JPS62126863U - - Google Patents
Info
- Publication number
- JPS62126863U JPS62126863U JP1329686U JP1329686U JPS62126863U JP S62126863 U JPS62126863 U JP S62126863U JP 1329686 U JP1329686 U JP 1329686U JP 1329686 U JP1329686 U JP 1329686U JP S62126863 U JPS62126863 U JP S62126863U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring member
- resin film
- conductors
- adhesive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004840 adhesive resin Substances 0.000 claims description 3
- 229920006223 adhesive resin Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係るプリント配線
部材の平面図、第２図は第１図の―線拡大断
面図、第３図および第４図は従来のプリント配線
部材の接続過程を示す断面図である。
２１〜プリント配線部材、２２〜絶縁シート、
３３〜導体、２３ａ〜端子部、２４〜接続箇所、
２５〜接着性樹脂膜、２５ａ〜導電化部分。
Fig. 1 is a plan view of a printed wiring member according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view taken along the line - - in Fig. 1, and Figs. 3 and 4 illustrate the connection process of conventional printed wiring members. FIG. 21 - printed wiring member, 22 - insulation sheet,
33 - conductor, 23a - terminal section, 24 - connection point,
25 - Adhesive resin film, 25a - Conductive portion.
Claims (1)
、その導体の端子部を配列した他の部材との接続
箇所が設けられているプリント配線部材において
、上記接続箇所に接着性樹脂膜が張りつけられて
おり、その接着性樹脂膜の上記端子部上に位置す
る部分だけ導電化されていることを特徴とするプ
リント配線部材。 In a printed wiring member in which a predetermined pattern of conductors is formed on an insulating sheet and connection points with other members are provided in which the terminal portions of the conductors are arranged, an adhesive resin film is pasted on the connection points. , A printed wiring member characterized in that only a portion of the adhesive resin film located above the terminal portion is made conductive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1329686U JPH0514547Y2 (en) | 1986-02-03 | 1986-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1329686U JPH0514547Y2 (en) | 1986-02-03 | 1986-02-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62126863U true JPS62126863U (en) | 1987-08-12 |
| JPH0514547Y2 JPH0514547Y2 (en) | 1993-04-19 |
Family
ID=30802224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1329686U Expired - Lifetime JPH0514547Y2 (en) | 1986-02-03 | 1986-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514547Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01209795A (en) * | 1988-02-18 | 1989-08-23 | Nissha Printing Co Ltd | Laminated layer circuit substrate |
-
1986
- 1986-02-03 JP JP1329686U patent/JPH0514547Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01209795A (en) * | 1988-02-18 | 1989-08-23 | Nissha Printing Co Ltd | Laminated layer circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514547Y2 (en) | 1993-04-19 |