JPWO2017203859A1 - Electronic circuit apparatus and method - Google Patents

Electronic circuit apparatus and method Download PDF

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Publication number
JPWO2017203859A1
JPWO2017203859A1 JP2018519131A JP2018519131A JPWO2017203859A1 JP WO2017203859 A1 JPWO2017203859 A1 JP WO2017203859A1 JP 2018519131 A JP2018519131 A JP 2018519131A JP 2018519131 A JP2018519131 A JP 2018519131A JP WO2017203859 A1 JPWO2017203859 A1 JP WO2017203859A1
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conductor
solder
electrode
insulating member
circuit board
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恵子 上之
恵子 上之
横塚　剛秀
剛秀 横塚
小山　克也
克也 小山
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

電子部品の電極と回路基板の導体を接合する導電性接合材の高さを確保しつつ、導電性接合材の内部のボイドを低減することができる電子回路装置及び方法を提供する。電子制御装置１００（電子回路装置）は、電子部品１と、回路基板６と、導電性接合材３と、非金属部材７（絶縁性部材）と、を備える。電子部品１は、電極２を有し、回路基板６は、電極２に対向する導体５を有する。導電性接合材３は、電極２と導体５とを接合する。非金属部材７（絶縁性部材）は、導電性接合材３の中に配置され、導体５と電極２に接する。Provided are an electronic circuit device and a method capable of reducing voids inside a conductive bonding material while ensuring the height of a conductive bonding material for bonding an electrode of an electronic component and a conductor of a circuit board. The electronic control device 100 (electronic circuit device) includes an electronic component 1, a circuit board 6, a conductive bonding material 3, and a nonmetallic member 7 (insulating member). The electronic component 1 has an electrode 2, and the circuit board 6 has a conductor 5 that faces the electrode 2. The conductive bonding material 3 bonds the electrode 2 and the conductor 5 together. The nonmetallic member 7 (insulating member) is disposed in the conductive bonding material 3 and is in contact with the conductor 5 and the electrode 2.

Description

本発明は、電子回路装置及び方法に関する。   The present invention relates to an electronic circuit device and method.

電子制御装置（電子回路装置）の小型化・高密度実装化、また、高温環境下への搭載位置の変更により、電子制御装置の高寿命化が要求されている。電子制御装置の製品寿命を決定する１つのファクタとして、はんだ接続部の寿命がある。   The electronic control device (electronic circuit device) is required to have a long service life by downsizing and high-density mounting and changing the mounting position in a high temperature environment. One factor that determines the product life of the electronic control device is the life of the solder joint.

電子部品と基板のはんだ接続部には、温度変化の環境下において、電子部品と基板の線膨張係数差に起因した応力が発生する。温度変化によって発生する応力が、繰り返しかかることではんだにはせん断ひずみが生じ、やがて破壊に至る。この繰り返し応力によってはんだに生じる破壊を熱疲労破壊と呼び、熱疲労破壊によって破断に至るまでの寿命を熱疲労破壊寿命と呼ぶ。   A stress caused by a difference in linear expansion coefficient between the electronic component and the substrate is generated in the solder connection portion between the electronic component and the substrate in an environment of temperature change. The stress generated by the temperature change is repeatedly applied, so that the solder undergoes shear strain and eventually breaks. The failure that occurs in the solder due to this repeated stress is called thermal fatigue failure, and the life until failure due to thermal fatigue failure is called the thermal fatigue failure life.

はんだの熱疲労破壊を抑制するための策として、はんだの接続高さのコントロールがある。はんだの接続高さが低い程、はんだ接続部に発生するせん断ひずみは拡大し、熱疲労破壊寿命は短寿命となる。一方、はんだ接続高さが高いとはんだ接続部に発生するせん断ひずみは縮小し、熱疲労破壊寿命は長寿命となる。   As a measure for suppressing thermal fatigue failure of the solder, there is control of the connection height of the solder. The lower the solder connection height, the greater the shear strain generated in the solder connection part, and the shorter the thermal fatigue failure life. On the other hand, when the solder connection height is high, the shear strain generated in the solder connection portion is reduced, and the thermal fatigue failure life is long.

電子部品と基板のはんだ接続部の接続高さを稼ぐことではんだの熱疲労寿命を向上させる技術が開示されている（例えば、特許文献１参照）。この特許文献１には、「実装面の対向領域内にリード端子に接続されない未接続ランドの少なくとも一部が配置され、この未接続ランド上に半導体装置における本体部の下面に接触する高さ調整用はんだは、一部がソルダーレジスト上に配置されるはんだペーストが、リフロー処理時に溶融し表面張力により未接続ランド上に集まって盛り上がるように形成されることで、本体部の下面に対して押し上げるように接触する。」と記載されている。   A technique for improving the thermal fatigue life of solder by increasing the connection height between the electronic component and the solder connection portion of the substrate is disclosed (for example, see Patent Document 1). In this Patent Document 1, “at least a part of an unconnected land that is not connected to a lead terminal is disposed in a region opposite to the mounting surface, and a height adjustment that contacts the lower surface of the main body portion of the semiconductor device on the unconnected land. The solder for solder is pushed up against the lower surface of the main body by forming a part of the solder paste that is placed on the solder resist so that it melts during the reflow process and collects on the unconnected land due to surface tension. Are in contact with each other ”.

また、同様に、はんだの接続高さを稼ぐことによりはんだ接続部の長期接続信頼性を向上させる技術が開示されている（例えば、特許文献２参照）。この特許文献２には、「半導体素子の電極パッドと基板上の電極パッドとをはんだボールによって接続する。はんだボールは、金属製コア部と、金属製コア部の周囲に設けられ、前記コア部よりも剛性が低く融点が低いはんだ部とで構成されている。はんだボールを半導体素子にリフローによって接続する。その後、はんだボールが付いた半導体素子と基板を超音波にて接続し、基板側において金属コアと電極を直接接続する。」と記載されている。   Similarly, a technique for improving the long-term connection reliability of the solder connection portion by increasing the connection height of the solder is disclosed (for example, see Patent Document 2). In this Patent Document 2, “an electrode pad of a semiconductor element and an electrode pad on a substrate are connected by a solder ball. The solder ball is provided around a metal core part and the metal core part, and the core part The solder ball has a lower rigidity and a lower melting point, and the solder ball is connected to the semiconductor element by reflow, and then the semiconductor element with the solder ball is connected to the substrate by ultrasonic waves. The metal core and the electrode are directly connected. "

特開2015-144205号公報JP-A-2015-144205 特開2014-82526号公報JP 2014-82526

特許文献１及び２に開示されるような技術によれば、電子部品の電極と回路基板の導体を接合するはんだ（導電性接合材）の高さを確保することができる。   According to the techniques disclosed in Patent Documents 1 and 2, it is possible to ensure the height of the solder (conductive bonding material) that joins the electrode of the electronic component and the conductor of the circuit board.

一方、はんだの内部に発生するボイドによりはんだの接続信頼性が低下するという問題が知られている。   On the other hand, the problem that the connection reliability of solder falls by the void which generate | occur | produces inside a solder is known.

本発明の目的は、電子部品の電極と回路基板の導体を接合する導電性接合材の高さを確保しつつ、導電性接合材の内部のボイドを低減することができる電子回路装置及び方法を提供することにある。   An object of the present invention is to provide an electronic circuit device and method capable of reducing the voids in the conductive bonding material while ensuring the height of the conductive bonding material for bonding the electrode of the electronic component and the conductor of the circuit board. It is to provide.

上記目的を達成するために、本発明は、電極を有する電子部品と、前記電極に対向する導体を有する回路基板と、前記電極と前記導体とを接合する導電性接合材と、前記導電性接合材の中に配置され、前記導体と前記電極に接する絶縁性部材と、を備える。   In order to achieve the above object, the present invention provides an electronic component having an electrode, a circuit board having a conductor opposed to the electrode, a conductive bonding material for bonding the electrode and the conductor, and the conductive bonding. An insulating member disposed in the material and in contact with the conductor and the electrode.

本発明によれば、電子部品の電極と回路基板の導体を接合する導電性接合材の高さを確保しつつ、導電性接合材の内部のボイドを低減することができる。上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。   ADVANTAGE OF THE INVENTION According to this invention, the void inside an electroconductive joining material can be reduced, ensuring the height of the electroconductive joining material which joins the electrode of an electronic component, and the conductor of a circuit board. Problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

本発明の第１の実施形態に関わる電子制御装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the electronic control apparatus in connection with the 1st Embodiment of this invention. 図１に示す回路基板の上面図である。It is a top view of the circuit board shown in FIG. 図２に示す回路基板のＸ−Ｘ’断面図である。FIG. 3 is an X-X ′ sectional view of the circuit board shown in FIG. 2. 比較例である電子制御装置を示す断面図。Sectional drawing which shows the electronic control apparatus which is a comparative example. はんだの疲労寿命とはんだ接続高さおよびはんだ内ボイドの関係を示すグラフである。It is a graph which shows the fatigue life of solder, the solder connection height, and the relationship between the voids in solder. 本発明の第２の実施形態に関わる電子制御装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the electronic control apparatus in connection with the 2nd Embodiment of this invention. 図６に示す回路基板の上面図である。FIG. 7 is a top view of the circuit board shown in FIG. 6. 図７に示す回路基板のＹ−Ｙ’断面図である。FIG. 8 is a Y-Y ′ cross-sectional view of the circuit board shown in FIG. 7. 本発明の第１〜第２の実施形態に関わる電子制御装置の一例を示す断面図である。It is sectional drawing which shows an example of the electronic control apparatus in connection with the 1st-2nd embodiment of this invention. 非金属部材を形成する第１の方法を示すフローチャートである。It is a flowchart which shows the 1st method of forming a nonmetallic member. 非金属部材を形成する第２の方法を示すフローチャートである。It is a flowchart which shows the 2nd method of forming a nonmetallic member.

以下、図面を用いて、本発明の第１〜第２の実施形態に関わる電子制御装置の構成及び製造方法について説明する。なお、各図において、同一符号は同一部分を示す。   Hereinafter, the configuration and manufacturing method of the electronic control device according to the first and second embodiments of the present invention will be described with reference to the drawings. In each figure, the same numerals indicate the same parts.

（全体構成）
初めに、図９を用いて、電子制御装置１００（電子回路装置）の全体構成を説明する。図９は、本発明の第１〜第２の実施形態に関わる電子制御装置１００の一例を示す断面図である。(overall structure)
First, the overall configuration of the electronic control device 100 (electronic circuit device) will be described with reference to FIG. FIG. 9 is a cross-sectional view illustrating an example of the electronic control device 100 according to the first to second embodiments of the present invention.

電子制御装置１００は、主として、カバー３１、ベース３２、コネクタ２１、回路基板６を備える。なお、カバー３１及びベース３２は、筐体を構成し、回路基板６を収容する。   The electronic control device 100 mainly includes a cover 31, a base 32, a connector 21, and a circuit board 6. Note that the cover 31 and the base 32 constitute a housing and accommodate the circuit board 6.

図９では、電子部品１及び半導体パッケージ１１（電子部品）は、導電性接合材３を介して回路基板６に電気的に接続されている。コネクタ２１は、回路基板６に接続されるコネクタ端子２２を有し、外部コネクタと嵌合する。カバー３１とコネクタ２１の間、カバー３１とベース３２の間、コネクタ２１とベース３２の間は、シール材４１でシールされている。   In FIG. 9, the electronic component 1 and the semiconductor package 11 (electronic component) are electrically connected to the circuit board 6 via the conductive bonding material 3. The connector 21 has a connector terminal 22 connected to the circuit board 6 and is fitted with an external connector. Sealing material 41 seals between cover 31 and connector 21, between cover 31 and base 32, and between connector 21 and base 32.

ベース３２は、半導体パッケージ１１へ向けて突出するボス３２ａを有する。半導体パッケージ１１が搭載される回路基板６の面（表面）と反対側の面（裏面）と、ボス３２ａの先端側の面との間には、放熱部材４２が配置される。   The base 32 has a boss 32 a that protrudes toward the semiconductor package 11. A heat radiating member 42 is disposed between a surface (back surface) opposite to the surface (front surface) of the circuit board 6 on which the semiconductor package 11 is mounted and a surface on the tip side of the boss 32a.

（第１の実施形態）
図１は第１の実施形態の電子制御装置１００の要部を示す断面図である。電子部品１の電極２と回路基板６の導体５（配線）とが導電性接合材３により接続されている。ここで、電子部品１は、例えばチップ抵抗３２１６サイズ（３．２ｍｍ×１．６ｍｍ）とし、導電性接合材３にははんだを用いる。なお、図１に示すチップ抵抗は、リードレスなチップ部品である。(First embodiment)
FIG. 1 is a cross-sectional view illustrating a main part of the electronic control device 100 according to the first embodiment. The electrode 2 of the electronic component 1 and the conductor 5 (wiring) of the circuit board 6 are connected by the conductive bonding material 3. Here, the electronic component 1 has, for example, a chip resistance 3216 size (3.2 mm × 1.6 mm), and the conductive bonding material 3 uses solder. The chip resistor shown in FIG. 1 is a leadless chip component.

また、回路基板６はプリント基板とし、配線を保護するためのソルダーレジスト４および導体５を備え、導体５のはんだが接続される領域（電極パッド）に非金属部材７を備えた基板である。非金属部材７は、ソルダーレジスト４と同一の材料とし、電子制御装置１００においては電子部品１の電極２と相対する導体５の間にはんだに覆われるかたちで存在する。   The circuit board 6 is a printed board, and includes a solder resist 4 and a conductor 5 for protecting the wiring, and a non-metallic member 7 in a region (electrode pad) to which the solder of the conductor 5 is connected. The non-metallic member 7 is made of the same material as that of the solder resist 4, and in the electronic control device 100, the non-metallic member 7 exists between the electrode 2 of the electronic component 1 and the conductor 5 facing the solder.

換言すれば、図１に示すように、電子部品１は、電極２を有し、回路基板６は、電極２に対向する導体５を有する。導電性接合材３は、電極２と導体５とを接合する。非金属部材７（絶縁性部材）は、導電性接合材３の中に配置され、導体５と電極２に接する。つまり、非金属部材７は、電極２と導体５とを結ぶ方向に高さを有し、導体５から電極２へ向けて突出する。なお、図１に示す２つの非金属部材７（第１の絶縁性部材と第２の絶縁性部材）の導体５（第１の導体と第２の導体）の表面からの高さは同じである。   In other words, as illustrated in FIG. 1, the electronic component 1 includes the electrode 2, and the circuit board 6 includes the conductor 5 that faces the electrode 2. The conductive bonding material 3 bonds the electrode 2 and the conductor 5 together. The nonmetallic member 7 (insulating member) is disposed in the conductive bonding material 3 and is in contact with the conductor 5 and the electrode 2. That is, the nonmetallic member 7 has a height in the direction connecting the electrode 2 and the conductor 5, and protrudes from the conductor 5 toward the electrode 2. In addition, the height from the surface of the conductor 5 (a 1st conductor and a 2nd conductor) of the two nonmetallic members 7 (a 1st insulating member and a 2nd insulating member) shown in FIG. 1 is the same. is there.

図２は電子部品１実装前の回路基板６の上面図、図３は図２のＸ−Ｘ’断面図である。図１で説明した通り、電子部品１がはんだ付けされる導体５上に、非金属部材７を配置している。非金属部材７は回路基板６の表層の保護膜として塗布するソルダーレジスト４と同一の材料である。   2 is a top view of the circuit board 6 before the electronic component 1 is mounted, and FIG. 3 is a cross-sectional view taken along the line X-X ′ of FIG. 2. As described with reference to FIG. 1, the nonmetallic member 7 is disposed on the conductor 5 to which the electronic component 1 is soldered. The non-metallic member 7 is the same material as the solder resist 4 applied as a protective film on the surface layer of the circuit board 6.

換言すれば、非金属部材７（絶縁性部材）は、回路基板６を保護するソルダーレジスト４と同じ材料でできている。非金属部材７は、回路基板６を保護するソルダーレジスト４と分離され、孤立している。図２に示すように、２つの非金属部材７（第1の絶縁性部材と前記第２の絶縁性部材）は、２つの導体５（第1の導体と第２の導体）の配列方向に一列に配置される。   In other words, the non-metallic member 7 (insulating member) is made of the same material as the solder resist 4 that protects the circuit board 6. The nonmetallic member 7 is separated from the solder resist 4 that protects the circuit board 6 and is isolated. As shown in FIG. 2, the two non-metallic members 7 (the first insulating member and the second insulating member) are arranged in the arrangement direction of the two conductors 5 (the first conductor and the second conductor). Arranged in a row.

（第１の製造方法）
次に、図１０を用いて、第１の実施形態の電子制御装置１００の製造工程について説明する。本実施形態の電子制御装置１００は、従来のプリント基板および電子制御装置の製造工程と同一の工程で製造できる。第１の実施形態の特徴である非金属部材７は、一例として、プリント基板製造工程の「ソルダーレジスト塗布・露光・現像」の既存の製造工程において形成する。(First manufacturing method)
Next, the manufacturing process of the electronic control apparatus 100 according to the first embodiment will be described with reference to FIG. The electronic control device 100 of this embodiment can be manufactured in the same process as the manufacturing process of the conventional printed circuit board and the electronic control device. As an example, the non-metallic member 7 that is a feature of the first embodiment is formed in an existing manufacturing process of “solder resist coating / exposure / development” in the printed circuit board manufacturing process.

具体的には、ソルダーレジストを例えばスプレー方式あるいは印刷方式等により基板全面に塗布する（Ｓ１０）。その後、「露光」工程において、ソルダーレジストを形成する部分をフォトマスクを用いて露光により硬化する（Ｓ１５）。この時に、導体５のはんだ付け領域にソルダーレジストを硬化させる。次の「現像」工程において、ソルダーレジストの不要となる未硬化部分を洗い流す（Ｓ２０）。この結果形成した非金属部材７は、例えばφ０．１ｍｍの円柱とする。   Specifically, a solder resist is applied to the entire surface of the substrate by, for example, a spray method or a printing method (S10). Thereafter, in the “exposure” step, the portion where the solder resist is to be formed is cured by exposure using a photomask (S15). At this time, the solder resist is hardened in the soldering region of the conductor 5. In the next “development” step, the uncured portion that does not require the solder resist is washed away (S20). The non-metal member 7 formed as a result is a cylinder having a diameter of 0.1 mm, for example.

換言すれば、Ｓ１０〜Ｓ２０の工程において、回路基板６の導体５の上に柱状の非金属部材７（絶縁性部材）が形成される。Ｓ１０〜Ｓ２０の工程では、回路基板６を保護する膜状のソルダーレジスト４も形成される。つまり、柱状の非金属部材７は、回路基板６を保護するソルダーレジスト４を形成する工程において、ソルダーレジストとして形成される。   In other words, the columnar non-metallic member 7 (insulating member) is formed on the conductor 5 of the circuit board 6 in the steps S10 to S20. In the steps S10 to S20, a film-like solder resist 4 that protects the circuit board 6 is also formed. That is, the columnar non-metallic member 7 is formed as a solder resist in the step of forming the solder resist 4 that protects the circuit board 6.

次に電子制御装置１００の製造工程である回路基板６に電子部品１をはんだ付けする工程である。従来の工程と同一であり、はんだマスクを用いて基板の導体５にはんだペーストを印刷する（Ｓ２５）。その後、電子部品１を搭載しリフロー工程においてはんだを硬化させる（Ｓ３０）。   Next, the electronic component 1 is soldered to the circuit board 6 which is a manufacturing process of the electronic control device 100. This is the same as the conventional process, and a solder paste is printed on the conductor 5 of the substrate using a solder mask (S25). Thereafter, the electronic component 1 is mounted and the solder is cured in the reflow process (S30).

換言すれば、Ｓ２５の工程において、柱状の非金属部材７（絶縁性部材）の上に導電性接合材３を配置し、Ｓ３０の工程において、導電性接合材３の上に電子部品１を配置し、電子部品１の電極２と回路基板６の導体５とを導電性接合材３で接合する。   In other words, the conductive bonding material 3 is disposed on the columnar non-metallic member 7 (insulating member) in the step S25, and the electronic component 1 is disposed on the conductive bonding material 3 in the step S30. Then, the electrode 2 of the electronic component 1 and the conductor 5 of the circuit board 6 are joined by the conductive joining material 3.

一方、図４は、第１の実施形態との比較例である電子制御装置１００Ｐを示す断面図である。電子部品１の電極２と回路基板６の導体５とが導電性接合材３により接続されているが、電子部品１と導体５との間の導電性接合材３の体積は極めて少ない。電極２と対向する導体５との間の距離、即ちはんだの接続高さは約１０μｍ程度、場合によってはほぼ０に等しいこともある。これは、電子部品１の自重に因るものであり、リフロー時に電子部品が溶融したはんだ内に沈み込んでしまい、そのままはんだが硬化するためである。   On the other hand, FIG. 4 is a cross-sectional view showing an electronic control unit 100P which is a comparative example with the first embodiment. The electrode 2 of the electronic component 1 and the conductor 5 of the circuit board 6 are connected by the conductive bonding material 3, but the volume of the conductive bonding material 3 between the electronic component 1 and the conductor 5 is extremely small. The distance between the electrode 2 and the opposing conductor 5, that is, the connection height of the solder is about 10 μm, and in some cases, it may be substantially equal to zero. This is due to the weight of the electronic component 1, and the electronic component sinks into the molten solder during reflow, and the solder is cured as it is.

図５は、はんだの接続高さとはんだの熱疲労寿命の関係を示したグラフである。はんだの接続高さＨは、温度変化に伴うはんだの疲労寿命Ｎｆに影響し、はんだの接続高さＨが低い程、疲労寿命Ｎｆは短くなる（小さくなる）。   FIG. 5 is a graph showing the relationship between the solder connection height and the solder thermal fatigue life. The solder connection height H affects the fatigue life Nf of the solder accompanying a change in temperature. The lower the solder connection height H, the shorter (smaller) the fatigue life Nf.

本実施形態によれば、回路基板６の導体５に配置した非金属部材７の存在により、電子部品１を導体５に印刷したはんだペースト上に搭載した際に、非金属部材７がスペーサーの役目を果たす。この結果、電子部品１が溶融はんだ内に沈み込むことなく、電子部品１と導体５との間のはんだの体積を一定量に保つ。つまり、はんだの接続高さを従来よりも高くし一定に保つことが可能となる。   According to this embodiment, the nonmetallic member 7 functions as a spacer when the electronic component 1 is mounted on the solder paste printed on the conductor 5 due to the presence of the nonmetallic member 7 disposed on the conductor 5 of the circuit board 6. Fulfill. As a result, the volume of the solder between the electronic component 1 and the conductor 5 is kept constant without the electronic component 1 sinking into the molten solder. That is, it is possible to keep the solder connection height higher than before and keep it constant.

また、非金属部材７ははんだに包まれた形で存在するため、非金属部材７と導体５との間の剥離など非金属部材を起点とした破壊が生じる心配はない。   Further, since the non-metallic member 7 is present in a form wrapped in solder, there is no fear of causing breakage starting from the non-metallic member such as peeling between the non-metallic member 7 and the conductor 5.

以上、本実施形態は、既存の工程のみで実現可能なコストアップを招く事の無い信頼性を向上させた電子制御装置を提供する。   As described above, the present embodiment provides an electronic control device with improved reliability that does not cause an increase in cost that can be realized only by existing processes.

次に非金属部材７の存在によるはんだ内ボイドへの影響について説明する。図５に示したはんだの接続高さＨとはんだの熱疲労寿命Ｎｆの関係のグラフは、はんだ内のボイドと疲労寿命の関係も示す。グラフから判るように、はんだ内のボイドが多い程はんだの疲労寿命Ｎｆは低下する。   Next, the influence of the presence of the nonmetallic member 7 on the voids in the solder will be described. The graph of the relationship between the solder connection height H and the solder thermal fatigue life Nf shown in FIG. 5 also shows the relationship between the voids in the solder and the fatigue life. As can be seen from the graph, the fatigue life Nf of the solder decreases as the number of voids in the solder increases.

図１、２、３に示した非金属部材７は、電気抵抗が１×１０３Ω以上の部材とする。この非金属部材７の存在により、以下に示すように、はんだ内のボイドを低減することが可能である。The nonmetallic member 7 shown in FIGS. 1, 2, and 3 is a member having an electric resistance of 1 × 10 3 Ω or more. Due to the presence of the non-metallic member 7, voids in the solder can be reduced as will be described below.

ボイド発生と消失の工程について説明する。リフロー工程でのはんだ溶融時に、はんだ内にはんだとは異なる非金属部材７が存在することにより、溶融はんだの対流が活発に起きる。対流が活発に起きることにより、溶融はんだ内に存在するフラックスや気泡が溶融はんだの外部へ抜け出ていき易い状態となる。   The process of void generation and disappearance will be described. When the solder is melted in the reflow process, the non-metallic member 7 different from the solder is present in the solder, so that convection of the molten solder occurs actively. When convection occurs actively, the flux and bubbles present in the molten solder are likely to escape to the outside of the molten solder.

本実施形態によれば、非金属部材７を電気抵抗率が１×１０3以上の材料とすることにより、はんだ付け後のはんだ内のボイドを低減し、はんだの疲労寿命を長寿命化することが可能となる。この結果、信頼性を向上させた電子制御装置を実現する。According to this embodiment, the non-metallic member 7 is made of a material having an electrical resistivity of 1 × 10 3 or more, thereby reducing voids in the solder after soldering and extending the fatigue life of the solder. Is possible. As a result, an electronic control device with improved reliability is realized.

このように、非金属部材７により電子部品１の電極２と回路基板６の導体５の間の導電性接合材３（はんだ）の高さが確保されるため、導電性接合材３の疲労寿命を向上することができる。また、非金属部材７は絶縁性を有するとともに濡れ性が金属よりも低いため、非金属部材７と導電性接合材３の境界で合金層が形成されず、導電性接合材３の溶融時に対流が起きやすい。その結果、ボイドを低減することができる。   In this way, the height of the conductive bonding material 3 (solder) between the electrode 2 of the electronic component 1 and the conductor 5 of the circuit board 6 is secured by the non-metallic member 7, so that the fatigue life of the conductive bonding material 3 is maintained. Can be improved. Further, since the nonmetallic member 7 has insulating properties and lower wettability than the metal, an alloy layer is not formed at the boundary between the nonmetallic member 7 and the conductive bonding material 3, and convection occurs when the conductive bonding material 3 is melted. Is prone to occur. As a result, voids can be reduced.

次に、非金属部材７のサイズについて説明する。非金属部材７は、電子部品１の電極２と、相対する導体５とを結ぶ方向に高さを有し、該高さは１０μｍ以上とする。換言すれば、導体５の表面からの非金属部材７（絶縁性部材）の高さは、１０μｍ以上である。   Next, the size of the nonmetallic member 7 will be described. The non-metallic member 7 has a height in a direction connecting the electrode 2 of the electronic component 1 and the opposing conductor 5, and the height is 10 μm or more. In other words, the height of the nonmetallic member 7 (insulating member) from the surface of the conductor 5 is 10 μm or more.

例えば、図１、２、３で示した非金属部材７は高さ３０μｍのソルダーレジストとする。また、直径０．１ｍｍの円柱状とする。回路基板６の表層のソルダーレジストは、一般に厚み２５μｍ〜５０μｍ、最少塗布幅は０．１ｍｍとされている。よって、非金属部材７は回路基板６の製造工程における既存のソルダーレジスト塗布工程のみにより形成することが可能である。   For example, the nonmetallic member 7 shown in FIGS. 1, 2, and 3 is a solder resist having a height of 30 μm. Moreover, it is set as a cylindrical shape with a diameter of 0.1 mm. The solder resist on the surface layer of the circuit board 6 generally has a thickness of 25 μm to 50 μm and a minimum coating width of 0.1 mm. Therefore, the nonmetallic member 7 can be formed only by the existing solder resist coating process in the manufacturing process of the circuit board 6.

加えて、非金属部材７の高さを３０μｍとする場合、該厚みは、はんだ印刷工程において使用するはんだ印刷マスクの一般的な厚み（１００〜１５０μｍ）よりも小さいため、はんだ印刷時に非金属部材７がはんだ印刷マスクから飛び出る事無く、既存と変わりない工程ではんだ付けを実施できる。この結果、はんだの接続信頼性を向上させた電子制御装置を得ることが可能となる。   In addition, when the height of the nonmetallic member 7 is 30 μm, the thickness is smaller than the general thickness (100 to 150 μm) of the solder printing mask used in the solder printing process. Soldering can be performed in the same process as existing, without jumping out of the solder printing mask. As a result, an electronic control device with improved solder connection reliability can be obtained.

以上説明したように、本実施形態によれば、電子部品１の電極２と回路基板６の導体５を接合する導電性接合材３の高さを確保しつつ、導電性接合材３の内部のボイドを低減することができる。その結果、導電性接合材３の接続信頼性が向上する。   As described above, according to the present embodiment, the height of the conductive bonding material 3 for bonding the electrode 2 of the electronic component 1 and the conductor 5 of the circuit board 6 is secured, and the inside of the conductive bonding material 3 is secured. Voids can be reduced. As a result, the connection reliability of the conductive bonding material 3 is improved.

また、非金属部材７を回路基板６の製造工程における既存のソルダーレジスト塗布工程のみにより形成することができるため、製造コストを低減することができる。   Moreover, since the nonmetallic member 7 can be formed only by the existing solder resist coating process in the manufacturing process of the circuit board 6, manufacturing cost can be reduced.

（第２の実施形態）
次に、図６〜図８を用いて、第１の実施形態と異なる非金属部材の構成（配置）について説明する。(Second Embodiment)
Next, the configuration (arrangement) of the non-metallic member different from that of the first embodiment will be described with reference to FIGS.

図６は第２の実施形態の電子制御装置１００の要部を示す断面図である。本構造では、電子部品１の電極２と相対する回路基板６の導体５との１対の接合部８、９において、導電性接合材３の中に非金属部材７をそれぞれ２つ設けている。また、全ての非金属部材７の高さは同一となるよう形成する。   FIG. 6 is a cross-sectional view illustrating a main part of the electronic control device 100 according to the second embodiment. In this structure, two nonmetallic members 7 are provided in the conductive bonding material 3 at a pair of bonding portions 8 and 9 between the electrode 2 of the electronic component 1 and the conductor 5 of the circuit board 6 facing each other. . Further, all the non-metallic members 7 are formed to have the same height.

図７は回路基板６の上面図、図８は図７のＹ−Ｙ’断面図を示している。接合部８および接合部９の非金属部材７は、電子部品１の中心に対して対称に位置するよう形成している。すなわち、非金属部材７（絶縁性部材）は、電子部品１の中心を通り電子部品１の電極２の配列方向に垂直な平面に対して対称に配置される。   7 is a top view of the circuit board 6, and FIG. 8 is a sectional view taken along the line Y-Y 'of FIG. The joining portion 8 and the nonmetallic member 7 of the joining portion 9 are formed so as to be positioned symmetrically with respect to the center of the electronic component 1. That is, the nonmetallic member 7 (insulating member) is disposed symmetrically with respect to a plane that passes through the center of the electronic component 1 and is perpendicular to the arrangement direction of the electrodes 2 of the electronic component 1.

また、図７に示すように、全ての非金属部材７（第１の絶縁性部材〜第４の絶縁性部材）は、２つの導体５（第１の導体と第２の導体）の配列方向に一列に配置される。   Further, as shown in FIG. 7, all the non-metallic members 7 (first insulating member to fourth insulating member) are arranged in the direction in which the two conductors 5 (first conductor and second conductor) are arranged. Arranged in a row.

本実施形態によれば、各接合部に設けた非金属部材７が電子部品１の中心に対して対称であることから、電子部品１を回路基板６の導体５に搭載し接合する際に、電子部品１が傾くことを防ぐ。この結果、電子部品１が傾くことなくはんだの接続高さを稼ぎ、はんだの接続信頼性を向上させた電子制御装置を得ることが可能となる。   According to the present embodiment, since the non-metallic member 7 provided at each joint is symmetrical with respect to the center of the electronic component 1, when the electronic component 1 is mounted on the conductor 5 of the circuit board 6 and joined, The electronic component 1 is prevented from tilting. As a result, it is possible to obtain an electronic control device that increases the solder connection height without tilting the electronic component 1 and improves the solder connection reliability.

（第２の製造方法）
既存の工程に新たに工程を追加し非金属部材７を形成する方法を説明する。(Second manufacturing method)
A method of forming a non-metallic member 7 by adding a new process to an existing process will be described.

図１および図６にて示す非金属部材７を、回路基板製造後、部品搭載前に工程を加えることで形成する。非金属部材７には、例えば、熱硬化性の有機溶剤を用いる。   The nonmetallic member 7 shown in FIGS. 1 and 6 is formed by adding a process after manufacturing a circuit board and before mounting components. For the non-metallic member 7, for example, a thermosetting organic solvent is used.

図１１を用いて、本実施形態の製造工程について説明する。なお、図１１において、Ｓ４０〜Ｓ５０は、非金属部材７の形成を除き、図１０のＳ１０〜Ｓ２０と同じであるため、説明を省略する。   The manufacturing process of the present embodiment will be described with reference to FIG. In FIG. 11, S40 to S50 are the same as S10 to S20 of FIG. 10 except for the formation of the non-metallic member 7, and thus the description thereof is omitted.

Ｓ５０に続いて、回路基板６の導体５上に熱硬化性の有機溶剤を、例えばシリンダーを用い柱状に塗布する（Ｓ５５）。次に、該有機溶剤の硬化温度の環境で有機溶剤を硬化させることにより非金属部材７を形成する（Ｓ６０）。その後、回路基板６の導電性接合材３を例えばマスク印刷により塗布する（Ｓ６５）。リフロー工程において、その上面に電子部品１を搭載し、導電性接合材３の硬化温度の環境に通すことにより、電子部品１の電極２と導電性接合材３と導体５とを接合する（Ｓ７０）。   Subsequent to S50, a thermosetting organic solvent is applied to the conductor 5 of the circuit board 6 in a column shape using, for example, a cylinder (S55). Next, the non-metallic member 7 is formed by curing the organic solvent in an environment of the curing temperature of the organic solvent (S60). Thereafter, the conductive bonding material 3 of the circuit board 6 is applied by, for example, mask printing (S65). In the reflow process, the electronic component 1 is mounted on the upper surface, and the electrode 2 of the electronic component 1, the conductive bonding material 3, and the conductor 5 are bonded by passing through the environment of the curing temperature of the conductive bonding material 3 (S 70). ).

本実施形態によれば、非金属部材７を予め回路基板製造工程にて形成していない場合でも、電子部品搭載前に工程を追加することで非金属部材７を形成することが可能である。その結果、はんだの接続高さを稼ぎ、且つはんだ内ボイドを低減させた構造を実現し、信頼性を向上させた電子制御装置を得ることが可能である。   According to this embodiment, even when the nonmetallic member 7 is not formed in advance in the circuit board manufacturing process, the nonmetallic member 7 can be formed by adding a process before mounting the electronic component. As a result, it is possible to obtain an electronic control device that achieves a structure in which the solder connection height is increased and the voids in the solder are reduced, and the reliability is improved.

なお、本発明は上記した実施形態に限定されるものではなく、様々な変形例が含まれる。例えば、上述した実施形態は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、ある実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。   In addition, this invention is not limited to above-described embodiment, Various modifications are included. For example, the above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to the one having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. Moreover, it is possible to add / delete / replace other configurations for a part of the configurations of the embodiments.

上記実施形態では、非金属部材７（絶縁性部材）は円柱状であるが、角柱状であってもよい。また、非金属部材７は、まくら木状（堤状）であってもよい。   In the said embodiment, although the nonmetallic member 7 (insulating member) is cylindrical shape, prismatic shape may be sufficient. Moreover, the non-metallic member 7 may have a pillow shape (bank shape).

また、電子部品１は２つ以上の電極２を有し、回路基板６はこれらの電極２にそれぞれ対向する２つ以上の導体５を有するようにしてもよい。   The electronic component 1 may include two or more electrodes 2, and the circuit board 6 may include two or more conductors 5 that face the electrodes 2.

なお、本発明の実施形態は、以下の態様であってもよい。   In addition, the following aspects may be sufficient as embodiment of this invention.

（１）電子部品が実装される回路基板を備える電子制御装置において、前記電子部品が有する電極と、前記回路基板の導体とを接合する導電性接合材の中に、前記電極と前記導体とを結ぶ方向に高さを有する非金属部材が配置される、電子制御装置。   (1) In an electronic control device including a circuit board on which an electronic component is mounted, the electrode and the conductor are included in a conductive bonding material that joins an electrode of the electronic component and a conductor of the circuit board. An electronic control device in which a non-metallic member having a height in the direction of tying is disposed.

（２）前記非金属部材は、前記回路基板の表層に施されるソルダーレジストによって構成される、（１）に記載の電子処理装置。   (2) The electronic processing apparatus according to (1), wherein the non-metallic member is configured by a solder resist applied to a surface layer of the circuit board.

（３）前記回路基板の導体に配置される前記非金属部材としてのソルダーレジストは、前記回路基板の表層に施されるソルダーレジストとは分離して形成される、（２）に記載の電子制御装置。   (3) The electronic control according to (2), wherein the solder resist as the non-metallic member disposed on the conductor of the circuit board is formed separately from the solder resist applied to the surface layer of the circuit board. apparatus.

（４）前記非金属部材は、電気抵抗が１０３Ω以上である、（１）に記載の電子制御装置。(4) The electronic control device according to (1), wherein the nonmetallic member has an electric resistance of 10 3 Ω or more.

（５）前記非金属部材は、高さが１０μｍ以上である、（１）に記載の電子制御装置。   (5) The electronic control device according to (1), wherein the non-metallic member has a height of 10 μm or more.

（６）前記非金属部材は、前記方向の延びる柱形状を有する、（１）に記載の電子制御装置。   (6) The electronic control device according to (1), wherein the non-metallic member has a column shape extending in the direction.

（７）前記非金属部材は、前記回路基板の平面方向に沿って対向する一対の電極を有し、前記非金属部材は、前記一対の電極と前記導体とを接合する各導電性接合材の中にそれぞれ配置され、前記各非金属部材は、高さが同一である、（１）に記載の電子制御装置。   (7) The non-metallic member has a pair of electrodes facing each other along a planar direction of the circuit board, and the non-metallic member is formed of each conductive bonding material that joins the pair of electrodes and the conductor. The electronic control device according to (1), wherein each of the non-metallic members is disposed in the same height.

（１）〜（７）の実施形態によれば、電子部品をはんだにより基板のランドに接続する電子制御装置において、はんだの接続高さを一定にコントロールすることによりはんだの接続信頼性を向上させ、且つそれは既存の工程のみで実現させることができる。   According to the embodiments of (1) to (7), in the electronic control device for connecting the electronic component to the land of the substrate with the solder, the solder connection reliability is improved by controlling the solder connection height constant. And it can be realized only by existing processes.

特許文献１では、電子部品と基板の電極を接続するためのはんだペーストとは別に、はんだ接続高さを調節するためのはんだペーストを用いている。該はんだ高さ調節用のはんだペーストは、一部が基板表面のソルダーレジスト上に塗布され、リフロー時に溶融したはんだの表面張力によってランド上に盛り上がって集まることで電子部品と基板のはんだ接続高さを調節する。つまり、電子部品の重さと高さ調節用はんだペーストの体積によってはんだ接続高さをコントロールしようという発明である。しかし、はんだペーストの上に搭載された電子部品の足場は、リフロー時には不安定な溶融はんだとなっており、電子部品が傾いて接続されることが懸念される。よって、特許文献１の技術では電子部品が傾くことなく高さを一定にコントロールすることが困難となる可能性がある。   In Patent Document 1, a solder paste for adjusting the solder connection height is used separately from the solder paste for connecting the electronic component and the electrode of the substrate. The solder paste for adjusting the solder height is partially applied on the solder resist on the board surface, and rises and collects on the land due to the surface tension of the solder melted at the time of reflow. Adjust. That is, the invention is an invention in which the solder connection height is controlled by the weight of the electronic component and the volume of the height adjusting solder paste. However, the scaffold of the electronic component mounted on the solder paste is an unstable molten solder at the time of reflow, and there is a concern that the electronic component is inclined and connected. Therefore, with the technology of Patent Document 1, it may be difficult to control the height to be constant without tilting the electronic component.

これに対し、上記実施形態によれば、電子部品が傾くことなく高さを一定にコントロールすることが容易である。   On the other hand, according to the above-described embodiment, it is easy to control the height to be constant without tilting the electronic component.

特許文献２は、はんだボールを用いて電子部品を基板に接合する構造に関する。はんだボール内に金属コアを設けることによりリフロー後のはんだ接続高さを一定の高さに確保し、はんだ接続信頼性を向上させることを可能としている。しかし、特許文献２では、金属コアを内蔵したはんだボールを製造するための新たな製造プロセスが必要となる。また、特許文献２の技術は、ＢＧＡ（Ball Grid Array）やフリップチップ等のはんだボールを用いた構造のみに適用するものである。   Patent Document 2 relates to a structure for joining an electronic component to a substrate using solder balls. By providing a metal core in the solder ball, the solder connection height after reflowing is ensured to a certain level, and the solder connection reliability can be improved. However, Patent Document 2 requires a new manufacturing process for manufacturing a solder ball with a built-in metal core. Moreover, the technique of patent document 2 is applied only to the structure using solder balls, such as BGA (Ball Grid Array) and a flip chip.

これに対し、上記実施形態によれば、任意の電子部品に適用することができる。   On the other hand, according to the said embodiment, it can apply to arbitrary electronic components.

１…電子部品
２…電子部品の電極
３…導電性接合材
４…ソルダーレジスト
５…導体
６…回路基板
７…非金属部材
８…電極２と導電性接合材３と導体５との接合部
９…電極２と導電性接合材３と導体５との接合部
１１…半導体パッケージ
２１…コネクタ
２２…コネクタ端子
３１…カバー
３２…ベース
３２ａ…ボス
４１…シール材
４２…放熱部材
１００、１００Ｐ…電子制御装置DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Electrode 3 of an electronic component ... Conductive joining material 4 ... Solder resist 5 ... Conductor 6 ... Circuit board 7 ... Nonmetallic member 8 ... Joint part 9 of the electrode 2, the conductive joining material 3, and the conductor 5 ... Junction 11 between electrode 2, conductive bonding material 3 and conductor 5 ... Semiconductor package 21 ... Connector 22 ... Connector terminal 31 ... Cover 32 ... Base 32a ... Boss 41 ... Seal material 42 ... Heat dissipation member 100, 100P ... Electronic control apparatus

Claims (11)

電極を有する電子部品と、
前記電極に対向する導体を有する回路基板と、
前記電極と前記導体とを接合する導電性接合材と、
前記導電性接合材の中に配置され、前記導体と前記電極に接する絶縁性部材と、
を備えることを特徴とする電子回路装置。An electronic component having an electrode;
A circuit board having a conductor facing the electrode;
A conductive bonding material for bonding the electrode and the conductor;
An insulating member disposed in the conductive bonding material and in contact with the conductor and the electrode;
An electronic circuit device comprising: 請求項１に記載の電子回路装置であって、
前記絶縁性部材は、
前記回路基板を保護するソルダーレジストと同じ材料でできている
ことを特徴とする電子回路装置。The electronic circuit device according to claim 1,
The insulating member is
An electronic circuit device characterized by being made of the same material as a solder resist for protecting the circuit board. 請求項２に記載の電子回路装置であって、
前記絶縁性部材は、
前記回路基板を保護するソルダーレジストと分離される
ことを特徴とする電子回路装置。The electronic circuit device according to claim 2,
The insulating member is
An electronic circuit device, wherein the electronic circuit device is separated from a solder resist that protects the circuit board. 請求項１に記載の電子回路装置であって、
前記絶縁性部材の電気抵抗は、
１０３Ω以上である
ことを特徴とする電子回路装置。The electronic circuit device according to claim 1,
The electrical resistance of the insulating member is
An electronic circuit device characterized by being 10 3 Ω or more. 請求項１に記載の電子回路装置であって、
前記導体の表面からの前記絶縁性部材の高さは、
１０μｍ以上である
ことを特徴とする電子回路装置。The electronic circuit device according to claim 1,
The height of the insulating member from the surface of the conductor is:
An electronic circuit device characterized by being 10 μm or more. 請求項１に記載の電子回路装置であって、
前記絶縁性部材は、
柱状である
ことを特徴とする電子回路装置。The electronic circuit device according to claim 1,
The insulating member is
An electronic circuit device characterized by having a columnar shape. 請求項１に記載の電子回路装置であって、
前記電極は、
少なくとも第１の電極と第２の電極から構成され、
前記導体は、
少なくとも第１の導体と第２の導体から構成され、
前記導電性接合材は、
前記第１の電極と前記第１の導体とを接合する第１の導電性接合材と、
前記第２の電極と前記第２の導体とを接合する第２の導電性接合材と、を含み、
前記絶縁性部材は、
前記第１の導電性接合材の中に配置され、前記第１の導体と前記第１の電極に接する第１の絶縁性部材と、
前記第２の導電性接合材の中に配置され、前記第２の導体と前記第２の電極に接する第２の絶縁性部材と、を含み、
前記第１の導体の表面からの前記第１の絶縁性部材の高さは、
前記第２の導体の表面からの前記第２の絶縁性部材の高さと同じである
ことを特徴とする電子回路装置。The electronic circuit device according to claim 1,
The electrode is
Composed of at least a first electrode and a second electrode,
The conductor is
Composed of at least a first conductor and a second conductor;
The conductive bonding material is
A first conductive bonding material for bonding the first electrode and the first conductor;
A second conductive bonding material for bonding the second electrode and the second conductor;
The insulating member is
A first insulating member disposed in the first conductive bonding material and in contact with the first conductor and the first electrode;
A second insulating member disposed in the second conductive bonding material and in contact with the second conductor and the second electrode;
The height of the first insulating member from the surface of the first conductor is:
The electronic circuit device, wherein the height of the second insulating member from the surface of the second conductor is the same. 請求項７に記載の電子回路装置であって、
前記第１の絶縁性部材と前記第２の絶縁性部材は、
前記第１の導体と前記第２の導体の配列方向に一列に配置される
ことを特徴とする電子回路装置。The electronic circuit device according to claim 7,
The first insulating member and the second insulating member are:
The electronic circuit device, wherein the electronic circuit device is arranged in a line in an arrangement direction of the first conductor and the second conductor. 請求項７に記載の電子回路装置であって、
前記絶縁性部材は、
前記第１の導電性接合材の中に配置され、前記第１の導体と前記第１の電極に接する第３の絶縁性部材と、
前記第２の導電性接合材の中に配置され、前記第２の導体と前記第２の電極に接する第４の絶縁性部材と、をさらに含み、
前記第１の絶縁性部材〜前記第４の絶縁性部材の高さは、同じであり、
前記第１の導体と前記第２の導体の配列方向に一列に配置される
ことを特徴とする電子回路装置。The electronic circuit device according to claim 7,
The insulating member is
A third insulating member disposed in the first conductive bonding material and in contact with the first conductor and the first electrode;
A fourth insulating member disposed in the second conductive bonding material and in contact with the second conductor and the second electrode;
The heights of the first insulating member to the fourth insulating member are the same,
The electronic circuit device, wherein the electronic circuit device is arranged in a line in an arrangement direction of the first conductor and the second conductor. 回路基板の導体の上に柱状の絶縁性部材を形成する工程と、
柱状の前記絶縁性部材の上に導電性接合材を配置する工程と、
前記導電性接合材の上に電子部品を配置する工程と、
前記電子部品の電極と前記回路基板の前記導体とを前記導電性接合材で接合する工程と、
を有することを特徴とする方法。Forming a columnar insulating member on the conductor of the circuit board;
Arranging a conductive bonding material on the columnar insulating member;
Placing an electronic component on the conductive bonding material;
Bonding the electrode of the electronic component and the conductor of the circuit board with the conductive bonding material;
A method characterized by comprising: 請求項１０に記載の方法であって、
前記回路基板を保護するソルダーレジストを形成する工程をさらに有し、
柱状の前記絶縁性部材は、
前記回路基板を保護するソルダーレジストを形成する工程において、ソルダーレジストとして形成される
ことを特徴とする方法。The method of claim 10, comprising:
Further comprising forming a solder resist for protecting the circuit board;
The columnar insulating member is:
In the step of forming a solder resist for protecting the circuit board, the solder resist is formed.
JP2018519131A 2016-05-25 2017-04-11 Electronic circuit apparatus and method Pending JPWO2017203859A1 (en)

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