JPS57149154A - Method of polishing semiconductor wafer - Google Patents

Method of polishing semiconductor wafer

Info

Publication number
JPS57149154A
JPS57149154A JP56035182A JP3518281A JPS57149154A JP S57149154 A JPS57149154 A JP S57149154A JP 56035182 A JP56035182 A JP 56035182A JP 3518281 A JP3518281 A JP 3518281A JP S57149154 A JPS57149154 A JP S57149154A
Authority
JP
Japan
Prior art keywords
polishing
wafer
primarily
secondarily
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56035182A
Other languages
Japanese (ja)
Other versions
JPH0122113B2 (en
Inventor
Masaharu Kinoshita
Hiroshi Kataoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56035182A priority Critical patent/JPS57149154A/en
Publication of JPS57149154A publication Critical patent/JPS57149154A/en
Publication of JPH0122113B2 publication Critical patent/JPH0122113B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Abstract

PURPOSE:To perform accurate finishing to a slick surface, by securing a primarily polshed wafer with a pressure-reduction holder and secondarily polishing the wafer with a one-side polisher. CONSTITUTION:After a wafer 1 is primarily conventionally polished (primary polishing) by a both-side polisher having a polishing surface provided by pouring a polishing agent onto a polishing cloth, the wafer is secondarily polished while a polishing agent 20 containing abrasive grains of extremely small size is dropped through a nozzle 13 onto a turntable 11 to which a soft polishing cloth 12 is bonded. To secure the wafer 1 throughout the secondary polishing, the wafer is sucked through an elastic sheet 14a and a pressure reducing passage 14b.
JP56035182A 1981-03-13 1981-03-13 Method of polishing semiconductor wafer Granted JPS57149154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56035182A JPS57149154A (en) 1981-03-13 1981-03-13 Method of polishing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56035182A JPS57149154A (en) 1981-03-13 1981-03-13 Method of polishing semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS57149154A true JPS57149154A (en) 1982-09-14
JPH0122113B2 JPH0122113B2 (en) 1989-04-25

Family

ID=12434702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56035182A Granted JPS57149154A (en) 1981-03-13 1981-03-13 Method of polishing semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57149154A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
US5523868A (en) * 1991-12-19 1996-06-04 Dsc Communications Corporation Apparatus and method for monitoring power loss in a telecommunications system

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270401A (en) 1996-01-31 1997-10-14 Shin Etsu Handotai Co Ltd Polishing method of semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
US5523868A (en) * 1991-12-19 1996-06-04 Dsc Communications Corporation Apparatus and method for monitoring power loss in a telecommunications system

Also Published As

Publication number Publication date
JPH0122113B2 (en) 1989-04-25

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