JPS5399671U - - Google Patents
Info
- Publication number
- JPS5399671U JPS5399671U JP17620476U JP17620476U JPS5399671U JP S5399671 U JPS5399671 U JP S5399671U JP 17620476 U JP17620476 U JP 17620476U JP 17620476 U JP17620476 U JP 17620476U JP S5399671 U JPS5399671 U JP S5399671U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combined Means For Separation Of Solids (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17620476U JPS5399671U (en) | 1976-12-29 | 1976-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17620476U JPS5399671U (en) | 1976-12-29 | 1976-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5399671U true JPS5399671U (en) | 1978-08-12 |
Family
ID=28783561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17620476U Pending JPS5399671U (en) | 1976-12-29 | 1976-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5399671U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015150506A (en) * | 2014-02-14 | 2015-08-24 | 国立研究開発法人産業技術総合研究所 | selection method |
| JP2015150505A (en) * | 2014-02-14 | 2015-08-24 | 国立研究開発法人産業技術総合研究所 | Selector |
| WO2019151350A1 (en) * | 2018-01-31 | 2019-08-08 | Ｊｘ金属株式会社 | Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap |
| US11754794B2 (en) | 2021-05-25 | 2023-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device including optical through via and method of making |
-
1976
- 1976-12-29 JP JP17620476U patent/JPS5399671U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015150506A (en) * | 2014-02-14 | 2015-08-24 | 国立研究開発法人産業技術総合研究所 | selection method |
| JP2015150505A (en) * | 2014-02-14 | 2015-08-24 | 国立研究開発法人産業技術総合研究所 | Selector |
| WO2019151350A1 (en) * | 2018-01-31 | 2019-08-08 | Ｊｘ金属株式会社 | Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap |
| CN111670077A (en) * | 2018-01-31 | 2020-09-15 | 捷客斯金属株式会社 | Method and apparatus for removing thread, and method for processing electronic/electric device component dust |
| JPWO2019151350A1 (en) * | 2018-01-31 | 2021-01-14 | Ｊｘ金属株式会社 | Method for removing linear objects, method for removing linear objects, and method for disposing of scraps of electronic and electrical equipment parts |
| US11548032B2 (en) | 2018-01-31 | 2023-01-10 | Jx Nippon Mining & Metals Corporation | Method for removing wire-form objects, device for removing wire-form objects, and method for processing electronic/electrical apparatus component scrap |
| US11754794B2 (en) | 2021-05-25 | 2023-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device including optical through via and method of making |