated with the container 100 or may be separate bodies. As the material of the plurality of heat radiation fins 600, for example, a metal material (for example, aluminum, an aluminum alloy, or stainless steel) is used.

By attaching the plurality of heat radiating fins 600 to the outer surface of the container 100 in this way, the heat of the heating element 300 received by the container 100 can be radiated to the outside air more efficiently. That is, the heat from the heating element 300 in contact with the plate facing the main surface 210 of the circuit board 200 on the side surface of the container 100 is dissipated to the outside air through the plurality of heat radiating fins 600.

In particular, the bubbles of the vapor-phase refrigerant GP-COO flow along the straightening vane 400, and when they cross the tip of the straightening vane 400, they go upward in the vertical direction G. However, when the straightening vane 400 is close to the surface of the inner surface of the container 100 facing the main surface 201 of the circuit board 200, most of the bubbles of the gas phase refrigerant GP-COO are on the inner surface of the container 100. Then, it collides with the surface of the circuit board 200 facing the main surface 201 rather than the inner surface of the upper plate (the plate on the upper side of the paper in FIGS. 2A and 2B).

Therefore, when the rectifying plate 400 is close to the surface of the container 100 facing the main surface 201 of the circuit board 200, the outside of the container 100 facing the main surface 201 of the circuit board 200. By attaching a plurality of heat radiating fins 600 to the container 100, the heat of the heating element 300 received by the container 100 can be radiated to the outside air more efficiently.

When the straightening vane 400 is close to the surface of the inner surface of the container 100 facing the main surface 201 of the circuit board 200, for example, as described above, the circuit board is on the inner surface of the container 100. This refers to a case where the distance between the surface of the 200 facing the main surface 201 and the tip of the straightening vane 400 is within several mm to several cm.

Further, in addition to the heat radiation fin 600, the heat radiation fin 500 may be further attached to the outside of the container 100. That is, both the heat radiation fin 500 and the heat radiation fin 600 may be attached to the outside of the container 100. As a result, the heat from the heating element 300 can be radiated to the outside air by both the heat radiating fin 500 and the heat radiating fin 600.

<Second Embodiment>
The configuration of the electronic device 1000C according to the second embodiment of the present invention will be described. FIG. 4A is a transmission side view showing the configuration of the electronic device 1000C through. FIG. 4B is a transmission front view showing the configuration of the electronic device 1000C through the electronic device 1000C, and is a diagram showing the configuration seen through the electronic device 1000C in the direction of the arrowhead DA of FIG. 4A. In addition, in FIG. 4A and FIG. 4B, the vertical direction G is shown for convenience of explanation.

As shown in FIGS. 4A and 4B, the electronic device 1000C includes a container 100, a circuit board 200, a plurality of heating elements 300a and 300b, and a plurality of straightening vanes 400a to 400e.

Here, the electronic device 1000C in the present embodiment is compared with the electronic device 1000 in the first embodiment.

As shown in FIGS. 1A and 1B, in the electronic device 1000, the plurality of straightening vanes 400a to 400e were attached to both the heating element 300a and the heating element 300b. On the other hand, in the electronic device 1000C, the plurality of straightening vanes 400a to 400e are attached only to the heating element 300a on the upper side in the vertical direction G. In this respect, the two differ from each other.

When three or more heating elements 300 are provided, the rectifying plate 400 is attached only to the heating element 300 on the upper side of the vertical direction G among the two heating elements 300 adjacent to each other in the vertical direction G at least. It is assumed that the rectifying plate 400 is not attached to the heating element 300 on the lower side in the vertical direction G.

Next, the operation of the electronic device 1000C will be described.

When the electronic device 1000C is activated, the heating elements 300a and 300b start operating. As a result, the heating elements 300a and 300b generate heat.

When the heating element 300a generates heat, the heat of the heating element 300a is transferred to the straightening vane 400 and the liquid phase refrigerant LP-COO. When the heating element 300b generates heat, the heat of the heating element 300 is transferred to the liquid phase refrigerant LP-COO.

Further, the liquid phase refrigerant LP-COO in the container 100 is boiled by the heat of the heating element 300 on the surface of the heating element 300 or the rectifying plate 400, and the phase changes to the gas phase refrigerant GP-COO. In this way, latent heat exchange is performed around the surface of the heating element 300 or the straightening vane 400, and bubbles of the vapor phase refrigerant GP-COO are generated as shown in FIG. 4A. Note that FIG. 4B does not show bubbles of the gas phase refrigerant GP-COO for convenience of drawing. The heat generated by the heating element 300 is dissipated by the heat of vaporization (latent heat) generated by this phase change. As a result, the heating element 300 is cooled.

Here, as shown in FIGS. 4A and 4B, the plurality of straightening vanes 400a to 400e are arranged so as to overlap each other along the vertical direction G with a gap. Further, each of the plurality of straightening vanes 400a to 400e is provided so as to extend toward the surface side of the inner surface of the container 100 facing the main surface 201 of the circuit board 200.

Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300a on the upper side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the inner surface of the container 100 of the circuit board 200. The inside of the liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201.

Further, the bubbles of the vapor phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G go vertically to the upper side of the vertical direction G immediately after the generation, and the heating element 300a on the upper side of the vertical direction G Collides with the rectifying plate 400e attached to. Then, after the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G collide with the rectifying plate 400e, the bubbles of the circuit board 200 on the inner surface of the container 100 along the rectifying plate 400e The liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201. The straightening vane 400e is a straightening vane provided on the lowermost side in the vertical direction G among the plurality of straightening vanes 400.

Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 300 is cooled by coming into contact with the inner wall surface of the container 100, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the container 100 in the vertical direction G, accumulates on the lower side of the container 100 in the vertical direction G, and is used again for cooling the heating element 300.

As described above, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are mainly generated by the rectifying plate 400e along the rectifying plate 400e from the inner surface of the container 100 on the circuit board 200. The adjustment is made so as to face the surface side facing the surface 201 and away from the main surface 201 of the circuit board 200.

Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are parallel to the surface of the heating element 300a on the upper side in the vertical direction G (parallel to the main surface 201 of the circuit board 200). Flow toward the surface) is suppressed. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G adhere to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Is suppressed.

The operation of the electronic device 1000C has been described above.

The electronic device 1000C according to the second embodiment of the present invention, like the electronic device 1000 according to the first embodiment, includes a container 100, a circuit board 200, a plurality of heating elements 300, and a plurality of straightening vanes 400. And have. Therefore, according to the electronic device 1000C, the same effect as that of the electronic device 1000 of the first embodiment can be obtained. In the electronic device 1000C of the present embodiment, since the rectifying plate 400 is not mounted on the heating element 300b on the lower side of the vertical direction G, the vertical direction G is compared with the electronic device 1000 of the first embodiment. The contact area between the heating element 300b on the lower side and the liquid phase refrigerant LP-COO is reduced. Further, when the heating element of the heating element 300b on the lower side in the vertical direction G is smaller than the heating element 300a on the upper side in the vertical direction G, the present embodiment can be effectively used.

<Third embodiment>
The configuration of the electronic device 1000D according to the third embodiment of the present invention will be described. FIG. 5A is a transmission side view showing the configuration of the electronic device 1000D. FIG. 5B is a transmission front view showing the configuration of the electronic device 1000D through the electronic device 1000D, and is a diagram showing the configuration seen through the electronic device 1000D in the direction of the arrow EA of FIG. 5A. In addition, in FIG. 5A and FIG. 5B, the vertical direction G is shown for convenience of explanation.

As shown in FIGS. 5A and 5B, the electronic device 1000D includes a container 100, a circuit board 200, a plurality of heating elements 300a and 300b, and a plurality of straightening vanes 400a to 400e.

Here, the electronic device 1000D in the present embodiment is compared with the electronic device 1000 in the first embodiment.

As shown in FIGS. 1A and 1B, in the electronic device 1000, the plurality of straightening vanes 400a to 400e were attached to both the heating element 300a and the heating element 300b. On the other hand, in the electronic device 1000D, the plurality of straightening vanes 400a to 400e are attached only to the heating element 300b on the lower side in the vertical direction G. In this respect, the two differ from each other.

Further, the electronic device 1000D in the present embodiment is compared with the electronic device 1000C in the second embodiment.

As shown in FIGS. 4A and 4B, in the electronic device 1000C, the plurality of straightening vanes 400a to 400e are attached only to the heating element 300a on the upper side in the vertical direction G. On the other hand, in the electronic device 1000D, the plurality of straightening vanes 400a to 400e are attached only to the heating element 300b on the lower side in the vertical direction G. In this respect, the two differ from each other.

When three or more heating elements 300 are provided, the rectifying plate 400 is attached only to the heating element 300 on the lower side of the vertical direction G among the two heating elements 300 adjacent to each other in the vertical direction G at least. It is assumed that the rectifying plate 400 is not attached to the heating element 300 on the upper side in the vertical direction G.

Next, the operation of the electronic device 1000D will be described.

When the electronic device 1000D is activated, the heating elements 300a and 300b start operating. As a result, the heating elements 300a and 300b generate heat.

When the heating element 300a generates heat, the heat of the heating element 300 is transferred to the liquid phase refrigerant LP-COO. When the heating element 300b generates heat, the heat of the heating element 300b is transferred to the straightening vane 400 and the liquid phase refrigerant LP-COO.

Further, the liquid phase refrigerant LP-COO in the container 100 is boiled by the heat of the heating element 300 on the surface of the heating element 300 or the rectifying plate 400, and undergoes a phase change to the gas phase refrigerant GP-COO. In this way, latent heat exchange is performed around the surface of the heating element 300 or the straightening vane 400, and bubbles of the gas phase refrigerant GP-COO are generated as shown in FIG. 5A. Note that FIG. 5B does not show bubbles of the gas phase refrigerant GP-COO for convenience of drawing. The heat generated by the heating element 300 is dissipated by the heat of vaporization (latent heat) generated by this phase change. As a result, the heating element 300 is cooled.

The vapor-phase refrigerant GP-COO generated around the heating element 300a on the upper side of the vertical direction G goes almost vertically upward in the vertical direction G, passes over the liquid surface of the liquid-phase refrigerant LP-COO, and further in the vertical direction. Head upwards on G.

The gas-phase refrigerant GP-COO generated around the heating element 300b on the lower side of the vertical direction G goes upward in the vertical direction G along each rectifying plate 400 in the liquid-phase refrigerant LP-COO, and the liquid-phase refrigerant LP -Passes above the liquid surface of the COO and further upwards in the vertical direction G.

Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 300 is cooled by coming into contact with the inner wall surface of the container 100, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the container 100 below the vertical direction G, accumulates on the lower side of the container 100 in the vertical direction G, and is used again for cooling the heating element 300.

Here, as shown in FIGS. 5A and 5B, the plurality of straightening vanes 400a to 400e are arranged so as to overlap each other along the vertical direction G with a gap. Further, each of the plurality of straightening vanes 400a to 400e is provided so as to extend toward the surface side of the inner surface of the container 100 facing the main surface 201 of the circuit board 200.

Therefore, the bubbles of the gas phase refrigerant generated by the heat of the heating element 300b on the lower side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but are on the inner surface of the container 100 along the straightening plate 400. The inside of the liquid phase refrigerant LP-COO rises toward the surface side facing the main surface 201 of the circuit board 200 and away from the main surface 201 of the circuit board 200. Then, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G go vertically to the upper side in the vertical direction G after passing through the tip end portion of the straightening vane 400.

Further, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300a on the upper side of the vertical direction G go vertically to the upper side of the vertical direction G immediately after the generation.

Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are parallel to the surface of the heating element 300a on the upper side in the vertical direction G (parallel to the main surface 201 of the circuit board 200). Flow toward the surface) is suppressed. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G adhere to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Is suppressed.

The operation of the electronic device 1000D has been described above.

The electronic device 1000D according to the third embodiment of the present invention, like the electronic device 1000 according to the first embodiment, includes a container 100, a circuit board 200, a plurality of heating elements 300, and a plurality of straightening vanes 400. And have. Therefore, according to the electronic device 1000D, the same effect as that of the electronic device 1000 of the first embodiment can be obtained. In the electronic device 1000D of the present embodiment, since the rectifying plate 400 is not mounted on the heating element 300a on the upper side of the vertical direction G, the vertical direction G is compared with the electronic device 1000 of the first embodiment. The contact area between the heating element 300a on the upper side and the liquid phase refrigerant LP-COO is reduced. Further, when the heating element of the heating element 300a on the upper side in the vertical direction G is smaller than the heating element 300b on the lower side in the vertical direction G, the present embodiment can be effectively used.

<Rectifier member>
Next, the configuration of the rectifying member 700 will be described. FIG. 6 is a perspective view showing the configuration of the rectifying member 700.

Here, in the electronic devices 1000, 1000A, 1000B, 1000C and 1000D, the plurality of straightening vanes 400 were directly attached to the heating element 300. On the other hand, a rectifying member 700 including a plurality of rectifying plates 400 may be attached to the heating element 300.

As shown in FIG. 6, the straightening vane 700 includes a plurality of straightening vanes 400, a base plate 800, and a hinge 900. Note that FIG. 6 shows the vertical direction G for convenience of explanation.

The rectifying member 700 is attached to either or both of the heating element 300a on the upper side in the vertical direction G and the heating element 300b on the lower side in the vertical direction G.

Each of the plurality of straightening vanes 400 is attached to the base plate 800 via a hinge 900. The plurality of straightening vanes 400 are arranged so as to overlap each other with a gap between them.

The base plate 800 is formed in a flat plate shape. A heat conductive member (for example, aluminum, aluminum alloy, or stainless steel) is used as the material of the base plate 800.

The hinge 900 connects the plurality of straightening vanes 400 and the base plate 800 so that each of the plurality of straightening vanes 400 can rotate. At this time, each of the plurality of straightening vanes 400 can rotate about the hinge 900. For the hinge 900, for example, a hinge having a free stop specification can be used. The free-stop hinge is a hinge that can be stationary by fixing the angle between the members connected to the hinge to an arbitrary angle. By using this free-stop hinge, the angle between the straightening vane 400 and the base plate 800 can be fixed at an arbitrary angle to hold the straightening vane 400 on the base plate 800. A thermally conductive member (for example, aluminum, aluminum alloy, or stainless steel) is used as the material of the hinge 900. For the hinge 900, for example, a LAMP torque hinge HG-TS type manufactured by Sugatsune Industries can be used as a hinge having a free stop specification.

Further, among the plurality of straightening vanes 400, the rigidity between the straightening vanes 400 adjacent to each other is increased so that the plurality of straightening vanes 400 are parallel to each other and the distances between the straightening vanes 400 are the same. It is connected by a wire (not shown). As a result, all of the plurality of straightening vanes 400 can rotate around the hinge 900 in conjunction with each other. At this time, the angles formed by each of the plurality of straightening vanes 400 and the base plate 800 are the same.

The surface of the base plate 800 to which the straightening vane 400 is not attached is fixed to the surface of the heating element 300 with an adhesive. A hook claw may be provided on the base plate 800, and the base plate 800 may be fixed to the heating element 300 by using the hook claw. As a result, the rectifying member 700 can be attached to the heating element 300.

As described above, the plurality of straightening vanes 400 can be integrally attached to the base plate 800. As a result, a plurality of straightening vanes 400 can be easily attached to the heating element 300 simply by fixing the base plate 800 to the heating element 300.

<First modification of the rectifying member>
Next, the configuration of the rectifying member 700A, which is a first modification of the rectifying member 700, will be described. FIG. 7 is a perspective view showing the configuration of the rectifying member 700A. Note that FIG. 7 shows the vertical direction G for convenience of explanation. FIG. 8 is a plan view showing an example of the straightening vane, and is a diagram showing a configuration in which the straightening vane 400A is viewed in the direction of arrow Z.

As shown in FIG. 7, the rectifying member 700A includes rectifying plates 400 and 400A, a base plate 800, and a hinge 900.

Here, the rectifying member 700 shown in FIG. 6 is compared with the rectifying member 700A shown in FIG. 7.

As shown in FIG. 6, in the rectifying member 700, a plurality of the same rectifying plates 400 are connected to the base plate 800 by a hinge 900. On the other hand, as shown in FIG. 7, in the rectifying member 700A, two types of rectifying plates 400 and 400A are connected to the base plate 800 by a hinge 900. In this respect they differ from each other.

Further, the straightening vane 400 does not have a through hole 410. On the other hand, the straightening vane 400A has a through hole 410.

As shown in FIG. 7, in the rectifying member 700A, the rectifying plate 400 having no through hole 410 is provided on the lowermost side in the vertical direction G. Further, the straightening vane 400A having the through hole 410 is provided in the vertical direction G other than the lowermost side.

As shown in FIG. 8, the through hole 410 is formed on the end side of the straightening vane 400A on the base plate 800 side. Since the base plate 800 is attached to the heating element 300, the through hole 410 is formed at the end of the rectifying plate 400A on the heating element 300 side. Further, the through hole 410 is arranged at the center in the direction along the connecting line between the straightening vane 400A and the base plate 800.

As described above, the electronic device according to the embodiment of the present invention includes a through hole 410 formed in at least one (rectifying plate 400A) of the plurality of straightening plates 400 and 400A. As a result, the bubbles of the gas-phase refrigerant GP-COO stagnant in the straightening vane 400 (or 400A) and the liquid-phase refrigerant LP-COO can flow upward in the vertical direction G through the through holes 410.

That is, the specific gravity of the gas phase refrigerant GP-COO is smaller than the specific gravity of the liquid phase refrigerant LP-COO. Therefore, by providing the through hole 410 in the straightening vane 400A, bubbles of the gas phase refrigerant GP-COO flow to the upper side in the vertical direction G through the through hole 410. Further, the specific gravity of the liquid-phase refrigerant LP-COO generally tends to decrease as the temperature rises. Therefore, since the liquid-phase refrigerant LP-COO stagnant in the straightening vane 400 (or 400A) is heated by the heat of the heating element 300, it flows upward in the vertical direction G through the through hole 410.

Therefore, by forming the through hole 410 in the straightening vane 400A, the bubbles of the gas phase refrigerant GP-COO stagnant in the straightening vane 400 (or 400A) and the liquid phase refrigerant LP-COO are passed through the through hole 410. It can flow upward in the vertical direction.

Further, in the electronic device according to the embodiment of the present invention, it is formed on at least one of the plurality of straightening vanes 400 and 400A (rectifying plate 400A) other than the lowermost straightening vane in the vertical direction G. It is provided with a through hole 410. That is, the straightening vane 400 in which the through hole 410 is not formed is arranged on the lowermost side in the vertical direction G. Further, a rectifying plate 400A having a through hole 410 is arranged in at least one of the rectifying plates except on the lowermost side in the vertical direction G.

Such a configuration is realized by, for example, the rectifying member 700A shown in FIG. 7. Further, in particular, when the rectifying member 700A is attached to the heating element 300a on the upper side in the vertical direction G as in the configuration shown in FIGS. 4A and 4B, the heating element 300 can be cooled more efficiently.

In this case, the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating element 300a on the upper side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the inner surface of the container 100, the circuit board 200. The inside of the liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201. Further, bubbles of the gas phase refrigerant GP-COO and the liquid phase refrigerant LP-COO stagnant between the rectifying plates of the rectifying member 700A flow to the upper side in the vertical direction G through the through hole 410. Therefore, the circulation of the refrigerant COO in the container 100 can be promoted.

On the other hand, in the rectifying member 700A attached to the heating element 300a on the upper side in the vertical direction G, the rectifying plate 400A in which the through hole 410 is not formed is arranged on the lowermost side in the vertical direction G. Therefore, the bubbles of the vapor phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G go vertically to the upper side of the vertical direction G immediately after the generation, and the heating element on the upper side of the vertical direction G. It collides with the lowermost rectifying plate 400 of the rectifying member 700A attached to the 300a. Then, after the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G collide with the rectifying plate 400, the bubbles of the circuit board 200 on the inner surface of the container 100 along the rectifying plate 400 The liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201.

Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are parallel to the surface of the heating element 300a on the upper side in the vertical direction G (parallel to the main surface 201 of the circuit board 200). Flow toward the surface) is suppressed. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G adhere to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Is suppressed.

Further, in the electronic device according to the embodiment of the present invention, the through hole 410 is formed at the end of the rectifying plate 400A on the heating element 300 side. As a result, among the bubbles of the gas phase refrigerant GP-COO or the liquid phase refrigerant LP-COO stagnant between the rectifying plates of the rectifying member 700A, especially the bubbles of the gas phase refrigerant GP-COO are vertically passed through the through hole 410. It can flow upward in the direction G.

That is, in the rectifying plate 400A, the temperature on the side closer to the heating element 300 (the root side of the rectifying plate 400A) is higher than that on the side distant from the heating element 300 (the tip side of the rectifying plate 400A). The amount of bubbles in the refrigerant GP-COO is large. Therefore, by forming the through hole 410 on the heating element 300 side of the straightening vane 400A, the bubbles of the gas phase refrigerant GP-COO are more positively passed through the through hole 410 as compared with the liquid phase refrigerant LP-COO. Therefore, it can flow upward in the vertical direction G.

On the other hand, in the electronic device according to the embodiment of the present invention, the through hole 410 may be formed at the end (tip side) of the rectifying plate 400A opposite to the heating element 300 side. FIG. 9 is a plan view showing an example of the straightening vane, showing a through hole 410 formed on the tip end side of the straightening vane 400B.

As shown in FIG. 9, a through hole 410 is formed at an end (tip side) of the straightening vane 400B opposite to the heating element 300 side. In the rectifying member 700A shown in FIG. 7, a rectifying plate 400B can be used instead of the rectifying plate 400A.

As a result, among the bubbles of the gas-phase refrigerant GP-COO or the liquid-phase refrigerant LP-COO stagnant between the rectifying plates of the rectifying member 700A, particularly the liquid-phase refrigerant LP-COO is passed through the through hole 410 in the vertical direction G. Can be flushed to the upper side of.

That is, in the rectifying plate 400B, on the side away from the heating element 300 (the tip side of the rectifying plate 400A), the liquid phase refrigerant LP-COO is more than the side closer to the heating element 300 (the root side of the rectifying plate 400B). The amount is large. Therefore, by forming a through hole 410 at the end (tip) of the rectifying plate 400B opposite to the heating element 300 side, the liquid phase refrigerant LP-COO can be compared with the bubbles of the gas phase refrigerant GP-COO. More positively, it can flow upward in the vertical direction G through the through hole 410.

Further, in the electronic device according to the embodiment of the present invention, two through holes 410 may be formed in the straightening vane 400C. FIG. 10 is a plan view showing an example of the straightening vane, and is a diagram showing two through holes 410 formed in the straightening vane 400C. In the rectifying member 700A shown in FIG. 7, a rectifying plate 400C can be used instead of the rectifying plate 400A. The first through hole 410 is formed at the end of the straightening plate 400C on the heating element 300 side, similarly to the straightening plate 400A. The second through hole 410 is formed at the end (tip side) of the rectifying plate 400C opposite to the heating element 300 side, similarly to the rectifying plate 400B.

As a result, both the effect of the straightening vane 400A and the effect of the straightening vane 400B can be achieved. That is, by forming the through hole 410 on the heating element 300 side of the straightening vane 400C, the bubbles of the gas phase refrigerant GP-COO are more positively passed through the through hole 410 as compared with the liquid phase refrigerant LP-COO. Therefore, it can flow upward in the vertical direction G. At the same time, by forming a through hole 410 at the end (tip) opposite to the heating element 300 side of the rectifying plate 400C, the liquid phase refrigerant LP-COO is compared with the bubbles of the gas phase refrigerant GP-COO. Can be more aggressively flowed upward in the vertical direction G through the through hole 410.

Further, in the electronic device according to the embodiment of the present invention, the through hole 420 may be formed in a slit shape so as to extend between the heating element 300 side and the tip end side of the straightening vane 400D. ..

FIG. 11 is a plan view showing an example of the straightening vane, and is a diagram showing a slit-shaped through hole 420 formed in the straightening vane 400D. In the rectifying member 700A shown in FIG. 7, a rectifying plate 400D can be used instead of the rectifying plate 400A.

As a result, both the effect of the straightening vane 400A and the effect of the straightening vane 400B can be achieved. That is, by forming the through hole 410 in a slit shape, the heating element 300 side of the through hole 430 penetrates the bubbles of the gas phase refrigerant GP-COO more positively than the liquid phase refrigerant LP-COO. It can flow upward in the vertical direction G through the hole 410. At the same time, on the side of the through hole 430 opposite to the heating element 300 (tip side), the liquid phase refrigerant LP-COO is more positively passed through the through hole 410 than the bubbles of the gas phase refrigerant GP-COO. Therefore, it can flow upward in the vertical direction G.

Further, in the electronic device according to the embodiment of the present invention, the through hole 430 may be formed in a slit shape so as to extend between the heating element 300 side and the tip end side of the straightening vane 400D. ..

Further, among the lengths of the through holes 430, the length of the width in the direction parallel to the main surface of the circuit board 200 is from the tip side of the straightening vane 400E (opposite side of the heating element 300) to the heating element 300 side. It may be set to be larger toward the end.

FIG. 12 is a plan view showing an example of the straightening vane, showing a slit-shaped through hole 430 having a variable width and length formed in the straightening vane 400E. In the rectifying member 700A shown in FIG. 7, a rectifying plate 400E can be used instead of the rectifying plate 400A.

As a result, both the effect of the straightening vane 400A and the effect of the straightening vane 400B can be achieved as in the straightening vane 400D. That is, by forming the through hole 410 in a slit shape so that the width of the heating element 300 side becomes larger, the heating element 300 side of the through hole 430 is compared with the liquid phase refrigerant LP-COO. The bubbles of the vapor-phase refrigerant GP-COO can be more positively flowed to the upper side in the vertical direction G through the through hole 410. At the same time, on the side of the through hole 430 opposite to the heating element 300 (tip side), the liquid phase refrigerant LP-COO is more positively passed through the through hole 410 than the bubbles of the gas phase refrigerant GP-COO. Therefore, it can flow upward in the vertical direction G. Further, by forming the straightening vane 400E so that the width of the tip side (opposite side to the heating element 300) becomes small, the liquid phase refrigerant LP-COO is rectified on the tip side of the straightening vane 400E. The area in contact with the 400E can be maximized. Therefore, the heat of the heating element 300 can be cooled more efficiently.

<Second modification of the rectifying member>
Next, the configuration of the rectifying member 700B, which is a second modification of the rectifying member 700, will be described. FIG. 13 is a perspective view showing the configuration of the rectifying member 700B. Note that FIG. 13 shows the vertical direction G for convenience of explanation.

As shown in FIG. 13, the rectifying member 700B includes rectifying plates 400 and 400A, a base plate 800, and a hinge 900.

Here, the rectifying member 700 shown in FIG. 6 is compared with the rectifying member 700B shown in FIG.

As shown in FIG. 6, in the rectifying member 700, a plurality of the same rectifying plates 400 are connected to the base plate 800 by a hinge 900. On the other hand, as shown in FIG. 13, in the rectifying member 700B, two types of rectifying plates 400 and 400A are connected to the base plate 800 by a hinge 900. In this respect they differ from each other.

Further, the rectifying member 700A shown in FIG. 7 and the rectifying member 700B shown in FIG. 13 are compared.

As shown in FIG. 7, in the rectifying member 700A, the rectifying plate 400 having no through hole 410 is provided on the lowermost side in the vertical direction G. Further, in addition to the rectifying plate on the lowermost side in the vertical direction G, a rectifying plate 400A having a through hole 410 is used.

On the other hand, as shown in FIG. 13, in the rectifying member 700B, the rectifying plate 400 having no through hole 410 is provided on the uppermost side in the vertical direction G. Further, in addition to the straightening vane on the uppermost side in the vertical direction G, a straightening vane 400A having a through hole 410 is used.

As shown in FIG. 13, in the rectifying member 700B, the rectifying plate 400 having no through hole 410 is provided on the uppermost side in the vertical direction G. Further, a straightening vane 400A having a through hole 410 is provided on a side other than the uppermost side in the vertical direction G.

As described above, the electronic device according to the embodiment of the present invention includes a through hole 410 formed in at least one (rectifying plate 400A) of the plurality of straightening plates 400 and 400A. As a result, similarly to the effect of the first modification of the rectifying member, the bubbles of the gas phase refrigerant GP-COO stagnant on the rectifying plate 400 (or 400A) and the liquid phase refrigerant LP-COO are passed through the through hole 410. Therefore, it can flow upward in the vertical direction.

Further, in the electronic device according to the embodiment of the present invention, it is formed on at least one (rectifying plate 400A) of the plurality of straightening plates 400 and 400A other than the uppermost straightening plate in the vertical direction G. It is provided with a through hole 410. That is, the straightening vane 400 in which the through hole 410 is not formed is arranged on the uppermost side in the vertical direction G. Further, a rectifying plate 400A having a through hole 410 is arranged in at least one of the rectifying plates except on the uppermost side in the vertical direction G.

Such a configuration is realized by, for example, the rectifying member 700B shown in FIG. Further, in particular, when the rectifying member 700B is attached to the heating element 300b on the lower side in the vertical direction G as in the configuration shown in FIGS. 5A and 5B, the heating element 300 can be cooled more efficiently.

In this case, the bubbles of the vapor phase refrigerant GP-COO generated by the heat of the heating element 300a on the lower side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the inner surface of the container 100, the circuit board 200. The inside of the liquid phase refrigerant LP-COO rises in the direction away from the main surface 201 of the circuit board 200 toward the surface side facing the main surface 201. Further, bubbles of the gas phase refrigerant GP-COO and the liquid phase refrigerant LP-COO stagnant between the rectifying plates of the rectifying member 700A flow to the upper side in the vertical direction G through the through hole 410. However, in the rectifying member 700B attached to the heating element 300a on the lower side in the vertical direction G, the rectifying plate 400 in which the through hole 410 is not formed is arranged on the uppermost side in the vertical direction G. Therefore, the bubbles of the gas phase refrigerant GP-COO and the liquid phase refrigerant LP-COO flowing upward in the vertical direction G through the through hole 410 are in the vertical direction of the straightening vane 400 arranged on the uppermost side in the vertical direction G. It collides with the lower surface of G, flows toward the tip of the straightening vane 400, and then flows upward in the vertical direction G. Therefore, the circulation of the refrigerant COO in the container 100 can be promoted.

On the other hand, the rectifying member 700B is not attached to the heating element 300a on the upper side in the vertical direction G. Therefore, the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating element 300a on the upper side of the vertical direction G rise in the liquid phase refrigerant LP-COO in the vertical direction to the upper side of the vertical direction G immediately after the generation. To do.

Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side in the vertical direction G are parallel to the surface of the heating element 300a on the upper side in the vertical direction G (parallel to the main surface 201 of the circuit board 200). Flow toward the surface) is suppressed. Therefore, bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating element 300b on the lower side of the vertical direction G adhere to the heating element 300a on the upper side of the vertical direction G and the rectifying plate 400 attached to the heating element 300a. Is suppressed.

In the rectifying member 700B, any of the rectifying plates 400B to 400E may be used instead of the rectifying plate 400A. In this case, as described above, the effect according to the shape of the straightening vanes 400B to 400E can be obtained.

<Fourth Embodiment>
The configuration of the electronic device 1000E according to the fourth embodiment of the present invention will be described. FIG. 14A is a transmission side view showing the configuration of the electronic device 1000E. FIG. 14B is a transmission front view showing the configuration of the electronic device 1000E through the electronic device 1000E, and is a diagram showing the configuration seen through the electronic device 1000E in the direction of the arrow FA in FIG. 14A. FIG. 14C is a transmission top view showing the configuration of the electronic device 1000E through the electronic device 1000E, and is a diagram showing the configuration seen through the electronic device 1000E in the direction of the arrow FB of FIG. 14A. In addition, in FIG. 14A and FIG. 14B, the vertical direction G is shown for convenience of explanation.

With reference to FIGS. 14A, 14B and 14C, the electronic device 1000E includes a container 100A, a circuit board 200A, a plurality of heating elements 300a, 300b, 300c, 300d, and a plurality of straightening vanes 1400a to 1400e. There is. In the following description, when it is not necessary to distinguish the heating elements 300a, 300b, 300c, and 300d, the heating elements 300a, 300b, 300c, and 300d are collectively referred to as the heating element 300. When it is not necessary to distinguish the straightening vanes 1400a to 1400e, the straightening vanes 1400a to 1400e are collectively referred to as the straightening vanes 1400.

Here, the electronic device 1000E in the present embodiment is compared with the electronic device 1000 in the first embodiment.

As shown in FIGS. 1A and 1B, in the electronic device 1000, two heating elements 300a and 300b are provided on the circuit board 200 along the vertical direction G. On the other hand, referring to FIGS. 14A, 14B and 14C, in the electronic device 1000E, the four heating elements 300a, 300b, 300c and 300d are in the vertical direction G and in the direction perpendicular to the vertical direction G. Along, they are mounted on the circuit board 200A in parallel. More specifically, the heating elements 300a and 300b are arranged along the vertical direction G. Similarly, heating elements 300c and 300d are arranged along the vertical direction G. Further, the heating elements 300a and 300c are arranged along the direction perpendicular to the vertical direction G. Similarly, the heating elements 300b and 300d are arranged along the direction perpendicular to the vertical direction G. In these respects, the electronic device 1000E and the electronic device 1000 differ from each other.

Further, as shown in FIGS. 1A and 1B, in the electronic device 1000, each of the straightening vanes 400a to 400e was attached to the heating elements 300a and 300b, respectively. On the other hand, referring to FIGS. 14A, 14B and 14C, each of the straightening vanes 1400a to 1400e connects the heating elements 300a and 300c arranged in parallel along the direction perpendicular to the vertical direction G. It is attached to. Similarly, each of the straightening vanes 1400a to 1400e is attached so as to connect the heating elements 300b and 300d arranged in parallel along the direction perpendicular to the vertical direction G. Also in this respect, the electronic device 1000E and the electronic device 1000 are different from each other.

Next, the operation of the electronic device 1000E will be described.

When the electronic device 1000E is activated, the heating elements 300a, 300b, 300c, and 300d start operating. As a result, the heating elements 300a, 300b, 300c, and 300d generate heat.

When the heating elements 300a to 300d generate heat, the heat of the heating elements 300a to 300d is transferred to the straightening vane 400 and the liquid phase refrigerant LP-COO.

Further, the liquid phase refrigerant LP-COO in the container 100A boils on the surface of the heating element 300 or the rectifying plate 400 due to the heat of the heating element 300, and undergoes a phase change to the gas phase refrigerant GP-COO. In this way, latent heat exchange is performed around the surface of the heating element 300 or the straightening vane 400, and bubbles of the gas phase refrigerant GP-COO are generated as shown in FIG. 14A. Note that FIG. 14B does not show bubbles of the gas phase refrigerant GP-COO for convenience of drawing. The heat generated by the heating element 300 is dissipated by the heat of vaporization (latent heat) generated by this phase change. As a result, the heating element 300 is cooled.

The gas-phase refrigerant GP-COO generated around the heating elements 300b and 300d on the lower side of the vertical direction G goes upward in the liquid-phase refrigerant LP-COO along each rectifying plate 1400, and the liquid phase. It passes over the liquid surface of the refrigerant LP-COO and further heads upward in the vertical direction G.

Similarly, the gas phase refrigerant GP-COO generated around the heating elements 300a and 300c on the upper side of the vertical direction G goes upward in the liquid phase refrigerant LP-COO along each rectifying plate 1400 toward the upper side of the vertical direction G. , Passes over the liquid surface of the liquid phase refrigerant LP-COO, and further heads upward in the vertical direction G.

Then, when the vapor phase refrigerant GP-COO boiled by the heat of the heating element 300 is cooled by coming into contact with the inner wall surface of the container 100A, the phase changes to the liquid phase refrigerant LP-COO again. This liquid-phase refrigerant LP-COO descends in the container 100A in the vertical direction G, accumulates on the lower side of the container 100A in the vertical direction G, and is used again for cooling the heating element 300.

Here, as shown in FIGS. 14A, 14B, and 14C, the plurality of straightening vanes 1400a to 1400e are arranged so as to overlap each other along the vertical direction G with a gap. Further, each of the plurality of straightening vanes 1400a to 1400e is provided so as to extend toward the surface side of the inner surface of the container 100A facing the main surface 201 of the circuit board 200A.

Therefore, the bubbles of the gas phase refrigerant GP-COO generated by the heat of the heating elements 300b and 300d on the lower side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but on the circuit board in the inner surface of the container 100A. The inside of the liquid phase refrigerant LP-COO rises toward the side facing the main surface 201 of the 200A and away from the main surface 201 of the circuit board 200A. Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating elements 300b and 300d on the lower side of the vertical direction G are suppressed from flowing toward the heating elements 300a and 300c on the upper side of the vertical direction G. .. Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating elements 300b and 300d on the lower side of the vertical direction G are attached to the heating elements 300a and 300c and the heating elements 300a and 300c on the upper side of the vertical direction G. Adhesion to the rectifying plate 400 is suppressed.

It should be noted that the bubbles of the vapor phase refrigerant GP-COO generated by the heat of the heating elements 300a and 300c on the upper side of the vertical direction G do not go vertically to the upper side of the vertical direction G, but are on the circuit board of the inner surface of the container 100A. The inside of the liquid phase refrigerant LP-COO rises toward the side facing the main surface 201 of the 200A and away from the main surface 201 of the circuit board 200A. Therefore, the bubbles of the vapor-phase refrigerant GP-COO generated by the heat of the heating elements 300a and 300c on the upper side in the vertical direction G are directly applied to the rectifying plate 400 attached to the heating elements 300a and 300c and the heating elements 300a and 300c. Adhesion is suppressed.

The operation of the electronic device 1000E has been described above.

The electronic device 1000E according to the fourth embodiment of the present invention has a container 100A, a circuit board 200A, a plurality of heating elements 300, and a plurality of straightening vanes 1400, similarly to the electronic device 1000 according to the first embodiment. And have. Therefore, according to the electronic device 1000E, the same effect as that of the electronic device 1000 of the first embodiment can be obtained. In the electronic device 1000E of the present embodiment, the plurality of heating elements 300 are arranged in parallel with the vertical direction G along the direction perpendicular to the vertical direction G so as to be immersed in the liquid phase refrigerant LP-COO. It is mounted on the circuit board 200A as described above. Further, the rectifying plate 1400 is attached so as to connect a plurality of heating elements 300a and 300c arranged in parallel along a direction perpendicular to the vertical direction G among the plurality of heating elements 300. Similarly, the rectifying plate 1400 is attached so as to connect a plurality of heating elements 300b and 300d arranged in parallel along a direction perpendicular to the vertical direction G among the plurality of heating elements 300. Therefore, the number of parts can be reduced as compared with the case where the straightening vane 400 is provided for each of the plurality of heating elements 300 in the first embodiment. Further, the surface area of the straightening vane 1400 is larger than the area of two straightening vanes 400. Therefore, by using the straightening vane 1400, the heat of the heating element 300 can be transferred to the liquid phase refrigerant LP-COO more efficiently.

Further, in the electronic device 1000E according to the present embodiment, the through hole 1410 may be provided in the straightening vane 1400A. FIG. 15 is a plan view showing an example of a straightening vane, showing a through hole 1410 formed in the straightening vane 1400A. Any of the straightening vanes 1400a to 1400d shown in FIGS. 14A and 14B can be replaced with 1400A.

As a result, similar to the effect of the first and second modifications of the rectifying member, the bubbles of the gas phase refrigerant GP-COO stagnant on the rectifying plate 1400 (or 1400A) and the liquid phase refrigerant LP-COO are passed through the through hole 410. It can flow upward in the vertical direction through the.

Further, as shown in FIG. 15, the through hole 1410 may be formed between a plurality of heating elements 300a and 300c arranged in parallel along a direction perpendicular to the vertical direction G. Similarly, the through hole 1410 may be formed between a plurality of heating elements 300b, 300d arranged in parallel along a direction perpendicular to the vertical direction G. As a result, since the through hole 1410 is formed between the heating element 300a and the heating element 300c, it is not necessary to provide the through hole 1410 corresponding to each of the heating elements 300a and 300c. Therefore, bubbles of the gas phase refrigerant GP-COO containing heat of both the heating elements 300a and 300c and the liquid phase refrigerant LP-COO can be efficiently flowed through the through holes 1410. Similarly, since the through hole 1410 is formed between the heating element 300b and the heating element 300d, it is not necessary to provide the through hole 1410 corresponding to each of the heating element 300b and 300d. Therefore, bubbles of the gas phase refrigerant GP-COO containing heat of both the heating elements 300b and 300d and the liquid phase refrigerant LP-COO can be efficiently flowed through a smaller number of through holes 1410.

The through hole 1410 may be provided on the heating element 300 side, or the heating element 300 side may be provided on the opposite side. The effect of such an arrangement is the same as the content described with reference to FIGS. 8 to 10.

Further, through holes 1410 may be provided according to each of the heating elements 300a to 300d. As a result, bubbles of the gas phase refrigerant GP-COO containing heat for each heating element 300 and the liquid phase refrigerant LP-COO can flow through the through holes 1410. Therefore, it is possible to prevent the heat of the heating elements 300a and 300c from interfering with each other. Similarly, it is possible to prevent the heat of the heating elements 300b and 300d from interfering with each other. In this case as well, the through hole 1410 may be provided on the heating element 300 side, or the heating element 300 side may be provided on the opposite side. The effect of such an arrangement is the same as the content described with reference to FIGS. 8 to 10.

Further, in the electronic device according to the embodiment of the present invention, a straightening vane 1400A having a through hole 1410 may be provided in addition to the uppermost side in the vertical direction G among the plurality of straightening vanes 1400 and 1400A. That is, the straightening vane 1400 in which the through hole 1410 is not formed is arranged on the uppermost side in the vertical direction G. Further, a rectifying plate 1400A having a through hole 1410 is arranged in at least one of the rectifying plates except on the uppermost side in the vertical direction G. Even with such a configuration, the same effect as that described in the first modification of the rectifying member can be obtained.

Further, in the electronic device according to the embodiment of the present invention, a straightening vane 1400A having a through hole 1410 may be provided in addition to the lowermost side in the vertical direction G among the plurality of straightening vanes 1400 and 1400A. That is, the straightening vane 1400 in which the through hole 1410 is not formed is arranged on the lowermost side in the vertical direction G. Further, a rectifying plate 1400A having a through hole 1410 is arranged in at least one of the rectifying plates except on the lowermost side in the vertical direction G. Even with such a configuration, the same effect as that described in the second modification of the rectifying member can be obtained.

In the rectifying plate 1400A, instead of the heating element 300 side, the through hole 1410 may be arranged on the side opposite to the heating element 300 side (the tip end side of the rectifying plate 1400A). Further, in the straightening vane 1400A, in addition to the heating element 300 side, the through hole 1410 may be arranged on the side opposite to the heating element 300 side (the tip end side of the straightening vane 1400A). Further, the shape of the through hole 1410 may be formed in a slit shape like the through hole 420. Further, the shape of the through hole 1410 may be formed in the same manner as the through hole 430. In these cases, the same effects as those described above can be achieved.

Some or all of the above embodiments may also be described, but not limited to:
[Appendix 1]
A container for encapsulating a refrigerant that undergoes a phase change between a liquid phase refrigerant and a gas phase refrigerant,
A circuit board provided in the container so that the main surface extends along the vertical direction,
A plurality of heating elements mounted on the circuit board along the vertical direction so as to be immersed in the liquid phase refrigerant.
It is formed of a heat conductive member, is arranged so as to overlap each other along a vertical direction with a gap, and extends toward the surface side of the inner surface of the container facing the main surface of the circuit board. An electronic device provided with a plurality of straightening vanes provided and attached to at least one of the plurality of heating elements.
[Appendix 2]
Each of the plurality of straightening vanes gradually increases as the distance between the main plane of the circuit board and each straightening vane in the direction perpendicular to the main plane of the circuit board increases in the vertical direction. The electronic device according to Appendix 1 attached to the heating element.
[Appendix 3]
The electronic device according to Appendix 1 or 2, wherein the through hole is formed in at least one of the plurality of straightening vanes.
[Appendix 4]
The electronic device according to Appendix 3, wherein the electronic device is provided with a through hole formed in at least one of the plurality of straightening vanes other than the lowermost straightening vane in the vertical direction.
[Appendix 5]
The electronic device according to Appendix 3, wherein the electronic device is provided with a through hole formed in at least one of the rectifying plates other than the rectifying plate on the uppermost side in the vertical direction among the plurality of rectifying plates.
[Appendix 6]
The electronic device according to any one of Supplementary note 3 to 5, wherein the through hole is formed at an end portion of the straightening vane on the heating element side.
[Appendix 7]
The electronic device according to any one of Supplementary note 3 to 5, wherein the through hole is formed at an end portion of the straightening vane on the side opposite to the heating element side.
[Appendix 8]
The plurality of heating elements are mounted on the circuit board in parallel along the vertical direction and the direction perpendicular to the vertical direction so as to be immersed in the liquid phase refrigerant.
The electronic device according to Appendix 1 or 2, wherein the rectifying plate is attached so as to connect a plurality of heating elements arranged in parallel along a direction perpendicular to the vertical direction among the plurality of heating elements.
[Appendix 9]
The electronic device according to Appendix 8, which includes a through hole formed in at least one of the plurality of straightening vanes.
[Appendix 10]
The electronic device according to Appendix 9, further comprising a through hole formed in at least one of the plurality of straightening vanes other than the lowermost straightening vane in the vertical direction.
[Appendix 11]
The electronic device according to Appendix 9, further comprising a through hole formed in at least one of the plurality of straightening vanes other than the straightening vane on the uppermost side in the vertical direction.
[Appendix 12]
The electronic device according to any one of Supplementary note 9 to 11, wherein the through hole is formed between a plurality of heating elements arranged in parallel along a direction perpendicular to the vertical direction.
[Appendix 13]
The electron according to any one of Supplementary note 3 to 7 and 9 to 12, wherein the through hole is formed in a slit shape so as to extend from the tip end side of the straightening vane toward the heating element side. apparatus.
[Appendix 14]
Of the lengths of the through holes, the length of the width in the direction parallel to the main surface of the circuit board is set to increase from the tip end side of the straightening vane toward the heating element side. The electronic device described.

Although the present invention has been described above with reference to the embodiments (and examples), the present invention is not limited to the above embodiments (and examples). Various changes that can be understood by those skilled in the art can be made to the structure and details of the present invention within the scope of the present invention.

1000, 1000A, 1000B Electronic equipment 1000C, 1000D, 1000E Electronic equipment 100, 100A Container 200, 200A Circuit board 300, 300a, 300b, 300c. 300d Heating element 400, 400A, 400B, 400C, 400D, 400E Rectifier plate 400a, 400b, 400c, 400d, 400e Rectifier plate 410, 420, 430 Through holes 500, 600 Heat dissipation fins 1400, 1400a, 1400b, 1400c, 1400d, 1400e rectifier

Claims (14)

A container for encapsulating a refrigerant that undergoes a phase change between a liquid phase refrigerant and a gas phase refrigerant,
A circuit board provided in the container so that the main surface extends along the vertical direction,
A plurality of heating elements mounted on the circuit board along the vertical direction so as to be immersed in the liquid phase refrigerant.
It is formed of a heat conductive member, is arranged so as to overlap each other along a vertical direction with a gap, and extends toward the surface side of the inner surface of the container facing the main surface of the circuit board. An electronic device provided with a plurality of straightening vanes provided and attached to at least one of the plurality of heating elements. Each of the plurality of straightening vanes gradually increases as the distance between the main plane of the circuit board and the straightening vanes in the direction perpendicular to the main plane of the circuit board increases in the vertical direction. The electronic device according to claim 1, which is attached to the heating element. The electronic device according to claim 1 or 2, further comprising a through hole formed in at least one of the plurality of straightening vanes. The electronic device according to claim 3, further comprising a through hole formed in at least one of the rectifying plates other than the rectifying plate on the lowermost side in the vertical direction among the plurality of rectifying plates. The electronic device according to claim 3, further comprising a through hole formed in at least one of the rectifying plates other than the rectifying plate on the uppermost side in the vertical direction among the plurality of rectifying plates. The electronic device according to any one of claims 3 to 5, wherein the through hole is formed at an end portion of the straightening vane on the heating element side. The electronic device according to any one of claims 3 to 5, wherein the through hole is formed at an end portion of the straightening vane on the side opposite to the heating element side. The plurality of heating elements are mounted on the circuit board in parallel along the vertical direction and the direction perpendicular to the vertical direction so as to be immersed in the liquid phase refrigerant.
The electronic device according to claim 1 or 2, wherein the rectifying plate is attached so as to connect a plurality of heating elements arranged in parallel along a direction perpendicular to the vertical direction among the plurality of heating elements. The electronic device according to claim 8, further comprising a through hole formed in at least one of the plurality of straightening vanes. The electronic device according to claim 9, further comprising a through hole formed in at least one of the rectifying plates other than the rectifying plate on the lowermost side in the vertical direction among the plurality of rectifying plates. The electronic device according to claim 9, further comprising a through hole formed in at least one of the rectifying plates other than the rectifying plate on the uppermost side in the vertical direction among the plurality of rectifying plates. The electronic device according to any one of claims 9 to 11, wherein the through hole is formed between a plurality of heating elements arranged in parallel along a direction perpendicular to the vertical direction. The one according to any one of claims 3 to 7 and 9 to 12, wherein the through hole is formed in a slit shape so as to extend from the tip end side of the straightening vane toward the heating element side. Electronic device. 13. Claim 13 of the lengths of the through holes, the length of the width in the direction parallel to the main surface of the circuit board is set so as to increase from the tip end side of the straightening vane toward the heating element side. The electronic device described in.

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