JPS6163048A - Memory module - Google Patents

Abstract

PURPOSE:To produce memory module with high mounting concentration by a method wherein a flat package of ultraviolet ray elimination type EPROM with an ultraviolet ray transmission window is deposited on flat patterns of other memory elements with the same dimension while exposing this window to atmosphere to connect these leads with circuit substrate provided on both sides. CONSTITUTION:A flat package 1 of ultraviolet ray elimination type EPROM with an ultraviolet ray transmission window such as glass on the surface is deposited on a laminated body of three static RAMs 3 with the same shape, width between leads. Next a pair of circuit substrates 4, 5 provided with conductive patterns on both sides of packages 1 and 3 are arranged in parallel with each other to insert leads 1a of package 1 and leads 3a of package 3 respectively into through holes 4a and 5a made into the circuit substrates 4, 5 and then bonded to each other using solder 6. Besides, dip leads 7 are fixed to the lower ends of substrate 4, 5 to connected to the conductive patterns on the substrates 4, 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a memory module in which an ultraviolet erasable EPROM is mounted with other memory elements in a Qf, degree.

[Technical Background of the Invention and Other Points] The ultraviolet erasable EPROM' chip is constructed such that written memory data is erased by irradiation with ultraviolet rays.

Conventionally, when configuring a memory module by mounting such ultraviolet erasable EPROM chips, EPR
A pair of OM chips is sealed together with other memory elements in the same package, and the package is provided with an ultraviolet light transmitting window.

However, in such a memory module, the entire large package must have a special structure having an ultraviolet a-transmitting window, resulting in an increase in cost.

In addition, with EPROM pair chips, it is difficult to completely guarantee writing and erasing performance, so there is a problem that the yield of the entire product is poor and Yamahiko is difficult to manufacture.

Furthermore, since there is a risk that dust may adhere to the surface of paired chips and cause erase failure, there is a problem in that the level of cleanliness must be even higher when mounting the chips and assembling the package.

CObject of the Invention The present invention has been made to solve these problems, and an object of the present invention is to provide a high-quality memory module with a high packaging density in which an ultraviolet erasable EPROM is mounted.

[Summary of the Invention] That is, the memory module of the present invention includes a flat package of an ultraviolet-a erase type EPROM having an ultraviolet-transmitting window, and a flat package of another memory element or a memory element mounting board of approximately the same size as the EPROM.
The flat packages are stacked one on top of the other so that the ultraviolet transmitting window is exposed on the outermost side, and each lead is inserted into the through hole of a pair of circuit boards placed opposite each other to connect the conductor pattern and electricity on each circuit board. It is characterized by being connected to each other.

[Embodiments of the invention] The detailed description of the present invention will be given below based on concave surfaces.

FIG. 1 is a partial sectional view of a memory module according to an embodiment of the present invention.

In the figure, reference numeral 1 indicates a flat package of an ultraviolet erasable EPROM, which has an ultraviolet transmitting window 2 made of glass on its upper surface. Three equal static RAM flat packages 3 are stacked and arranged.

Flat package 1 of these ultraviolet erase type EPRO~1 and flat package 3 of static RAM
are the through-holes 4a of a pair of circuit boards 4.5, which are arranged opposite to each other with the glues 1a and 3a sandwiching them, respectively;
5a respectively, and are connected to the circuit board 4.5 by soldering 6.
It is electrically connected to a conductor pattern (not shown).

Further, a plurality of D (P type) leads 7 are protruded from the lower edge of the circuit board 4.5.These leads 7 are electrically connected to the conductive patterns on the circuit board 4.5. This module is electrically connected to another circuit board, which becomes the motherboard.

In the memory module of the embodiment configured in this manner, a flat package 1 of ultraviolet erasable EPROM which is completely sealed and whose quality is guaranteed is used, and this is stacked together with a flat package 3 of static RAM for mounting. Therefore, the EPROM can be easily erased by ultraviolet rays, and high packaging density can be obtained.

That is, in the embodiment shown in FIG. 1, if the memory capacity of each of the ultraviolet erasable EPROM and static RAM is 64 bits and each memory configuration is 8 bytes, these flat packages generally have a lead pitch of 1. Since the package thickness is 27a and 2~3u,
An extremely high-density memory module with an extremely thin overall thickness of 10 to 15+n and a width close to the standard JEDEC 28-bin DIR can be obtained.

The second factor is a cross-sectional view of a memory module according to another embodiment of the present invention. In FIG. 2, the same reference numerals are given to the parts common to the first factor.

In this embodiment, an ultraviolet erasable EPR (5M flat package 1 and static RAM flat package 3) is used, as well as a
A different flat package type ■C8 is implemented as follows.

That is, this flat package type IC 8 is planarly mounted on another circuit board 9, and this IR circuit board has a through hole 9a provided in the circuit board 9, and a circuit board 4. The lead 7 at the lower end of the module 5 is inserted and held together by the solder 6, thereby being incorporated into the module.

In addition, in the present invention, not only the flat package type 1C but also other chip components, resistors,
It is also possible to planarly mount capacitors and the like and incorporate them into the module in the same manner as the embodiment shown in FIG.

[Effects of the Invention 1] As explained above, the memory module of the present invention has an ultraviolet erasable type E which has guaranteed quality and is completely sealed.
Since the PROM flat package is mounted on top of other memory element flat packages, the packaging density is high, and the manufacturing yield is high and manufacturing costs can be kept low. Furthermore, since the ultraviolet transmitting window of the flat package of the ultraviolet erasable EPROM is located at the outermost side, the EPROM can be easily erased with ultraviolet light.

[Brief explanation of drawings]

FIG. 1 is a partial sectional view of one embodiment of the present invention, and FIG. 2 is a partial sectional view of another embodiment. 1・・・・・・・・・・・・・・・Ultraviolet erasing type EPR
OM flat package 2・・・・・・・・・・・・Ultraviolet transmission window 3・・・・
..........Static RAM flat package 4.5.9...Circuit board 6...Solder 7...・・・
・・・・・・・・・Lead 8・・・・・・・・・・・・
...Flat package type IC Figure 1 Figure 2

Claims (1)

[Claims] (1) A flat package of an ultraviolet erasable EPROM having an ultraviolet transmitting window and a flat package of another memory element of approximately the same size or a memory element mounting board are arranged so that the flat package of the EPROM is the outermost part and the ultraviolet transmitting window is The leads are stacked so as to be exposed to the outside, and each lead is inserted into a through hole of a pair of circuit boards arranged opposite each other, and electrically connected to a conductor pattern on each circuit board. memory module.