JPS6471661A - Mirror polishing method for semiconductor wafer - Google Patents
Mirror polishing method for semiconductor waferInfo
- Publication number
- JPS6471661A JPS6471661A JP62224003A JP22400387A JPS6471661A JP S6471661 A JPS6471661 A JP S6471661A JP 62224003 A JP62224003 A JP 62224003A JP 22400387 A JP22400387 A JP 22400387A JP S6471661 A JPS6471661 A JP S6471661A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- pad
- semiconductor wafer
- wafer
- urethane pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
PURPOSE:To decrease flaw generated at the time of polishing a wafer improved in finished surface flatness by using a trued urethane pad as the polishing pad. CONSTITUTION:A polishing pad is combined with a polishing material containing abrasive grains and etchant, polishing a mirror surface of a semiconductor wafer. Here smoothly flatting by truing a surface 4 of a urethane pad, formed by a polyurethane sheet with most of the blow holes 3 closed, the urethane pad is used as the polishing pad. Thus by using the urethane pad applying truing, polished surface roughness of the semiconductor wafer decreases, and flaw generated at the time of polishing the wafer, decreases while improving flatness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62224003A JPS6471661A (en) | 1987-09-09 | 1987-09-09 | Mirror polishing method for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62224003A JPS6471661A (en) | 1987-09-09 | 1987-09-09 | Mirror polishing method for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6471661A true JPS6471661A (en) | 1989-03-16 |
Family
ID=16807065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62224003A Pending JPS6471661A (en) | 1987-09-09 | 1987-09-09 | Mirror polishing method for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6471661A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0656031A1 (en) * | 1992-08-19 | 1995-06-07 | Rodel, Inc. | Polymeric substrate with polymeric microelements |
WO1997047433A1 (en) * | 1996-06-14 | 1997-12-18 | Speedfam Corporation | Methods and apparatus for the chemical mechanical planarization of electronic devices |
JP2001179638A (en) * | 1999-12-20 | 2001-07-03 | Read Co Ltd | Abrasive cloth dresser and its manufacturing method |
US6679769B2 (en) * | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
-
1987
- 1987-09-09 JP JP62224003A patent/JPS6471661A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0656031A1 (en) * | 1992-08-19 | 1995-06-07 | Rodel, Inc. | Polymeric substrate with polymeric microelements |
EP0656031A4 (en) * | 1992-08-19 | 1995-07-26 | Rodel Inc | Polymeric substrate with polymeric microelements. |
US5578362A (en) * | 1992-08-19 | 1996-11-26 | Rodel, Inc. | Polymeric polishing pad containing hollow polymeric microelements |
EP0829328A2 (en) * | 1992-08-19 | 1998-03-18 | Rodel, Inc. | Polymeric substrate with polymeric microelements |
EP0829328A3 (en) * | 1992-08-19 | 1998-12-09 | Rodel, Inc. | Polymeric substrate with polymeric microelements |
US5900164A (en) * | 1992-08-19 | 1999-05-04 | Rodel, Inc. | Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements |
US6439989B1 (en) | 1992-08-19 | 2002-08-27 | Rodel Holdings Inc. | Polymeric polishing pad having continuously regenerated work surface |
WO1997047433A1 (en) * | 1996-06-14 | 1997-12-18 | Speedfam Corporation | Methods and apparatus for the chemical mechanical planarization of electronic devices |
US7083501B1 (en) | 1996-06-14 | 2006-08-01 | Speedfam-Ipec Corporation | Methods and apparatus for the chemical mechanical planarization of electronic devices |
JP2001179638A (en) * | 1999-12-20 | 2001-07-03 | Read Co Ltd | Abrasive cloth dresser and its manufacturing method |
US6679769B2 (en) * | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5791975A (en) | Backing pad | |
MY130639A (en) | Method of rough polishing semiconductor wafers to reduce surface roughness | |
EP1176630A4 (en) | Polishing body, polisher, method for adjusting polisher, method for measuring thickness of polished film or end point of polishing, method for producing semiconductor device | |
EP1334802A4 (en) | Polisher | |
TW369458B (en) | Method of processing semiconductor wafers | |
SG131737A1 (en) | Polishing tool and polishing method and apparatus using same | |
GB2329601A (en) | Methods and apparatus for the chemical mechanical planarization of electronic devices | |
TW364867B (en) | Polishing method, abrasive material, and polishing apparatus | |
US6420265B1 (en) | Method for polishing semiconductor device | |
JPS6471661A (en) | Mirror polishing method for semiconductor wafer | |
AU672653B2 (en) | Polishing method, apparatus for the same and buff polishing wheel | |
JPS57170538A (en) | Polishing method for one side of semiconductor wafer | |
JPH06208980A (en) | Polishing apparatus | |
US3488895A (en) | Method for surfacing glass | |
ATE75176T1 (en) | TOOL FOR DRESSING A GRINDING WHEEL AND METHOD OF APPLICATION. | |
MY108912A (en) | Polishing method, device and buff wheel therefor | |
EP1125688A4 (en) | Polishing apparatus and a semiconductor manufacturing method using the same | |
JPS642865A (en) | Dressing method for polishing belt in belt polishing machine | |
JPS57149154A (en) | Method of polishing semiconductor wafer | |
JPS531395A (en) | Method for mirror finishing work by electrolytic buff polishing | |
JPS645770A (en) | Polishing tool | |
EP0322083A3 (en) | Polishing device | |
JPS6212536Y2 (en) | ||
JPS5640246A (en) | Surface treatment of silicon wafer | |
JPS6464773A (en) | Method for polishing semiconductor wafer |