JPS56155550A - Multilayer wiring structure and manufacture thereof - Google Patents
Multilayer wiring structure and manufacture thereofInfo
- Publication number
- JPS56155550A JPS56155550A JP5781180A JP5781180A JPS56155550A JP S56155550 A JPS56155550 A JP S56155550A JP 5781180 A JP5781180 A JP 5781180A JP 5781180 A JP5781180 A JP 5781180A JP S56155550 A JPS56155550 A JP S56155550A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wiring layer
- layer
- patterning
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To obtain the wiring in high density without generating breaking of wire in the multilayer wiring structure by a method wherein the second wiring layer is stacked on the first wiring layer using a different material from the first layer through an interlayer insulating film. CONSTITUTION:The Al wiring 2 is provided on a substrate 1, the insulating film 3 of SiO2, etc., is stacked and an opening 4 is formed. Ti 7, Al 5 are laminated on the whole surface, and when a resist mask is applied thereon and etching is performed with phosphoric acid, glacial acetic acid, and nitric acid, Ti is not etched and patterning is performed only on Al. Then only Ti is etched with a mixed liquid of ethyl diamine 4 acetic acid, hydrogen peroxide and water using the Al wiring as a mask. By this constitution, the Al wiring layer 2 is not broken when the patterning of the second Al wiring layer 5 is performed, and density of wiring can be improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5781180A JPS56155550A (en) | 1980-05-02 | 1980-05-02 | Multilayer wiring structure and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5781180A JPS56155550A (en) | 1980-05-02 | 1980-05-02 | Multilayer wiring structure and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56155550A true JPS56155550A (en) | 1981-12-01 |
Family
ID=13066300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5781180A Pending JPS56155550A (en) | 1980-05-02 | 1980-05-02 | Multilayer wiring structure and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56155550A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59148340A (en) * | 1983-02-14 | 1984-08-25 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
| JPH03178131A (en) * | 1989-12-06 | 1991-08-02 | Nec Corp | Semiconductor device |
| CN101608985A (en) * | 2009-07-27 | 2009-12-23 | 上海市机械制造工艺研究所有限公司 | Coating shows a display packing of etchant and multi-coated coating institutional framework |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49115689A (en) * | 1973-03-07 | 1974-11-05 | ||
| JPS51132089A (en) * | 1975-05-12 | 1976-11-16 | Hitachi Ltd | Semiconductor device |
| JPS5374392A (en) * | 1976-12-15 | 1978-07-01 | Hitachi Ltd | Multi-layer coat formation method |
-
1980
- 1980-05-02 JP JP5781180A patent/JPS56155550A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49115689A (en) * | 1973-03-07 | 1974-11-05 | ||
| JPS51132089A (en) * | 1975-05-12 | 1976-11-16 | Hitachi Ltd | Semiconductor device |
| JPS5374392A (en) * | 1976-12-15 | 1978-07-01 | Hitachi Ltd | Multi-layer coat formation method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59148340A (en) * | 1983-02-14 | 1984-08-25 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
| JPH03178131A (en) * | 1989-12-06 | 1991-08-02 | Nec Corp | Semiconductor device |
| CN101608985A (en) * | 2009-07-27 | 2009-12-23 | 上海市机械制造工艺研究所有限公司 | Coating shows a display packing of etchant and multi-coated coating institutional framework |
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