JP3153018U - Heat dissipation device for communication device housing - Google Patents

Abstract

Provided is a heat dissipation device for a communication device housing having an excellent heat dissipation effect and high thermal conductivity. A housing 2 and at least one second heat pipe set 4 are included. The housing 2 includes a plurality of heat radiation fins 25, at least one first copper heat receiving member 22, and at least one first heat pipe set 24. The heat radiating fins 25 are disposed on the outer surface of the housing 2. The first heat pipe set 24 is connected to the first copper heat receiving member 22 and the first copper heat receiving member non-contact area 23, and the heat absorbed by the first copper heat receiving member 22 is the first heat pipe set 24. It is conducted to the copper heat receiving member non-contact area 23 and radiated. The second heat pipe set 4 is provided on the heat radiating fins 25 of the housing 2, and the heat on the heat radiating fins 25 is quickly and uniformly diffused and radiated to increase the thermal conductivity. [Selection] Figure 2

Description

  The present invention relates to a heat radiating device for a communication device housing, and in particular, heat from the heat radiating fins can be swiftly provided by at least one second heat pipe set penetrating the heat radiating fins above the housing and the lid. The present invention relates to a heat radiating device for a communication device housing that diffuses uniformly and radiates heat and has high thermal conductivity.

  Conventional electronic communication devices are placed in a housing and generate heat when operating. The housing is a sealed body in which metal is cast. Due to the limitations of casting technology, the thermal conductivity of the material is low. Therefore, since all the heat generated from the electronic element is concentrated in a partial region of the housing, the temperature in the partial region becomes high and it is difficult to dissipate heat. As a result, the allowable temperature of the electronic device is exceeded, and the reliability and service life of the electronic device are seriously affected. On the other hand, the temperature of the other wide area away from the heat generating electronic element of the housing is much lower than the temperature of the partial area in contact with the electronic element. That is, the temperature of the casing is extremely unbalanced, and the heat dissipation effect of the entire casing is low. Conventional solutions to the above problems are generally methods of increasing the size of the housing or improving the material of the housing. However, in such a case, since a technical problem such as excessive weight of the casing occurs, how to increase the heat dissipation effect without changing the dimensions and weight of the casing was an important issue. .

  Please refer to FIG. FIG. 1 is an exploded perspective view showing a conventional communication apparatus. As shown in FIG. 1, the communication device includes a housing 10, a lid 11, a plurality of support pillars 12, and a substrate 13. The housing 10 includes an accommodation space 101 and a plurality of heat radiation fins 103. The heat radiating fins 103 are arranged on the surface of the housing 10 that has a front and back relationship with the housing space 101. The plurality of support pillars 12 are arranged at positions adjacent to the housing 10 in the accommodation space 101. A substrate 13 is connected to the support column 12. The lid 11 covers the substrate 13 and is accommodated in the accommodation space 101.

  When the substrate 13 of the communication device operates, a large amount of heat is generated because a plurality of heating elements 131 (for example, a chip, a CPU, or another IC) on the substrate 13 perform arithmetic processing. However, the heat is conducted on the housing 10 by the radiation method, diffused to the outside by the radiation method through the plurality of heat radiation fins 103 on the housing 10, and is only radiated. Can't quickly dissipate heat. In addition, since the heat generating element 131 on the substrate 13 is not provided with other heat conductive media such as a heat pipe and a heat conductive member, the heat generated from the heat generating element 131 is immediately applied to the heat radiating fins 103 of the housing 10. Can't conduct and dissipate heat. Accordingly, the heat in the communication device casing cannot be quickly diffused to the outside and cannot be dissipated, so that the heating element 131 is likely to crash during the arithmetic processing and the quality of the communication signal is deteriorated. In a severe case, the heating element 131 may be damaged or the life may be shortened.

That is, the conventional communication device has the following drawbacks.
1. It is not excellent in heat dissipation effect.
2. Prone to crashing.
3. Communication signal quality is low.
4). Service life is short.
5. High damage rate.

  Therefore, how to solve the above problems and drawbacks was the research goal of the inventors of the present invention and those skilled in the art.

JP 2003-209385 A

The present invention has been made in view of the above-mentioned conventional drawbacks. A first object of the present invention is to provide at least one second heat pipe set penetrating through the heat dissipating fins above the housing and the lid. Accordingly, an object of the present invention is to provide a heat dissipating device for a communication device casing that can dissipate and dissipate heat on a heat dissipating fin quickly and uniformly and achieve an extremely excellent heat dissipating effect.
A second object of the present invention is to provide a heat dissipating device for a communication device housing capable of increasing a heat dissipating area by joining at least one second heat pipe set and at least one heat dissipating module. It is to provide.
A third object of the present invention is to provide a heat radiating device for a communication device housing having a high thermal conductivity.
A fourth object of the present invention is to provide a heat dissipating device for a communication device housing capable of stabilizing the quality of a communication signal.
A fifth object of the present invention is to provide a heat dissipation device for a communication device housing having a long service life.

  In order to solve the above-described problem, a heat dissipation device for a communication device housing according to the present invention includes a housing and at least one second heat pipe set. The housing includes a plurality of radiating fins, at least one first copper heat receiving member, and at least one first heat pipe set. The plurality of radiating fins are disposed on the outer surface of the housing. The first heat pipe set is connected to the first copper heat receiving member and the first copper heat receiving member non-contact region. The heat absorbed by the first copper heat receiving member is conducted to the non-contact region of the first copper heat receiving member and radiated. When the second heat pipe set is provided on the heat radiating fins of the housing, the heat on the heat radiating fins is quickly and uniformly diffused and radiated to increase the thermal conductivity. Therefore, the heat radiating device of the communication device casing can achieve an extremely excellent heat radiating effect.

The heat dissipating device for the communication device housing of the present invention can uniformly dissipate the heat of the heat dissipating fins above the housing and the lid by the second heat pipe and quickly dissipate the heat to the outside. As a result, the thermal conductivity is increased, the heat inside and above the housing is effectively removed, the board in the communication device is stably operated, the quality of the communication signal is stabilized, and the service life of the entire communication device And an extremely excellent heat dissipation effect can be achieved.
In addition, the structure in which the second heat pipe and the heat radiating module are connected quickly diffuses the heat of the housing, the heat radiating fin above the housing, the lid, and the heat radiating fin above the lid, thereby reducing the heat radiating area. It is possible to increase the heat effectively inside and above the housing. Thereby, the board | substrate in a communication apparatus can be operated stably, the quality of a communication signal can be stabilized, the service life of the whole communication apparatus can be extended, and the outstanding heat dissipation effect can be achieved.

It is a disassembled perspective view which shows the conventional communication apparatus. It is a disassembled perspective view which shows the state before assembling the housing | casing and 2nd heat pipe set by one Embodiment of this invention. It is a disassembled perspective view which shows the state after assembling the housing | casing and 2nd heat pipe set by one Embodiment of this invention. It is a disassembled perspective view which shows the state before assembling the cover body and 2nd heat pipe set by one Embodiment of this invention. It is a disassembled perspective view which shows the state after assembling the cover body and 2nd heat pipe set by one Embodiment of this invention. It is a disassembled perspective view which shows the thermal radiation apparatus of the communication apparatus housing | casing by one Embodiment of this invention. It is a disassembled perspective view which shows the state before assembling the housing | casing by the other embodiment of this invention, a 2nd heat pipe set, and a thermal radiation module. It is a disassembled perspective view which shows the state before assembling the cover body by the other embodiment of this invention, the 2nd heat pipe set, and the thermal radiation module. It is a disassembled perspective view which shows the thermal radiation apparatus of the communication apparatus housing | casing by other embodiment of this invention. It is a perspective view which shows the thermal radiation apparatus of the communication apparatus housing | casing by other embodiment of this invention.

  DESCRIPTION OF EMBODIMENTS Embodiments showing the objects, features, and effects of the present invention will be described in detail with reference to the drawings.

  Please refer to FIG. 2 and FIG. As shown in FIGS. 2 and 3, the heat radiating device for a communication device housing according to an embodiment of the present invention includes a housing 2 and at least one second heat pipe set 4. The housing 2 includes at least one first copper heat receiving member 22, at least one first heat pipe set 24, and a plurality of radiating fins 25. The first heat pipe set 24 is connected to the first copper heat receiving member 22 and the first copper heat receiving member non-contact area 23, and the first copper heat receiving member 22 absorbs the heat absorbed by the first copper heat receiving member 22. The heat receiving member non-contact region 23 conducts heat and dissipates heat. The first copper heat receiving member non-contact area 23 is defined at a position where the first copper heat receiving member 22 is not in contact with the first copper heat receiving member 22 in a direction away from the first copper heat receiving member 22.

  The housing 2 includes an accommodation space 21. The plurality of heat radiating fins 25 are arranged on the surface of the housing 2 that has a front and back relationship with the accommodation space 21. That is, the heat radiating fins 25 are disposed on the outer surface of the housing 2. The second heat pipe set 4 includes a plurality of second heat pipes 40 penetrating on the radiation fins 25 above the housing 2. The second heat pipe 40 includes a second evaporator 41 and a second condenser 42. The second evaporating part 41 is provided through the heat radiating fins 25 above the casing 2 and is disposed at a position corresponding to the first copper-based heat receiving member 22 of the casing 2. The second condensing unit 42 extends in a direction away from the second evaporating unit 41 and penetrates through the heat radiating fins 25 above the housing 2. The second evaporator 41 of the second heat pipe 40 quickly conducts the heat of the casing 2 and the radiating fin 25 above the casing 2 to the second condenser 42. The heat conducted to the second condensing unit 42 is quickly and uniformly dispersed in the heat radiating fins 25 having a low temperature, rapidly diffused to the outside and radiated, and the thermal conductivity is greatly increased.

  Please refer to FIGS. As shown in FIGS. 2 to 6, the first heat pipe set 24 includes a plurality of first heat pipes 240. Each first heat pipe 240 includes a first evaporator 241 adjacent to the first copper heat receiving member 22, and a first condensing unit 242 disposed at a position away from the first copper heat receiving member 22. And including. The first evaporating unit 241 conducts the absorbed heat to the first condensing unit 242, and radiates heat. That is, first, the heat absorbed by the first copper heat receiving member 22 is quickly conducted from the first evaporator 241 to the first condenser 242. Next, the heat conducted to the first condensing unit 242 is conducted to the radiation fins 25 above the housing 2. Next, the heat conducted to the radiating fins 25 is conducted via the second heat pipe 40 onto the radiating fins 25 where heat has not been conducted yet, and the heat is dispersed to radiate heat. Part of the heat is conducted to the first copper heat receiving member non-contact region 23 and is radiated.

  The first copper-based heat receiving member 22 has suitable thermal conductivity (or endothermic property) and can absorb heat quickly. The first copper heat receiving member 22 includes a first end surface and a second end surface. The first end surface is on the same plane as the bottom surface of the housing 2, and the second end surface is provided inside the bottom surface of the housing 2 and is integrally molded with the housing 2. The first copper heat receiving member 22 is in contact with at least one heating element 61 to form a high temperature region H. The high temperature region H is a region that absorbs heat generated from the heating element 61 of the first copper heat receiving member 22, and is a high temperature heat source region in the accommodation space 21.

  The housing 2 includes a first heat radiating portion 231, a second heat radiating portion 232, a third heat radiating portion 233, a fourth heat radiating portion 234, and a fifth heat radiating portion 235, and is electrically connected to each other to form the low temperature region L. Form. The low temperature region L is away from the high temperature region H and does not contact the heating element 61. The low temperature region L is a low temperature heat dissipation region in the accommodation space 21. The first heat radiating portion 231 is disposed at a position away from the first copper-based heat receiving member 22 on the bottom surface of the accommodation space 21. The second heat radiating part 232, the third heat radiating part 233, the fourth heat radiating part 234, and the fifth heat radiating part 235 are electrically connected to each other and are provided around the accommodation space 21. That is, one side portion of the third heat radiating portion 233 and the fifth heat radiating portion 235 is connected to both side portions of the second heat radiating portion 232. In addition, both side portions of the fourth heat radiating portion 234 are connected to the other side portions of the third heat radiating portion 233 and the fifth heat radiating portion 235. Thereby, the second heat radiating part 232, the third heat radiating part 233, the fourth heat radiating part 234 and the fifth heat radiating part 235 are provided around the accommodation space 21.

  The accommodation space 21 includes at least one concave groove 214 in which the first heat pipe 240 is accommodated. A part of the concave groove 214 is adjacent to the periphery of the first copper heat receiving member 22, and the other part is adjacent to the first copper heat receiving member non-contact region 23 and the periphery of the housing 2. That is, a part of the concave groove 214 is provided around the first copper heat receiving member 22 and the first evaporation part 241 of the first heat pipe 240 is accommodated. The other part of the concave groove 214 is provided at a position away from the first copper heat receiving member 22, extends to the first copper heat receiving member non-contact area 23 and the housing 2, and the first heat pipe 240. The first condensing part 242 is accommodated. In the accommodation space 21, at least one substrate 6 on which the heat generating element 61 is arranged is mounted.

  Reference is again made to FIG. As shown in FIG. 6, the accommodation space 21 further includes at least one support member 215 and at least one heat conducting member 216. The support member 215 is disposed in the accommodation space 21 of the housing 2 and supports the substrate 6. The heat conducting member 216 is disposed between two adjacent substrates 6. One end of the heat conducting member 216 is tightly fixed inside the accommodation space 21. Both surfaces of the heat conducting member 216 include at least one second copper-based heat receiving member 2162, respectively. Each second copper heat receiving member 2162 extends and contacts the heating element 61 on each substrate 6 to form a high temperature region H. The second copper heat receiving member 2162 has suitable thermal conductivity (heat absorption) and quickly absorbs heat generated from the heating elements 61 on each substrate 6. The heat conducting member 216 is a heat diffusing plate. The end surface of the second copper-based heat receiving member 2162 is on the same plane as the heat conducting member 216 and is integrally formed with the heat conducting member 216.

  The heat conducting member 216 includes a third heat pipe set 2163. Third heat pipe set 2163 includes a plurality of third heat pipes 2164. Each third heat pipe 2164 includes a third evaporator 2165 adjacent to the second copper heat receiving member 2162 and a third condensing unit 2166 disposed at a position away from the second copper heat receiving member 2162. And including. The third evaporating unit 2165 receives the heat absorbed through the third condensing unit 2166 in the first copper heat receiving member non-contact region 23 (that is, the first heat radiating unit 231, the second heat radiating unit 232, the second 3 radiating portion 233, fourth radiating portion 234 and fifth radiating portion 235) to dissipate heat. That is, the heat from the heating element 61 absorbed by the second copper heat receiving member 2162 is conducted to the third condensing unit 2166 through the third evaporating unit 2165. The heat conducted to the third condensing unit 2166 is conducted to the first copper-based heat receiving member non-contact region 23. The first copper heat receiving member non-contact area 23 dissipates heat by diffusing the conducted heat to the outside by a radiation method. At the same time, the heat of the heat radiating fins 25 at the top of the housing 2 is quickly conducted and distributed to the other heat radiating fins 25 via the second heat pipe 40 and radiated.

  Reference is again made to FIGS. 4, 5 and 6. As shown in FIGS. 4, 5, and 6, a lid 7 is connected to the housing 2 so as to face each other. One side surface of the lid 7 faces the accommodation space 21. The lid body 7 includes at least one third copper-based heat receiving member 71 and at least one fourth heat pipe set 72. A plurality of heat radiating fins 73 through which the second heat pipe 40 is penetrated are arranged on the side surfaces of the lid body 7 that are in front of and behind the accommodation space 21. The third copper heat receiving member 71 protrudes and contacts the heat generating element 61, absorbs heat generated from the heat generating element 61, and forms a high temperature region H. The third copper heat receiving member 71 is on the same plane as one side surface of the lid body 7 and is integrally formed with the lid body 7. The second evaporating part 41 of the second heat pipe 40 is provided through the heat dissipating fins 73 above the lid body 7 and is disposed at a position corresponding to the third copper heat receiving member 71 of the lid body 7. The second condensing unit 42 is provided at a position away from the second evaporating unit 41 and penetrates the heat radiating fins 73 above the lid body 7.

  The fourth heat pipe set 72 includes a plurality of fourth heat pipes 720. Each fourth heat pipe 720 includes a fourth evaporator 721 adjacent to the third copper heat receiving member 71 and a fourth condensing unit 722 disposed at a position away from the third copper heat receiving member 71. And including. The heat absorbed by the fourth evaporating unit 721 is conducted and radiated through the fourth condensing unit 722 to the heat dissipating fins 73 on the top of the lid body 7 and the first copper heat receiving member non-contact region 23. In other words, the third copper heat receiving member 71 absorbs heat from the heating element 61 and conducts the heat to the fourth condensing unit 722 via the fourth evaporation unit 721. The fourth condensing unit 722 conducts the conducted heat to the first copper heat receiving member non-contact area 23 and the heat radiating fins 73 on the lid body 7 and radiates heat. At the same time, the second evaporator 41 of the second heat pipe 40 absorbs the heat of the heat dissipating fins 73 of the lid body 7, and the other heat dissipating fins 73 are connected in series through the second condensing part 42. It spreads evenly and dissipates heat quickly to the outside.

  Please refer to FIGS. Hereinafter, this embodiment will be specifically described.

  When the substrate 6 in the communication device is operating, high heat is generated from the heating element 61 of the substrate 6. The first copper heat receiving member 22 absorbs heat generated from the heating element 61 of the substrate 6. Heat is transferred to the first condensing unit 242 by the first evaporation unit 241 of the first heat pipe 240. The heat conducted to the first condensing part 242 is conducted to the first copper heat receiving member non-contact area 23, the housing 2 and the lid body 7 to be radiated. At this time, the radiating fins 25 and 73 above the housing 2 and the lid body 7 transfer the heat on the radiating fins 25 and 73 to the second condensing unit via the second evaporation unit 41 of the second heat pipe 40. 42 are respectively conducted and dispersed. That is, each second condensing unit 42 uniformly dissipates the conducted heat to the heat radiation fins 25 and 73, and quickly diffuses and radiates heat to the outside by a radiation method. Here, most of the heat is quickly and uniformly diffused to the heat radiation fins 25 and 73 above the housing 2 and the lid body 7 by the second heat pipe 40 to dissipate the heat. The copper heat receiving member non-contact area 23 (that is, the first heat radiating portion 231, the second heat radiating portion 232, the third heat radiating portion 233, the fourth heat radiating portion 234, and the fifth heat radiating portion 235) radiates heat. .

  Further, the second copper heat receiving members 2162 provided on both sides of the heat conducting member 216 absorb the heat from the two heating elements 61 on the corresponding substrates 6, and the third heat pipe 2164 has the third heat pipe 2164. The evaporation unit 2165 conducts heat to the third condensing unit 2166. The third condensing unit 2166 conducts the conducted heat to the first copper-based heat receiving member non-contact region 23 to radiate heat. Further, the heat described above is radiated in the first copper heat receiving member non-contact region 23 and is simultaneously conducted to the heat radiating fins 25 and 73 above the housing 2 and the lid body 7. The heat conducted to the radiation fins 25 and 73 is uniformly distributed to the radiation fins 25 and 73 of the housing 2 and the lid body 7 through the second heat pipe 40. The heat radiation fins 25 and 73 dissipate heat by diffusing heat to the outside by a radiation method, and also radiate heat by exchanging heat with external air.

  With the second heat pipe 40 of the present embodiment, the heat of the radiation fins 25 and 73 above the housing 2 and the lid body 7 can be uniformly diffused and quickly radiated to the outside. Thereby, the thermal conductivity is increased, the heat inside the housing 2 and above the housing 2 is effectively removed, the substrate 6 in the communication device is stably operated, the quality of the communication signal is stabilized, and the communication device The overall service life can be extended and an extremely excellent heat dissipation effect can be achieved.

  Please refer to FIGS. 7 to 10 show a heat dissipating device of a communication device housing according to another embodiment of the present invention. Since the entire structure and the connection relationship between the members are the same as in the above-described embodiment, the description of the same parts will not be given. This embodiment is different from the above-described embodiment in that at least one heat radiation module 3 is connected to the second heat pipe set 4. The heat dissipation module 3 includes a plurality of heat dissipation fins 31 and a fan 32. The fan 32 is disposed on one side surface of the radiation fin 31 and forcibly radiates the radiation fin 31. The second condensing part 42 of the second heat pipe 40 penetrating the housing 2 and the lid 7 is penetrating on the heat dissipating fins 31 of the heat dissipating module 3. Thereby, the heat of the radiation fins 25 and 73 above the housing 2 and the lid body 7 is conducted to the heat radiation module 3 and radiated. That is, the second evaporator 41 of each second heat pipe 40 receives the heat of the casing 2, the radiating fins 25 above the casing 2, the lid 7 and the radiating fins 73 above the lid 7. Conducted to the second condensing unit 42. By conducting the heat conducted to the second condensing part 42 to each heat radiating module 3, the heat is dispersed and radiated to greatly increase the thermal conductivity.

  By connecting and combining the second heat pipe set 4 and the heat dissipation module 3, the heat dissipation module 3 shares the heat dissipation of the heat dissipation fins 25 and 73 above the housing 2 and the lid body 7. This effectively increases the heat dissipation area.

  Please refer to FIGS. Hereinafter, this embodiment will be specifically described.

  When the substrate 6 in the communication device is operating, high heat is generated from the heating element 61 of the substrate 6. The first copper heat receiving member 22 absorbs heat generated from the heating element 61 of the substrate 6. Heat is transferred to the first condensing unit 242 by the first evaporation unit 241 of the first heat pipe 240. The heat conducted to the first condensing part 242 is conducted to the first copper heat receiving member non-contact area 23, the housing 2 and the lid body 7 to be radiated. At this time, the radiating fins 25 and 73 above the housing 2 and the lid body 7 transfer the heat on the radiating fins 25 and 73 to the second condensing unit via the second evaporation unit 41 of the second heat pipe 40. 42 are respectively conducted and dispersed. Each of the second condensing units 42 dissipates and dissipates the heat of a part of the conducted heat uniformly through the heat dissipating fins 25 and 73, and the other heat of the heat dissipating fins 31 of the heat dissipating module 3. Conducted upward, the fan 32 conducts forced convection heat radiation to the radiation fin 31.

  The second copper heat receiving members 2162 on both sides of the heat conducting member 216 absorb heat from the two heating elements 61 on the substrate 6 corresponding to each other. Next, the third evaporator 2165 of the third heat pipe 2164 conducts heat to the third condenser 2166. The third condensing unit 2166 conducts the conducted heat to the first copper-based heat receiving member non-contact region 23 to radiate heat. Further, the heat described above is radiated in the first copper heat receiving member non-contact region 23 and is simultaneously conducted to the heat radiating fins 25 and 73 above the housing 2 and the lid body 7. The heat conducted to the radiating fins 25 and 73 is uniformly distributed to the radiating fins 25 above the casing 2, the radiating fins 73 above the lid body 7, and the radiating fins 31 of the radiating module 3 through the second heat pipe 40. To be distributed. The radiating fins 25, 73, and 31 dissipate heat by radiating to the outside by a radiation method, and the fan 32 performs forced convection heat radiation to the radiating fins 31.

  With the structure in which the second heat pipe 40 and the heat dissipation module 3 of the present embodiment are connected, the housing 2, the heat radiation fins 25 above the housing 2, the lid body 7, and the heat radiation fins 73 above the lid body 7 In addition to being able to diffuse heat quickly, the heat dissipation area can be increased and the heat in and above the housing 2 can be effectively eliminated. Thereby, the board | substrate 6 in a communication apparatus can be operated stably, the quality of a communication signal can be stabilized, the service life of the whole communication apparatus can be extended, and the outstanding heat dissipation effect can be achieved.

  As described above, the heat dissipation device for the communication device casing according to the present embodiment has the following advantages.

1. It has a suitable heat dissipation effect.
2. Increases heat dissipation area.
3. High thermal conductivity.
4). Stabilize communication signal quality.
5. Extend the service life of communication devices.

  The above detailed description shows possible embodiments of the present invention, and all of the above-described changes in the method, shape, structure and apparatus of the present invention are included in the scope of the utility model registration claim of the present invention. It is.

2 Housing 21 Housing space 214 Concave groove 215 Support member 216 Heat conducting member 2162 Second copper-based heat receiving member 2163 Third heat pipe set 2164 Third heat pipe 2165 Third evaporating unit 2166 Third condensing unit 22 1st copper heat receiving member 23 1st copper heat receiving member non-contact field 231 1st heat sink 232 2nd heat sink 233 3rd heat sink 234 4th heat sink 235 5th heat sink 24 1 heat pipe set 240 1st heat pipe 241 1st evaporating section 242 1st condensing section 25 radiating fin 3 radiating module 31 radiating fin 32 fan 4 second heat pipe set 40 second heat pipe 41 second Evaporating section 42 Second condensing section 6 Substrate 61 Heating element 7 Lid 71 Third copper heat receiving member 72 Fourth heat pipe set 720 Fourth heat pipe Flop 721 fourth evaporators 722 fourth condenser section 73 radiation fin H high temperature region L low temperature region

Claims (17)

Including a housing and at least one second heat pipe set;
The housing includes at least one first copper heat receiving member, a plurality of heat radiation fins and at least one first heat pipe set, and the plurality of heat radiation fins are disposed on an outer surface of the housing,
The first heat pipe set is connected to the non-contact area of the first copper heat receiving member and the first copper heat receiving member, and the heat absorbed by the first copper heat receiving member is the first heat pipe set. Copper heat receiving member is conducted to the non-contact area and dissipated,
The at least one second heat pipe set is provided on a plurality of heat radiation fins of the housing so as to penetrate therethrough. At least one heat dissipation module is connected to the second heat pipe set, and the heat dissipation module includes a plurality of heat dissipation fins and a fan,
The fan is disposed on one side surface facing the heat radiation fin, and the second heat pipe is provided on the heat radiation fin of the heat radiation module,
The heat radiating device of the communication device housing according to claim 1, wherein the heat conducted to the heat radiating fin of the housing is conducted to the heat radiating module and radiated.   The heat dissipation device for a communication device housing according to claim 2, wherein the housing includes an accommodation space.   The first copper heat-receiving member includes a first end surface that is coplanar with the bottom surface of the housing, and a second end surface that is provided inside the bottom surface of the housing and is integrally formed with the housing. The heat radiating device for a communication device housing according to claim 1, wherein: The second heat pipe set includes a plurality of second heat pipes, the second heat pipe includes a second evaporator and a second condenser, and the second evaporator includes the second evaporator Penetrating through the heat dissipating fins of the housing, disposed at a position corresponding to the first copper heat receiving member of the housing,
The heat radiating device for a communication device case according to claim 2, wherein the second condensing unit extends in a direction away from the second evaporating unit and extends through a heat radiating fin of the case. .   The heat dissipation device for a communication device casing according to claim 3, wherein the first copper heat receiving member and at least one heating element are in contact with each other to form a high temperature region. The first heat pipe set includes a plurality of first heat pipes,
The plurality of first heat pipes include a first evaporation section and a first condensation section, and the first evaporation section is adjacent to the first copper heat receiving member,
2. The heat dissipation device for a communication device housing according to claim 1, wherein the first condensing unit is disposed at a position away from the first copper heat receiving member. The housing includes a first heat radiating portion, a second heat radiating portion, a third heat radiating portion, a fourth heat radiating portion, and a fifth heat radiating portion,
The first heat radiating portion, the second heat radiating portion, the third heat radiating portion, the fourth heat radiating portion and the fifth heat radiating portion are electrically connected to each other to form a low temperature region,
The first heat radiating portion is disposed in a direction away from the first copper-based heat receiving member on the bottom surface of the housing space,
The communication device casing according to claim 3, wherein the second heat radiating portion, the third heat radiating portion, the fourth heat radiating portion, and the fifth heat radiating portion are provided around the housing space. Heat dissipation device.   The heat radiating device for a communication device housing according to claim 6, wherein at least one substrate is mounted in the housing space, and the heating element is disposed on the substrate. The accommodation space includes at least one concave groove in which the first heat pipe set is accommodated,
A part of the concave groove is adjacent to the periphery of the first copper heat receiving member,
4. The heat dissipation device for a communication device housing according to claim 3, wherein the other portion of the concave groove is adjacent to the first copper heat receiving member non-contact area and the periphery of the housing. The accommodating space further includes at least one support member and at least one heat conducting member,
The at least one support member is disposed in a housing space of the housing and supports the substrate;
The at least one heat conducting member is disposed between two adjacent substrates;
At least one second copper heat receiving member is provided on both sides of the heat conducting member, and the second copper heat receiving member extends to and contacts the heating element on the substrate to form a high temperature region. The heat dissipating device for a communication device casing according to claim 9. The end surface of the second copper heat receiving member is on the same plane as the heat conducting member,
The heat dissipation device for a communication device housing according to claim 11, wherein the second copper heat receiving member is integrally formed with the heat conducting member. The heat conducting member includes a third heat pipe set, and the third heat pipe set includes a plurality of third heat pipes,
Each of the third heat pipes includes a third evaporation unit adjacent to the second copper heat receiving member, a third condensing unit disposed at a position away from the second copper heat receiving member, Including
The communication according to claim 11, wherein the heat absorbed by the third evaporating unit is conducted and radiated through the third condensing unit to the non-contact region of the first copper heat receiving member. A heat dissipation device for the device housing. A lid is oppositely connected to the housing, and one side surface of the lid is opposed to the accommodation space,
The lid includes at least one third copper heat receiving member,
A plurality of heat radiation fins through which the second heat pipe set is provided are arranged on the side surface opposite to the housing space of the lid,
The heat dissipation device for a communication device casing according to claim 1, wherein the third copper heat receiving member protrudes and contacts at least one heating element to form a high temperature region. The third copper heat receiving member is on the same plane as one side surface of the lid,
The heat dissipation device for a communication device housing according to claim 14, wherein the third copper heat receiving member is integrally formed with the lid. The lid includes a fourth heat pipe set,
The fourth heat pipe set includes a plurality of fourth heat pipes,
The plurality of fourth heat pipes include a fourth evaporation section adjacent to the third copper heat receiving member, and a fourth condensing section disposed at a position away from the third copper heat receiving member. Each including
The heat absorbed by the fourth evaporating part is conducted and radiated through the fourth condensing part to the heat dissipating fins on the lid body and the non-contact region of the first copper heat receiving member. The heat dissipation device for a communication device casing according to claim 14. The second heat pipe set includes a plurality of second heat pipes,
The plurality of second heat pipes each include a second evaporation unit and a second condensing unit,
The second evaporating part is provided through the heat radiating fin of the housing, and is disposed at a position corresponding to the third copper heat receiving member of the lid.
The heat dissipation device for a communication device casing according to claim 14, wherein the second condensing unit extends in a direction away from the second evaporating unit and extends through a heat dissipating fin of the lid. .

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