JPS6453505A - External packaging of electronic component - Google Patents

External packaging of electronic component

Info

Publication number
JPS6453505A
JPS6453505A JP62210501A JP21050187A JPS6453505A JP S6453505 A JPS6453505 A JP S6453505A JP 62210501 A JP62210501 A JP 62210501A JP 21050187 A JP21050187 A JP 21050187A JP S6453505 A JPS6453505 A JP S6453505A
Authority
JP
Japan
Prior art keywords
metal mold
protrusion
resin
upper metal
external packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62210501A
Other languages
Japanese (ja)
Inventor
Hideki Sugimoto
Takehiko Unokuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62210501A priority Critical patent/JPS6453505A/en
Publication of JPS6453505A publication Critical patent/JPS6453505A/en
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PURPOSE:To arrange an internal element accurately and forcibly between an upper metal mold and a lower metal mold by a method wherein a protrusion is installed at one part of the upper metal mold and the lower metal mold and a tilt of the internal element is corrected. CONSTITUTION:Lead frames 3 are sandwiched between an upper metal mold 1 and a lower metal mold 2; at the same time, an element 4 is held by a protrusion 6 of the upper metal mold 1 and a protrusion 7 of the lower metal mold 2; a molding resin is filled into its surrounding space 5. If an external packaging operation by molding the resin is executed in this manner, the element 4 is corrected forcibly by the protrusions 6, 7 even when it is bent; the element 4 is not exposed to the outside. A hole 9 which has been made by the protrusion 6 of the upper metal mold 1 in an external packaging resin 8 is shaped; after that, a second resin 10 for sealing purpose is injected and hardened.
JP62210501A 1987-08-25 1987-08-25 External packaging of electronic component Pending JPS6453505A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62210501A JPS6453505A (en) 1987-08-25 1987-08-25 External packaging of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62210501A JPS6453505A (en) 1987-08-25 1987-08-25 External packaging of electronic component

Publications (1)

Publication Number Publication Date
JPS6453505A true JPS6453505A (en) 1989-03-01

Family

ID=16590410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62210501A Pending JPS6453505A (en) 1987-08-25 1987-08-25 External packaging of electronic component

Country Status (1)

Country Link
JP (1) JPS6453505A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149104A (en) * 1984-01-14 1985-08-06 ロ−ム株式会社 Method of sealing with resin composite electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149104A (en) * 1984-01-14 1985-08-06 ロ−ム株式会社 Method of sealing with resin composite electronic part

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