JPS59169765A - Manufacture of grindstone for cutting process - Google Patents

Abstract

PURPOSE:To reduce production of cutouts in a hard brittle material, by a method wherein grinding grain, such as diamond, boron nitride, is metal-bonded on a base metal, and ink, which is prepared such that grinding grain is mixed with resin, solvent, and a plasticizer, is printed and baked on the surface thereof. CONSTITUTION:A sintered grindstone 1 is formed such that grinding grain, such as diamond, cubic boron nitride, is metal-bonded on a base metal by a sintering or an electrodeposition method. After the surface of the sintered grindstone 1 is cleansed and activated, ink 2, prepared such that 30g an acetate acid-vinyl chloride copolymer, 100cc nitrobenzene, 50cc ethyl acetate, 25g a plasticizer, 50g diamond (or cubic boron nitride) powder, etc. are kneaded, is screen-printed in place and in a given thickness for baking. Thisa grinding effect peculia to resin bond to prevent production of cutouts in the surface of a hard brittle material, and allows a remarkably wearing edge part to maintain the life of the grindstone by means of a metal bond.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a grindstone for cutting hard and brittle materials such as ferrite, ceramics, and crystal.

Conventional configuration and its problems Diamond is generally used as a grindstone for cutting.

Sintered whetstones and electroplated whetstones in which abrasive grains such as cubic boron nitride are metal-bonded with nickel, copper, etc. are often used. While it certainly has good grinding performance and processing efficiency, and a long service life for the two-wheel grinding wheel, it does tend to generate scratches on the surface of hard and brittle materials when cutting, so polishing to remove surface scratches is required in the post-process. I need.

A resin grindstone is made by kneading phenol or polyimide resin with abrasive grains such as diamond or cubic boron nitride, and then heat-curing the mixture into a predetermined shape. Although this grindstone is characterized by a high polishing effect, it is not heat resistant and has a very short lifespan, making it unsuitable for use as a cutting wheel.

Purpose of the Invention The present invention provides a method for manufacturing a grindstone that reduces the scratches that conventionally occur on the surface of hard and brittle materials during cutting, and that eliminates the need for post-processing such as polishing to remove the scratches, allowing high-precision cutting. It provides:

Structure of the Invention The method for manufacturing a cutting whetstone according to the present invention is to apply an ink prepared by kneading abrasive grains such as diamond, cubic boron nitride, etc. with a resin, a solvent, and a plasticizer on a part of the surface of a sintered whetstone or an electroplated whetstone. It is printed to a predetermined thickness by screen printing and baked to form a whetstone.It has three pages. That is, by resin-bonding a part of the metal-bonded grindstone surface, the polishing effect unique to resin bonding is exerted to prevent the occurrence of scratches on the surface of the hard and brittle material. In addition, only the tip of the grinding wheel, which is severely worn, is left in the state of metal bond, making the life of the grinding wheel similar to that of conventional metal bond.

Description of examples Example 1 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a normal sintered grindstone 1. After cleaning and activating the surface of this sintered whetstone, it was screen printed to a predetermined thickness at a predetermined location with an ink mixed with diamond abrasive grains, resin, solvent, and plasticizer as shown below, and then baked. .

Composition of Ink JP-A-59-169765 (2) FIG. 2 is a cross-sectional view of the grindstone of Example 1, showing that the ink 2 containing abrasive grains was printed on the sintered grindstone 1.

Example 2 First, a stainless steel plate with a thickness of 0.16 mm was processed into a circular shape using the usual photoetching method to avoid warping or cracking, and after performing electrolytic degreasing, pickling, etc., it was coated in the following nickel chloride plating bath. Undercoat plating was performed.

Immediately after washing with running water, eutectoid plating of diamond and nickel was performed in an electroless nickel plating bath in which diamond abrasive grains described below were dispersed.

Further, eutectoid plating of diamond abrasive grains and nickel was performed in the electrolytic nickel plating bath shown below.

After the above-mentioned plating was thoroughly washed with water and dried, screen printing was performed at a predetermined location to a predetermined thickness using the ink shown in the following 6 pages, and baking was performed.

Composition of ink Figure 3 is a cross-sectional view of the grinding wheel of Example 2, and the stainless steel base metal 3.
Electroless nickel eutectoid plating 4. Electrolytic nickel eutectoid plating 5. Furthermore, it is shown that the ink 6 includes abrasive grains.

Abrasive grains such as cubic boron nitride other than the diamond shown in the examples can be used in the same manner, and printing inks kneaded with resins such as phenol, epoxy, and polyimide can also be used.

Effects of the Invention According to the grinding wheel of the present invention, no scratches are generated on the surface of the hard brittle material during cutting, so there is no need for a polishing process to remove the scratches after cutting, and material loss can be reduced. It is possible.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a conventional sintered whetstone, FIG. 2 is a cross-sectional view of a whetstone obtained by a method according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a whetstone obtained by another embodiment of the present invention. It is. 1...Sintered whetstone, 2...Ink. Name of agent Patent attorney Toshio Nakao and 1 other person 1 Terakachi U39-IG97G5 (3) Figure 1 Figure 2? Figure 3 363-

Claims (1)

[Claims] Abrasive grains such as diamond or cubic boron nitride are metal-plated onto the base metal by sintering or electrodeposition, and a portion of this surface is coated with abrasive grains such as diamond or cubic boron nitride, resin, solvent, or plasticizer. A method for manufacturing a grindstone for cutting by printing and baking ink mixed with a chemical agent.