JPS6471661A - Mirror polishing method for semiconductor wafer - Google Patents

Mirror polishing method for semiconductor wafer

Info

Publication number
JPS6471661A
JPS6471661A JP62224003A JP22400387A JPS6471661A JP S6471661 A JPS6471661 A JP S6471661A JP 62224003 A JP62224003 A JP 62224003A JP 22400387 A JP22400387 A JP 22400387A JP S6471661 A JPS6471661 A JP S6471661A
Authority
JP
Japan
Prior art keywords
polishing
pad
semiconductor wafer
wafer
urethane pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62224003A
Other languages
Japanese (ja)
Inventor
Masahiro Takiyama
Kunihiro Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP62224003A priority Critical patent/JPS6471661A/en
Publication of JPS6471661A publication Critical patent/JPS6471661A/en
Pending legal-status Critical Current

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To decrease flaw generated at the time of polishing a wafer improved in finished surface flatness by using a trued urethane pad as the polishing pad. CONSTITUTION:A polishing pad is combined with a polishing material containing abrasive grains and etchant, polishing a mirror surface of a semiconductor wafer. Here smoothly flatting by truing a surface 4 of a urethane pad, formed by a polyurethane sheet with most of the blow holes 3 closed, the urethane pad is used as the polishing pad. Thus by using the urethane pad applying truing, polished surface roughness of the semiconductor wafer decreases, and flaw generated at the time of polishing the wafer, decreases while improving flatness.
JP62224003A 1987-09-09 1987-09-09 Mirror polishing method for semiconductor wafer Pending JPS6471661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62224003A JPS6471661A (en) 1987-09-09 1987-09-09 Mirror polishing method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62224003A JPS6471661A (en) 1987-09-09 1987-09-09 Mirror polishing method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS6471661A true JPS6471661A (en) 1989-03-16

Family

ID=16807065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62224003A Pending JPS6471661A (en) 1987-09-09 1987-09-09 Mirror polishing method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS6471661A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0656031A1 (en) * 1992-08-19 1995-06-07 Rodel, Inc. Polymeric substrate with polymeric microelements
WO1997047433A1 (en) * 1996-06-14 1997-12-18 Speedfam Corporation Methods and apparatus for the chemical mechanical planarization of electronic devices
JP2001179638A (en) * 1999-12-20 2001-07-03 Read Co Ltd Abrasive cloth dresser and its manufacturing method
US6679769B2 (en) * 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0656031A1 (en) * 1992-08-19 1995-06-07 Rodel, Inc. Polymeric substrate with polymeric microelements
EP0656031A4 (en) * 1992-08-19 1995-07-26 Rodel Inc Polymeric substrate with polymeric microelements.
US5578362A (en) * 1992-08-19 1996-11-26 Rodel, Inc. Polymeric polishing pad containing hollow polymeric microelements
EP0829328A2 (en) * 1992-08-19 1998-03-18 Rodel, Inc. Polymeric substrate with polymeric microelements
EP0829328A3 (en) * 1992-08-19 1998-12-09 Rodel, Inc. Polymeric substrate with polymeric microelements
US5900164A (en) * 1992-08-19 1999-05-04 Rodel, Inc. Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements
US6439989B1 (en) 1992-08-19 2002-08-27 Rodel Holdings Inc. Polymeric polishing pad having continuously regenerated work surface
WO1997047433A1 (en) * 1996-06-14 1997-12-18 Speedfam Corporation Methods and apparatus for the chemical mechanical planarization of electronic devices
US7083501B1 (en) 1996-06-14 2006-08-01 Speedfam-Ipec Corporation Methods and apparatus for the chemical mechanical planarization of electronic devices
JP2001179638A (en) * 1999-12-20 2001-07-03 Read Co Ltd Abrasive cloth dresser and its manufacturing method
US6679769B2 (en) * 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto

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