JPH11284233A - Flat mounting type led element - Google Patents
Flat mounting type led elementInfo
- Publication number
- JPH11284233A JPH11284233A JP10082206A JP8220698A JPH11284233A JP H11284233 A JPH11284233 A JP H11284233A JP 10082206 A JP10082206 A JP 10082206A JP 8220698 A JP8220698 A JP 8220698A JP H11284233 A JPH11284233 A JP H11284233A
- Authority
- JP
- Japan
- Prior art keywords
- led element
- mounting type
- type led
- resin substrate
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15156—Side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＬＥＤ素子に関す
るものであり、フラットパッケージなどと称されて、回
路基板の表面に直接に実装可能なパッケージに収納され
たＬＥＤ素子に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED element, and more particularly to an LED element housed in a package called a flat package, which can be directly mounted on a surface of a circuit board.
【０００２】[0002]
【従来の技術】従来のこの種の平面実装型ＬＥＤ素子９
０の構成の例を示すものが図２であり、先ず、樹脂基板
９１はガラス基材エポキシ板などの部材による上部基板
９２と、同じ部材による下部基板９３とから構成され、
前記上部基板９２には略中心にドリルなど適宜な手段で
貫通孔９２ａが設けられている。2. Description of the Related Art Conventional planar mounting type LED elements 9
FIG. 2 shows an example of the configuration of No. 0. First, the resin substrate 91 is composed of an upper substrate 92 made of a member such as a glass base epoxy plate and a lower substrate 93 made of the same member.
The upper substrate 92 is provided with a through hole 92a at a substantially center thereof by a suitable means such as a drill.
【０００３】そして、上部基板９２に前記貫通孔９２ａ
を背面側から塞ぐように下部基板９３が貼着されてホー
ン部９４が構成されるものであり、このときに、前記貫
通孔９２ａの側面がホーン部９４の反射面９４ａと成
り、下部基板９３の表面がホーン部９４の底面９４ｂと
なる。The upper substrate 92 is provided with the through hole 92a.
A horn portion 94 is formed by adhering a lower substrate 93 so as to cover the horn portion 94 from the rear side. At this time, the side surface of the through hole 92a becomes a reflection surface 94a of the horn portion 94, and the lower substrate 93 Is the bottom surface 94b of the horn portion 94.
【０００４】このように構成された樹脂基板９１には前
記ホーン部９４を含み樹脂メッキなどによる導電膜９５
が適宜な形状として施され、前記ホーン部９４の底面９
４ｂにはＬＥＤチップ９６がマウントされ、金ワイヤ９
７により配線が行われた後に前記ＬＥＤチップ９６を覆
い透明樹脂によるケース部９８が形成されて平面実装型
ＬＥＤ素子９０とされるものである。[0004] The resin substrate 91 thus configured includes the horn portion 94 and a conductive film 95 formed by resin plating or the like.
Is formed in an appropriate shape, and the bottom surface 9 of the horn portion 94 is formed.
An LED chip 96 is mounted on 4b and the gold wire 9 is mounted.
After the wiring is performed by 7, a case portion 98 made of a transparent resin is formed to cover the LED chip 96 to form a planar mounting type LED element 90.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、前記し
た従来の平面実装型ＬＥＤ素子９０において、第一に
は、ＬＥＤチップ９６をホーン部９４の中にマウントし
たことで、樹脂基板９１と直交する照射方向Ｚに光を発
するものとは成っているが、前記ホーン部９４の反射面
９４ａが照射方向Ｚに対し平行であるので、この反射面
９４ａに達した光を上記した照射方向Ｚに効率良く変換
することができず、ＬＥＤチップ９６に対する光束利用
率が低いという問題点を生じている。However, in the above-described conventional planar mounting type LED element 90, first, the LED chip 96 is mounted in the horn portion 94, so that the irradiation light orthogonal to the resin substrate 91 is obtained. The horn 94 emits light in the direction Z. However, since the reflecting surface 94a of the horn portion 94 is parallel to the irradiation direction Z, light reaching the reflecting surface 94a is efficiently emitted in the above-described irradiation direction Z. The conversion cannot be performed, and there is a problem that the light flux utilization rate for the LED chip 96 is low.
【０００６】また第二には、ＬＥＤチップ９６が全面を
樹脂基板９１、ケース部９８と熱伝導性が低い部材で取
囲まれているので、通電時のＬＥＤチップ９６からの発
熱が効率良く外部への放熱が行われず、ＬＥＤチップ９
６が高熱になり易く、従って、通電電流（点灯電流）に
制約を受けるものとなって、明るい平面実装型ＬＥＤ素
子９０が実現できない問題点も生じ、これらの点の解決
が課題とされるものとなっている。Second, since the entire surface of the LED chip 96 is surrounded by the resin substrate 91, the case portion 98 and a member having low thermal conductivity, heat generated from the LED chip 96 during energization is efficiently supplied to the outside. No heat is dissipated to the LED chip 9
6 is likely to be heated to a high temperature, and therefore, is subject to restrictions on the energizing current (lighting current), causing a problem that a bright plane-mounted LED element 90 cannot be realized, and solving these points is an issue. It has become.
【０００７】[0007]
【課題を解決するための手段】本発明は前記した従来の
課題を解決するための具体的な手段として、樹脂基板に
反射面と底面とから成るホーン部を設け、該ホーン部の
底面にＬＥＤチップをマウントしてなる平面実装型ＬＥ
Ｄ素子において、前記ホーン部が、前記樹脂基板を貫通
して設けられた上拡がりのテーパー状の貫通孔により構
成される反射面と、前記樹脂基板の底面側から貼着され
る銅箔により構成される底面とされていることを特徴と
する平面実装型ＬＥＤ素子を提供することで前記課題を
解決するものである。According to the present invention, as a specific means for solving the above-mentioned conventional problems, a horn portion having a reflection surface and a bottom surface is provided on a resin substrate, and an LED is provided on the bottom surface of the horn portion. Plane mount type LE with chip mounted
In the D element, the horn portion includes a reflection surface formed by a tapered through hole extending upward and provided through the resin substrate, and a copper foil adhered from a bottom surface side of the resin substrate. The object is achieved by providing a planar mounting type LED element having a bottom surface to be formed.
【０００８】[0008]
【発明の実施の形態】つぎに、本発明を図に示す実施形
態に基づいて詳細に説明する。図１に符号１で示すもの
は本発明に係る平面実装型ＬＥＤ素子であり、この平面
実装型ＬＥＤ素子１は樹脂基板２にホーン部３が設けら
れ、このホーン部３にＬＥＤチップ６がマウントされて
成るものである点は従来例のものと同様である。Next, the present invention will be described in detail based on an embodiment shown in the drawings. In FIG. 1, reference numeral 1 denotes a planar mounting type LED element according to the present invention. The planar mounting type LED element 1 is provided with a horn portion 3 on a resin substrate 2, and an LED chip 6 is mounted on the horn portion 3. This is the same as the conventional example.
【０００９】また、前記ホーン部３は反射面３ａと、底
面３ｂとから構成されるものである点も従来例と同様で
あるが、本発明では前記樹脂基板２を貫通して設ける貫
通孔２ａを上拡がりのテーパー状とするものであり、こ
れは、適宜な先端角（例えば９０°）を有するツイスト
ドリルを適宜な送り込み深さとして穴明け加工を行うこ
となどで実現可能である。Also, the horn portion 3 is composed of a reflecting surface 3a and a bottom surface 3b, which is the same as the conventional example. However, in the present invention, a through hole 2a formed through the resin substrate 2 is provided. Is formed in a tapered shape having an upwardly extending shape. This can be realized by performing drilling with a twist drill having an appropriate tip angle (for example, 90 °) and an appropriate feeding depth.
【００１０】また、底面３ｂは従来例のものが下部基板
を貼着していたのに対し、本発明では例えば厚みｔが
０．１mm近傍の銅箔４を樹脂基板２の背面側から前記孔
２ａを塞ぐようにして貼着するものとしている。従っ
て、本発明においてはホーン部３の反射面３ａは貫通孔
２ａの側面で構成され、ホーン部３の底面３ｂは銅箔４
で構成されるものとなる。On the other hand, in the present invention, for example, a copper foil 4 having a thickness t of about 0.1 mm is attached to the bottom surface 3b from the back side of the resin substrate 2 by using the hole. It is to be adhered so as to cover 2a. Therefore, in the present invention, the reflection surface 3a of the horn 3 is formed by the side surface of the through hole 2a, and the bottom 3b of the horn 3 is
It is composed of
【００１１】このときに、前記銅箔４は完成した後の平
面実装型ＬＥＤ素子１を回路基板（図示は省略する）に
取付けるための端子部４ａ、４ｂも兼ねるものとなるの
で、銅箔４を樹脂基板２の背面側の全面にわたり貼着し
ておき、後の適宜の時点でエッチングなど適宜な手段に
より不要部分を削除するなどは自在である。At this time, the copper foil 4 also serves as the terminal portions 4a and 4b for attaching the completed planar mounting type LED element 1 to a circuit board (not shown). Can be adhered over the entire back surface of the resin substrate 2 and unnecessary portions can be removed by an appropriate means such as etching at an appropriate time later.
【００１２】上記のように銅箔４が貼着された後の樹脂
基板２には、例えば樹脂メッキなどにより適宜な形状と
された導電部５が形成されるが、このときには、導電部
５は従来例と同様にホーン部３の反射面３ａおよび底面
３ｂを含み行われるものとされている。After the copper foil 4 is adhered to the resin substrate 2 as described above, a conductive portion 5 having an appropriate shape is formed by, for example, resin plating. Like the conventional example, the horn portion 3 includes the reflection surface 3a and the bottom surface 3b, and is performed.
【００１３】そして、前記ホーン部３の底面３ｂにはＬ
ＥＤチップ６が一方の極でマウントされ、このＬＥＤチ
ップ６の他方の極には前記導電部５とに金ワイヤ７によ
る配線が行われた後に、前記ＬＥＤチップ６を覆い透明
樹脂によるケース部８が形成されて、本発明の平面実装
型ＬＥＤ素子１とされるのである。The bottom 3b of the horn 3 has L
The ED chip 6 is mounted at one pole, and the other pole of the LED chip 6 is connected to the conductive part 5 by a gold wire 7 and then covered with the LED chip 6 to form a case part 8 made of a transparent resin. Is formed to obtain the planar mounting type LED element 1 of the present invention.
【００１４】次いで、上記の構成とした本発明の平面実
装型ＬＥＤ素子１の作用および効果について説明する。
先ず第一には、樹脂基板２に設けられる貫通孔２ａが上
拡がりのテーパー状とされたことで、この貫通孔２ａの
側面で構成されるホーン部３の反射面３ａで反射するＬ
ＥＤチップ６からの光は、進行方向をこの平面実装型Ｌ
ＥＤ素子１の照射方向Ｚに向かうものと変換される。Next, the operation and effects of the above-configured planar mounting type LED element 1 of the present invention will be described.
First, since the through-hole 2a provided in the resin substrate 2 is tapered so as to expand upward, L reflected by the reflection surface 3a of the horn portion 3 formed by the side surface of the through-hole 2a.
The light from the ED chip 6 travels in the direction
The light is converted to light directed in the irradiation direction Z of the ED element 1.
【００１５】従って、同じ点灯電流で駆動されている同
じ明るさのＬＥＤチップ６に対しても、従来例のこの種
の平面実装型ＬＥＤ素子に比較して光束利用率が格段に
向上するものとなり、同じ消費電力でより明るい平面実
装型ＬＥＤ素子１が得られるものとなる。Therefore, even for the LED chips 6 of the same brightness driven by the same lighting current, the luminous flux utilization rate is remarkably improved as compared with this type of conventional planar mounting type LED element. Thus, a brighter planar mounting type LED element 1 can be obtained with the same power consumption.
【００１６】また第二には、ホーン部３の底面３ｂが、
樹脂基板２の背面側に貼着された銅箔４とされたこと
で、この銅箔４のＬＥＤチップ６がマウントされたのと
反対側の面は直接に外部に露出し、機器などへの組込み
を行う際には回路基板あるいは外気などに直接に接触す
るものとなる。Second, the bottom surface 3b of the horn 3 is
Since the copper foil 4 is adhered to the back side of the resin substrate 2, the surface of the copper foil 4 on the side opposite to the side where the LED chip 6 is mounted is directly exposed to the outside, and the When assembling, it comes into direct contact with the circuit board or the outside air.
【００１７】このことは、前記ＬＥＤチップ６に対する
冷却効率が向上するものとなるので、同じ定格のＬＥＤ
チップ６に対しても、より多い点灯電流の供給が可能と
なり、従来例の平面実装型ＬＥＤ素子に比較して、一層
に光量面で高出力を発生することのできる平面実装型Ｌ
ＥＤ素子１の実現を可能とする。また、同じ点灯電流で
あれば、冷却効率が優れる分だけＬＥＤチップ６は低温
に保たれるものとなり、寿命面の延長など信頼性にも向
上が期待できるものとなる。This means that the cooling efficiency for the LED chip 6 is improved.
A larger amount of lighting current can be supplied to the chip 6 as well, and a flat mounting type LED that can generate a higher output in terms of light quantity than the conventional flat mounting type LED element can be obtained.
The ED element 1 can be realized. In addition, if the lighting current is the same, the LED chip 6 is kept at a low temperature by an amount corresponding to the excellent cooling efficiency, and the reliability can be expected to be improved such as the extension of the service life.
【００１８】以上を総括すれば、本発明の平面実装型Ｌ
ＥＤ素子１においては、テーパー状の貫通孔２ａ（反射
面３ａ）としたことで、同じ点灯電流でより明るいもの
となり、従来通りの明るさで使用する場合であればより
少ない点灯電流で良く、即ち、消費電力が低減できるも
のとなる。Summarizing the above, the planar mounting type L of the present invention
In the ED element 1, the use of the tapered through-hole 2a (reflection surface 3a) makes it brighter with the same lighting current, and requires less lighting current when used with the conventional brightness. That is, power consumption can be reduced.
【００１９】また、上記反射面３ａの構成で明るさが格
段に増したことに加えて、底面３ｂを銅箔４で構成され
るものとしたことで、点灯電流の一層の増加が可能とな
り、双方が相乗して得られる最大の明るさは格段のもの
となる。従って、例えば屋外用の表示器など従来の平面
実装型ＬＥＤ素子においては不可能な用途にも対応が可
能となり用途の拡大が図れるものとなる。Further, in addition to the remarkable increase in brightness due to the configuration of the reflection surface 3a, the bottom surface 3b is made of the copper foil 4, so that the lighting current can be further increased. The maximum brightness that can be obtained when both are synergistic is remarkable. Therefore, for example, it is possible to cope with an application which cannot be performed by a conventional planar mounting type LED element such as an outdoor display device, so that the application can be expanded.
【００２０】[0020]
【発明の効果】以上に説明したように本発明により、ホ
ーン部が、樹脂基板を貫通して設けられた上拡がりのテ
ーパー状の貫通孔により構成される反射面と、前記樹脂
基板の底面側から貼着される銅箔により構成される底面
とされている平面実装型ＬＥＤ素子としたことで、第一
には、上拡がりのテーパー状としたホーン部の反射面に
よりＬＥＤチップからの側方に向かう光を照射方向Ｚに
変換し、光束利用率を向上させ、この種の平面実装型Ｌ
ＥＤ素子における効率の向上に極めて優れた効果を奏す
るものである。As described above, according to the present invention, the horn portion has a reflecting surface formed by a tapered through-hole extending upward and penetrating through the resin substrate, and a bottom surface of the resin substrate. First, by using a planar mounting type LED element that has a bottom surface made of copper foil adhered from above, the first is that the reflection surface of the horn part that has a tapered flank on the upper side has Is converted into the irradiation direction Z to improve the luminous flux utilization rate, and this type of planar mounting type L
This is extremely effective in improving the efficiency of the ED element.
【００２１】また第二には、ホーン部の底面が、樹脂基
板の背面側に貼着された銅箔とされたことで、この銅箔
の一面は直接に外部に露出するものとし、ＬＥＤチップ
に対する冷却効率を向上させ、同じ点灯電流である場合
にはＬＥＤチップの温度を低く保ち信頼性の向上が図れ
るものとすると共に、ＬＥＤチップに同じ最大温度を許
容する場合には一層に多くの点灯電流の印加を可能とし
て、更に一層に明るい平面実装型ＬＥＤ素子の実現を可
能とし、この種の平面実装型ＬＥＤ素子の用途の拡大な
どにも優れた効果を奏するものである。Second, the bottom surface of the horn portion is made of copper foil adhered to the back side of the resin substrate, so that one surface of this copper foil is directly exposed to the outside, and the LED chip In the case of the same lighting current, the LED chip temperature is kept low to improve reliability, and when the same maximum temperature is allowed for the LED chip, more lighting is performed. By applying a current, it is possible to realize an even brighter surface-mounted LED element, which is also excellent in expanding the applications of this type of plane-mounted LED element.
【図１】 本発明に係る平面実装型ＬＥＤ素子の実施形
態を示す断面図である。FIG. 1 is a cross-sectional view showing an embodiment of a planar mounting type LED element according to the present invention.
【図２】 従来例を示す断面図である。FIG. 2 is a sectional view showing a conventional example.
１……平面実装型ＬＥＤ素子 ２……樹脂基板 ２ａ……貫通孔 ３……ホーン部 ３ａ……反射面 ３ｂ……底面 ４……銅箔 ４ａ、４ｂ……端子部 ５……導電部 ６……ＬＥＤチップ ７……金ワイヤ ８……ケース部 Ｚ……照射方向 DESCRIPTION OF SYMBOLS 1 ... Plane mounting LED element 2 ... Resin board 2a ... Through-hole 3 ... Horn part 3a ... Reflection surface 3b ... Bottom surface 4 ... Copper foil 4a, 4b ... Terminal part 5 ... Conducting part 6 …… LED chip 7 …… Gold wire 8 …… Case part Z …… Irradiation direction
Claims (1)
ン部を設け、該ホーン部の底面にＬＥＤチップをマウン
トしてなる平面実装型ＬＥＤ素子において、前記ホーン
部が、前記樹脂基板を貫通して設けられた上拡がりのテ
ーパー状の貫通孔により構成される反射面と、前記樹脂
基板の底面側から貼着される銅箔により構成される底面
とされていることを特徴とする平面実装型ＬＥＤ素子。1. A planar mounting type LED device comprising a resin substrate provided with a horn portion including a reflection surface and a bottom surface, and an LED chip mounted on the bottom surface of the horn portion, wherein the horn portion penetrates the resin substrate. A planar surface characterized by having a reflecting surface formed by a tapered through-hole extending upward and a bottom surface formed by a copper foil adhered from the bottom side of the resin substrate. Type LED element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10082206A JPH11284233A (en) | 1998-03-27 | 1998-03-27 | Flat mounting type led element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10082206A JPH11284233A (en) | 1998-03-27 | 1998-03-27 | Flat mounting type led element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11284233A true JPH11284233A (en) | 1999-10-15 |
Family
ID=13767959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10082206A Pending JPH11284233A (en) | 1998-03-27 | 1998-03-27 | Flat mounting type led element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11284233A (en) |
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