JPS5984534A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS5984534A
JPS5984534A JP57195475A JP19547582A JPS5984534A JP S5984534 A JPS5984534 A JP S5984534A JP 57195475 A JP57195475 A JP 57195475A JP 19547582 A JP19547582 A JP 19547582A JP S5984534 A JPS5984534 A JP S5984534A
Authority
JP
Japan
Prior art keywords
wire
bonding
arm
clamp
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57195475A
Other languages
Japanese (ja)
Inventor
Kazuya Noguchi
野口　一哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57195475A priority Critical patent/JPS5984534A/en
Publication of JPS5984534A publication Critical patent/JPS5984534A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To execute stable bonding work by providing a wire loop control mechanism. CONSTITUTION:A ball is formed at the tip of a wire 1 by a spark electrode 10, linear motors 4, 5 are driven, and a bonding arm 8 and a wire-cut clamp 9 begin to fall toward a first bonding point while they are left as they clamp the wire 1. When the bonding arm 8 rises up to loop height (c) after first bonding, the arm 8 begins to move toward a second bonding point while the wire-cut clamp 9 begins to fall as it is left as it is closed. The wire 1 is pushed out through the bonding tool 11 of the arm 8 by the wire-cut clamp 9 only by wire length of (c+d) until the bonding tool 11 is in contact with an external lead 16. Accordingly, a stable wire loop is obtained regardless of distances among pads and a lead by forcedly pushing the wire 1 out during bonding only by optimum length.

Description

【発明の詳細な説明】 本発明は、半導体ＩＯの組立工程で用いられるワイヤー
ボンディング装機に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wire bonding machine used in a semiconductor IO assembly process.

ボンディング中ワイヤーに伺らの強制も行なわないか又
は、ワイヤーに軽くテンションを与える程度の従来のボ
ンディング装置では、そのワイヤーループ形状はボンデ
ィングツールからのワイヤー＜シ出し量、ボンディング
中のボンディングツールへのワイヤー吸い込み量によシ
決まっていた。With conventional bonding equipment that does not force the wire to bend during bonding or only applies a slight tension to the wire, the wire loop shape is such that the wire from the bonding tool is less than the amount of extension of the wire, and It was determined by the amount of wire suction.

ワイヤーく夛出し量は、第１ボンディング点からボンデ
ィングツールの最上点までの距離に相当するため、ボン
ディングする半導体ペレットの厚さに応じてこの距離を
変える心安があシ、シかもその値は定量的なものではな
く、またボンディングツールへのワイヤーの吸い込み量
もまたボンディングツール穴の内部面の仕上げ程度、ボ
ンディングツールの下降速度、ボンディングツールのボ
ンディング軌跡等に依存し、定量的ではなかった。The amount of wire extension corresponds to the distance from the first bonding point to the top point of the bonding tool, so it may be safe to change this distance depending on the thickness of the semiconductor pellet to be bonded, but the value is quantitative. Moreover, the amount of wire sucked into the bonding tool also depended on the degree of finish of the inner surface of the bonding tool hole, the lowering speed of the bonding tool, the bonding trajectory of the bonding tool, etc., and was not quantitative.

そのため、ワイヤーループ形状は一定に保つことが困難
で１つの半導体式レットをボンディングする時、半導体
ベレット面のパッド電極と外部リードとの距離によって
ワイヤーループがたるんだシ突り張ったシするという欠
点があった。Therefore, it is difficult to keep the wire loop shape constant, and when bonding one semiconductor bullet, the wire loop becomes slack or taut depending on the distance between the pad electrode on the semiconductor bullet surface and the external lead. was there.

本発明は、半導体ベレット面のパッド電極と外部リード
との距離が変わっても、適当な安定したループ形状のボ
ンディングが可能なボンディング装置を得ることを目的
としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding device capable of appropriately and stably loop-shaped bonding even if the distance between a pad electrode on a semiconductor pellet surface and an external lead changes.

本発明の％徴は先端にボンディングツールを有するボン
ディングアームと、１個又は複数のワイヤークランパー
と、ワイヤー供給部と、スパーク電極部と、ボンディン
グアーム位置検出部と、各駆動用モーターとを有するボ
ンディングヘッドに、ワイヤーループコントロール機構
を取付けたボンディング装置にある。A feature of the present invention is a bonding arm having a bonding tool at its tip, one or more wire clampers, a wire supply section, a spark electrode section, a bonding arm position detection section, and each drive motor. This is a bonding device with a wire loop control mechanism attached to the head.

次に、本発明を図面を用いて説明する。第１図は、本発
明の一実施例を示す構成図である。パターン認識、又は
作業者による目合せによシ半導体ペレット（第２図の１
４）のマウントズレを考慮した新しいパッド位置を算出
し、さらに各パッド、リード間の距離を算出する。第２
図に示すようにパッド、リード間距離ａが解ると、次式
によシワイヤー長が容易に得られる。Next, the present invention will be explained using the drawings. FIG. 1 is a configuration diagram showing an embodiment of the present invention. Semiconductor pellets (1 in Figure 2) can be identified by pattern recognition or operator alignment.
4) Calculate a new pad position taking into account the mounting misalignment, and further calculate the distance between each pad and lead. Second
As shown in the figure, when the distance a between the pad and the lead is known, the shear wire length can be easily obtained from the following formula.

〈ワイヤー長＞＃　Ｃ＋　ｂ ＝Ｃ＋４百て百］７ ここで　Ｃ：ループ高さ ｄ：ペレット厚 ワイヤー１は、ワイヤー供給部（図示せず）よシワイヤ
ー径路（図示せず）、ワイヤーガイド２゜３ワイヤーカ
ツトクランプ９を通ってボンディングアーム８の先端に
取シ付けられているボンディングツール１１に達する。<Wire length># C+ b = C + 4 100] 7 Where C: Loop height d: Pellet thickness The wire 1 is connected to the wire supply section (not shown), the shear wire path (not shown), and the wire guide 2°. It passes through the three-wire cut clamp 9 and reaches the bonding tool 11 attached to the tip of the bonding arm 8.

ワイヤー１の先端にスパーク電極１０によシボールを形
成後、リニアモーター４，５が駆動され、第１ボンド点
へ向ってボンディングアーム８．ワイヤーカットクラン
プ９がワイヤー１をクランプしたまま同時に下降を始め
る。第一ボンディング後、ボンディングアーム８がルー
プ高さく第２図：ｃ）ｔで上昇するとボンディングアー
ム８は第２ボンド点へ向って移動を始め、これと同時に
ワイヤーカットクランプ９が閉じた１１、下降？始める
。ボンディングアーム８のボンディングツール１１が、
外部リード（第２図の１６）ヘタッチするまでにワイヤ
ー１は、ワイヤー長（ｃ−１−ｄ）だけワイヤーカット
クランプ９によってボンディングツール１１を通って押
し出される。このように、ボンディング中にワイヤー１
を強制的に最適長さだけ押し出すことによシパッド、リ
ード間距離に関らず、安定したワイヤーループが得られ
る。本実施例では、ワイヤーループコントロール機構と
して既設のワイヤーカットクランプ９にリニアーモータ
ー５２位置検出用センサー１３を取付けて実現したが、
ワイヤーカットクランプ９とは全く別に本機材を取シ付
けても構わない。After a spark ball is formed on the tip of the wire 1 by the spark electrode 10, the linear motors 4 and 5 are driven, and the bonding arm 8. The wire cut clamp 9 starts descending simultaneously while clamping the wire 1. After the first bonding, as the bonding arm 8 rises to the loop height at t in FIG. ? start. The bonding tool 11 of the bonding arm 8 is
The wire 1 is pushed through the bonding tool 11 by the wire cutting clamp 9 by the wire length (c-1-d) before touching the external lead (16 in FIG. 2). In this way, wire 1 during bonding
By forcibly extruding the wire to the optimum length, a stable wire loop can be obtained regardless of the distance between the pad and the lead. In this embodiment, the wire loop control mechanism was realized by attaching the sensor 13 for detecting the position of the linear motor 52 to the existing wire cut clamp 9.
This equipment may be attached completely separately from the wire cut clamp 9.

また、本機構の制御は、ワイヤ−カットクランプ９０基
準位置（図示せず）からの位置をセンサー１３により検
知できるので、決められたタイミング時にワイヤーカッ
トクランプ９を動かすようにリニアーモーター５，６へ
流れる電流値を変えるだけで良い。In addition, since the position of the wire-cut clamp 90 from the reference position (not shown) can be detected by the sensor 13, this mechanism is controlled by the linear motors 5 and 6 to move the wire-cut clamp 9 at a predetermined timing. All you have to do is change the flowing current value.

本発明は以上説明したように、ワイヤールー、ブコント
ロール、礪構を取シ付りることによシ、よ多安定しまた
ボンデインク作業の実現が可能となる。As explained above, the present invention provides a more stable bonding work by incorporating wire loops, control, and a structure.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本発明の一実施例を示す斜視図であり、第２
図はボンディングしたワイヤーのループ形状を示す図で
ある。 尚、図において、１・・・・・・ワイヤー、２，３・・
・・・・ワイヤーガイド、４，５．６・・・・・・リニ
アモーター７・・・・・・電磁ソレノイド、８・・・・
・・ボンディングアーム　９・・・・・・ワイヤーカッ
トクランプ、１０・・・・・・スパークロッド、１１・
・・・・・ボンディングツール、１２・・・・・・エン
コーダー、１３・・・・・・セン？−，１４・・・・・
・半導体ペレット、１５・・・・・・電極ノくラド、１
６・・・・・・外部リード、１７・・・・・パワイヤー
ループである。 ｚ　ｌ　図 物　２　図 １５９FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG.
The figure shows the loop shape of the bonded wire. In addition, in the figure, 1... wire, 2, 3...
...Wire guide, 4,5.6...Linear motor 7...Electromagnetic solenoid, 8...
...Bonding arm 9...Wire cut clamp, 10...Spark rod, 11...
...Bonding tool, 12...Encoder, 13...Sen? -, 14...
・Semiconductor pellet, 15...Electrode nokrad, 1
6... External lead, 17... Power wire loop. z l Figure 2 Figure 159

Claims (1)

【特許請求の範囲】[Claims] 先端にボンディングツールを有するボンディングアーム
と、１個又は複数のワイヤークランパーと、ワイヤー供
給部と、スパーク電極部と、ポンディングアーム位買検
出部と、各駆動用モーターとを有するボンディングヘッ
ドに、ワイヤーループコントロール機構を取付けたこと
を特徴とするボンディング装置。A wire is attached to a bonding head having a bonding arm having a bonding tool at the tip, one or more wire clampers, a wire supply section, a spark electrode section, a bonding arm position detection section, and each drive motor. A bonding device characterized by being equipped with a loop control mechanism.
JP57195475A 1982-11-08 1982-11-08 Bonding device Pending JPS5984534A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57195475A JPS5984534A (en) 1982-11-08 1982-11-08 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57195475A JPS5984534A (en) 1982-11-08 1982-11-08 Bonding device

Publications (1)

Publication Number Publication Date
JPS5984534A true JPS5984534A (en) 1984-05-16

Family

ID=16341697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57195475A Pending JPS5984534A (en) 1982-11-08 1982-11-08 Bonding device

Country Status (1)

Country Link
JP (1) JPS5984534A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0425966A1 (en) * 1989-11-02 1991-05-08 Motorola, Inc. Method for controlling wire loop height
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
JPH05291336A (en) * 1992-04-13 1993-11-05 Mitsubishi Electric Corp Wire bonding method and device
EP1187190A1 (en) * 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
EP0425966A1 (en) * 1989-11-02 1991-05-08 Motorola, Inc. Method for controlling wire loop height
EP0425966B1 (en) * 1989-11-02 1994-03-16 Motorola, Inc. Method for controlling wire loop height
JPH05291336A (en) * 1992-04-13 1993-11-05 Mitsubishi Electric Corp Wire bonding method and device
EP1187190A1 (en) * 2000-09-11 2002-03-13 Marconi Communications GmbH Method for monitoring the length of constant-wire-length bonds & apparatus therefor
US6661525B2 (en) 2000-09-11 2003-12-09 Marconi Communications Gmbh Method for monitoring the length of constant-wire-length bonds and apparatus therefor

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