JPS57153495A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS57153495A
JPS57153495A JP3996181A JP3996181A JPS57153495A JP S57153495 A JPS57153495 A JP S57153495A JP 3996181 A JP3996181 A JP 3996181A JP 3996181 A JP3996181 A JP 3996181A JP S57153495 A JPS57153495 A JP S57153495A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3996181A
Other languages
Japanese (ja)
Inventor
Akihiro Aketo
Kazumori Baba
Hideo Saitou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP3996181A priority Critical patent/JPS57153495A/en
Publication of JPS57153495A publication Critical patent/JPS57153495A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP3996181A 1981-03-18 1981-03-18 Method of producing printed circuit board Pending JPS57153495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3996181A JPS57153495A (en) 1981-03-18 1981-03-18 Method of producing printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3996181A JPS57153495A (en) 1981-03-18 1981-03-18 Method of producing printed circuit board

Publications (1)

Publication Number Publication Date
JPS57153495A true JPS57153495A (en) 1982-09-22

Family

ID=12567546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3996181A Pending JPS57153495A (en) 1981-03-18 1981-03-18 Method of producing printed circuit board

Country Status (1)

Country Link
JP (1) JPS57153495A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160171A (en) * 1991-07-01 1993-06-25 Internatl Business Mach Corp <Ibm> Integrated circuit carrier assembly, manufacture thereof and method of selectively applying liquid material
JPH06232203A (en) * 1993-02-03 1994-08-19 Nec Corp Lsi packaging structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593294A (en) * 1979-01-05 1980-07-15 Matsushita Electric Ind Co Ltd Reflow soldering method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5593294A (en) * 1979-01-05 1980-07-15 Matsushita Electric Ind Co Ltd Reflow soldering method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160171A (en) * 1991-07-01 1993-06-25 Internatl Business Mach Corp <Ibm> Integrated circuit carrier assembly, manufacture thereof and method of selectively applying liquid material
JPH06232203A (en) * 1993-02-03 1994-08-19 Nec Corp Lsi packaging structure

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