JPS5522865A - Manufacturing methof of semiconductor device - Google Patents
Manufacturing methof of semiconductor deviceInfo
- Publication number
- JPS5522865A JPS5522865A JP9645378A JP9645378A JPS5522865A JP S5522865 A JPS5522865 A JP S5522865A JP 9645378 A JP9645378 A JP 9645378A JP 9645378 A JP9645378 A JP 9645378A JP S5522865 A JPS5522865 A JP S5522865A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- semiconductor device
- psg
- laminating
- wet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To improve an wet-proof property by laminating a polyimide resin and Si3N4 on a metallic wiring layer on a PSG having an opening provided thereon.
CONSTITUTION: The surface is formed flat by laminating a PSG 3 on a SiO2 2 on a Si substrate 1 and an opening is selectively provided in a predetermined position to provide an Al wiring 4. Successively, a polyimide resin 5 having a thickness of about 2μm is formed. The resin 5 has a small wer-proof effect, but a great stickness to make a step at the end of the wiring mild. When a Si3N46 of about 1μm thickness is laminated, to cover the end of the wiring completely. Therefore, the entering water can be prevented to improve a wet-proof property.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9645378A JPS5522865A (en) | 1978-08-07 | 1978-08-07 | Manufacturing methof of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9645378A JPS5522865A (en) | 1978-08-07 | 1978-08-07 | Manufacturing methof of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5522865A true JPS5522865A (en) | 1980-02-18 |
Family
ID=14165433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9645378A Pending JPS5522865A (en) | 1978-08-07 | 1978-08-07 | Manufacturing methof of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5522865A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57111030A (en) * | 1980-12-27 | 1982-07-10 | Fujitsu Ltd | Passivation film |
JPS60249333A (en) * | 1984-05-25 | 1985-12-10 | Toshiba Corp | Semiconductor device and manufacture thereof |
US4686559A (en) * | 1984-08-03 | 1987-08-11 | Advanced Micro Devices, Inc. | Topside sealing of integrated circuit device |
JPS6489086A (en) * | 1987-09-30 | 1989-04-03 | Canon Kk | Information recording and reproducing device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5285474A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Semiconductor device |
JPS52131484A (en) * | 1976-04-28 | 1977-11-04 | Hitachi Ltd | Semiconductor device |
-
1978
- 1978-08-07 JP JP9645378A patent/JPS5522865A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5285474A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Semiconductor device |
JPS52131484A (en) * | 1976-04-28 | 1977-11-04 | Hitachi Ltd | Semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57111030A (en) * | 1980-12-27 | 1982-07-10 | Fujitsu Ltd | Passivation film |
JPS60249333A (en) * | 1984-05-25 | 1985-12-10 | Toshiba Corp | Semiconductor device and manufacture thereof |
US4686559A (en) * | 1984-08-03 | 1987-08-11 | Advanced Micro Devices, Inc. | Topside sealing of integrated circuit device |
JPS6489086A (en) * | 1987-09-30 | 1989-04-03 | Canon Kk | Information recording and reproducing device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0318954A3 (en) | Semiconductor device having a composite insulating interlayer | |
JPS5365088A (en) | Semiconductor device | |
JPS5522865A (en) | Manufacturing methof of semiconductor device | |
JPS5731155A (en) | Manufacture of semiconductor device | |
JPS55102235A (en) | Formation of interlayer conductive layer | |
JPS54128296A (en) | Wiring structure and its manufacture | |
JPS642339A (en) | Manufacture of semiconductor device | |
JPS56125856A (en) | Manufacture of semiconductor device | |
JPS5617041A (en) | Manufacture of semiconductor device | |
JPS5585042A (en) | Semiconductor device | |
JPS5568655A (en) | Manufacturing method of wiring | |
JPS54113277A (en) | Production of semiconductor device | |
JPS6482652A (en) | Manufacture of semiconductor device | |
JPS52151567A (en) | Protecting method of wiring layers | |
JPS5615052A (en) | Semiconductor device with multilayer wiring | |
JPS5563843A (en) | Formation of wiring conductive layer in semiconductor i.c. device | |
JPS52113161A (en) | Semiconductor device | |
JPS5731157A (en) | Wiring structure on circuit substrate | |
JPS54156476A (en) | Manufacture for semiconductor device | |
JPS54145488A (en) | Semiconductor device | |
JPS52120781A (en) | Semiconductor device | |
JPS5718327A (en) | Production of semiconductor device | |
JPS5555546A (en) | Method of wiring semiconductor device | |
JPS57147253A (en) | Manufacture of semiconductor device | |
JPS5519880A (en) | Manufacturing method of semiconductor device |