JPH0110929Y2 - - Google Patents

Info

Publication number
JPH0110929Y2
JPH0110929Y2 JP1982104336U JP10433682U JPH0110929Y2 JP H0110929 Y2 JPH0110929 Y2 JP H0110929Y2 JP 1982104336 U JP1982104336 U JP 1982104336U JP 10433682 U JP10433682 U JP 10433682U JP H0110929 Y2 JPH0110929 Y2 JP H0110929Y2
Authority
JP
Japan
Prior art keywords
wire
guide members
capillary
bonding
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982104336U
Other languages
Japanese (ja)
Other versions
JPS599543U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982104336U priority Critical patent/JPS599543U/en
Publication of JPS599543U publication Critical patent/JPS599543U/en
Application granted granted Critical
Publication of JPH0110929Y2 publication Critical patent/JPH0110929Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Unwinding Of Filamentary Materials (AREA)
  • Wire Bonding (AREA)
  • Control Of Stepping Motors (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、ICペレツトとリードの間などにワ
イヤを懸け渡すボンデイング装置のワイヤの繰り
出し量を検出する機構に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a mechanism for detecting the amount of wire fed out of a bonding device that suspends the wire between an IC pellet and a lead.

〔従来の技術〕[Conventional technology]

一般にICチツプのパツドとリードとの間のボ
ンデイングを行うには、ボンデイング装置のボン
デイングアームの先端に設けられたボンデイング
ツール（例えば金線用のボールボンデイング用の
キヤピラリー、或いはアルミニウム線用のステツ
チボンデイング用のウエツジ）にてワイヤを保持
して対象物であるパツド又はリードの表面上にワ
イヤの一部を押しつぶして、熱圧縮により圧着す
るか超音波の作用で溶着せしめることが行われて
いる。 Generally, in order to bond between the pads and leads of an IC chip, a bonding tool (for example, a capillary for ball bonding for gold wire, or a stitch bonding tool for aluminum wire) is installed at the tip of the bonding arm of the bonding device. The wire is held in a conventional wedge (for example, a wedge), a part of the wire is crushed onto the surface of the target pad or lead, and the wire is crimped by thermal compression or welded by the action of ultrasonic waves.

この従来のボンデイング装置の第１図に示すよ
うにホーン１３のある超音波振動子１０がフレー
ム１１上にピン１２により揺動可能に支えられて
いて、ホーン１３の先端にキヤピラリー１が設け
られボンデイングアームの作用も有している。こ
の振動子１０は、その他端はレバー１４を介して
ローラ１５でカム１６と接触するようにバネ１７
により反時計方向のモーメントを受けている。 As shown in FIG. 1 of this conventional bonding apparatus, an ultrasonic transducer 10 with a horn 13 is swingably supported on a frame 11 by a pin 12, and a capillary 1 is provided at the tip of the horn 13 for bonding. It also has the function of an arm. This vibrator 10 has a spring 17 so that the other end is in contact with a cam 16 via a lever 14 and a roller 15.
is receiving a counterclockwise moment.

前記キヤピラリー１の挿入されるワイヤ２は、
モータ５５により駆動されるリール１８に巻込ま
れ、ワイヤ２を握持してカツトするためのクラン
プ１９と、ボールを引き上げてキヤピラリー１の
下端に接触させるためのハーフクランプ２０とで
キヤピラリー１に繰り出し案内するようになつて
いる。またワイヤ２の一端部にボール３（第２
図）を作るためのトーチ２１が、垂直軸２２のま
わりに回動し得るように備えられ、かつ位置検出
装置２３でペレツト４及び各パツド５（第２図）
の標準位置からのズレを検出する。このズレの検
出値に応じてフレーム１１又はペレツト４を水平
面にＸ又はＹ方向に移動せしめてキヤピラリー１
とペレツト４のパツド５との間の相対位置を調整
し整合を行う。 The wire 2 into which the capillary 1 is inserted is
It is wound into a reel 18 driven by a motor 55, and is guided to feed into the capillary 1 by a clamp 19 for grasping and cutting the wire 2, and a half clamp 20 for pulling up the ball and bringing it into contact with the lower end of the capillary 1. I'm starting to do that. Also, a ball 3 (second
A torch 21 for making pellets 4 and each pad 5 (Fig.
Detects the deviation from the standard position. Depending on the detected value of this deviation, the frame 11 or pellet 4 is moved horizontally in the X or Y direction, and the capillary 1
The relative position between the pellet 4 and the pad 5 is adjusted and aligned.

ボンデイングに当たつては、パルスモータなど
によりカム１６を回転せしめその、カム１６の形
状に応じてキヤピラリー１が昇降し、同時にフレ
ーム１１を水平面内に所定の方向に所定の距離を
移動せしめながら、ボンデイング作業を行う。例
えば、第２図に示す如くキヤピラリー１を用い、
ワイヤ２の先端に形成したボール３をICペレツ
ト４のパツド５にボンデイングする場合につき説
明する。６はパツド５と接続すべきリードであ
る。 During bonding, the cam 16 is rotated by a pulse motor or the like, and the capillary 1 is moved up and down according to the shape of the cam 16. At the same time, the frame 11 is moved a predetermined distance in a predetermined direction in a horizontal plane. Perform bonding work. For example, using the capillary 1 as shown in FIG.
The case of bonding the ball 3 formed at the tip of the wire 2 to the pad 5 of the IC pellet 4 will be explained. 6 is a lead to be connected to pad 5.

先ず、フレーム１１をＸ，Ｙ方向に移動せし
め、同図ａの如くパツド５の直上の或る高さにキ
ヤピラリー１を位置せしめる。このときワイヤ２
の先端にはボール３が形成されている。t0はキヤ
ピラリー１の下端７から突出した部分のボール３
の高さである。次にキヤピラリー１を下降せしめ
て同図ｂの如くボール３をパツド５に接触せしめ
る。その後ローラ１５はカム１６から離れるが、
バネ１７の力により、さらにキヤピラリー１を押
し下げてボール３をつぶし、同図ｃの如く偏平部
８を形成する。この押しつぶしと同時に超音波振
動又は加熱を与える。t1は押しつぶし量、t2は偏
平部８の厚さである。この押しつぶし動作により
ワイヤ２をパツド５に固着せしめるに必要な押付
力を与え、また、偏平部８が形成されて電気的接
触に十分な接触面積が確保される。その後キヤピ
ラリー１を上昇及び水平方向にも移動せしめ、同
図ｄの如く、ボンドすべきリード６の上方に位置
せしめ、二点鎖線の如くキヤピラリー１を下降せ
しめて下端７によりワイヤ２の一部を押しつぶ
し、偏平部９を形成して超音波或いは加熱を併用
してリード６に固定せしめ、ワイヤ２を引いて偏
平部９の端から切断し、その後キヤピラリー１を
上昇せしめて一回のボンデイングを終了する。そ
の後ワイヤ２の先端にトーチによりボール３を形
成し、第２図ａの状態に戻り、次のボンデイング
を行う。t0′はワイヤ２の直径、t1′は押しつぶし
量、t2′は偏平部９の厚さである。 First, the frame 11 is moved in the X and Y directions, and the capillary 1 is positioned at a certain height directly above the pad 5, as shown in FIG. At this time wire 2
A ball 3 is formed at the tip. t 0 is the ball 3 that protrudes from the lower end 7 of the capillary 1
It is the height of Next, the capillary 1 is lowered to bring the ball 3 into contact with the pad 5 as shown in FIG. After that, the roller 15 separates from the cam 16, but
The force of the spring 17 further pushes down the capillary 1 and crushes the ball 3, forming a flat portion 8 as shown in FIG. At the same time as this crushing, ultrasonic vibration or heating is applied. t 1 is the amount of crushing, and t 2 is the thickness of the flat portion 8. This squeezing action applies a pressing force necessary to fix the wire 2 to the pad 5, and also forms a flat portion 8 to ensure a sufficient contact area for electrical contact. Thereafter, the capillary 1 is moved upward and horizontally to position it above the lead 6 to be bonded, as shown in FIG. Crush it to form a flat part 9, fix it to the lead 6 using ultrasonic waves or heating, pull the wire 2 and cut it from the end of the flat part 9, and then raise the capillary 1 to complete one bonding. do. Thereafter, a ball 3 is formed at the tip of the wire 2 using a torch, and the state shown in FIG. 2a is returned to for the next bonding. t 0 ' is the diameter of the wire 2, t 1 ' is the amount of compression, and t 2 ' is the thickness of the flat portion 9.

以上の如きキヤピラリーボンデイングのほか、
例えばウエツジボンデイング（Al線に用いられ
る）の場合でも、押付力及び接触面積を得るため
にワイヤ２の一部の押しつぶしを行う。 In addition to the above capillary bonding,
For example, even in the case of wedge bonding (used for Al wire), part of the wire 2 is crushed in order to obtain pressing force and contact area.

〔考案が解決しようとする課題〕[The problem that the idea aims to solve]

従来、このようなボンデイング工程において、
モータ５５によるワイヤ２の繰り出しが多すぎた
場合、ワイヤ２がたるんでボンデイング作業に支
障を来すことがあつた。形成する前の状態ではク
ランプ１９によりワイヤ２をクランプするので抜
けることはない。しかしながらボール３が形成さ
れなかつたり、小寸法であつたりまた、クランプ
１９のクランプ力が不十分であつたりするとワイ
ヤが供給されず、不良品を生ずる支障を招くこと
があつた。 Conventionally, in such a bonding process,
If the wire 2 is fed out too much by the motor 55, the wire 2 may become slack, which may interfere with the bonding work. Since the wire 2 is clamped by the clamp 19 before being formed, it will not come off. However, if the ball 3 is not formed or has a small size, or if the clamping force of the clamp 19 is insufficient, the wire may not be fed, resulting in problems such as defective products.

このため、ワイヤ２のたるみをノズルからのエ
アで検出することでワイヤ繰り出しモータを制御
することが特開昭51−29868号公報及び特開昭55
−72049号公報に提案されているが、いずれも検
出手段に光学系や接触片センサーによつて行われ
るが、この検出にはポジシヨンの僅かな差によつ
て検出されないこともあつて不安定でバラツキが
あつて信頼性の上で問題がまだあつた。 For this reason, Japanese Patent Application Laid-Open No. 51-29868 and Japanese Patent Application Laid-Open No. 55-1981 disclose that the wire feeding motor is controlled by detecting the slack of the wire 2 using air from a nozzle.
-Proposed in Publication No. 72049, both use an optical system or a contact piece sensor as a detection means, but this detection is unstable as it may not be detected due to slight differences in position. There were still problems with reliability due to variations.

本考案は、従来のものの上記の欠点を除き、ワ
イヤのたるみを確実に検出することによりワイヤ
の繰り出し過ぎをバラツキなく検出して、運転を
停止して対策を施し、不具合な作業を防止し不良
品の発生を未然に防止するボンデイング装置のワ
イヤ繰り出し量検出機構を提供することを目的と
するものである。 The present invention eliminates the above-mentioned drawbacks of the conventional method, and by reliably detecting slack in the wire, over-feeding of the wire is detected without any variation, and the operation is stopped and countermeasures are taken to prevent defective work. It is an object of the present invention to provide a wire feed-out amount detection mechanism for a bonding device that prevents the occurrence of non-defective products.

〔課題を解決するための手段〕[Means to solve the problem]

本考案は、ボンデイング装置のモータ駆動のワ
イヤリール１８からキヤピラリー１までの間のワ
イヤ２の径路に沿つてワイヤ２が接触する２個の
導電性ガイド部材３２，３３を互に所定の間隔だ
け離して設け、該２個のガイド部材３２，３３の
間でワイヤ２の径路よりも外れた位置に導電性接
触片３４，３５を一対間隔をあけて設け、前記２
個のガイド部材３２，３３の間に張られたワイヤ
２に接触片３４，３５側に向けて空気を吹き付け
るノズル３６と、前記２個のガイド部材３２，３
３の何れか一方と一対の前記接触片３４，３５と
の間の導通を検出する導通検出機構をそれぞれ備
えたことを特徴とするボンデイング装置のワイヤ
繰り出し量検出機構である。 In the present invention, two conductive guide members 32 and 33 with which the wire 2 contacts along the path of the wire 2 from the motor-driven wire reel 18 of the bonding apparatus to the capillary 1 are separated from each other by a predetermined distance. A pair of conductive contact pieces 34, 35 are provided at a distance between the two guide members 32, 33 from the path of the wire 2,
a nozzle 36 that blows air toward the contact pieces 34 and 35 on the wire 2 stretched between the two guide members 32 and 33;
3 and the pair of contact pieces 34, 35, respectively.

〔実施例〕〔Example〕

本考案を実施例につき図面を用いて説明すれ
ば、第３図において、振動子１０及びホーン１３
にて形成されるボンデイングアームはレバー１４
に保持されて支承フレームであるフレーム１１に
対し、ピン１２のまわりに回動可能に支えられ、
その先端にボンデイングツールであるキヤピラリ
ー１を備えている。前記レバー１４の端部はロー
ラ１５が設けられ、パルスモータ又はエンコーダ
を用いたモータ（図示せず）などにより駆動され
るカム１６に接触従動するように配置してボンデ
イングアームの先のキヤピラリー１を昇降せしめ
るようになつている。 To explain the present invention with reference to the drawings, an embodiment of the present invention will be described. In FIG. 3, a vibrator 10 and a horn 13 are shown.
The bonding arm formed by lever 14
It is supported rotatably around a pin 12 with respect to a frame 11 which is a support frame and is held in
A capillary 1, which is a bonding tool, is provided at its tip. A roller 15 is provided at the end of the lever 14, and is arranged so as to contact and follow a cam 16 driven by a pulse motor or a motor using an encoder (not shown), so as to connect the capillary 1 at the end of the bonding arm. It is designed to be raised and lowered.

このワイヤ２の一端にボール３を作るためにト
ーチ２１が垂直軸２２のまわりに回動しうるよう
に備えられ、かつ位置検出装置２３を支持フレー
ム２４に備えてあり、該支持フレーム２４に固定
されたブラケツト２５には、調節ネジ２６、ムー
ビングコイル２７が取付けられている。この調節
ネジ２６は、キヤピラリー１の最低位置を調節し
設定するストツパーであり、またムービングコイ
ル２７に対応して、レバー１４に鋼などの強磁性
体で作られた挿入体２８が設けられ、ムービング
コイル２７の中に一部挿入された状態で組合され
ている。ムービングコイル２７は、電圧が印加さ
れると挿入体２８を介してレバー１４を反時計方
向に回転せしめようとするモーメントを与えてい
る。即ち、キヤピラリー１を常に下に向けて押付
ける向きの力を与えている。カム１６とローラ１
５が接触している間はその相互押付力をムービン
グコイル２７にて与え、カム１６とローラ１５と
が離れているときには、ボール３（第２図）をつ
ぶす押付力をムービングコイル２７にて与えてい
る。ムービングコイル２７は、このようにしてボ
ンデイングアームと支承フレームとの間の相対的
な回転を拘束する力を与えており、かつ、この拘
束力は印加電圧を変えることによつて任意の時点
で任意の大きさに調節することができる。従つて
高速上昇又は高速降下時は強い拘束力を与えてハ
ンテイングなどを防止して速応性があり安定した
作業を行い、ボール３を押しつぶす際には適度な
押付力となして良好なボンデイング作業を行うこ
とができる。 A torch 21 is provided at one end of the wire 2 so as to be able to rotate around a vertical axis 22 in order to form a ball 3, and a position detection device 23 is provided on a support frame 24 and is fixed to the support frame 24. An adjustment screw 26 and a moving coil 27 are attached to the bracket 25. This adjustment screw 26 is a stopper for adjusting and setting the lowest position of the capillary 1. In addition, an insert body 28 made of a ferromagnetic material such as steel is provided on the lever 14 in correspondence with the moving coil 27. It is assembled with a portion inserted into the coil 27. Moving coil 27 provides a moment through insert 28 that tends to rotate lever 14 counterclockwise when voltage is applied. In other words, a force is applied that always pushes the capillary 1 downward. Cam 16 and roller 1
While the cam 16 and the roller 15 are in contact, the moving coil 27 applies a mutual pressing force, and when the cam 16 and the roller 15 are apart, the moving coil 27 applies a pressing force that crushes the ball 3 (Fig. 2). ing. The moving coil 27 thus provides a force that restrains the relative rotation between the bonding arm and the support frame, and this restraining force can be changed at any time by changing the applied voltage. The size can be adjusted. Therefore, when ascending or descending at high speed, a strong restraining force is applied to prevent hunting and the like to ensure quick response and stable work, and when crushing the ball 3, an appropriate pressing force is applied to ensure good bonding work. It can be carried out.

第２図ａの如き状態からボール３が下降して同
図ｂの如くボール３がペレツト４上のパツド５に
タツチしたあとも、カム１６は回転して半径が一
層減少するが、キヤピラリー１の下降は一時停止
するのでローラ１５はカム１６から離れる。従つ
てカム１６とローラ１５との接触を導通などによ
り検出するタツチセンサ回路を備え、ボール３が
パツド５にタツチしたことを検出する。 Even after the ball 3 descends from the state shown in FIG. 2a and touches the pad 5 on the pellet 4 as shown in FIG. Since the lowering is temporarily stopped, the roller 15 separates from the cam 16. Therefore, a touch sensor circuit is provided which detects the contact between the cam 16 and the roller 15 by conduction or the like, and detects when the ball 3 touches the pad 5.

２９，３０はカムでそれぞれクランプ１９、ハ
ーフクランプ２０を操作するものであり、それぞ
れパルスモータ（図示せず）で駆動され、ガイド
部材３１で案内されるワイヤ２を前記キヤピラリ
ー１に繰り出し誘導できるようにしてある。 Cams 29 and 30 operate the clamp 19 and the half clamp 20, respectively, and are driven by pulse motors (not shown) so that the wire 2 guided by the guide member 31 can be fed out and guided to the capillary 1. It is set as.

また導電性ガイド部材３２，３３を互に所定間
隔離して設け、この２個のガイド部材３２，３３
の間でワイヤ２の径路よりも外れた位置に導電性
接触片３４，３５を一対間隔をあけて設け、前記
ガイド部材３２，３３の間に張られたワイヤ２に
接触片３４，３５側に向けて空気を吹き付けるノ
ズル３６によりワイヤの繰り出し量検出機構が形
成されている。ワイヤ２は、リール１８からモー
タ５５により繰り出されるが、繰り出し量が多過
ぎる場合、ノズル３６から噴射される空気でガイ
ド部材３２，３３の間のワイヤがたるんで接触片
３４，３５の何れかに接触する。この接触片３４
又は３５は、公知の導通検出機構により他の接触
棒、或いはガイド部材３２，３３の何れかと導通
があると信号を発し、たるみを検出し、モータ５
５によるワイヤの繰り出し量の多すぎることを検
知しモータ５５を止め又は減速するようになつて
いて、繰り出し量検出の信号によりボンデイング
動作は停止し不良品の発生を未然に防止すること
ができる。 Further, conductive guide members 32 and 33 are provided separated from each other by a predetermined distance, and these two guide members 32 and 33 are separated from each other by a predetermined distance.
A pair of conductive contact pieces 34, 35 are provided at a distance from the path of the wire 2 between the guide members 32, 33. The nozzle 36 that blows air toward the wire forms a wire payout amount detection mechanism. The wire 2 is unwound from the reel 18 by the motor 55, but if the unwound amount is too large, the wire between the guide members 32 and 33 will become slack due to the air jetted from the nozzle 36, causing the wire to sag on either of the contact pieces 34 or 35. Contact. This contact piece 34
Or 35 uses a known continuity detection mechanism to issue a signal when there is continuity with another contact rod or with any of the guide members 32 and 33, detects slack, and connects the motor 5.
The motor 55 is stopped or decelerated when it is detected that the amount of wire being fed out is too large, and the bonding operation is stopped in response to a signal from the amount of wire being fed out, thereby preventing the occurrence of defective products.

〔考案の効果〕[Effect of idea]

本考案は、ワイヤが接触する２個の導電性ガイ
ド部材を互に所定の間隔だけ離して設け、該２個
のガイド部材の間でワイヤの径路よりも外れた位
置に導電性接触片を一対間隔をあけて設け、前記
２個のガイド部材の間に張られたワイヤに接触片
側に向けて空気を吹き付けるノズルと、前記２個
のガイド部材の何れか一方と一対の前記接触片と
の間の導通を検出する導通検出機構をそれぞれ備
えたことにより、ワイヤのたるみを適確に検出
し、たるみ方向や、たるみ量の差によるバラツキ
に対しても検出確率を大きくすることが可能で安
全にワイヤの繰り出し量を検出し、繰り出しすぎ
を未然に防止し、ワイヤリールの繰り出しの制御
を安定して行い、不良品の発生を未然に防止する
ことができ実用上極めて大なる効果を奏する。 In the present invention, two conductive guide members with which the wire comes into contact are provided at a predetermined distance from each other, and a pair of conductive contact pieces is placed between the two guide members at a position away from the path of the wire. between a nozzle that is provided at an interval and blows air toward one side of the wire stretched between the two guide members; and one of the two guide members and the pair of contact pieces. By equipping each wire with a continuity detection mechanism that detects continuity, it is possible to accurately detect slack in the wire, and increase the detection probability even with variations due to differences in the direction of slack and the amount of slack, making it possible to safely detect wire slack. It is possible to detect the amount of wire being fed out, to prevent excessive feeding, to stably control the feeding of the wire reel, and to prevent the occurrence of defective products, which is extremely effective in practice.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のボンデイング装置の正面図、第
２図ａ，ｂ，ｃ，ｄはボンデイングの工程説明
図、第３図は本考案の実施例の正面図である。 １……キヤピラリー、２……ワイヤ、３……ボ
ール、４……ペレツト、５……パツド、６……リ
ード、７……下端、８，９……偏平部、１０……
振動子、１１……フレーム、１２……ピン、１３
……ホーン、１４……レバー、１５……ローラ、
１６……カム、１７……バネ、１８……リール、
１９……クランプ、２０……ハーフクランプ、２
１……トーチ、２２……垂直軸、２３……位置検
出装置、２４……支持フレーム、２５……ブラケ
ツト、２６……調節ネジ、２７……ムービングコ
イル、２８……挿入体、２９，３０……カム、３
１，３２，３３……ガイド部材、３４，３５……
接触片、３６……ノズル、５５……モータ。 FIG. 1 is a front view of a conventional bonding apparatus, FIGS. 2a, b, c, and d are explanatory diagrams of bonding steps, and FIG. 3 is a front view of an embodiment of the present invention. 1... Capillary, 2... Wire, 3... Ball, 4... Pellet, 5... Pad, 6... Lead, 7... Lower end, 8, 9... Flat part, 10...
Vibrator, 11... Frame, 12... Pin, 13
...Horn, 14...Lever, 15...Roller,
16...Cam, 17...Spring, 18...Reel,
19...Clamp, 20...Half clamp, 2
DESCRIPTION OF SYMBOLS 1... Torch, 22... Vertical axis, 23... Position detection device, 24... Support frame, 25... Bracket, 26... Adjustment screw, 27... Moving coil, 28... Insert, 29, 30 ...Cam, 3
1, 32, 33... Guide member, 34, 35...
Contact piece, 36... nozzle, 55... motor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ボンデイング装置のモータ駆動のワイヤリール
１８からキヤピラリー１までの間のワイヤ２の径
路に沿つてワイヤ２が接触する２個の導電性ガイ
ド部材３２，３３を互に所定の間隔だけ離して設
け、該２個のガイド部材３２，３３の間でワイヤ
２の径路よりも外れた位置に導電性接触片３４，
３５を一対間隔をあけて設け、前記２個のガイド
部材３２，３３の間に張られたワイヤ２に接触片
３４，３５側に向けて空気を吹き付けるノズル３
６と、前記２個のガイド部材３２，３３の何れか
一方と一対の前記接触片３４，３５との間の導通
を検出する導通検出機構をそれぞれ備えたことを
特徴とするボンデイング装置のワイヤ繰り出し量
検出機構。 Along the path of the wire 2 from the motor-driven wire reel 18 of the bonding device to the capillary 1, two conductive guide members 32 and 33 with which the wire 2 comes into contact are provided at a predetermined distance from each other. A conductive contact piece 34 is placed between the two guide members 32 and 33 at a position away from the path of the wire 2.
A pair of nozzles 3 are provided with a pair of nozzles 35 spaced apart from each other and blow air toward the contact pieces 34 and 35 onto the wire 2 stretched between the two guide members 32 and 33.
6, and a wire feeding device for a bonding device, each comprising a continuity detection mechanism for detecting continuity between one of the two guide members 32, 33 and the pair of contact pieces 34, 35. Amount detection mechanism.
JP1982104336U 1982-07-12 1982-07-12 Wire feeding amount detection mechanism of bonding equipment Granted JPS599543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982104336U JPS599543U (en) 1982-07-12 1982-07-12 Wire feeding amount detection mechanism of bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982104336U JPS599543U (en) 1982-07-12 1982-07-12 Wire feeding amount detection mechanism of bonding equipment

Publications (2)

Publication Number Publication Date
JPS599543U JPS599543U (en) 1984-01-21
JPH0110929Y2 true JPH0110929Y2 (en) 1989-03-29

Family

ID=30245032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982104336U Granted JPS599543U (en) 1982-07-12 1982-07-12 Wire feeding amount detection mechanism of bonding equipment

Country Status (1)

Country Link
JP (1) JPS599543U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129868A (en) * 1974-09-06 1976-03-13 Hitachi Ltd
JPS5572049A (en) * 1978-11-27 1980-05-30 Nec Corp Wire bonding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129868A (en) * 1974-09-06 1976-03-13 Hitachi Ltd
JPS5572049A (en) * 1978-11-27 1980-05-30 Nec Corp Wire bonding device

Also Published As

Publication number Publication date
JPS599543U (en) 1984-01-21

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