JPS5743820A - Manufacture of moldform panel - Google Patents
Manufacture of moldform panelInfo
- Publication number
- JPS5743820A JPS5743820A JP55073553A JP7355380A JPS5743820A JP S5743820 A JPS5743820 A JP S5743820A JP 55073553 A JP55073553 A JP 55073553A JP 7355380 A JP7355380 A JP 7355380A JP S5743820 A JPS5743820 A JP S5743820A
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- electrode
- surface material
- heater
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Ceramic Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To manufacture a moldform panel for a short time by applying a high frequency voltage to pressure a first material with a heat being generated from a heater of a first electrode plate after a first surface plate high in the dielectric characteristic of the material is arranged on the second electrode plate side adhering to a metal piece face.
CONSTITUTION: A first material 6 in which a first surface material 4a high in the dielectric characteristic is piled on one surface of a metal mold 2 through an unhardened adhesive layer 3b is arranged between a first high frequency electrode 5b embedded with a heater and a second high frequency electrode 5a with the surface material 4a on the electrode 5a to pressurize. A high frequency voltage is applied between the electrodes 5a and 5b and an adhesive layer 3b is solidified with a heat generated from the heater to adhere to the surface material 4a. Then, A second surface material 4b low in the dielectric characteristic is stacked on the mold 2 through the unhardened adhesive 3b to make a second material 7 to be pressurized, which is pressurized between the electrodes 5a and 5b while a high frequency voltage is applied to solidify the adhesive 3b whereby the surface material 4b adheres to the mold 2.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55073553A JPS5743820A (en) | 1980-05-30 | 1980-05-30 | Manufacture of moldform panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55073553A JPS5743820A (en) | 1980-05-30 | 1980-05-30 | Manufacture of moldform panel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5743820A true JPS5743820A (en) | 1982-03-12 |
JPS6357477B2 JPS6357477B2 (en) | 1988-11-11 |
Family
ID=13521540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55073553A Granted JPS5743820A (en) | 1980-05-30 | 1980-05-30 | Manufacture of moldform panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5743820A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102501281A (en) * | 2011-10-13 | 2012-06-20 | 青岛国森机械有限公司 | Hydraulic press for multi-layer bamboo wood integrated material |
-
1980
- 1980-05-30 JP JP55073553A patent/JPS5743820A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102501281A (en) * | 2011-10-13 | 2012-06-20 | 青岛国森机械有限公司 | Hydraulic press for multi-layer bamboo wood integrated material |
Also Published As
Publication number | Publication date |
---|---|
JPS6357477B2 (en) | 1988-11-11 |
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