JPS58103148A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS58103148A
JPS58103148A JP56202814A JP20281481A JPS58103148A JP S58103148 A JPS58103148 A JP S58103148A JP 56202814 A JP56202814 A JP 56202814A JP 20281481 A JP20281481 A JP 20281481A JP S58103148 A JPS58103148 A JP S58103148A
Authority
JP
Japan
Prior art keywords
arm
capillary
position detector
detects
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56202814A
Other languages
Japanese (ja)
Other versions
JPS6410093B2 (en
Inventor
Masayoshi Yamaguchi
政義 山口
Toshiro Tsuruta
鶴田　寿郎
Nobushi Suzuki
鈴木　悦四
Sumio Nagashima
永島　純雄
Koichi Chiba
宏一 千葉
Noriyasu Kashima
規安 加島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56202814A priority Critical patent/JPS58103148A/en
Publication of JPS58103148A publication Critical patent/JPS58103148A/en
Publication of JPS6410093B2 publication Critical patent/JPS6410093B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain the wire bonding device enable to detect adequacy and inclination of a capillary arm, and moreover enabled to attain formation of the device in a small type by a method wherein a position detector is provided on the base board edge side of an oscillation arm. CONSTITUTION:When a current is made to flow in a moving coil 24, the oscillating arm 13 oscillates making a supporting axis 12 as the axial center, the capillary arm 17 fixed thereto oscillates simultaneously, and presses by pressure the tip of a gold wire 14 inserted through a capillary 16 to the bonding pad of a semiconductor pellet 29 to perform bonding. At this time, a bracket 26 moves vertically according to an oscillation of the oscillating arm 13, and the stroke thereof is detected by the position detector 27. Accordingly, the position detector 27 detects the position of the capillary 16, while detects moderation by converting output thereof by a differential circuit. Because the dislocation quantity can be enlarged by enlarging the distance L between the supporting axis 12 and the position detector 27, and nearly linear dislocation can be obtained by structure thereof like this, high precision of detection can be obtained.

Description

【発明の詳細な説明】 発明の技術分野 この発明は半導体ｓＩ＆丸とえはＬｌｉｌ等の＾精度部
品ＯＪｉ立工程に訃けるワイヤーンディンダ装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a wire-and-dinder device that can be used in the OJI assembly process of precision parts such as semiconductor SI and Llil.

発明の技術的背景 半導体部品の組立においては、半導体ペレ。Technical background of the invention Semiconductor Pelle is used in the assembly of semiconductor parts.

トとリードフレームとを電気的に接続するためのワイヤ
ーンディンダが行なわれる。このワイヤＩンディ／ダに
用いられる装置には、従来、種々の構造のものがあるが
、揺動アームの揺動連層および揺動角度を検出できる機
能を備え九ワイヤーンデ（ンダ装置として特開昭５６−
３０７３８号公報が知られている。これは、第１図に示
すように構成されている。すなわち、支軸１ａを中心と
して揺動自在な揺動アーム１の先端部にキャピラリ１が
設けられ、基端部にはムービングコイル３が設けられて
いる。そして、このムービングコイル３は永久磁石４と
■−り１とから構成され九磁気回路６の空隙内にあシ、
ムービングコイルＪＫ電流を流すことによ）上記揺動ア
ーム１を駆動するようになっている。オ九、支軸１ａの
一端には位置検出器１、他端には速度検出器−が設けら
れ、揺動アーム１の揺動角度および揺動速度を検出する
ようになっており、揺動アーム１０位置および速度を検
知しながらムーＣンダコイルＪの電流を制御することて
中ャビラリ２の軌跡および一ンディンダ圧力を制御でき
るように構成畜れている。なお、Ｉは金線で、１０は半
導体ペレットである。Wiring is performed to electrically connect the board and the lead frame. Conventionally, devices used for this wire indicator have various structures, but a 9-wire indie device equipped with a function that can detect the interlocking layers of the oscillating arm and the oscillating angle has been developed. 1972-
No. 30738 is known. This is constructed as shown in FIG. That is, a capillary 1 is provided at the distal end of a swinging arm 1 that is freely swingable about a support shaft 1a, and a moving coil 3 is provided at its base end. This moving coil 3 is composed of a permanent magnet 4 and a wire 1, and is located within the gap of the nine magnetic circuits 6.
The swing arm 1 is driven by passing current through the moving coil JK. E9. A position detector 1 is provided at one end of the support shaft 1a, and a speed detector is provided at the other end to detect the swing angle and swing speed of the swing arm 1. The structure is such that the locus of the inner cavity 2 and the pressure of the inner cavity 2 can be controlled by controlling the current of the coil J while detecting the position and speed of the arm 10. Note that I is a gold wire and 10 is a semiconductor pellet.

背景技術の間慝点 揺動アーム１の、支軸１ａに位置検出１１ｋ　ｒ　％速
度検出Ｆ＃１を取付けて角１ｔおよび速度を検出してい
る九め、検出！！＃度が充分得られず、ソフトがンディ
ンダすなわち一ンディン！条件の微調整が不可能であり
、ｔた構造的に大形化するという欠点がある。さらに、
揺動アームに直接キャピラリを固定し、ムービングコイ
ルの電流制御によシｌンディンダ圧力を制御している九
め回路が複雑である。The cornerstone of the background technology is the position detection 11k r % speed detection F#1 attached to the support shaft 1a of the swinging arm 1 to detect the angle 1t and speed. ! #I can't get enough strength, and the software is undinda, that is, one ndin! There are disadvantages in that fine adjustment of conditions is not possible and the structure is large. moreover,
The ninth circuit, which fixes the capillary directly to the swing arm and controls the cylinder pressure by controlling the current of the moving coil, is complex.

発明の目的 位置検出器のみでキャピラリアームの適度および角度が
高精度に検出することができ、しかも小形化を図ること
かで龜るワイヤがンデインダ装置を提供することＫＴｏ
る。OBJECT OF THE INVENTION It is to provide a wire indinder device which can detect the appropriateness and angle of a capillary arm with high accuracy using only a position detector, and which can be miniaturized to reduce the need for wires.
Ru.

発明のｗ費 揺動アームをリニアモータによって駆動するとともに、
揺動アームの基端側にキャピラリアームの速度および角
度を検出する位置検出器を設けたことにある。In addition to driving the swing arm of the invention by a linear motor,
A position detector for detecting the speed and angle of the capillary arm is provided on the base end side of the swing arm.

発明の実施例 １１ｇ２図紘こ０発明の一実施例を示すもので、１１は
フレームである。この７レーム１１には支軸１２を軸心
として揺動自在な揺動アームＩＪが枢支されている。こ
の揺動アーム１３の先端部には金線１４をフラングする
クランパ１６が設けられている。さらに、この揺動アー
ムＩＪの先端側における下側には先端にキャピラリ１ｇ
を有するキャピラリアーム１ｒが設けられ、この基端は
板はね１８を介して上記揺動アームＩＪに支持されて−
る。また、上記キャピラリアーム１１０基端にはアーム
ブラケット１−が設けられていて、このアームプラグ、
ト１９と揺動アームＩＩのビン２０との間にはコイルス
ゲリンダ１１が張設されている。そして、このコイルス
プリング２１によりてキャピラリアーム１１を反時計方
向に付勢するようになってお夛、これらがＩンディンダ
加圧力ｍｓ機構２２を構成し、機械的に微調整可能にな
っている。Embodiment 11 of the invention This figure shows an embodiment of the invention, where 11 is a frame. A swinging arm IJ that is swingable about a support shaft 12 is pivotally supported on the seven frames 11. A clamper 16 for flanging the gold wire 14 is provided at the tip of the swing arm 13. Furthermore, a capillary of 1 g is attached to the lower end of the swing arm IJ.
A capillary arm 1r is provided, the base end of which is supported by the swinging arm IJ via a plate 18.
Ru. Further, an arm bracket 1- is provided at the base end of the capillary arm 110, and this arm plug,
A coil cylinder 11 is stretched between the shaft 19 and the bin 20 of the swing arm II. The coil spring 21 biases the capillary arm 11 counterclockwise, and these constitute an I-pressure force ms mechanism 22, which can be mechanically finely adjusted.

ま九、揺動アームＩＪの基端部に紘これを揺動駆動する
りニアモータ２１が設けられている。Ninth, a linear motor 21 is provided at the base end of the swing arm IJ to swing the swing arm IJ.

り具アモータ２Ｊを構成するムービングコイル２４は永
久磁石（図示しな％ｎｏ）および賀−り２Ｊとから構成
される磁気回路の空−内にｌ）上記ムービンダコイル２
４に電流を流すことにより揺動アーム１１を駆動で虐る
ようになっている。さらに、ムービングコイル１４に社
！ラケット２６が固定され、このブラケット２ｉの先端
ｓＫは上記フレームＪＪＫ固定された位置検出！１７Ｆ
の軸方向に進退自在な掬定子２ａが当接している。この
位置検出＠ｘｙは図示しない微分回路に接続され、その
出力を微分変換することにより速度を求めることができ
るようになっている。The moving coil 24 constituting the armature motor 2J is inserted into the space of a magnetic circuit composed of a permanent magnet (not shown) and a gate 2J.
By passing a current through 4, the swinging arm 11 is driven. In addition, moving coil 14! The racket 26 is fixed, and the tip sK of this bracket 2i detects the fixed position of the frame JJK! 17F
A scooping ruler 2a that can freely move forward and backward in the axial direction is in contact with it. This position detection @xy is connected to a differential circuit (not shown), and the velocity can be determined by differentially converting the output thereof.

しかして、ムービンダコイｋ１４に電流を流すと、ｌＩ
馳アーム１１は支軸１２を軸心として揺動する。したが
りて、この揺動アームＩＪに取付けられ九キャビ２リア
ーム１１も同時に揺動し、キャピラリ１＃に挿通された
金線１４の先端を半導体ペレット２＃の？ンディンダ・
中ラドに抑圧して一ンディンダする。このとき、上記揺
動アームＩＪの揺動に伴うてブラケット２−が上下動し
、そのストロークは位置検出器２１によりて検出される
。これにより、位置検出器２ｒはキャピラリ１σの位置
を検出するとともにそＯ出力を微分回路で変換すること
によシ適度をも検出する。しかも、この構造でＬ支軸１
１と位置検出器１１との間の距１１ｍ１ｉＬを長くして
変位量を大暑くすることができ、またこれによりはｔ！
直線変位が得られるため高い検出精度が得られる。し九
がりて、この位置検出ｇＨｒからの検出信号によってム
ービングコイル２４０１１１１１を制御することにより
キャビツリ１σの変位および一ンｒイング速度を任意に
設定できる。Therefore, when a current is passed through Movindakoi k14, lI
The arm 11 swings about the support shaft 12. Therefore, the nine-cabin 2 rear arm 11 attached to this swing arm IJ swings at the same time, and the tip of the gold wire 14 inserted into the capillary 1# is connected to the semiconductor pellet 2#. Ndinda
Suppress it to middle rad and do one ndinda. At this time, the bracket 2- moves up and down as the swing arm IJ swings, and its stroke is detected by the position detector 21. As a result, the position detector 2r detects the position of the capillary 1σ and also detects the degree of displacement by converting its O output with a differentiating circuit. Moreover, with this structure, the L support shaft 1
By increasing the distance 11m1iL between 1 and the position detector 11, the amount of displacement can be greatly increased.
Since linear displacement can be obtained, high detection accuracy can be obtained. Furthermore, by controlling the moving coil 24011111 using the detection signal from the position detection gHr, the displacement of the cavity 1σ and the rotation speed can be arbitrarily set.

発明の効果 １ＩＩＩｉｌアームに？ンｒイン！加圧力ｓ＊ｑ謔にキ
ャビクリアームを設けたから、ぎンディング圧力を任意
に設定できるとと４に、揺動アームの支軸と１置検出器
との間の距離を長くとることができ、キャピラリの変位
を為精度に検出できる。さらに、位置検出器のみで位置
、速度が検出できるため、従来のように支軸の両端に位
置検出器と速度検出器とを各別に設は丸ものに比べ、構
造が簡単で、小形化を図ることができる。Effect of invention 1IIIil arm? In! Since the cavity clearance arm is provided for the pressurizing force s*q, the binding pressure can be set arbitrarily.Fourth, the distance between the pivot of the swinging arm and the single-position detector can be increased. Capillary displacement can be detected with high precision. Furthermore, since the position and speed can be detected using only the position detector, the structure is simpler and more compact than the traditional position detector and speed detector, which are installed separately at both ends of the spindle. can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図線従来のワイヤーンディンダ装置の斜視図、１Ｉ
ｋ２図はこの発明の一実施例を示す側面図である。 １２・・・支軸、１１・・・揺動アーム、１１・・・キ
ャピラリアーム、２１・・・リエアモーメ、２１・・・
位置検出器。 出願人代理人　　弁理士　鈴　江　武　門弟１図 京芝浦電気株式会社生産技術研 究所内 ２０１ −Figure 1: A perspective view of a conventional wire-undinder device, 1I
Figure k2 is a side view showing an embodiment of the present invention. 12... Support shaft, 11... Swing arm, 11... Capillary arm, 21... Rear arm, 21...
position detector. Applicant's agent Patent attorney Takeshi Suzue Disciple 1 Figure 201, Kyoshibaura Electric Co., Ltd. Production Technology Laboratory -

Claims (1)

【特許請求の範囲】[Claims] 貰軸を中心として揺動角１Ｅな揺動アームと、この揺動
アームの先端側に一ンディンダ加圧力調整可能に設けら
れたキャピラリアームと、上記揺動アームの１端儒に設
けられ揺動アームを駆−さぜるリニアモータと、同じく
揺動アームの基端部に設けられ上記キャピラリアームＯ
変位とこの変位から速度を検出する位置検出器とを具備
し九ことを％黴とするワイヤ？ンディンダ装置。A swinging arm with a swinging angle of 1E about the axis, a capillary arm provided at the tip side of this swinging arm so that the pressure force can be adjusted, and a capillary arm provided at one end of the swinging arm to swing. A linear motor that drives the arm and a capillary arm O that is also provided at the base end of the swing arm.
A wire that is equipped with a displacement and a position detector that detects the velocity from this displacement? Ndinda device.
JP56202814A 1981-12-16 1981-12-16 Wire bonding device Granted JPS58103148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56202814A JPS58103148A (en) 1981-12-16 1981-12-16 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56202814A JPS58103148A (en) 1981-12-16 1981-12-16 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS58103148A true JPS58103148A (en) 1983-06-20
JPS6410093B2 JPS6410093B2 (en) 1989-02-21

Family

ID=16463638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56202814A Granted JPS58103148A (en) 1981-12-16 1981-12-16 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS58103148A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214441A (en) * 1985-03-19 1986-09-24 Toshiba Corp Bonding device
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5219112A (en) * 1991-05-07 1993-06-15 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61214441A (en) * 1985-03-19 1986-09-24 Toshiba Corp Bonding device
US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5219112A (en) * 1991-05-07 1993-06-15 Kabushiki Kaisha Shinkawa Wire bonding apparatus

Also Published As

Publication number Publication date
JPS6410093B2 (en) 1989-02-21

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