JPWO2007010595A1 - Semiconductor device and manufacturing method thereof - Google Patents

Abstract

An object of the present invention is to provide a technology capable of efficiently manufacturing an IC card on which a nonvolatile memory chip is mounted. In order to achieve this object, a nonvolatile memory chip is mounted on the module substrate 1 in a nonvolatile memory production line, and then sealed with a resin 6. Then, the module substrate 1 is separated. At this time, the module substrate 1 is provided with a holding portion 7, which is connected to the tape substrate 13 by using the holding portion 7 after performing an electrical characteristic test. The module substrate 1 integrated in a tape shape is shipped to an IC card production line. Thereafter, in the IC card manufacturing line, the IC card is manufactured using the module substrate 1 integrated in a tape shape.

Description

  The present invention relates to a semiconductor device and a manufacturing technique thereof, and more particularly to a technique effective when applied to the manufacture of an IC card.

  Card-type information media such as IC cards and memory cards are small, thin, and light, and thus are excellent in portability, portability, and convenience, and are widely used in various fields.

  An IC card is a card-type information medium in which an IC card chip is embedded in a cash card-sized plastic thin plate and information can be recorded, and is excellent in authenticity and tamper resistance. For this reason, IC cards, for example, credit cards, cash cards, ETC (Electronic Toll Collection system) system cards, commuter passes, mobile phone cards, authentication cards, etc. are high in finance, transportation, communication, distribution and authentication. It is spreading in fields where security is required.

  Regarding the IC card, for example, FIG. 9 of Japanese Patent Laid-Open No. 2001-357376 (Patent Document 1) discloses a configuration in which a SIM (Subscriber Identify Module) type card is fixed by providing a bridge at the opening of the frame card. Yes.

  On the other hand, a memory card is a card-type information medium that employs a non-volatile memory (EEPROM, flash memory, etc.) as a storage medium, and is smaller than an IC card and can write or read large-capacity information at high speed. Can do. For this reason, memory cards are widely used as recording media for portable information devices such as digital cameras, notebook personal computers, portable music players, mobile phones, and the like that require portability. Typical memory card standards include SD (Secure Digital) memory cards (there are standards standardized by the SD Card Association), miniSD, MMC (Multi Media Card, registered trademark of Infineon Technologies AG), RS-MMC (Reduced Size MMC).

The memory card is described in, for example, International Publication No. WO02 / 099742A1 (Patent Document 2). For the purpose of improving security, a non-volatile memory chip, an IC card chip capable of executing security processing, and these A memory card comprising a controller chip for controlling the circuit operation of the chip is disclosed.
JP 2001-357376 A International Publication No. 02 / 099742A1 Pamphlet

  Here, the present inventors have studied to improve the function of the IC card by mounting a nonvolatile memory chip on the IC card. As a result, the present inventors have found that how to efficiently manufacture an IC card is an important issue in the manufacturing process of an IC card equipped with a nonvolatile memory chip.

  An object of the present invention is to provide a technique capable of efficiently manufacturing an IC card on which a nonvolatile memory chip is mounted.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A method of manufacturing a semiconductor device according to the present invention includes: (a) preparing a sheet-like laminated printed circuit board (Print Circuit Board) in which a plurality of module boards are integrated; and (b) on each of the module boards. A step of mounting a semiconductor chip, (c) a step of electrically connecting the module substrate and the semiconductor chip, and (d) a step of separating individual module substrates from the printed wiring board in the form of a sheet. With. In the step (d), the holding unit protruding from the module substrate is singulated.

  Further, as needed, (e) the module substrate divided into pieces is held on a tape substrate.

  A semiconductor device according to the present invention includes (a) a module substrate, (b) a semiconductor chip mounted on the module substrate, and (c) a holding portion protruding from the module substrate.

  Furthermore, if necessary, the semiconductor chips mounted on the module substrate are connected in a tape shape.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  An IC card equipped with a nonvolatile memory chip can be efficiently manufactured.

It is the top view which showed the manufacturing process of the IC card carrying the non-volatile memory chip in embodiment of this invention. FIG. 2 is a plan view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 1. FIG. 3 is a plan view showing a manufacturing process of an IC card on which a nonvolatile memory chip is mounted following FIG. 2. FIG. 4 is a plan view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 3. It is a top view which shows the module board | substrate which provided the holding | maintenance part. (A) is the top view which showed one surface of the module board | substrate which provided the holding part, (b) is the top view which showed the other surface of the module board | substrate which provided the holding part. It is a perspective view which shows the module board | substrate which provided the holding | maintenance part. It is a top view which shows the manufacturing process of the IC card carrying the non-volatile memory chip in embodiment. FIG. 9 is a perspective view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 8. FIG. 10 is a perspective view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 9. FIG. 11 is a perspective view illustrating a manufacturing process of an IC card on which a nonvolatile memory chip is mounted following FIG. 10. FIG. 12 is a perspective view showing a manufacturing process of the IC card on which the nonvolatile memory chip is mounted following FIG. 11. FIG. 13 is a perspective view illustrating a manufacturing process of an IC card on which a nonvolatile memory chip is mounted following FIG. 12. It is a top view which shows one surface of the IC card carrying a non-volatile memory chip. It is a top view which shows the other surface of the IC card carrying a non-volatile memory chip. It is the figure which showed an example of the circuit structure of an IC card chip. It is the figure which showed an example of the circuit structure of a controller chip. It is the figure explaining the example which changed the connection method of the module substrate separated into pieces and a tape board | substrate. It is the figure explaining the example which made the shape of the holding | maintenance part provided in the separated module board T shape. It is sectional drawing which showed the cross section cut | disconnected by the AA line of FIG. (A) is sectional drawing which showed one process which implement | achieves the connection shown in FIG. 19, (b) is sectional drawing which showed the process following (a). It is the perspective view which showed the example which provided the level | step difference (offset) in the holding | maintenance part of a tape board | substrate. It is the perspective view which showed the other connection method of the holding part of a module board, and the holding part of a tape board | substrate.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like.

  Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number.

  Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say.

  Similarly, in the following embodiments, when referring to the shape, positional relationship, etc., of components, etc., unless otherwise specified, and in principle, it is considered that this is not clearly the case, it is substantially the same. Including those that are approximate or similar to the shape. The same applies to the above numerical values and ranges.

  Embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted. In order to make the figure easy to see, even a plan view may be hatched.

  A method for manufacturing an IC card (semiconductor device) in the present embodiment will be described with reference to the drawings.

  First, as shown in FIG. 1, a rigid substrate 2 is prepared by integrating a plurality of module substrates 1 (hatched). In the present embodiment, a laminated printed circuit board is referred to as a rigid board. The rigid substrate 2 is excellent in the formation of multilayer wiring and fine wiring, and is made of, for example, glass epoxy resin.

  Subsequently, as shown in FIG. 2, the nonvolatile memory chip 3 and the controller chip 4 are stacked and mounted on the individual module substrates 1 formed on the rigid substrate 2. The nonvolatile memory chip 3 is formed with a rewritable nonvolatile memory such as a flash memory, and the controller chip 4 is formed with a circuit for controlling a writing operation and a reading operation of the nonvolatile memory. . The non-volatile memory chip 3 and the controller chip 4 are mounted not on the central portion of the module substrate 1 but on a position according to one side of the module substrate 1. This is because an IC card chip is also efficiently mounted on the module substrate 1 as will be described later. For example, as shown in FIG. 2, the nonvolatile memory chip 3 and the controller chip 4 are mounted in a region opposite to the region where the corner portion chamfered with respect to the center of the module substrate 1 is provided. An area for mounting an IC card chip is secured on the top. By securing an area for mounting an IC card chip in this manner, a large nonvolatile memory chip can be efficiently arranged.

  Next, as shown in FIG. 3, the nonvolatile memory chip 3 and the module substrate 1 are electrically connected using bonding wires 5. Similarly, the controller chip 4 and the module substrate 1 are electrically connected using a bonding wire 5. Further, if necessary, the nonvolatile memory chip 3 and the controller chip 4 are electrically connected using bonding wires 5. Here, although not shown, bonding pads are formed on the nonvolatile memory chip 3, the controller chip 4, and the module substrate 1, and bonding wires 5 are connected to these bonding pads. Of the stacked nonvolatile memory chip 3 and controller chip 4, the nonvolatile memory chip 3 disposed in the lower layer does not use the bonding wires 5, and uses, for example, bump electrodes to electrically connect to the module substrate 1. You may make it connect. The bonding wire 5 is made of, for example, a gold wire.

  Subsequently, as shown in FIG. 4, the nonvolatile memory chip 3 and the controller chip 4 mounted on the module substrate 1 are sealed with a resin 6. At this time, the resin 6 is not formed so as to cover the entire module substrate 1, but the minimum area necessary for sealing the nonvolatile memory chip 3, the controller chip 4 and the bonding wire 5 is sealed with the resin 6. Stopped. That is, the module substrate 1 is partially sealed by the resin 6. As will be described later, components different from the nonvolatile memory chip 3 and the controller chip 4 such as an IC card chip are mounted on the module substrate 1, so that the IC card chip mounting area is not sealed with the resin 6. This is because it is necessary to secure it. In the present embodiment, an IC card chip is exemplified as a component different from the nonvolatile memory chip 3 and the controller chip 4. However, the present invention is not limited to this, and a passive element such as a capacitor can be provided as appropriate.

  Next, the plurality of module substrates 1 formed integrally with the rigid substrate 2 are separated into individual module substrates 1. When the module substrate 1 is separated into pieces, each module substrate 1 is cut so that the protruding holding portion 7 remains. As described above, in the present embodiment, one feature is that not only the individual module substrates 1 are separated into individual pieces but also including the protruding holding portions 7 at the upper and lower portions of the module substrate 1. There is.

  Conventionally, only an IC card chip has been mounted on an IC card, but in recent years, there has been an increasing demand for higher functionality and more functionality of the IC card. For this reason, it is considered to mount a large-capacity nonvolatile memory chip on the IC card in addition to the IC card chip. Thus, in order to manufacture an IC card on which an IC card chip and a nonvolatile memory chip are mounted, it is necessary to mount the nonvolatile memory chip and the IC card chip on a module substrate.

  Here, it is conceivable to newly create a production line for mounting the nonvolatile memory chip and the IC card chip on the module substrate. However, creating such a new production line is costly and inefficient. In other words, by using an existing production line as much as possible, an IC card on which a nonvolatile memory chip is mounted can be produced efficiently. Further, since the non-volatile memory and the IC card are different products, there is a demand for manufacturing them by different manufacturing companies. Therefore, from the viewpoint of using an existing production line, it is efficient to produce an IC card by dividing an IC card equipped with a nonvolatile memory chip by different manufacturing companies. However, when the IC card is manufactured separately by different manufacturing companies, the product form of the product delivered between the manufacturing companies becomes a problem. That is, first, a rigid board integrated with a module board is used in a manufacturing line of a manufacturing company that manufactures a nonvolatile memory. And after mounting a non-volatile memory chip on each module substrate of a rigid substrate, it seals and separates into individual module substrates. Then, the separated module substrate is shipped as a product to an IC card manufacturer. In this way, when using an existing nonvolatile memory production line, it is desirable to ship individual module boards.

  On the other hand, in a manufacturing line of a manufacturing company that manufactures IC cards, IC cards are manufactured using a tape-shaped substrate. That is, the IC card production line has a COT (Chip On Tape) structure in which the IC card chip is mounted on the continuous tape substrate. For this reason, in an existing IC card production line, even if an individual module board is carried in, an IC card chip cannot be mounted on the individual module board. That is, it is desirable not to divide the module substrate into individual IC card production lines. Thus, the product form of the product delivered between the manufacturing companies becomes a problem.

  Therefore, in the present embodiment, when the module substrate 1 on which the nonvolatile memory chip 3 is mounted is separated, the module substrate 1 is also separated into pieces including the protruding holding portions 7 at the upper and lower portions of the module substrate 1. . By doing in this way, the problem of the product form of the product delivered between manufacturing companies can be solved as will be described later. Therefore, an IC card on which the nonvolatile memory chip 3 is mounted can be efficiently manufactured using an existing manufacturing line at each manufacturing company.

  FIG. 6 is a view showing the external appearance of the module substrate 1 including the holding portion 7 that has been separated into pieces. FIG. 6A is a view of the surface of the module substrate 1 in the present embodiment. As shown in FIG. 6A, an IC card in which a mold region covered with a resin 6 and an electrode (IC card chip mounting pattern) 8 are formed on the surface of the module substrate 1 in the present embodiment. There is a chip mounting area. FIG. 6B is a view of the back surface of the module substrate 1 in the present embodiment. As shown in FIG. 6B, an IC card back electrode (referred to as an ISO electrode 9) connected to the electrode 8 is formed on the back surface of the module substrate 1 in the present embodiment. In addition, an extended electrode 10 connected to the nonvolatile memory chip 3 and the controller chip 4 covered with the resin 6 is formed. FIG. 7 is a perspective view showing the module substrate 1 including the holding unit 7 as a single piece. As shown in FIG. 7, a non-volatile memory chip 3 is mounted on the module substrate 1, and a controller chip 4 is mounted on the non-volatile memory chip 3. The nonvolatile memory chip 3 and the controller chip 4 are connected to the module substrate 1 via bonding wires 5. A resin 6 is formed so as to cover the nonvolatile memory chip 3 and the controller chip 4. On the other hand, an electrode 8 is formed in a region not covered with the resin 6. An IC card chip mounting area 11 is formed between the electrodes 8. A conductor pattern 12 made of a conductor film is formed on the holding portion 7 on the IC card chip mounting area 11 side. The conductor pattern 12 is formed of, for example, a gold film, and is formed in order to improve the releasability of the resin formed on the gate at the time of molding an IC card chip described later. Further, the conductor pattern 12 is provided so as to extend to the inner side (center side of the module substrate 1) than the outer periphery of the module substrate 1 excluding the holding portion 7. By forming the conductor pattern 12 in this way, it is possible to further prevent the aforementioned resin from peeling off.

  Next, the electrical characteristics inspection of the nonvolatile memory chip 3 and the controller chip 4 is performed on the module substrate 1 thus configured. The electrical property inspection is performed using the extended electrode 10 shown in FIG. The separated module substrate 1 has a long test time and can be easily determined, selected, and distributed in the electrical characteristic inspection of the nonvolatile memory chip 3 and the controller chip 4 with many test items. The electrical characteristic inspection of the nonvolatile memory chip 3 or the like is performed by putting the module substrate 1 singulated into a test socket. Since a plurality of test sockets are arranged in parallel and a plurality of separated module substrates 1 can be processed in parallel, the efficiency of electrical characteristic inspection can be improved. In other words, the test of electrical characteristics of the nonvolatile memory chip 3 or the like takes a long test time, but the electrical characteristics can be determined by selecting non-defective or defective products while processing a plurality of separated module substrates 1 in parallel. The efficiency of inspection is improved.

  In the present embodiment, the holding unit 7 is provided on the individual module substrate 1, but in an existing manufacturing line that performs electrical characteristic inspection of a module substrate that is not provided with the holding unit 7, the module substrate By sharing or slightly changing a handler, a test socket, or the like that transports the module board, it is possible to inspect the electrical characteristics of the module substrate 1 on which the holding unit 7 is provided. For this reason, an electrical property test can be efficiently performed using an existing production line.

  Next, as shown in FIG. 8, a heat-resistant tape substrate 13 such as stainless steel is prepared. The tape substrate 13 is provided with a plurality of module substrate mounting areas by, for example, punching a hoop material to provide a space. And the holding part 14 is provided so that it may protrude in the module board | substrate mounting area | region of the tape board | substrate 13. As shown in FIG. As shown in FIG. 9, the separated module substrate 1 is connected to the tape substrate 13 configured as described above. For example, as shown in FIG. 9, the connection method is such that the holding portion 7 provided on the module substrate 1 is disposed on the holding portion 14 provided on the tape substrate 13, and the holding portion 14 is bent (caulked). The holding unit 7 and the holding unit 14 are mechanically connected. As a result, a plurality of separated module substrates 1 can be connected to the tape substrate 13. In this manner, a plurality of individual module substrates 1 can be mounted on one tape substrate 13. That is, by providing the holding unit 7 on the module substrate 1 that has been separated into pieces, the module substrate 1 that has been separated into pieces can be easily mounted on the tape substrate 13 again.

  The steps so far are performed on the production line of the manufacturer that manufactures the nonvolatile memory. In the production line in which the nonvolatile memory chip 3 is mounted on the module substrate 1, after the module substrate 1 is separated into pieces, the module substrate 1 is attached to the tape substrate 13 again using the holding unit 7 provided on the module substrate 1. Connected. By mounting the module substrate 1 on the tape substrate 13 in this way, it is possible to ship the module substrate 1 in a tape shape to a manufacturing line of a manufacturing company that manufactures IC cards. Thereby, the problem of the product form of the product delivered between manufacturing companies can be solved.

  Here, in the non-volatile memory production line, the module substrate 1 is connected to the tape substrate 13 so that the module substrate 1 is separated into individual pieces and then shipped again in a tape form. Therefore, in the non-volatile memory production line, it is conceivable that the module substrate 1 is shipped after being subjected to the process in which the module substrate 1 is integrated into the rigid substrate 2 without being separated. However, if the module substrate 1 is not separated, the following inconvenience occurs. That is, the electrical characteristic inspection of the nonvolatile memory basically has many test items and requires a long test time. For this reason, the module substrate 1 is separated into pieces, and a plurality of nonvolatile memories are simultaneously inspected in parallel. According to this method, when a defective product is found, the defective product is removed at that time, and a new module substrate 1 can be set in the vacant test socket by removing the defective product. For this reason, the electrical characteristic inspection can be performed efficiently.

  On the other hand, in the state in which the module substrate 1 is integrated with the rigid substrate 2, the electrical characteristics can be inspected only in series for the nonvolatile memories arranged in a tape shape. Therefore, the efficiency is deteriorated in the nonvolatile memory having a long test time. . Moreover, even if a defective product is found as a result of the electrical characteristic inspection, it cannot be removed from the integrated rigid substrate 2 and is shipped as a product with the defective product connected. Furthermore, in the existing production line, the electrical characteristic inspection is performed in the state of the module substrate 1 that has been singulated. Therefore, in order to perform the electrical characteristic inspection in the state of the integrated rigid substrate 2 It is necessary to change the configuration to be different from the existing production line. For this reason, it is necessary to divide the module substrate 1 into pieces in the nonvolatile memory production line. Therefore, in order to make the product form of the product delivered to the manufacturing company that manufactures the IC card into a tape shape, as described in the present embodiment, the holding part 7 of the module substrate 1 separated into pieces is used. Thus, it is necessary to mount the module substrate 1 singulated on the tape substrate 13 again.

  In the present embodiment, an example in which the material of the tape substrate 13 is made of stainless steel is shown. The reason why heat resistance is required for the material of the tape substrate 13 is that the tape substrate 13 needs to withstand the heating when sealing the IC card chip mounted on the module substrate 1 in the IC card production line described later. It is. Therefore, the material of the tape substrate 13 is required to have heat resistance enough to withstand the heating when the IC card chip is sealed. Here, when a resin sheet, heat-resistant paper, or non-woven cloth is used as the tape substrate 13, the connection between the tape substrate 13 and the module substrate 1 separated into pieces is not a mechanical connection, but an adhesive, for example, is used. It can be a connection. Further, instead of the adhesive, a tape-like substrate can be fused and connected.

  Next, a process for manufacturing an IC card using the tape substrate 13 to which a plurality of module substrates 1 are connected will be described. The process from here is carried out on the production line of the manufacturer that produces the IC card.

  As shown in FIG. 10, the IC card chip 15 is mounted on each module substrate 1 connected to the tape substrate 13. The IC card chip 15 is mounted on the IC card chip mounting area of the module substrate 1. Then, as shown in FIG. 11, the IC card chip 15 and the electrode 8 are electrically connected using a bonding wire 16. The bonding wire 16 is made of, for example, a gold wire.

  Next, as shown in FIG. 12, the IC card chip 15 and the bonding wire 16 are sealed with a resin 17. Sealing with the resin 17 can use, for example, a transfer molding method. At this time, the runner / gate portion into which the resin 17 flows can be formed in the holding portion 7 of the module substrate 1. As shown in FIG. 7, since the conductive pattern 12 made of a gold film is formed on the holding portion 7, the peelability of the resin 17 formed on the runner / gate portion of the holding portion 7 can be improved. . For example, the resin 17 is injected from the upper direction of the module substrate 1 into a runner / gate portion formed in the holding portion 7 and formed so as to cover the IC card chip 15 mounted on the module substrate 1 from the runner / gate portion. Is done.

  Subsequently, as shown in FIG. 13, the individual module substrates 1 are separated from the tape substrate 13 to which the module substrate 1 is connected. At this time, the module substrate 1 is cut at a connection portion between the holding unit 7 and the module substrate 1. As a cutting method for cutting both the module substrate 1 and the resin 17, for example, a method using a mold, a water jet method, or a cutting method using a diamond saw can be used.

  Next, by embedding the separated module substrate 1 in a plastic card substrate 18, an IC card as shown in FIGS. 14 and 15 can be manufactured. FIG. 14 is a view showing one surface of the completed IC card, and FIG. 15 is a view showing the surface opposite to FIG.

  In the module structure of the present embodiment, the sealing portion in the area where the nonvolatile memory chip and its controller are mounted is separated from the sealing portion in the area where the IC card chip is mounted. Thereby, it has the characteristic that the softness | flexibility with respect to the bending of a card | curd can be improved.

  According to the present embodiment, a nonvolatile memory chip is mounted on a module substrate on a nonvolatile memory production line, and the module substrate is separated into pieces. At this time, the module substrate is provided with a holding portion, and after the electrical characteristic inspection is performed, the module substrate is connected to the tape substrate using the holding portion. Then, the module substrate integrated in a tape shape is shipped to an IC card production line. Thereafter, in an IC card production line, an IC card is produced using a module substrate integrated in a tape shape. Therefore, since existing facilities can be used in both the nonvolatile memory production line and the IC card production line, an IC card equipped with the nonvolatile memory can be efficiently produced. In other words, in the existing nonvolatile memory production line, individual module boards are shipped, and in the existing IC card production line, an IC card using a module board integrated in a tape shape is used. Is manufactured. At this time, when transferring the module substrate from the nonvolatile memory production line to the IC card production line, it is desirable to deliver the module substrate with a tape substrate in which the module substrate is integrated, but the problem is because the module substrate is separated into pieces. It becomes. However, in this embodiment, since the module substrate separated into one piece is integrated with the tape substrate by the holding portion, after performing the process by the non-volatile memory production line, a plurality of module substrates are taped Thus, the module substrate can be delivered to the IC card production line.

  In the present embodiment, it is described that the process up to the step of connecting the module substrate to the tape substrate by the holding portion in the production line of the nonvolatile memory is described. However, in the non-volatile memory production line, the electrical characteristic inspection of the non-volatile memory is performed, and the process of connecting the separated module substrate to the tape substrate by the holding unit is performed in the IC card production line. May be. The inspection of the electrical characteristics of the nonvolatile memory can be omitted if necessary.

  Next, the IC card chip 20 (corresponding to the IC card chip 15 in FIG. 10), the nonvolatile memory chip 21 (corresponding to the nonvolatile memory chip 3 in FIG. 7), and the controller chip 22 (corresponding to the controller chip 4 in FIG. 7). The circuit configuration will be described.

  On the main surface of the nonvolatile memory chip 21, for example, a nonvolatile memory circuit such as a flash memory capable of electrically erasing and writing data is formed. The storage capacity of the nonvolatile memory chip 21 is larger than that of the memory part of the other IC card chip 20 or controller chip 22. The bonding pads on the main surface of the nonvolatile memory chip 21 are electrically connected to the module substrate through bonding wires. The bonding wire is made of, for example, a gold (Au) fine wire. The plurality of memory cells constituting the memory circuit of the nonvolatile memory chip 21 have a threshold voltage that rises when electrons are injected into the floating gate of the memory cell, for example, and a threshold voltage that rises when electrons are extracted from the floating gate or the like. Has come to decline. The memory cell stores information corresponding to the level of the threshold voltage with respect to the word line voltage for reading data. Although not particularly limited, for example, a state in which the threshold voltage of the memory cell transistor is low is defined as an erased state, and a state in which the threshold voltage is high is defined as a written state.

  For example, an IC card microcomputer circuit is formed on the main surface of the IC card chip 20. This IC card microcomputer circuit is a circuit having a function as a security controller, and realizes an authenticated function by an evaluation / certification organization of ISO / IEC15408 that can be used for an electronic payment service, for example. The IC card microcomputer circuit includes, for example, a CPU (Central Processing Unit), a mask ROM (Read Only Memory), a RAM (Random Access Memory), an EEPROM (Electrically Erasable Programmable ROM), and other arithmetic circuits. Integrated circuit. In the mask ROM, for example, an execution program, an encryption algorithm, and the like are stored. Further, the RAM has a function as a memory for data processing, for example. Further, the EEPROM has a function as a memory for storing data. The IC card on which the IC card chip 20 is mounted receives the authentication request from the host, sends a predetermined authentication certificate held in the EEPROM, and obtains the authentication for the subsequent authentication certificate. Communication processing is enabled. Such a security processing operation program is stored in the mask ROM.

  FIG. 16 shows an example of an IC card microcomputer circuit in the IC card chip 20. The IC card microcomputer circuit includes a CPU 20a, a RAM 20b as a work RAM, a timer 20c, an EEPROM 20d, a coprocessor unit 20e, a mask ROM 20f, a system control logic 20g, an input / output port (I / O port) 20h, a data bus 20i and an address bus 20j. have.

  The mask ROM 20f is used to store an operation program (encryption program, decryption program, interface control program, etc.) and data of the CPU 20a. The RAM 20b is a work area of the CPU 20a or a temporary data storage area, and is composed of, for example, SRAM or DRAM. When an IC card command is supplied to the I / O port 20h, the system control logic 20g decodes it and causes the CPU 20a to execute a processing program necessary for executing the command. That is, the CPU 20a accesses the mask ROM 20f with an address instructed by the system control logic 20g, fetches an instruction, decodes the fetched instruction, and performs operand fetch and data operation based on the decoding result. The coprocessor unit 20e performs a remainder calculation process in RSA or elliptic curve cryptographic calculation according to the control of the CPU 20a.

The I / O port 20h has a 1-bit input / output terminal I / O, and is used both for data input / output and external interrupt signal input. The I / O port 20h is coupled to a data bus 20i, and a CPU 20a, a RAM 20b, a timer 20c, an EEPROM 20d, a coprocessor unit 20e, and the like are electrically connected to the data bus 20i.

  The system control logic 20g controls the operation mode and interrupt of the IC card microcomputer circuit, and further includes a random number generation logic used for generating an encryption key. When the reset operation is instructed by the reset signal / RES, the IC card microcomputer circuit is initialized, and the CPU 20a starts executing the instruction from the top address of the program in the EEPROM 20d. The IC card microcomputer circuit operates in synchronization with the clock signal CLK.

  The EEPROM 20d is electrically erasable and writable, and is used as an area for storing data such as ID (Identification) information and an authentication certificate used to identify an individual. A flash memory or a ferroelectric memory may be employed instead of the EEPROM 20d. The IC card microcomputer circuit supports a contact interface that uses an external terminal to interface with the outside.

  Next, for example, an interface controller circuit is formed on the main surface of the controller chip 22. The interface controller circuit has a function of controlling the external interface operation and the memory interface operation in accordance with a control mode according to an instruction from the outside or a setting determined in advance inside. The function of the interface controller circuit recognizes a memory card interface control mode corresponding to a command exchanged with the outside via an external connection terminal or a bus state. Also, the bus width is switched according to the recognized memory card interface control mode, and the data format is converted according to the recognized memory card interface control mode. Further, a power-on reset function, interface control with the IC card microcomputer circuit in the IC card chip 20, interface control with the memory circuit in the nonvolatile memory chip 21, power supply voltage conversion, and the like are performed. These operations may be performed in whole or in part depending on the purpose of use.

  FIG. 17 shows an example of the interface controller circuit 22. Note that the memory circuit 21 a in FIG. 17 is a memory circuit formed in the nonvolatile memory chip 21.

  The interface controller circuit 22 includes a host interface circuit 22a, a microcomputer 22b, a flash controller 22c, a buffer controller 22d, a buffer memory 22e, and an IC card interface circuit 22f. The buffer memory 22e is composed of DRAM or SRAM. The IC card microcomputer circuit 20 is electrically connected to the IC card interface circuit 22f. The microcomputer 22b has a CPU (central processing unit) 22b1, a program memory (PGM) 22b2 that holds an operation program of the CPU 22b1, a work memory (WRAM) 22b3 used for a work area of the CPU 22b1, and the like.

  When the host interface circuit 22a detects the issuance of a memory card initialization command or the like, the host interface circuit 22a makes it possible to execute an interface control mode control program corresponding to the microcomputer 22b by an interrupt. The microcomputer 22b controls the external interface operation by the host interface circuit 22a by executing the control program. The flash controller 22c controls access (write, erase, and read operations) to the memory circuit 21a and data management, and the buffer controller 22d performs format conversion between the data format specific to the memory card and the common data format for the memory. Control. The buffer memory 22e temporarily holds data read from the memory circuit 21a or data written to the memory circuit 21a. The flash controller 22c can also operate the memory circuit 21a as a hard disk compatible file memory and manage data in units of sectors. The flash controller 22c includes an ECC circuit (not shown), adds an ECC code when storing data in the memory circuit 21a, and performs error detection / correction processing on the read data using the ECC code. Further, the IC card interface 22f can be omitted depending on the purpose of use.

  Next, a modification of the present embodiment will be described.

  FIG. 18 is a diagram illustrating an example in which the method of connecting the separated module substrate 1 and the tape substrate 13 is changed. FIG. 9 shows an example in which the holding unit 7 provided on the module substrate 1 is connected to the upper part of the holding unit 14 provided on the tape substrate 13. On the other hand, in FIG. 18, the holding unit 7 provided on the module substrate 1 is connected so as to be covered with the holding unit 14 provided on the tape substrate 13. By connecting in this way, when the IC card chip mounted on the module substrate 1 is resin-sealed, the runner / gate into which the resin flows can be formed in the horizontal direction along the tape substrate 13. This is because the tape substrate 13 is made of, for example, a metal material such as stainless steel, so that the processing accuracy is good, and even if a runner / gate is formed on the tape substrate 13, resin leakage can be prevented. . In addition, since the holding | maintenance part 7 formed in the module board | substrate 1 is formed, for example from resin, the dispersion | variation in the thickness becomes large. For this reason, when resin sealing is performed, it is necessary to prevent resin leakage by suppressing with a movable plate that absorbs variation in thickness from the back side of the holding portion 7.

  FIG. 19 is a diagram illustrating an example in which the shape of the holding portion 7 provided on the separated module substrate 1 is a T-shape. As shown in FIG. 19, through holes 26 are provided in the T-shaped holding portion 7, and individual module substrates 1 are connected by passing connection members 27 through the through holes 26. Even if comprised in this way, the module board | substrate 1 can be integrated. The configuration shown in FIG. 19 has an advantage that it is not necessary to prepare a new tape substrate since the holding unit 7 itself has a role as a tape substrate to be integrated. The connection member 27 can be made of, for example, a metal material. In addition to the through hole 26 described above, the holding portion 7 is provided with a transport hole 26a.

  20 is a cross-sectional view showing a cross section taken along line AA of FIG. As shown in FIG. 20, it can be seen that the connecting member 27 is inserted and caulked into the through hole 26 provided in the holding portion 7. A method of connecting the holding portion 7 provided with the through hole 26 with the connecting member 27 will be described with reference to FIG. As shown in FIG. 21A, a U-shaped connecting member 27 is inserted into the through hole 26 formed in each different holding portion 7. Then, as shown in FIG. 21 (b), the connection member 27 is caulked by bending the upper portion of the inserted connection member 27. In this way, a plurality of module substrates can be connected using the T-shaped holding portion 7.

  FIG. 22 is a view showing an example in which a step (offset) 28 is provided in the holding portion 14 of the tape substrate 13. As shown in FIG. 22, when the holding portion 14 is provided with a step 28, the step 28 increases the thickness of the holding portion of the module substrate when the holding portion of the module substrate and the holding portion 14 of the tape substrate 13 are connected. Since absorption is possible, the surface of the module substrate and the height of the tape substrate 13 can be made uniform.

  FIG. 23 is a diagram illustrating another connection method between the holding unit 7 of the module substrate 1 and the holding unit 14 of the tape substrate 13. As shown in FIG. 23, a through hole 29 is provided in the holding portion 7 provided in the module substrate 1. Then, the holding portion 14 and the holding portion 14 are connected by inserting and bending the protruding holding portion 14 into the through hole 29. Also with this configuration, the plurality of module substrates 1 can be connected to the tape substrate 13.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the above embodiment, an example of using a non-volatile memory production line and an IC card production line in another company has been described. For example, a non-volatile memory production line and an IC card production line in the same company It can also be applied when used.

The present invention can be widely used in the manufacturing industry for manufacturing IC cards equipped with a nonvolatile memory chip.

Claims (30)

(A) preparing a wiring board in which a plurality of module boards are integrated;
(B) mounting a semiconductor chip on each of the module substrates;
(C) electrically connecting the module substrate and the semiconductor chip;
(D) comprising the step of separating individual module boards from the wiring board,
In the step (d), the semiconductor device manufacturing method is characterized by including the holding portion protruding from the module substrate.   The method of manufacturing a semiconductor device according to claim 1, further comprising a step of sealing the semiconductor chip.   The method of manufacturing a semiconductor device according to claim 1, further comprising a step of performing an electrical characteristic inspection of the semiconductor chip mounted on the module substrate that has been separated.   The method of manufacturing a semiconductor device according to claim 1, further comprising a step of connecting the plurality of module substrates to a tape substrate using the holding portion on the module substrate separated into pieces.   5. The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate is formed by punching a hoop material to provide a space in a mounting region of the module substrate.   5. The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate is used in an IC card manufacturing process.   The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate has heat resistance.   5. The method of manufacturing a semiconductor device according to claim 4, wherein the module substrate and the tape substrate are mechanically connected.   5. The method of manufacturing a semiconductor device according to claim 4, wherein the module substrate and the tape substrate are connected by an adhesive or fusion.   5. The method for manufacturing a semiconductor device according to claim 4, wherein the tape substrate is made of metal.   The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate is made of a resin sheet.   5. The method of manufacturing a semiconductor device according to claim 4, wherein the tape substrate is made of heat-resistant paper or non-woven cloth.   The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor chip includes a nonvolatile memory chip and a controller chip that controls the nonvolatile memory chip.   3. The method of manufacturing a semiconductor device according to claim 2, wherein the module substrate is partially sealed.   2. The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor chip is mounted at a position according to one side of the module substrate.   One corner of the module substrate is chamfered, and the semiconductor chip is mounted in a region opposite to the region where the corner is chamfered with respect to the center of the module substrate. The method of manufacturing a semiconductor device according to claim 1.   2. The method of manufacturing a semiconductor device according to claim 1, wherein an area for mounting an IC card chip different from the semiconductor chip is secured on the module substrate.   18. The method of manufacturing a semiconductor device according to claim 17, wherein a pattern for mounting the IC card chip is formed on the module substrate.   The method of manufacturing a semiconductor device according to claim 1, wherein a conductor pattern is formed in the holding portion.   The method of manufacturing a semiconductor device according to claim 19, wherein the conductor pattern is formed of a gold film.   5. The method of manufacturing a semiconductor device according to claim 4, further comprising a step of mounting an IC card chip different from the semiconductor chip on the module substrate in a state where a plurality of the module substrates are connected to the tape substrate.   The method of manufacturing a semiconductor device according to claim 21, further comprising a step of sealing the IC card chip with a resin.   23. The method of manufacturing a semiconductor device according to claim 22, further comprising a step of cutting the module substrate and the holding portion to separate the module substrate.   24. The method of manufacturing a semiconductor device according to claim 23, wherein a cutting method using a mold, a water jet method, or a cutting method using a diamond saw is used for cutting the module substrate and the holding portion. (A) a module substrate;
(B) a semiconductor chip mounted on the module substrate;
(C) A semiconductor device comprising: a holding portion protruding from the module substrate.   26. The semiconductor device according to claim 25, wherein the semiconductor chip is sealed.   27. The semiconductor device according to claim 26, wherein the semiconductor chip includes a nonvolatile memory chip and a controller chip that controls the nonvolatile memory chip.   26. The semiconductor device according to claim 25, wherein a through hole is formed in the holding portion.   30. The semiconductor device according to claim 28, wherein the holding portion has a T shape. The semiconductor device further includes
26. The semiconductor device according to claim 25, further comprising an IC chip mounted on the module substrate in a region different from a region where the semiconductor chip is mounted.

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