JPS5522865A - Manufacturing methof of semiconductor device - Google Patents

Manufacturing methof of semiconductor device

Info

Publication number
JPS5522865A
JPS5522865A JP9645378A JP9645378A JPS5522865A JP S5522865 A JPS5522865 A JP S5522865A JP 9645378 A JP9645378 A JP 9645378A JP 9645378 A JP9645378 A JP 9645378A JP S5522865 A JPS5522865 A JP S5522865A
Authority
JP
Japan
Prior art keywords
wiring
semiconductor device
psg
laminating
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9645378A
Other languages
Japanese (ja)
Inventor
Kimiyoshi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9645378A priority Critical patent/JPS5522865A/en
Publication of JPS5522865A publication Critical patent/JPS5522865A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve an wet-proof property by laminating a polyimide resin and Si3N4 on a metallic wiring layer on a PSG having an opening provided thereon.
CONSTITUTION: The surface is formed flat by laminating a PSG 3 on a SiO2 2 on a Si substrate 1 and an opening is selectively provided in a predetermined position to provide an Al wiring 4. Successively, a polyimide resin 5 having a thickness of about 2μm is formed. The resin 5 has a small wer-proof effect, but a great stickness to make a step at the end of the wiring mild. When a Si3N46 of about 1μm thickness is laminated, to cover the end of the wiring completely. Therefore, the entering water can be prevented to improve a wet-proof property.
COPYRIGHT: (C)1980,JPO&Japio
JP9645378A 1978-08-07 1978-08-07 Manufacturing methof of semiconductor device Pending JPS5522865A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9645378A JPS5522865A (en) 1978-08-07 1978-08-07 Manufacturing methof of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9645378A JPS5522865A (en) 1978-08-07 1978-08-07 Manufacturing methof of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5522865A true JPS5522865A (en) 1980-02-18

Family

ID=14165433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9645378A Pending JPS5522865A (en) 1978-08-07 1978-08-07 Manufacturing methof of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5522865A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111030A (en) * 1980-12-27 1982-07-10 Fujitsu Ltd Passivation film
JPS60249333A (en) * 1984-05-25 1985-12-10 Toshiba Corp Semiconductor device and manufacture thereof
US4686559A (en) * 1984-08-03 1987-08-11 Advanced Micro Devices, Inc. Topside sealing of integrated circuit device
JPS6489086A (en) * 1987-09-30 1989-04-03 Canon Kk Information recording and reproducing device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285474A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Semiconductor device
JPS52131484A (en) * 1976-04-28 1977-11-04 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5285474A (en) * 1976-01-09 1977-07-15 Hitachi Ltd Semiconductor device
JPS52131484A (en) * 1976-04-28 1977-11-04 Hitachi Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111030A (en) * 1980-12-27 1982-07-10 Fujitsu Ltd Passivation film
JPS60249333A (en) * 1984-05-25 1985-12-10 Toshiba Corp Semiconductor device and manufacture thereof
US4686559A (en) * 1984-08-03 1987-08-11 Advanced Micro Devices, Inc. Topside sealing of integrated circuit device
JPS6489086A (en) * 1987-09-30 1989-04-03 Canon Kk Information recording and reproducing device

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