JPS61158191A - Hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit board on which, for example, a plurality of identical hybrid integrated circuits are formed.

[Conventional technology]

FIG. 3 shows an example of a production process for a hybrid integrated circuit (hereinafter referred to as a hybrid IC). A board manufacturer first prepares a board and forms a circuit pattern through photoetching or other processing.

Next, after printing and firing the resistor paste, the resistance value is adjusted by radar trimming to form a printed resistor.

Next, the conduction of the circuit pattern, the resistance value of the resistor, etc. are inspected. Further, manufacturers of hybrid ICs using this board mount components on the board by soldering 70-, and then inspect and complete the board.

In this case, the substrate actually includes a plurality of substrate parts on which a plurality of hybrid ICs are formed, for example, A as shown in FIG.
1 to A6, and the hybrid ICs are produced in an assembled state until inspection is completed by the manufacturer.

[Problem that the invention seeks to solve]

When production is carried out in a collective state like this.

During the production process, when a defect occurs in a part of the set, how to handle it becomes a problem. That is, if the entire set is defective, the production yield will drop significantly, leading to an increase in costs. On the other hand, if you ignore some of the defects and continue production as is, you will waste man-hours and money on the defective parts, leading to an increase in costs.

In view of these points, the present invention provides a hybrid IC that is devised to avoid reducing the yield and also to avoid wasting man-hours and costs for defective parts.
This paper aims to propose a substrate.

[Means for solving problems]

In order to solve the above-mentioned problems, the present invention provides a plurality of substrate parts A1
~ Consists of A6 and margin section (3), and margin section (31
K? ! Four conductive turns a1 to a6 for quality determination are formed corresponding to the number of substrate parts Al-A6.

[Effect]

In the above configuration, for example, a four-turn conductive metal cut corresponding to the defective part is cut at the board manufacturer. The manufacturer can identify the defective part by checking the continuity, and can then remove the defective part and mount the component.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to FIG.

In the figure, A1 to A6 are substrate parts on which the same hybrid IC is formed, (1) is a circuit/mother turn, and (2) is a printed resistor.

Also, (3) is a margin, and in this margin (3),
The number of conductive turns corresponding to the board members 1 to 86 is
a6 is formed. In addition, (4) refers to these conductive patterns a
1 to a6, and (51) to (56) are the other terminals of these conductive/# turns a1 to a6.

In this case, the terminals (41, (5rl-(56)) are formed in the same way at the same time as the circuit pattern (1) is formed, while the conductive patterns a1-a6 are formed in the same way at the same time as the printed resistor (2). Similarly formed using materials.

This example is configured as described above. For example, a board manufacturer checks the continuity of the circuit's 4 turns (1) and the value of the resistance (2) during inspection, and creates a conductive pattern corresponding to the defective part of the board. It is cut by radar machining or electric discharge machining and delivered to the manufacturer in that state.

For example, as shown in Figure 2, manufacturing manufacturers use contactors (
6) is used to check the continuity of the conductive pattern Machi~a6, determine that the board part corresponding to the non-conductive conductive/arm turn is a defective part, and send this information to the mounting system.
The parts are mounted after removing the defective parts.

As described above, according to the structure in which the conductive turns a1 to a6 are formed as in this example, if a defect occurs in a part of the board parts A1 to A6 at a board manufacturer, for example,
It is not necessary to mark the entire assembly as defective, which avoids a significant drop in yield, and also eliminates the wasteful process and expense of mounting parts on defective parts for manufacturers, reducing the production cost of the hybrid IC produced. can be reduced.

Further, according to this example, the conductive 9 turns a1 to a6 can be formed simultaneously with the formation of the circuit pattern (1) and the resistor (2),
Further, the conductive patterns a1 to a6 can be cut by, for example, laser processing, and there is an advantage that existing equipment can be used without requiring any special equipment. Further, there is the advantage that discrimination can be easily performed by checking electrical continuity using the contactor (6).

Incidentally, according to the above-mentioned embodiment, conductive, arm turns a1 to a6
is made of the same material as the resistor (2), but may be made of the same material at the same time as the circuit/gut (1). However, cutting is somewhat difficult.

Further, according to the above-mentioned embodiment, the conductive/interturn al~a6
□ indicates the quality at the time of inspection by the board manufacturer, but it may also indicate the quality at other processes, and the conductive pattern indicates the quality of each board part A1 to A6 for each main process. may be formed. For example, in the case of a double-sided board, in addition to the above-mentioned example, it is conceivable that the manufacturer forms conductive turns that indicate the quality of the board by inspection after mounting components on one side.

Moreover, it goes without saying that the shapes and materials of the conductive patterns 31 to a6 are not limited to those in the above-mentioned embodiments.

〔Effect of the invention〕

According to the present invention described above, a conductive pattern indicating the quality of a plurality of substrate parts is formed in the margin part,
For example, a board manufacturer can avoid a significant drop in yield by not having to judge the entire board as defective even if a part of the board is defective, and a production manufacturer can avoid mounting parts on the defective part. , Hybrid I
It is possible to reduce the production cost of C.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram showing an embodiment of the present invention, Fig. 2 is a diagram for explaining the same, Fig. 3 is a diagram showing the production process of a hybrid IC, and Fig. 4 is an explanation of a hybrid IC board. This is a diagram for (11 is the circuit A turn, (2) is the printed resistor, (3) is the margin area, A1 to A6 are the board parts, and a1 to a6 are the conductive patterns.

Claims (1)

[Claims] What is claimed is: 1. A hybrid integrated circuit board comprising a plurality of substrate parts and a blank area, and a number of conductive patterns for quality determination corresponding to the plurality of substrate parts are formed in the blank area.