CN111106079B - Heat dissipation chip, manufacturing method thereof and electronic equipment - Google Patents
Heat dissipation chip, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN111106079B CN111106079B CN201911146818.3A CN201911146818A CN111106079B CN 111106079 B CN111106079 B CN 111106079B CN 201911146818 A CN201911146818 A CN 201911146818A CN 111106079 B CN111106079 B CN 111106079B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
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Abstract
The invention discloses a heat dissipation chip, a manufacturing method thereof and electronic equipment, wherein the heat dissipation chip comprises: a substrate; the chip module comprises a chip and a radiator, and the chip and the radiator are arranged on the same side of the substrate and are arranged adjacent to each other so that the radiator radiates heat to the chip; and the shell is arranged on one side, deviating from the substrate, of the chip module, covers the chip module, and is abutted to the radiator. The technical scheme of the invention aims to provide good heat dissipation for the chip, prevent the chip from being damaged due to overhigh temperature, prolong the service life of the chip, ensure that a shell structure is supported and improve the use stability of the chip.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation chip, a manufacturing method thereof and electronic equipment.
Background
In an exemplary technology, In an SIP Package module [ SIP Package (System In a Package System In Package), a plurality of functional chips, including a processor, a memory, and the like, are integrated In one Package, so as to achieve a substantially complete function ], and a highly integrated SIP module generates a large amount of heat during operation, and if the generated heat is not taken away In time by adopting effective measures, the functional chips In the SIP Package module are damaged quickly or cannot reach an expected service life. When the shell of the chip is manufactured, the shell structure cannot be reinforced and supported, so that the shell is easy to deform, and the use stability of the chip is reduced.
The above description is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above description is prior art.
Disclosure of Invention
The invention mainly aims to provide a heat dissipation chip, which aims to provide good heat dissipation for a chip, prevent the chip from being damaged due to overhigh temperature, prolong the service life of the chip, ensure a shell structure to be supported and improve the use stability of the chip.
In order to achieve the above object, the heat dissipating chip provided by the present invention includes:
a substrate;
the chip module comprises a chip and a radiator, and the chip and the radiator are arranged on the same side of the substrate and are arranged adjacent to each other so that the radiator radiates heat to the chip; and
the shell is arranged on one side, deviating from the substrate, of the chip module, and covers the chip module, and the shell abuts against the radiator.
In some embodiments of the present invention, the heat sink includes a heat dissipating portion disposed adjacent to the chip, and a heat conducting support portion disposed on a side of the heat dissipating portion facing away from the substrate and abutting against the housing.
In some embodiments of the present invention, the heat dissipating portion is a heat dissipating tube, and the heat conducting supporting portion is disposed on a side of the heat dissipating tube away from the substrate and abuts against the housing;
or the radiating part is a radiating fin, and the heat-conducting supporting part is arranged on one side of the radiating fin, which is deviated from the substrate, and is abutted against the shell.
In some embodiments of the present invention, when the heat dissipation portion is a heat dissipation tube, the number of the heat dissipation tubes is multiple, the multiple heat dissipation tubes are communicated with each other, and a heat conductive liquid is disposed in the heat dissipation tube.
In some embodiments of the invention, the number of the radiating pipes is at least four, and the head and the tail ends of the four radiating pipes are sequentially communicated to form a radiator with a rhombic outline;
or the number of the radiating pipes is at least five, the head end and the tail end of the five radiating pipes are communicated with each other, and the radiating pipes are surrounded to form a radiator with the outer contour comprising two triangles.
In some embodiments of the invention, the chip assembly further includes an encapsulating portion encapsulating the chip and the heat dissipation portion on the same surface of the substrate, and the heat-conducting supporting portion is exposed at a side of the encapsulating portion facing away from the substrate and abuts against the housing.
In some embodiments of the present invention, the housing includes a housing body and an elastic connecting member disposed inside the housing body, the housing body covers the chip module, and the elastic connecting member elastically abuts against the heat-conducting supporting portion.
In some embodiments of the invention, the elastic connector is a spring plate;
and/or the heat-conducting supporting part is a heat-conducting salient point;
and/or the heat dissipation part and the heat conduction supporting part are made of copper materials.
The invention also provides a manufacturing method of the heat dissipation chip, which comprises the following steps:
providing a substrate;
arranging a radiator on one surface of the substrate;
arranging a chip in a region close to the radiator;
encapsulating the heat radiator and the chip, and enabling part of the heat radiator to be exposed on the surface of the encapsulation layer;
a housing is provided and a portion of the heat spreader exposed at a surface of the encapsulation layer abuts the housing.
In some embodiments of the invention, the step of providing the housing and abutting a portion of the heat spreader exposed at the surface of the encapsulation layer against the housing comprises:
forming a housing having a mounting location by an injection molding process;
connecting the elastic connecting piece to the mounting position in a detachable manner;
covering the shell on the chip so that the elastic connecting piece is abutted against the part of the radiator exposed on the surface of the packaging layer;
alternatively, the step of providing the housing and abutting the portion of the heat spreader exposed at the surface of the encapsulation layer against the housing comprises:
placing the elastic connecting piece in a mould;
performing injection molding on the mold to form a shell with an elastic connecting piece;
and covering the shell on the chip so that the elastic connecting piece is abutted against the part of the heat radiator exposed on the surface of the packaging layer.
The invention also provides an electronic device, wherein the electronic device comprises a heat dissipation chip, and the heat dissipation chip comprises:
a substrate;
the chip module comprises a chip and a radiator, and the chip and the radiator are arranged on the same side of the substrate and are arranged adjacent to each other; and
the shell is arranged on one side, away from the substrate, of the chip module and covers the chip module, and the shell abuts against the radiator;
or, the electronic device includes the heat dissipation chip manufactured by the manufacturing method of the heat dissipation chip, and the manufacturing method of the heat dissipation chip includes the following steps:
providing a substrate;
arranging a radiator on one surface of the substrate;
arranging a chip in a region close to the radiator;
encapsulating the heat radiator and the chip, and enabling part of the heat radiator to be exposed on the surface of the encapsulation layer;
a housing is provided and a portion of the heat spreader exposed at a surface of the encapsulation layer abuts the housing.
According to the technical scheme, the chip module and the radiator are arranged on the same side of the substrate, the chip and the radiator are arranged adjacent to each other, and the shell covers the chip module, so that the shell is abutted to the radiator. Because chip module and radiator are that the homonymy sets up to adjacent to each other to when chip module temperature rose in the use, the radiator can carry out the heat exchange with chip module betterly, and then with heat transfer to shell, and the rethread shell carries out the heat exchange with external environment, reduces the temperature of whole heat dissipation chip. And because the shell is abutted against the radiator, when the chip shell is manufactured, the shell can be reinforced and supported, thereby avoiding the deformation during the manufacturing or using process and improving the use stability of the chip. Therefore, the technical scheme of the invention can provide good heat dissipation for the chip, prevent the chip from being damaged due to overhigh temperature, prolong the service life of the chip, ensure that the shell structure is supported and improve the use stability of the chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation chip according to an embodiment of the invention;
FIG. 2 is a cross-sectional view of the heat spreader chip of FIG. 1 taken along line A-A;
FIG. 3 is a cross-sectional view of the heat spreader chip of FIG. 2 taken along line B-B;
FIG. 4 is a flowchart illustrating a method of fabricating a heat sink chip according to an embodiment of the present invention;
FIG. 5 is a flowchart illustrating a method of fabricating a heat sink chip according to another embodiment of the present invention;
fig. 6 is a flowchart illustrating a method for manufacturing a heat sink chip according to another embodiment of the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a heat dissipating chip 100.
Referring to fig. 1 to 3, a heat dissipation chip 100 according to the present invention includes:
a substrate 10;
the chip module 20 includes a chip 21 and a heat sink 22, wherein the chip 21 and the heat sink 22 are disposed on the same side of the substrate 10 and are adjacent to each other, so that the heat sink 22 dissipates heat to the chip 21; and
and the shell 30 is arranged on one side, away from the substrate 10, of the chip module 20, and covers the chip module 20, and the shell 30 abuts against the heat radiator 22.
In this embodiment, the substrate 10 may be a printed circuit board, and the material thereof may be FR4 epoxy resin board. The substrate 10 is a combination of a printed circuit board and a flexible circuit board, and the number of circuit layers may be a single layer, a double layer or a multilayer. The chip module 20 may be a chip module 20 packaged by an SIP, and In the SIP Package (System In a Package System In Package), a plurality of functional chips 21, including functional chips 21 such as a processor and a memory, are integrated into one Package, so as to implement a substantially complete function. From the perspective of electronic equipment, SiP packages do not pay attention to the performance/power consumption of the chip 21, but realize the light, thin, short, multifunctional, and low power consumption of the whole electronic equipment, thereby improving the functionality and convenience of use of the electronic equipment.
And, the material of the housing 30 can be made of a material with good heat conduction and supporting effects, and specifically, can be made of metal (the material of the metal can be selected from stainless steel material, aluminum alloy material, copper alloy material, iron alloy material, etc.). The metal material has good thermal conductivity and structural stability, so, be favorable to promoting shell 30's stability that sets up more to effectively promote shell 30's practicality, reliability, and durability. The outer contour of the housing 30 can be set according to actual needs as long as the chip module 20 is protected. In the present embodiment, the housing 30 includes a top plate 311 and a side plate 312 connected to the top plate 311, the top plate 311 is substantially quadrilateral, and the heat sink 22 abuts against a middle portion of the housing 30 (i.e. a middle region of the top plate 311) in one embodiment, so as to facilitate supporting the housing 30. Of course, the top plate 311 may be supported by the heat sink 22 in the area near the edge, and in this case, a plurality of supporting points are preferably provided to ensure the supporting effect. Or a combination of the two, is preferably used to support the housing 30 using the heat sink 22.
According to the technical scheme of the invention, the chip module 20 and the radiator 22 are arranged on the same side of the substrate 10, the chip 21 and the radiator 22 are arranged adjacent to each other, and the shell 30 covers the chip module 20, so that the shell 30 is abutted to the radiator 22. Because the chip module 20 and the heat sink 22 are disposed on the same side and adjacent to each other, when the temperature of the chip module 20 rises during use, the heat sink 22 can exchange heat with the chip module 20 better, so as to transfer heat to the housing 30, and exchange heat with the external environment through the housing 30, thereby reducing the temperature of the whole heat dissipation chip 100. And because the shell 30 is abutted against the heat sink 22, when the shell 30 of the chip 21 is manufactured, the shell 30 can be reinforced and supported, thereby avoiding deformation during manufacturing or use and improving the use stability of the chip 21. Therefore, the technical scheme of the invention can provide good heat dissipation for the chip 21, prevent the chip 21 from being damaged due to overhigh temperature, prolong the service life of the chip 21, ensure the structure of the shell 30 to be supported and improve the use stability of the chip 21.
Referring to the drawings, in some embodiments of the present invention, the heat sink 22 includes a heat dissipation portion 221 and a heat conducting support portion 222, the heat dissipation portion 221 is disposed adjacent to the chip 21, and the heat conducting support portion 222 is disposed on a side of the heat dissipation portion 221 facing away from the substrate 10 and abuts against the housing 30. The heat exchange rate of the heat radiator 22 and the chip 21 can be improved by arranging the heat radiating part 221 for radiating heat, and the heat conducting supporting part 222 is arranged, so that the heat radiating part 221 and the temperature of the chip 21 subjected to heat exchange are conveniently led out to the shell 30, the shell 30 is conveniently supported, and the working stability of the chip 21 and the structural stability of the shell 30 are ensured.
In some embodiments of the present invention, the heat dissipating portion 221 is a heat dissipating tube 221, and the heat conducting supporting portion 222 is disposed on a side of the heat dissipating tube 221 away from the substrate 10 and abuts against the outer casing 30; the heat dissipation part 221 is provided as the heat dissipation pipe 221 such that the heat conduction path 2211 is formed in the hollow portion of the heat dissipation pipe 221, which facilitates to improve the heat exchange efficiency. Specifically, the cross-sectional shape of the heat dissipation tube 221 may be set to be elliptical or circular, and the heat exchange area of the heat dissipation tube 221 may be increased by setting the cross-sectional shape to be elliptical, so that the heat conduction effect is better, and of course, the cross-sectional shape of the heat dissipation tube 221 may also be rectangular or square, as long as the heat exchange area can be increased, the heat conduction efficiency is improved, and the working stability of the chip 21 is ensured.
Alternatively, the heat dissipation portion 221 is a heat sink 221, and the heat conducting support portion 222 is disposed on a side of the heat sink 221 away from the substrate 10 and abuts against the housing 30. The fins 221 are produced at a low cost and have a large heat exchange area. The heat conduction efficiency can be better improved, and the working stability of the chip 21 is ensured. It is understood that the heat dissipation portion 221 may also be a combination of the heat dissipation tube 221 and the heat dissipation plate 221, which may also better improve the heat conduction efficiency and ensure the stability of the operation of the chip 21.
In an embodiment of the present invention, the heat dissipation portion 221 and the heat conducting support portion 222 are made of copper. Copper is used as the material of the heat dissipation part 221 and the heat conductive support part 222, so that heat can be well conducted, heat dissipation is facilitated, the housing 30 is supported, and stability of the housing 30 is improved.
In some embodiments of the present invention, when the heat dissipation portion 221 is a heat dissipation tube 221, the number of the heat dissipation tubes 221 is multiple, the heat dissipation tubes 221 are communicated with each other, and a heat conductive liquid is disposed in the heat dissipation tube 221. By providing the plurality of heat dissipation tubes 221, the heat exchange area of the heat sink 22 can be greatly increased, the heat conduction efficiency can be improved, and the working stability of the chip 21 can be ensured. It is understood that the radiating pipe 221 may be in a form of being communicated with each other at the middle or end to end, as long as the heat transfer liquid is conveniently flowed. And, the heat-conducting liquid is disposed in the heat-radiating pipe 221 to make the temperature of the heat-radiating pipe 221 uniform, and the heat absorption of the heat-radiating pipe 221 to the chip 21 is improved and the heat-radiating efficiency is improved by the heat-conducting liquid further exchanging heat with the heat-radiating pipe 221.
In an embodiment of the present invention, the heat pipe 221 is a vacuum heat pipe 221, and capillary tubes (not shown), heat conductive particles (not shown) and heat conductive liquid (not shown) are disposed in the vacuum heat pipe 221. The vacuum heat pipe 221 is evacuated to reduce the boiling point of the heat conducting liquid. When the vacuum heat dissipation pipe 221 is heated, the heat conduction liquid is heated and can be evaporated, because the evaporation absorbs heat, the temperature of the vacuum heat dissipation pipe 221 is reduced, the evaporated gaseous heat conduction liquid flows along the capillary tube, and because the temperature of the external environment (connected to the heat dissipation pipe 221 at the heat conduction supporting part 222) is lower, the gaseous heat conduction liquid is liquefied when being cooled, the liquefied heat conduction liquid can fall back to the initial position under the action of gravity and capillary force, and the heat can be taken away through the continuous circulation of the heat conduction liquid.
In one embodiment, the vacuum heat pipe 221 is a liquid-cooled vacuum heat pipe 221, and specifically, the vacuum heat pipe 221 is a water-cooled vacuum heat pipe 221, and the water-cooled vacuum heat pipe 221 has excellent heat dissipation performance. Moreover, copper sand (heat conducting particles) and distilled water (not shown) are added into the water-cooling vacuum radiating pipe 221, and the copper sand is fixed on the inner wall of the water-cooling vacuum radiating pipe 221, because the gaps among the copper sand are very small, a capillary tube is formed, the water vapor evaporated by heating flows along the capillary tube under the action of capillary force, the heat exchange area with the external environment is increased, the water vapor is liquefied by cooling, the liquefied distilled water falls back to the original position under the action of gravity and capillary force, and the heat can be taken away through the continuous circulation of the distilled water. Of course, the heat-conducting liquid can also be cooling liquid, ethanol or liquid refrigerant and the like, as long as the heat-conducting liquid has a good cooling effect; the water-cooling vacuum heat dissipation pipe 221 may be a copper pipe, which has a good heat conduction performance and can dissipate heat well.
Referring to fig. 2, in some embodiments of the present invention, the number of the heat dissipation tubes 221 is at least four, and the head and the tail ends of the four heat dissipation tubes 221 are sequentially communicated to form a heat sink 22 with a diamond-shaped outer contour; by arranging the plurality of radiating pipes 221 of the radiator 22 to be communicated end to end, the heat-conducting liquid has a longer flow path in the radiating pipes 221, the heat exchange area between the heat-conducting liquid and the radiating pipes 221 is increased, and the heat exchange efficiency is improved. And the rhombus is provided with edges which are connected end to form a closed polygon, and the length of each edge is consistent, so that the support effect is good. Thus, the heat sink 22 with the diamond-shaped outer contour can better support the housing 30, and the stability of the housing 30 is improved. At this time, the heat conductive support 222 may be uniformly disposed on each of the heat dissipating pipes 221, thereby improving a contact position with the housing 30, and improving a heat dissipating effect and a supporting effect. And, in order to increase the heat exchange area between the heat dissipation tube 221 of the heat sink 22 and the chip 21, the heat dissipation tube 221 may be configured as an arc-shaped tube segment, and since the area of the arc surface under the same length is greater than the area of the plane, the heat exchange area between the heat dissipation tube 221 and the chip 21 may be effectively increased, thereby improving the heat exchange efficiency.
In some embodiments of the present invention, the number of the heat pipes 221 is at least five, and the head and the tail ends of the five heat pipes 221 are communicated with each other to form the heat sink 22 with an outer contour including two triangles. By arranging the plurality of radiating pipes 221 of the radiator 22 to be communicated end to end, the heat-conducting liquid has a longer flow path in the radiating pipes 221, the heat exchange area between the heat-conducting liquid and the radiating pipes 221 is increased, and the heat exchange efficiency is improved. And because the structure of triangle-shaped is stable, have good supporting effect. Thus, the heat sink 22 having an outer contour including two triangular shapes can better support the housing 30, and the stability of the housing 30 is improved. When the outer contour of the heat sink 22 includes a triangle, the heat-conducting support 222 may be disposed on the heat-dissipating pipe 221 located at the middle portion thereof, so that the middle housing 30 is well supported, thereby improving the heat-dissipating effect and the supporting effect.
Referring to fig. 3, in some embodiments of the present invention, the chip 21 assembly further includes an encapsulating portion 23, the encapsulating portion 23 encapsulates the chip 21 and the heat dissipation portion 221 on the same surface of the substrate 10, and the heat-conducting supporting portion 222 is exposed at a side of the encapsulating portion 23 facing away from the substrate 10 and abuts against the housing 30. The sealing portion 23 is used to fix the positions of the chip 21 and the heat dissipation portion 221, thereby ensuring the structural stability of the heat dissipation chip 100 and improving the working stability of the heat dissipation chip 100. The heat-conducting supporting part 222 is exposed to the packaging part 23, so that the heat-conducting supporting part 222 is convenient to abut against the shell 30, the temperature of the heat-radiating part 221 can be quickly transmitted to the shell 30, and the heat exchange efficiency is improved.
Referring to fig. 2 and 3, in some embodiments of the present invention, the outer shell 30 includes a shell body 31 and an elastic connector 32 disposed inside the shell body 31, the shell body 31 covers the chip module 20, and the elastic connector 32 elastically abuts against the heat conducting support 222. Considering that the shell 30 can reserve the design tolerance when making, in order to guarantee the good butt of shell 30 and heat conduction supporting part 222, set up elastic connection 32 for shell 30 and heat conduction supporting part 222 elasticity butt, thereby prevent the butt that design tolerance brought bad, guaranteed supporting effect and heat transfer effect. In an embodiment, the elastic connecting member 32 is disposed opposite to the heat conducting support portion 222, so that when the housing body 31 is fixed to the chip module 20, the heat conducting support portion 222 can be directly abutted to the elastic connecting member, the length of the elastic connecting member is reduced, the length of the heat conducting path is reduced, and the heat exchange efficiency is improved.
In some embodiments of the present invention, the elastic connecting member 32 is a spring plate 32; both the spring and the elastic sheet 32 can support the case body 31 well and facilitate conducting heat of the heat sink 22 to the outer case 30. And the surface area of the elastic sheet 32 is larger, so that heat dissipation is facilitated during heat conduction, and the temperature conduction to the heat sink 22 is further improved.
And/or, the heat-conducting supporting portion 222 is a heat-conducting bump, and the heat-conducting bump can better conduct the heat generated by the chip module 20 absorbed by the heat-dissipating portion 221 to the housing 30, so that the heat can be dissipated quickly, and the manufacturing cost is low and the stability is high.
Referring to fig. 4, the present invention further provides a method for manufacturing a heat dissipation chip 100, where the method for manufacturing the heat dissipation chip 100 includes the following steps:
step S10, providing a substrate 10; in this embodiment, one surface of the substrate 10 is disposed toward the processing platform, and the substrate 10 is fixed, so as to facilitate subsequent processing on the back side of the substrate 10. Specifically, in an embodiment, the substrate 10 may be adsorbed and fixed by a processing platform, and the processing platform may include vacuum nozzles, so that the substrate 10 may be well adsorbed and fixed by the vacuum nozzles uniformly distributed on the platform. The processing platform can also be a processing platform with a clamping and fixing function, and the buffering component is arranged on the clamping surface of the clamp so as to clamp and fix the substrate 10, so that the processing is carried out.
Step S20, disposing the heat sink 22 on one surface of the substrate 10; in this embodiment, the surface of the substrate 10 may be provided with a mounting position for mounting the heat sink 22, so as to facilitate the initial mounting of the heat sink 22, or the heat sink 22 may be directly mounted on the surface of the substrate 10, and the heat sink 22 is fixed by other auxiliary devices.
Step S30, disposing the chip 21 in an area close to the heat sink 22; specifically, the chip 21 may be fixed to the surface of the substrate 10 by soldering, or may be fixed by mounting as long as the chip 21 is well fixed. The region close to the heat sink 22 is the vicinity of the projected outer contour of the heat sink 22 projected on the surface of the substrate 10, and any region that facilitates heat conduction can be understood as the vicinity of the projected outer contour. And, because the outer contour of the heat sink 22 is considered to be larger than the outer contour of the chip 21, the heat sink 22 is arranged on the substrate 10, and then the chip 21 is arranged, so that the influence on the arrangement of the chip 21 when the heat sink 22 is arranged can be prevented, the working stability of the heat dissipation chip 100 is improved, and the production efficiency is improved.
Step S40, encapsulating the heat spreader 22 and the chip 21, and exposing a portion of the heat spreader 22 on the surface of the encapsulation layer; the heat sink 22 and the chip 21 are packaged so that the positions of the chip 21 and the heat dissipation portion 221 are fixed, thereby ensuring the structural stability of the heat dissipation chip 100 and improving the working stability of the heat dissipation chip 100. Through exposing heat conduction supporting part 222 in the packaging layer for heat conduction supporting part 222 is convenient for with shell 30 butt, guarantees that the temperature of heat dissipation portion 221 can transmit to shell 30 relatively fast, improves heat exchange efficiency.
Step S50 provides the housing 30, and makes the part of the heat spreader 22 exposed on the surface of the encapsulation layer abut against the housing 30. The housing 30 is convenient for preventing the normal operation of the chip module 20 from being influenced by external interference, and is convenient for the heat conduction of the heat sink 22, so as to improve the heat dissipation efficiency of the heat dissipation chip 100 and ensure the working stability of the heat dissipation chip 100.
In the embodiment, the chip module 20 and the heat sink 22 are disposed on the same side of the substrate 10, the chip 21 and the heat sink 22 are disposed adjacent to each other, and the housing 30 covers the chip module 20, so that the housing 30 abuts against the heat sink 22. Because the chip module 20 and the heat sink 22 are disposed on the same side and adjacent to each other, when the temperature of the chip module 20 rises during use, the heat sink 22 can exchange heat with the chip module 20 better, so as to transfer heat to the housing 30, and exchange heat with the external environment through the housing 30, thereby reducing the temperature of the whole heat dissipation chip 100. And because the shell 30 is abutted against the heat sink 22, when the shell 30 of the chip 21 is manufactured, the shell 30 can be reinforced and supported, thereby avoiding deformation during manufacturing or use and improving the use stability of the chip 21. Therefore, the technical scheme of the embodiment can provide good heat dissipation for the chip 21, prevent the chip 21 from being damaged due to overhigh temperature, prolong the service life of the chip 21, ensure that the structure of the shell 30 is supported, and improve the use stability of the chip 21.
Referring to fig. 5, in some embodiments of the invention, the step of providing the housing 30 and abutting the portion of the heat spreader 22 exposed at the surface of the encapsulation layer against the housing 30 includes:
step S51, forming the housing 30 having the mounting position by an injection molding process; in this embodiment, can reserve the installation position at the mould to can directly form the shell 30 that has the installation position when injection moulding, this installation position can be for pegging graft position or for cup jointing the position, can be the spliced eye when for pegging graft position, can be for cup jointing the post when for cup jointing the position, thereby be convenient for elastic connection 32's installation.
Step S52, detachably connecting the elastic connecting member 32 to the mounting position; considering that the shell 30 can reserve the design tolerance when making, in order to guarantee the good butt of shell 30 and heat conduction supporting part 222, set up elastic connection 32 for shell 30 and heat conduction supporting part 222 elasticity butt, thereby prevent the butt that design tolerance brought bad, guaranteed supporting effect and heat transfer effect. Moreover, the detachable elastic connecting piece 32 can be conveniently adjusted, the elastic connecting piece 32 with the most appropriate length is ensured to be abutted against the heat-conducting supporting part 222, and the supporting effect and the heat exchange effect are improved.
Step S53, covering the chip 21 with the housing 30, so that the elastic connector 32 abuts against the part of the heat spreader 22 exposed on the surface of the package layer; so set up, be convenient for prevent external disturbance influence chip module 20's normal work on the one hand, on the other hand is convenient for the heat conduction of radiator 22, improves radiating chip 100's radiating efficiency, guarantees radiating chip 100's job stabilization nature.
Referring to fig. 6, the step of providing the housing 30 and abutting the portion of the heat spreader 22 exposed at the surface of the encapsulation layer against the housing 30 includes:
step S51a, placing the elastic connecting member 32 in a mold; in this embodiment, portions of the resilient coupling 32 may be placed within a mold to facilitate molding with the housing 30 after injection molding.
Step S52a, performing injection molding on the mold to form the shell 30 with the elastic connecting piece 32; the housing 30 having the elastic connection member 32 is formed by injection molding, so that the assembly process of the elastic connection member 32 is saved and the production efficiency is improved.
Step S53a, cover the package 30 on the chip 21, so that the elastic connector 32 abuts against the portion of the heat spreader 22 exposed on the surface of the package layer. So set up, be convenient for prevent external disturbance influence chip module 20's normal work on the one hand, on the other hand is convenient for the heat conduction of radiator 22, improves radiating chip 100's radiating efficiency, guarantees radiating chip 100's job stabilization nature.
By arranging the housing 30 and abutting a part of the heat spreader 22 (the heat conducting support portion 222) exposed on the surface of the encapsulation layer against the housing 30, the stability of the housing 30 is improved, the service life of the chip module 20 is prolonged, and the heat dissipation effect of the heat dissipation chip 100 is improved.
The present invention further provides an electronic device, where the electronic device includes a heat dissipation chip 100, and the heat dissipation chip 100 includes: a substrate 10; the chip module 20 comprises a chip 21 and a heat sink 22, wherein the chip 21 and the heat sink 22 are arranged on the same side of the substrate 10 and are adjacent to each other; the shell 30 is arranged on one side, away from the substrate 10, of the chip module 20, and covers the chip module 20, and the shell 30 abuts against the heat sink 22; alternatively, the electronic device includes the heat dissipation chip 100 manufactured by the manufacturing method of the heat dissipation chip 100, and the manufacturing method of the heat dissipation chip 100 includes the following steps: providing a substrate 10; a heat sink 22 is provided on one surface of the substrate 10; the chip 21 is arranged in the area close to the heat sink 22; encapsulating the heat spreader 22 and the chip 21, and exposing a part of the heat spreader 22 on the surface of the encapsulation layer; a housing 30 is provided and a portion of the heat spreader 22 exposed at the surface of the encapsulation layer abuts the housing 30. Since the electronic device adopts all technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A heat dissipating chip, comprising:
a substrate;
the chip module comprises a chip and a radiator, and the chip and the radiator are arranged on the same side of the substrate and are arranged adjacent to each other so that the radiator radiates heat to the chip; and
the shell is arranged on one side, away from the substrate, of the chip module and covers the chip module, and the shell abuts against the radiator;
the heat radiator comprises a heat radiating part and a heat conducting supporting part, the heat radiating part is arranged close to the chip, and the heat conducting supporting part is arranged on one side of the heat radiating part, which is far away from the substrate, and is abutted against the shell;
the chip module further comprises an encapsulation part, the encapsulation part encapsulates the chip and the heat dissipation part on the same surface of the substrate, and the heat conduction support part is exposed on one side of the encapsulation part, which is far away from the substrate, and abuts against the shell;
the shell comprises a shell body and an elastic connecting piece arranged on the inner side of the shell body, the shell body covers the chip module, and the elastic connecting piece is elastically abutted to the heat conduction supporting part.
2. The heat dissipating chip of claim 1, wherein the heat dissipating portion is a heat dissipating tube, and the heat conducting supporting portion is disposed on a side of the heat dissipating tube away from the substrate and abuts against the housing;
or the radiating part is a radiating fin, and the heat-conducting supporting part is arranged on one side of the radiating fin, which is deviated from the substrate, and is abutted against the shell.
3. The heat dissipating chip as claimed in claim 2, wherein when the heat dissipating portion is a heat dissipating pipe, the number of the heat dissipating pipes is plural, the plural heat dissipating pipes are connected to each other, and the heat conductive liquid is disposed in the heat dissipating pipe.
4. The heat dissipating chip of claim 2, wherein the number of the heat dissipating tubes is at least four, and the head and the tail of the four heat dissipating tubes are sequentially connected to form a heat sink with a diamond-shaped outer contour;
or the number of the radiating pipes is at least five, the head end and the tail end of the five radiating pipes are communicated with each other, and the radiating pipes are surrounded to form a radiator with the outer contour comprising two triangles.
5. The heat dissipating chip of claim 1, wherein the resilient connecting member is a spring sheet;
and/or the heat-conducting supporting part is a heat-conducting salient point;
and/or the heat dissipation part and the heat conduction supporting part are made of copper materials.
6. A manufacturing method of a heat dissipation chip is characterized by comprising the following steps:
providing a substrate;
arranging a radiator on one surface of the substrate;
arranging a chip in a region close to the radiator;
encapsulating the heat radiator and the chip, and enabling part of the heat radiator to be exposed on the surface of the encapsulation layer;
providing a shell, and enabling a part of the radiator exposed on the surface of the packaging layer to abut against the shell;
the step of providing the housing and abutting a portion of the heat spreader exposed at the surface of the encapsulation layer against the housing comprises:
forming a housing having a mounting location by an injection molding process;
connecting the elastic connecting piece to the mounting position in a detachable manner;
covering the shell on the chip so that the elastic connecting piece is abutted against the part of the radiator exposed on the surface of the packaging layer;
alternatively, the step of providing the housing and abutting the portion of the heat spreader exposed at the surface of the encapsulation layer against the housing comprises:
placing the elastic connecting piece in a mould;
performing injection molding on the mold to form a shell with an elastic connecting piece;
and covering the shell on the chip so that the elastic connecting piece is abutted against the part of the heat radiator exposed on the surface of the packaging layer.
7. An electronic device comprising the heat dissipating chip according to any one of claims 1 to 5;
or, include the heat-dissipating chip made by the method for making heat-dissipating chip as claimed in claim 6.
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| CN201911146818.3A CN111106079B (en) | 2019-11-21 | 2019-11-21 | Heat dissipation chip, manufacturing method thereof and electronic equipment |
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| CN201911146818.3A CN111106079B (en) | 2019-11-21 | 2019-11-21 | Heat dissipation chip, manufacturing method thereof and electronic equipment |
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| CN103988296A (en) * | 2011-11-14 | 2014-08-13 | 美光科技公司 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
| CN204578954U (en) * | 2015-05-05 | 2015-08-19 | 遵义天义利威机电有限责任公司 | A kind of cooling mechanism of modified model brushless motor controller |
| CN208271867U (en) * | 2017-04-28 | 2018-12-21 | 半导体元件工业有限责任公司 | Semiconductor packages |
| CN109065511A (en) * | 2018-08-15 | 2018-12-21 | 王晓勇 | A kind of semiconductor package part and heat dissipating method with radiator structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6939632B2 (en) * | 2001-08-06 | 2005-09-06 | Massachusetts Institute Of Technology | Thermally efficient micromachined device |
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|---|---|---|---|---|
| CN103988296A (en) * | 2011-11-14 | 2014-08-13 | 美光科技公司 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods |
| CN204578954U (en) * | 2015-05-05 | 2015-08-19 | 遵义天义利威机电有限责任公司 | A kind of cooling mechanism of modified model brushless motor controller |
| CN208271867U (en) * | 2017-04-28 | 2018-12-21 | 半导体元件工业有限责任公司 | Semiconductor packages |
| CN109065511A (en) * | 2018-08-15 | 2018-12-21 | 王晓勇 | A kind of semiconductor package part and heat dissipating method with radiator structure |
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