JPS6195880A - Manufacturing method of electrodeposited grindstone - Google Patents
Manufacturing method of electrodeposited grindstoneInfo
- Publication number
- JPS6195880A JPS6195880A JP21261684A JP21261684A JPS6195880A JP S6195880 A JPS6195880 A JP S6195880A JP 21261684 A JP21261684 A JP 21261684A JP 21261684 A JP21261684 A JP 21261684A JP S6195880 A JPS6195880 A JP S6195880A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- base metal
- chip pocket
- manufacturing
- plated layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/08—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for close-grained structure, e.g. using metal with low melting point
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、砥粒を強固に保持した電着砥石の製造法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing an electrodeposited grindstone that firmly holds abrasive grains.
各種ある電着砥石は、一般に１第２図に示す如く台金１
Ｖ？−砥粒２をニッケルメッキ３等を施して保持するこ
とによシ製造されている。そして、良い砥石を製造する
ためには、砥粒２を台金１に如何に強固に保持させるか
が鍵である。Various electrodeposited grindstones generally have a base metal 1 as shown in Figure 2.
V? - Manufactured by holding abrasive grains 2 with nickel plating 3 or the like. In order to manufacture a good whetstone, the key is how firmly the abrasive grains 2 are held on the base metal 1.
砥粒２を強固に保持するためには、メッキ層３をできる
だけ厚くする方が良いが、厚くしすぎると、切屑ポケッ
トが小さくなシ、研削により発生する切屑を貯めておく
ことができず、砥石の研削性が悪くなる。一方、切屑ポ
ケットを大きくするために、メッキ層３をうすくすると
、砥粒２の保持力が弱く、またメッキをしただけでは、
第３図に示す如く、砥粒２近辺のメッキ層はうすくなり
、砥粒２を強固に保持することが困難であった。なお、
第３図において、４は切屑ポケットを示す。In order to firmly hold the abrasive grains 2, it is better to make the plating layer 3 as thick as possible, but if it is too thick, the chip pockets will be small and the chips generated by grinding will not be able to be stored. The grinding performance of the whetstone deteriorates. On the other hand, if the plating layer 3 is made thinner in order to enlarge the chip pockets, the holding power of the abrasive grains 2 will be weak, and if the plating is only applied,
As shown in FIG. 3, the plating layer near the abrasive grains 2 became thin, making it difficult to firmly hold the abrasive grains 2. In addition,
In FIG. 3, 4 indicates a chip pocket.
本発明は、上記のような欠点、すなわち、砥粒を台金に
強固に保持しようとすれば、切屑ポケットが小さくなっ
て研削性が悪くなり、一方、研削性を良くしようとする
と、砥粒保持力が小さくなるという欠点をなくすること
を目的とする。そして、本発明では、先ず砥粒を強固に
保持させるためにメッキ層を厚くメッキし、次いで、メ
ッキ層のみを除去することＫより所要の切屑ポケットを
得るようにした事を特徴とする。The present invention solves the above-mentioned drawbacks, namely, if you try to firmly hold the abrasive grains on the base metal, the chip pocket becomes smaller and the grinding performance deteriorates.On the other hand, if you try to improve the grindability, the abrasive grains The purpose is to eliminate the drawback of low holding force. The present invention is characterized in that a thick plating layer is first plated to firmly hold the abrasive grains, and then only the plating layer is removed to obtain the required chip pockets.
本発明は、電着砥石の製造にあたり、台金に砥粒をニッ
ケルメッキ等のメッキを砥粒の見えなくなるまでの厚さ
に施すととＫよシ保持し、次いで、砂を砥粒を設けた側
の表面に噴射してメッキ層を除去するととくよシ所望の
切屑ポケットを形成することを特徴とする電着砥石の製
造法に関する。In manufacturing an electrodeposited whetstone, the present invention involves plating abrasive grains on the base metal such as nickel plating until the abrasive grains are no longer visible, and then holding the abrasive grains in a horizontal position. The present invention relates to a method for producing an electrodeposited grindstone, characterized in that when the plated layer is removed by spraying on the surface of the electrodeposited grindstone, desired chip pockets are formed.
本発明では、研削性が良く、シかも長寿命の電着砥石の
製造方法として、第１図に示す如く、（１）先ず、台金
１に適当な厚さ、例えば、砥粒２が見えなくなるまでニ
ッケルメッキ等のメッキを施こし、
（２）次いで、例えば、エメリー砂などを砥粒を施した
側のメッキ層に噴射してメッキ層３を除去して所要の切
屑ポケット４′を得る。In the present invention, as shown in FIG. 1, as a method for manufacturing an electrodeposited grindstone with good grindability and long life, (1) First, a suitable thickness, for example, abrasive grains 2 are visible on the base metal 1. Apply plating such as nickel plating until it disappears, (2) Next, remove the plating layer 3 by spraying, for example, emery sand onto the plating layer on the abrasive side to obtain the required chip pockets 4'. .
このような製造工程をとることによシ、切屑ポケット４
′の形状は、第３図の切屑ポケット４の形から、第１図
に示す通シ、砥粒保持に必要な砥粒近辺のメッキ層を厚
くして、しかも、切屑ポケット４′は大きくすることが
でき、従来の欠点を解決することができる。By using this manufacturing process, the chip pocket 4
The shape of the chip pocket 4' is changed from the shape of the chip pocket 4 in FIG. 3 to the shape shown in FIG. It is possible to solve the conventional drawbacks.
また、切屑ポケット４′の部分を除去する方法としては
、上記のエメリー砂を噴射する方法だけでなく、砂等の
中に突込んで回転する方法等、各種の方法があシ、除去
方法を特定するものではない。さらに、砥粒２の大きさ
、間隔、切屑ポケット４′の形状等により、切屑ポケッ
ト４′の除去に用いる砂等は、適当な大きさ、形を選べ
ばよく、砂等の大きさ形は特定しない。In addition, there are various ways to remove the chip pocket 4', including not only the above-mentioned method of injecting emery sand, but also a method of thrusting into the sand and rotating. It's not something you do. Further, depending on the size and spacing of the abrasive grains 2, the shape of the chip pocket 4', etc., the sand used for removing the chip pocket 4' may be selected in an appropriate size and shape. Not specified.
本発明によれば、研削性が良く、シかも砥粒と台金が強
固に保持された長寿命の電着砥石を得ることができる。According to the present invention, it is possible to obtain an electrodeposited grindstone with good grindability and a long life in which the abrasive grains and the base metal are firmly held.
第１図は、本発明方法による電着砥石の製造法の説明図
であシ、第２図は、従来の電着砥石の概略図である。第
３図は、従来の電着砥石の製造例を示す説明図である。
復代理人 内 １） 明
復代理人 萩 原 亮 −FIG. 1 is an explanatory diagram of a method for manufacturing an electrodeposited grindstone according to the method of the present invention, and FIG. 2 is a schematic diagram of a conventional electrodeposition grindstone. FIG. 3 is an explanatory diagram showing an example of manufacturing a conventional electrodeposited grindstone. Sub-agents 1) Meifuku agent Ryo Hagiwara -
Claims (1)
等のメッキを砥粒の見えなくなるまでの厚さに施すこと
により保持し、次いで、砂を砥粒を設けた側の表面に噴
射してメッキ層を除去することにより所望の切屑ポケッ
トを形成することを特徴とする電着砥石の製造法。In manufacturing electroplated grindstones, the abrasive grains are held on the base metal by applying plating such as nickel plating until the abrasive grains are no longer visible, and then sand is injected onto the surface on the side where the abrasive grains are applied. A method for manufacturing an electrodeposited grindstone, which comprises forming desired chip pockets by removing a plating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21261684A JPS6195880A (en) | 1984-10-12 | 1984-10-12 | Manufacturing method of electrodeposited grindstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21261684A JPS6195880A (en) | 1984-10-12 | 1984-10-12 | Manufacturing method of electrodeposited grindstone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6195880A true JPS6195880A (en) | 1986-05-14 |
Family
ID=16625625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21261684A Pending JPS6195880A (en) | 1984-10-12 | 1984-10-12 | Manufacturing method of electrodeposited grindstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6195880A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0343581A (en) * | 1989-07-10 | 1991-02-25 | Sanwa Shutter Corp | Arranging structure of self-closing device in self-closing sliding door |
| WO1997025184A1 (en) * | 1996-01-09 | 1997-07-17 | Osaka Diamond Industrial Co., Ltd. | Superabrasive tool and method of manufacturing the same |
-
1984
- 1984-10-12 JP JP21261684A patent/JPS6195880A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0343581A (en) * | 1989-07-10 | 1991-02-25 | Sanwa Shutter Corp | Arranging structure of self-closing device in self-closing sliding door |
| WO1997025184A1 (en) * | 1996-01-09 | 1997-07-17 | Osaka Diamond Industrial Co., Ltd. | Superabrasive tool and method of manufacturing the same |
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