JPS5710952A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS5710952A
JPS5710952A JP8700280A JP8700280A JPS5710952A JP S5710952 A JPS5710952 A JP S5710952A JP 8700280 A JP8700280 A JP 8700280A JP 8700280 A JP8700280 A JP 8700280A JP S5710952 A JPS5710952 A JP S5710952A
Authority
JP
Japan
Prior art keywords
resin
nut
bolt
lead terminals
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8700280A
Other languages
Japanese (ja)
Other versions
JPS6130747B2 (en
Inventor
Hajime Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8700280A priority Critical patent/JPS5710952A/en
Publication of JPS5710952A publication Critical patent/JPS5710952A/en
Publication of JPS6130747B2 publication Critical patent/JPS6130747B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the damage to lead terminals due to bending moment, by a method wherein the end part of each of lead terminals is horizontally bent, a bolt is inserted through a bolt hole at the end and screwed in a nut, and resin is injected to form a sealing resin burying the nut. CONSTITUTION:In a synthetic resin container 1 with the upper part open, semiconductor elements 2 are installed and connected together with a connecting conductor 3. The end part of each of lead terminals 20, 21 and 22 is horizontally bent and provided with a bolt hole 23. A terminal nut 10 is abutted against the lower surface of each bent part, a bolt 11 is screwed therein to hold the same, and a cap 24 is put thereon. Then, resin is injected into the synthetic resin container 1, and the cast resin is hardened to form a sealing resin 25 which has hermetically sealed said elements 2. Thereby, there is no process to apply any bending moment to each lead terminal. Accordingly, the damage to the semiconductor elements is prevented.
JP8700280A 1980-06-23 1980-06-23 Resin sealed type semiconductor device Granted JPS5710952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8700280A JPS5710952A (en) 1980-06-23 1980-06-23 Resin sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8700280A JPS5710952A (en) 1980-06-23 1980-06-23 Resin sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS5710952A true JPS5710952A (en) 1982-01-20
JPS6130747B2 JPS6130747B2 (en) 1986-07-15

Family

ID=13902671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8700280A Granted JPS5710952A (en) 1980-06-23 1980-06-23 Resin sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5710952A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0591900A2 (en) * 1992-10-05 1994-04-13 Fuji Electric Co. Ltd. Resin-sealed semiconductor device
US5825085A (en) * 1995-09-01 1998-10-20 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device, armoring case thereof and method for manufacturing the same
JP2012178528A (en) * 2011-02-28 2012-09-13 Sansha Electric Mfg Co Ltd Semiconductor device
JP2013102242A (en) * 2013-03-05 2013-05-23 Mitsubishi Electric Corp Power semiconductor device
JP2013219110A (en) * 2012-04-05 2013-10-24 Shizuki Electric Co Inc Capacitor
JP2014017446A (en) * 2012-07-11 2014-01-30 Toyota Industries Corp Electronic component module and manufacturing method of the same
DE102011076235B4 (en) * 2010-06-01 2014-07-10 Mitsubishi Electric Corp. Power semiconductor device
JP2019145738A (en) * 2018-02-23 2019-08-29 パナソニックＩｐマネジメント株式会社 Capacitor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0591900A2 (en) * 1992-10-05 1994-04-13 Fuji Electric Co. Ltd. Resin-sealed semiconductor device
EP0591900A3 (en) * 1992-10-05 1994-11-23 Fuji Electric Co Ltd Resin-sealed semiconductor device.
US5825085A (en) * 1995-09-01 1998-10-20 Mitsubishi Denki Kabushiki Kaisha Power semiconductor device, armoring case thereof and method for manufacturing the same
DE102011076235B4 (en) * 2010-06-01 2014-07-10 Mitsubishi Electric Corp. Power semiconductor device
US8829534B2 (en) 2010-06-01 2014-09-09 Mitsubishi Electric Corporation Power semiconductor device
JP2012178528A (en) * 2011-02-28 2012-09-13 Sansha Electric Mfg Co Ltd Semiconductor device
JP2013219110A (en) * 2012-04-05 2013-10-24 Shizuki Electric Co Inc Capacitor
JP2014017446A (en) * 2012-07-11 2014-01-30 Toyota Industries Corp Electronic component module and manufacturing method of the same
JP2013102242A (en) * 2013-03-05 2013-05-23 Mitsubishi Electric Corp Power semiconductor device
JP2019145738A (en) * 2018-02-23 2019-08-29 パナソニックＩｐマネジメント株式会社 Capacitor

Also Published As

Publication number Publication date
JPS6130747B2 (en) 1986-07-15

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