JPS5831547A - Bonding device - Google Patents
Bonding deviceInfo
- Publication number
- JPS5831547A JPS5831547A JP56129762A JP12976281A JPS5831547A JP S5831547 A JPS5831547 A JP S5831547A JP 56129762 A JP56129762 A JP 56129762A JP 12976281 A JP12976281 A JP 12976281A JP S5831547 A JPS5831547 A JP S5831547A
- Authority
- JP
- Japan
- Prior art keywords
- coil
- capillary
- bonding
- wire
- flowed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/78822—Rotational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
仁の発−は午ヤビクリを設けた揺動アームを駆動する駆
動機構を改嵐したfyディング装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fyding device in which a drive mechanism for driving a swinging arm provided with a shaft is modified.
半導体装置の組立工1において、ペレッFとリードフレ
ームとをワイヤによりて接続する手段としてがンデイン
ダ装置が用いられている。In a semiconductor device assembly worker 1, an indinder device is used as a means for connecting a pellet F and a lead frame using wires.
F−0−ンデインダ装置紘、第1図で示すように、サー
Iモータ宜た紘Δルス毫−夕などのモータ1(Dii1
転力をペルシ1を介してカム1に伝達し、このカムJO
回転をカム7−74によって揺動アーム1を揺動する往
復運動に変換すゐようになりている。また、ζや揺動ア
ームjKはキャビツリアーム#が設けられ、このキャピ
ラリアームdの先端Oキャビツリrに導入し九ワイヤ1
をペレットおよびリードフレーム(いずれも図示せず)
の所定箇所に一ンデイングするようになっている。As shown in FIG.
The rolling force is transmitted to the cam 1 via the persi 1, and this cam JO
The rotation is converted into reciprocating motion for swinging the swinging arm 1 by the cams 7-74. In addition, ζ and the swinging arm jK are provided with a cavity arm #, which is introduced into the tip O cavity r of this capillary arm d, and the nine wires 1
pellet and lead frame (both not shown)
It is designed to be fixed at a predetermined location.
しかしながら、上述のように、カムSによって揺動アー
ム1を揺動するようにしたものは、カムの形状によりて
キャビツリ1のリフト高さが決りてしまい、リフト高さ
を賓える場合にはカム3を再設計、製作しなおさなけれ
ばならないため非常に不便である。また、モータの回転
をベルト1およびカム1を介して往復運動に変換してい
るため、構造的に複雑で、小形化が困難である7゜ζO
発*a上記事情に着目して1に一?5れたもので、そO
@的とするとζろは、リニヤ峰−夕によって揺動アーム
を駆動し、かヤビラリのリフト高さ、Iンデインダ曲線
が適宜変更することがで自る一ンデインダ装置を提供し
ようとすゐ亀のである。However, as mentioned above, in the case where the swing arm 1 is caused to swing by the cam S, the lift height of the cavity 1 is determined by the shape of the cam, and when the lift height can be adjusted, the cam This is extremely inconvenient as it would require redesigning and remanufacturing 3. In addition, since the rotation of the motor is converted into reciprocating motion via the belt 1 and cam 1, it is structurally complex and difficult to downsize.
From *a Focusing on the above circumstances, is it 1 to 1? 5, so O
As a target, ζro is trying to provide a self-inverter device by driving a swinging arm by a linear peak and changing the lift height of the curve and the index curve as appropriate. be.
以下、この発明を図画に示す一実施例にもとづいて1l
tIjiする。嬉3図中11はリニヤ峰−タで、これは
l−り12内に設は九永久磁石13、鉄心(中央極)1
4および可動コイル1gとから構成されている。そして
、こOvエヤモータ11は永久磁石11t)磁力と可動
コイル15に流れ九と亀に生じる磁力とによりて可動コ
イル11を矢印方向?Ic11復這動で龜るようになう
ている。ζ09エヤ篭′−タ11ows−り12はフレ
ーム1#に固定されているとと4に、可動コイル15は
支軸1rを中心として揺動自在な揺動アーム18□一端
部と連結されている。ζO揺動アーム18の他端部には
キャビツリアーム1gが集設され、この先端部IIc紘
ワイヤ20を挿通するキャビシリ21が設けられている
。を九、リニヤモータ11は上記中ヤCツリの位置を検
出するえとえば光電式の位置検出−およびキャピラリ速
度を検出する速度検出器からの出力信号を情報地層装置
によ0てデータ処理し、そO指令信号によって制御され
るようになってお〕、リニヤモータJJO可動コイル1
5に流れる電流量によってそのストロークを可変できる
ようになりている。すなわち、上記リニヤ篭−夕11の
推力yは次式で表わされ、
FWilNIA
良だし 1:磁束轡度
N::1イル巻数
I:コイルに流す電流
t:コイルの円周長
上記電流が流れる時間を制御することによシ、そのスト
ロークを調整するようになりている。Hereinafter, based on one embodiment of this invention shown in drawings, 1l.
tIji. Number 11 in Figure 3 is the linear peak, which has 9 permanent magnets 13 and 1 iron core (center pole) installed in l-ri 12.
4 and a moving coil 1g. The air motor 11 moves the moving coil 11 in the direction of the arrow by the magnetic force of the permanent magnet 11t) and the magnetic force generated in the moving coil 15 and the tortoise. Ic11's return movement seems to be slowing it down. The ζ09 air basket 11ows 12 is fixed to the frame 1#, and the movable coil 15 is connected to one end of a swinging arm 18□ that can swing freely around the support shaft 1r. . A cavity arm 1g is assembled at the other end of the ζO swing arm 18, and a cavity 21 through which the hollow wire 20 is inserted is provided at the tip end of the cavity arm 1g. 9. The linear motor 11 processes the output signals from, for example, a photoelectric position detection device for detecting the position of the above-mentioned medium cylindrical tree and a speed detector for detecting the capillary velocity, by using an information layer device. The linear motor JJO moving coil 1 is controlled by the O command signal.
The stroke can be varied depending on the amount of current flowing through 5. That is, the thrust force y of the linear cage 11 is expressed by the following formula: By controlling the time, you are supposed to adjust the stroke.
しかして、リニヤ毫−夕11の永久磁石13によりて吸
着され九揺動アー五18はほぼ水平状態に保九れ、キャ
♂ツリ21祉上位置にある。As a result, the nine oscillating arms 18 are attracted by the permanent magnets 13 of the linear gear 11 and are kept in a substantially horizontal state, and the cat 21 is in a convenient position.
この状態で、上記キャーラ921に挿通されえワイヤ2
#O下端部にトーチなどKよりて一−ル2−aを構成し
たのち、リュヤ量−タ11の可動冨イルJJK電瓢願方
向電(転)を流すと、可動コイル15はヨーク12から
央出し、揺動アーム11は支軸11を中心として反時計
方向に回動する。したがりて、キャビツ911杜第3図
で示すように下降し、ワイヤ10のI−ル211をペレ
ットzxyczンデイングする。ペレット22に対する
ワイヤ1−の−ンデインダが完了すると、つぎに可動コ
イルjJK逆方向の電流を流て、キャビシリ21を上昇
させ、再び可動;イル1sycH方向の電流を流すと下
降してワイヤ20をリードフレーム21にfンデイング
する。このようにしてペレット2jとリードフレーム2
3とがワイヤ20にようて結線されると、−ンデイング
工程の1サイクルが完了し、j4Dサイクルを繰返すこ
とによp−ンディンダ作業を連続的に行なうむとかで亀
る・を九、揺動アームJaorjA動範囲すなわちキャ
ーラリ21の9アシ高さおよび移動速度は、キャCうν
110位置を検出する位置検出器およびキャーツリ速度
を検出する速度検出!!にようて検出するヒとができ、
この検出信号を情報鶏雇装置によってデータ処理し、そ
の指令信号によってリニヤモータJJO可動=イルJJ
K流す電流量を調節することによ〉任意に制御すること
かで11ゐ。In this state, the wire 2 is inserted through the carrier 921.
After configuring the coil 2-a with a torch or the like at the lower end of #O, when an electric current is applied to the movable coil 11 of the yoke 11, the movable coil 15 is moved from the yoke 12. Centering, the swinging arm 11 rotates counterclockwise around the support shaft 11. Therefore, the cab 911 descends as shown in FIG. 3 and pelletizes the I-rule 211 of the wire 10. When the winding of the wire 1- to the pellet 22 is completed, a current is passed in the opposite direction to the movable coil jJK to raise the cavity 21 and move it again; fnding to frame 21. In this way, pellet 2j and lead frame 2
3 is connected with the wire 20, one cycle of the -nding process is completed, and by repeating the j4D cycle, the p-ndinda work is performed continuously. The range of movement of the arm JaorjA, that is, the height and moving speed of the 9-legged carriage 21 are as follows:
A position detector that detects 110 positions and a speed detector that detects the moving speed! ! A person can detect it according to
This detection signal is data-processed by the information controller, and the command signal moves the linear motor JJ.
It can be controlled arbitrarily by adjusting the amount of current flowing through K.
ζO!!明は以上説明したように、キャビシリを昇降す
る揺動アームをリニヤモータによりて駆動するようにし
九から、リニヤモータの可動コイルEllす電流を制御
すゐことによυキャビツリのリフト高さ、昇降適度を適
宜変更することができる。しか龜、従来Oカムおよびカ
ムフロアにより、て揺動アームを揺動すゐものに比べ、
構造的に簡単であるという効果もある。ζO! ! As explained above, the swinging arm that raises and lowers the cavity is driven by a linear motor, and the current flowing through the moving coil of the linear motor is controlled to control the lift height and degree of elevation of the cavity. It can be changed as appropriate. However, compared to the conventional O-cam and cam floor that swing the swing arm,
Another advantage is that it is structurally simple.
trswio筒単ttui
第1図は従来O&ンデインダ装置を示す儒画図、第3図
はこの発明の一実施例を示す側面−1第3図紘同じく今
ヤーツリのIンデイングー線図であみ。trswio cylinder unit ttui Figure 1 is a Confucian drawing showing a conventional O&N deinder device, and Fig. 3 is a side view showing an embodiment of the present invention.
11−リニヤモータ、18・−・揺動アーム、2Q−ワ
イヤ、21・−キャピラリ。11-linear motor, 18--swing arm, 2Q--wire, 21--capillary.
出願人代理人 弁運士 鈴 江 武 彦。Applicant's agent: Benunshi Suzue Takehiko.
第1図 ル 第3図 第1頁の続き 0発 明 者 加島規安 究所内Figure 1 le Figure 3 Continuation of page 1 0 shots Akiyasu Kashima Inside the laboratory
Claims (1)
リを揺動アームによりて揺動畜せてワイヤをIンデイン
ダするものにおいて、上記揺動アームをリニヤモータに
よりて駆動するようにしたことを特徴とするがンディン
r装置。A wire is introduced into a cavity and the cavity is swung by a swiveling arm to indinder the wire, characterized in that the swiveling arm is driven by a linear motor. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56129762A JPS5831547A (en) | 1981-08-19 | 1981-08-19 | Bonding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56129762A JPS5831547A (en) | 1981-08-19 | 1981-08-19 | Bonding device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5831547A true JPS5831547A (en) | 1983-02-24 |
Family
ID=15017567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56129762A Pending JPS5831547A (en) | 1981-08-19 | 1981-08-19 | Bonding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5831547A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5060841A (en) * | 1985-12-25 | 1991-10-29 | Hitachi, Ltd. | wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus |
-
1981
- 1981-08-19 JP JP56129762A patent/JPS5831547A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5060841A (en) * | 1985-12-25 | 1991-10-29 | Hitachi, Ltd. | wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus |
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