JPS62145322U - - Google Patents
Info
- Publication number
- JPS62145322U JPS62145322U JP3313886U JP3313886U JPS62145322U JP S62145322 U JPS62145322 U JP S62145322U JP 3313886 U JP3313886 U JP 3313886U JP 3313886 U JP3313886 U JP 3313886U JP S62145322 U JPS62145322 U JP S62145322U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- conductive wires
- substrate
- electronic
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 3
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の実施例を示す電子回路を構成
した基板の平面図、第２図は第１図のＡ―Ａ線に
よる視図である。
１…基板、２ａ，２ｂ，２ｃ，２ｄ…導線、３
…電子素子、４…導通部、５…保護層。
FIG. 1 is a plan view of a substrate constituting an electronic circuit showing an embodiment of the present invention, and FIG. 2 is a perspective view taken along line AA in FIG. 1. 1... Board, 2a, 2b, 2c, 2d... Conductive wire, 3
...electronic element, 4...conducting part, 5...protective layer.
Claims (1)
、かつこの電子回路を基板と共に合成樹脂等から
成る保護層により封止することにより全体をチツ
プ化するものにおいて、基板に対して絶縁性を有
する接着層を形成し、この接着層の所定の位置に
対して電子素子、及び予め所定の長さに切断しか
つ要すれば屈曲形成した導線を配置すると共に、
これら導線及び電子素子を接着層が接着保持し、
更にこれら導線及び電子素子の導通部に対して電
気的接続手段を施すことにより電子回路を構成し
たことを特徴とするネツトワーク電子部品。 An electronic circuit is constructed on an insulating substrate, and the entire electronic circuit is sealed together with the substrate with a protective layer made of synthetic resin, etc. to form a chip, which has insulating properties with respect to the substrate. Forming an adhesive layer, arranging electronic elements and conductive wires cut to a predetermined length and bent if necessary at predetermined positions on the adhesive layer;
The adhesive layer adheres and holds these conductive wires and electronic elements,
Furthermore, a network electronic component is characterized in that an electronic circuit is constructed by providing electrical connection means to the conductive portions of these conductive wires and electronic elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3313886U JPS62145322U (en) | 1986-03-10 | 1986-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3313886U JPS62145322U (en) | 1986-03-10 | 1986-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145322U true JPS62145322U (en) | 1987-09-12 |
Family
ID=30840465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3313886U Pending JPS62145322U (en) | 1986-03-10 | 1986-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145322U (en) |
-
1986
- 1986-03-10 JP JP3313886U patent/JPS62145322U/ja active Pending
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