JPS57134996A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS57134996A JPS57134996A JP2108581A JP2108581A JPS57134996A JP S57134996 A JPS57134996 A JP S57134996A JP 2108581 A JP2108581 A JP 2108581A JP 2108581 A JP2108581 A JP 2108581A JP S57134996 A JPS57134996 A JP S57134996A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- producing printed
- producing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2108581A JPS57134996A (en) | 1981-02-16 | 1981-02-16 | Method of producing printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2108581A JPS57134996A (en) | 1981-02-16 | 1981-02-16 | Method of producing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57134996A true JPS57134996A (en) | 1982-08-20 |
Family
ID=12045035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2108581A Pending JPS57134996A (en) | 1981-02-16 | 1981-02-16 | Method of producing printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57134996A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138090A (en) * | 1982-02-12 | 1983-08-16 | 株式会社日立製作所 | Method of producing printed circuit board |
JPH0210796A (en) * | 1988-06-28 | 1990-01-16 | Nec Corp | Manufacture of printed wiring board |
WO2010064602A1 (en) | 2008-12-02 | 2010-06-10 | パナソニック電工株式会社 | Method for manufacturing circuit board, and circuit board obtained using the manufacturing method |
WO2011052211A1 (en) | 2009-10-30 | 2011-05-05 | パナソニック電工株式会社 | Circuit board, and semiconductor device having component mounted on circuit board |
EP2469990A2 (en) | 2008-04-30 | 2012-06-27 | Panasonic Corporation | Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method |
US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
US8272126B2 (en) | 2008-04-30 | 2012-09-25 | Panasonic Corporation | Method of producing circuit board |
US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
-
1981
- 1981-02-16 JP JP2108581A patent/JPS57134996A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138090A (en) * | 1982-02-12 | 1983-08-16 | 株式会社日立製作所 | Method of producing printed circuit board |
JPH0210796A (en) * | 1988-06-28 | 1990-01-16 | Nec Corp | Manufacture of printed wiring board |
EP2469990A2 (en) | 2008-04-30 | 2012-06-27 | Panasonic Corporation | Method of producing ciruit board by additive method, and circuit board and multilayer circuit board obtained by the method |
US8240036B2 (en) | 2008-04-30 | 2012-08-14 | Panasonic Corporation | Method of producing a circuit board |
US8272126B2 (en) | 2008-04-30 | 2012-09-25 | Panasonic Corporation | Method of producing circuit board |
EP2592912A1 (en) | 2008-04-30 | 2013-05-15 | Panasonic Corporation | Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
US9332650B2 (en) | 2008-04-30 | 2016-05-03 | Panasonic Corporation | Method of producing multilayer circuit board |
US9082438B2 (en) | 2008-12-02 | 2015-07-14 | Panasonic Corporation | Three-dimensional structure for wiring formation |
WO2010064602A1 (en) | 2008-12-02 | 2010-06-10 | パナソニック電工株式会社 | Method for manufacturing circuit board, and circuit board obtained using the manufacturing method |
US8698003B2 (en) | 2008-12-02 | 2014-04-15 | Panasonic Corporation | Method of producing circuit board, and circuit board obtained using the manufacturing method |
WO2011052211A1 (en) | 2009-10-30 | 2011-05-05 | パナソニック電工株式会社 | Circuit board, and semiconductor device having component mounted on circuit board |
US8929092B2 (en) | 2009-10-30 | 2015-01-06 | Panasonic Corporation | Circuit board, and semiconductor device having component mounted on circuit board |
US9332642B2 (en) | 2009-10-30 | 2016-05-03 | Panasonic Corporation | Circuit board |
US9351402B2 (en) | 2009-10-30 | 2016-05-24 | Panasonic Corporation | Circuit board, and semiconductor device having component mounted on circuit board |
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