US20050199377A1

US20050199377A1 - Heat dissipation module with heat pipes

Info

Publication number: US20050199377A1
Application number: US11/053,616
Authority: US
Inventors: Chi-Hung Chuang; Wen-Liang Hwang; Chao-Jung Chen; Hung-Chou Chan
Original assignee: Quanta Computer Inc
Current assignee: Quanta Computer Inc
Priority date: 2004-03-11
Filing date: 2005-02-08
Publication date: 2005-09-15
Also published as: TW200530549A

Abstract

A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is soldered to the seat, covering the grooves and heat pipes. A second fin assembly with parallel second fins is secured to the cantilevered end of the heat pipes.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a heat dissipation module, and in particular to a heat dissipation module using heat pipes to increase heat transfer efficiency thereof.
2. Description of the Related Art
Presently, CPUs for conventional barebone servers consume excessive power and generate considerable heat. Space reserved inside the server for a heat dissipation module, however, is limited.
Heat sinks are a common component in conventional heat dissipation modules. Conventional heat sinks comprise aluminum extrusion type or copper adhering type, mounted directly on a chip or CPU and utilize the flow provided by preset passages or fans mounted thereon to dissipate heat. In order to increase stability of conventional severs, heat sinks must continue to dissipate heat even when some of system fans malfunction. Hence, there is a need for a better heat sink with higher heat dissipation efficiency for conventional barebone servers.

SUMMARY OF THE INVENTION

Accordingly, an object of the invention is to provide a heat sink with higher heat dissipation efficiency for conventional barebone servers.
Accordingly, the present invention provides a heat dissipation module with heat pipes. The heat dissipation module comprises a seat with grooves, heat pipes and two fin assemblies. The seat is disposed directly on a heat source. The first fin assembly with parallel first fins is disposed on the seat, covering the grooves. The second fin assembly with parallel second fins is disposed on a side of the first fin assembly. Each heat pipe comprises a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.
In a preferred embodiment, the heat pipes are soldered in the grooves, perpendicular to the first and second fins. The first fin assembly is soldered on the seat. The second fin assembly is soldered on the cantilevered ends of the heat pipes. The seat, heat pipes, first fin assembly and second fin assembly comprise copper or aluminum.
The heat dissipation module of the present invention utilizes heat pipes to transfer heat from a first fin assembly to an additional second fin assembly, increasing the effective area of the heat dissipation module.
Furthermore, the additional second fin assembly can be arranged in a residual area of a system or a position with better dissipation efficiency. The first and second fin assemblies are connected by heat pipes, thus improving heat dissipation efficiency of the heat dissipation module and effectively utilizing the limited space provided in a conventional sever.
A detailed description is given in the following embodiments with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
FIG. 1 is an exploded view of a heat dissipation module of present invention; and
FIG. 2 is a schematic view of the heat dissipation module.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is an exploded view of a heat dissipation module of the present invention. In FIG. 1, the heat dissipation module 10 comprises a seat 20, heat pipes 24 and two fin assemblies 30, 40. The seat 20 is a metal plate directly disposed on a heat source 2, such as a CPU, graphic chip or other chips. The seat 20 comprises a plurality of parallel grooves 22 with width and depth similar to the bore diameter of the heat pipes 24. The heat pipes 24 are hollow elliptic pipes with low-pressure heat conductive liquid therein, transferring heat by convection. The heat pipes 24 are secured in the grooves 22 at one end and protrudes from the grooves 22.
The first fin assembly 30 is disposed on the seat 20, covering the grooves 22 and heat pipes 24, and comprises a plate 32, a plurality of parallel first fins 34 and two fixing protectors 36. The first fins 34 are adhered or soldered on the plate 32. The fixing protectors 36 prevent damage to the edges of the first fins 34.
The second fin assembly 40 comprises a plate 42, a plurality of parallel second fins 44 and two fixing protectors 46. The second fins 44 are adhered or soldered on the plate 42. The fixing protectors 46 prevent damage to the edges of the second fins 44. Each second fin 44 has through holes 48 for access to the cantilevered ends of the heat pipes 24, such that the second fin assembly 40 can be soldered thereon.
FIG. 2 shows the heat dissipation module of the invention. In FIGS. 1 and 2, when fabricating the heat dissipation module 10, the heat pipes 24 are first soldered in the grooves 22, and solder is applied on the surface of the seat 20 and the cantilevered ends of the heat pipes 24. The first and second fin assemblies 30, 40 are disposed on the seat 20 and the cantilevered ends of the heat pipes 24. The entire module 10 is place in an oven, securing the first and second fin assemblies 30, 40 thereon by baking. After fabrication, the heat dissipation module 10 is fixed on a printed circuit board 1, the bottom surface of the seat 20 contacting the chip 2, by the screws 28 passing through the openings 26 thereof. Thus, the heat dissipation module 10 can dissipate heat generated by the chip 2.
In order to increase the heat dissipation efficiency, the seat 20, heat pipes 24, first and second fin assemblies 30 and 40 comprise copper or aluminum. Conventional heat dissipation paste can be applied between the chip 2 and the seat 20 and in the grooves 22 to facilitate heat conduction. The heat pipes 24 are perpendicular to the first fins 34 and second fins 44, preventing obstruction of provided flow.
Furthermore, the heat pipes 24 can be directly soldered on the top surface of the seat 20. The plate 20 and the first fins 34 comprise notches, such that the first fin assembly 30 can be secured on the seat 20 without forming grooves 22.
The additional second fin assembly 40 can be arranged in a residual area of a system or a position with better dissipation efficiency. The first and second fin assemblies 30 and 40 are connected by heat pipes 24, transferring heat, such that heat dissipation efficiency of the heat dissipation module 10 can be improved, and space inside a conventional severs can be utilized effectively.
The heat dissipation module 10 of present invention utilizes heat pipes 24 to transfer heat from the first to the second fin assembly, thus increasing heat dissipation efficiency and stability of conventional barebone servers.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.

Claims

1. A heat dissipation module comprising:

a seat with a plurality of grooves, contacting a heat source;

a first fin assembly with a plurality of first fins disposed on the seat, covering the grooves;

a second fin assembly with a plurality of second fins disposed on a side of the first fin assembly; and

a plurality of heat pipes, each heat pipe comprising a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.

2. The heat dissipation module as claimed in claim 1, wherein the first fins are parallel.

3. The heat dissipation module as claimed in claim 1, wherein the second first fins are parallel.

4. The heat dissipation module as claimed in claim 1, wherein the first fins are perpendicular to the heat pipes.

5. The heat dissipation module as claimed in claim 1, wherein the second fins are perpendicular to the heat pipes.

6. The heat dissipation module as claimed in claim 1, wherein the heat pipes are soldered in the grooves.

7. The heat dissipation module 10 as claimed in claim 1, wherein the first fin assembly is soldered on the seat.

8. The heat dissipation module as claimed in claim 1, wherein the second fin assembly is soldered to the second ends of the heat pipes.

9. The heat dissipation module as claimed in claim 1, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.

10. A heat dissipation module comprising:

a seat;

a plurality of heat pipes disposed on the seat and extending from the seat, forming a plurality of cantilevered ends;

a first fin assembly with a plurality of first fins, disposed on the seat and covering the heat pipes; and

a second fin assembly with a plurality of second fins, secured at the cantilevered ends of the heat pipes.

11. The heat dissipation module as claimed in claim 10, wherein the first fins are parallel.

12. The heat dissipation module as claimed in claim 10, wherein the second first fins are parallel.

13. The heat dissipation module as claimed in claim 10, wherein the first fins are perpendicular to the heat pipes.

14. The heat dissipation module as claimed in claim 10, wherein the second fins are perpendicular to the heat pipes.

15. The heat dissipation module as claimed in claim 10, wherein the heat pipes are soldered on the seat.

16. The heat dissipation module as claimed in claim 10, wherein the first fin assembly is soldered on the seat.

17. The heat dissipation module as claimed in claim 10, wherein the second fin assembly is soldered to the cantilevered ends of the heat pipes.

18. The heat dissipation module as claimed in claim 10, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.