JPH11258055A - Thermopile type temperature sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a temperature sensor, and accurately measure a cold junction temperature without being influenced by infrared rays by arranging a temperature measuring element such as thermistor on the surface on the opposite side of the surface forming a thermopile of a sensor base board. SOLUTION: A temperature measuring thermopile 9 is formed by arranging a cold junction 7 and a hot junction 8 of a thermocouple by alternately wiring/ joining thermoelectric materials 5, 6 between the upper surface of a heat sink 7 (a sensor base board) 2 composed of a silicon substrate and the upper surface of an insulating thin film 4 having electric insulating performance. When infrared rays are applied to the hot junction 8, thermoelectromotive force is generated, so that electromotive force according to a temperature difference between the hot junction 8 and the cold junction 7 is outputted from electrodes 10 on both ends of the thermopile 9. A thin film thermistor 13 is formed on the surface of an insulating thin film 12 covering an aluminum thin film 11 over the whole under surface of a heat sink 2. A temperature of the cold junction 7 is measured by measuring a temperature of the heat sink 2 by this thin film thermistor 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermopile type temperature sensor for measuring the temperature of an object without contact.

[0002]

2. Description of the Related Art Conventionally, a thermopile type temperature sensor utilizing an electromotive force generated in a thermocouple has been used. The thermopile type temperature sensor forms a thermopile by connecting two kinds of different types of metals or semiconductors in series to form a thermopile, and arranges a thermopile hot junction on a member having a small heat capacity such as an insulating thin film. The cold junction is disposed on a member having a large heat capacity such as a heat sink, and the hot junction is covered with an infrared absorber. When infrared rays emitted from the object to be measured are absorbed by the infrared absorber formed on the hot junction and converted into heat, a temperature difference occurs between the cold junction and the hot junction, so that the infrared rays are formed at both ends of the thermopile. Since an electromotive force is generated between the electrodes, the temperature of the object is measured by measuring the electromotive force. That is, assuming that the thermoelectromotive force generated when the temperature of the hot junction or the cold junction of the thermopile is T is represented by φ (T), when the temperature of the hot junction is Tw and the temperature of the cold junction is Tc, An electromotive force V represented by the following equation (1) is generated between both ends of a thermopile having m hot junctions and m cold junctions. V = m [φ (Tw) −φ (Tc)] (1) Accordingly, assuming that the temperature Tc of the heat sink is known, the temperature Tw of the object to be measured is measured by measuring the electromotive force V generated in the thermopile. It can be measured without contact.

Since the thermopile type temperature sensor based on such a principle can detect only the temperature difference between the hot junction and the cold junction, the temperature of the cold junction as a reference for determining the temperature of the hot junction is determined. Must be measured separately. A thermistor is mainly used to determine the temperature of the cold junction, and the thermistor is mounted near a thermopile type temperature sensor on a mounting board or the like, and the temperature of the thermistor is detected as the cold junction temperature.

However, in the case where the thermistor is mounted in the vicinity of the thermopile type temperature sensor as described above, since the thermistor is slightly apart from the thermopile type temperature sensor on the mounting board, the cold junction is not provided. However, the temperature of the mounting board on which the temperature sensor is mounted is detected instead of the temperature, and it is difficult to accurately detect the cold junction.

Further, since the mounting area of the thermopile type temperature sensor and the thermistor is required on the mounting board, the total area required for mounting the thermopile type temperature sensor and the thermistor is increased, and the thermopile type temperature sensor is increased. It is difficult to reduce the size of the temperature detector including the thermistor and thermistor. Therefore, when it is desired to insert a temperature sensor into a thin tube to detect the temperature inside the tube, there has been a problem that the temperature sensor cannot be inserted deep into the tube and accurate measurement cannot be performed. For example, when used as an ear thermometer, unless the temperature sensor is miniaturized, the temperature sensor cannot be inserted near the eardrum where the most accurate body temperature can be detected, and the accurate body temperature cannot be measured.

Therefore, in a thermopile type temperature sensor (thermopile type infrared sensor) disclosed in Japanese Patent Application Laid-Open No. 5-90649, a thermistor is integrally provided on the chip surface of the thermopile type temperature sensor. In this conventional example, since the thermistor is provided on the chip surface of the thermopile type temperature sensor, the thermistor and the cold junction can be brought close to each other, and the error between the temperature detected by the thermistor and the temperature of the cold junction is reduced.

[0007]

However, in this conventional example, since the thermistor is formed on the same surface as the thermopile, for example, when infrared rays are applied to the hot junction, infrared rays are simultaneously applied to the thermistor and the cold junction. May be irradiated. Since the cold junction is formed on a silicon substrate and silicon transmits infrared rays, the cold junction is hardly affected by infrared irradiation. In contrast, a thermistor generates a temperature change when exposed to infrared rays. Therefore, when the thermistor is irradiated with infrared rays, the temperature of the cold junction cannot be measured accurately, and there is a problem in the measurement accuracy and reliability of the temperature sensor.

Further, in this conventional example, since the thermistor is formed on the chip surface of the thermopile type temperature sensor, it seems that the overall size of the thermopile type temperature sensor and the thermistor can be reduced somewhat. However, since the area occupied by the thermopile and the area occupied by the thermistor exist on the same plane, an area equivalent to two elements is required, and as a result, this has not led to significant miniaturization. Therefore, it has not been possible to manufacture a small thermopile type temperature sensor that can be inserted into a thin tube such as the ear canal.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has as its object to provide a thermopile type temperature sensor having a thermopile for temperature measurement and a temperature measuring element such as a thermistor. The goal is to reduce the size. Another object of the present invention is to make it possible to accurately measure the cold junction temperature without being affected by infrared rays.

[0010]

A thermopile type temperature sensor according to a first aspect of the present invention is a thermopile type temperature sensor in which a thermopile having a hot junction and a cold junction is formed on a sensor substrate, the surface of the sensor substrate on which the thermopile is formed. On the opposite side, a temperature measuring element such as a thermistor is provided.

According to a second aspect of the present invention, there is provided a thermopile type temperature sensor, wherein a sensor substrate having a thermopile having a hot junction and a cold junction has a temperature measurement surface such as a thermistor on a surface opposite to a surface on which the thermopile is formed. It is mounted on the element and integrated.

The thermopile type temperature sensor according to the first and second aspects has a structure in which a temperature measuring element such as a thermistor and a thermopile are laminated.
A thermopile-type temperature sensor including a thermopile for measuring the temperature difference between the hot junction and the cold junction and a temperature measuring element for measuring the temperature of the cold junction can be miniaturized. Therefore, the number of sensors that can be obtained from one parent substrate (such as a semiconductor wafer) serving as a base of the sensor substrate increases, and the cost of the thermopile type temperature sensor can be reduced.

Further, since the thermopile type temperature sensor can be downsized, the thermopile type temperature sensor can be inserted deep into a thin tube or a hole. Can be inserted deeply (near the eardrum), accurately at the temperature (body temperature)
You can make measurements.

Further, since the thermopile and the temperature measuring element are provided on the opposite sides of the sensor substrate, even if the thermopile side is irradiated with infrared rays, the temperature measuring element is located on the back side of the sensor substrate and is not affected by the infrared rays. The temperature of the cold junction can be measured accurately. Therefore, the temperature of the object measured on the hot junction side can also be accurately measured.

If there is a possibility that infrared rays may pass through the sensor substrate from the thermopile side and reach the temperature measuring element to some extent, an infrared shielding layer may be provided between the thermopile and the temperature measuring element. The influence of infrared rays can be eliminated, and the measurement accuracy can be further improved.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIGS. 1 and 2
1 is a cross-sectional view showing a state before and after mounting a thermopile type temperature sensor 1 on a sensor mounting board 16 according to an embodiment of the present invention. As shown in FIG. 1, at the center of the upper surface of a heat sink (sensor substrate) 2 made of a silicon substrate,
A dish-shaped or mortar-shaped recess 3 is formed, and a hot-junction supporting film (insulating thin film) 4 having electrical insulation properties is provided on the upper surface of the recess 3 in a planar manner. The hot-junction support film 4 is formed of SiO ₂ , SiN, or the like.
The thickness is several microns to reduce the heat capacity.
Although not shown in the drawing, a small hole or slit used for forming the concave portion 3 by etching the silicon substrate is formed in a part of the hot junction supporting film 4.

As shown in FIG. 3, a first thermoelectric material 5 and a second thermoelectric material 6 are alternately arranged between the upper surface of the heat sink 2 and the upper surface of the hot junction support film 4.
The first and second thermoelectric materials 5 and 6 are joined on the upper surface to provide a cold junction 7 of a thermocouple, and the first and second thermoelectric materials are
Thermoelectric materials 5 and 6 are joined to provide a thermocouple hot junction 8,
This forms a thermopile 9 for temperature measurement in which thermocouples are connected in series. Electrodes 10 are provided at both ends of the thermopile 9, respectively. In addition,
The top of the hot junction 8 may be covered with an infrared absorber. Therefore, when the hot junction 8 is irradiated with infrared rays, a thermoelectromotive force is generated at the hot junction 8, and an electromotive force corresponding to the temperature difference between the hot junction 8 and the cold junction 7 is generated from the electrodes 10 at both ends of the thermopile 9. Is output.

An aluminum thin film 11 is formed on the entire lower surface of the heat sink 2, and the entire aluminum thin film 11 is covered with an insulating thin film 12. As the infrared shielding layer, a metal thin film other than the aluminum thin film 11 or a multilayer reflective film may be used.
1 is preferred. On the surface of the insulating thin film 12, a thin film thermistor 13 as shown in FIG. 4 is formed, and lead wires 14 and 15 are provided at both ends of the thin film thermistor 13. Since the heat sink 2 has a large heat capacity, the temperature change is small, and the temperature of the cold junction 7 and the temperature of the heat sink 2 are equal. Therefore, the heat sink 2 is formed by the thin film thermistor 13.
, The temperature of the cold junction 7 can be measured.

On the upper surface of the sensor mounting substrate 16 for mounting the thermopile type temperature sensor 1, as shown in FIG. 1 and FIG. A wiring pattern 18 for connecting to the lead wirings 14 and 15 of the thin film thermistor 13 is formed on both sides thereof. Then, as shown in FIG. 2, the thermopile type temperature sensor 1 is mounted on the sensor mounting substrate 16, and the lead wires 14, 15 of the thin film thermistor 13 are electrically conductive adhesive 19.
6, the thermopile-type temperature sensor 1 is fixed to the sensor mounting substrate 16 and the lead-out wirings 14 and 15 of the thin-film thermistor 13 are die-bonded.
And the wiring pattern 18 are electrically connected.

Further, by bonding wires (not shown) to both electrodes 10 of the thermopile 9, the output (temperature change) of the thermopile 9 can be taken out onto the sensor mounting board 16 or out of the sensor mounting board 16. As described above, by connecting the wiring from the wiring pattern 18 of the sensor mounting board 16 to the output circuit, the output of the thin film thermistor 13 (the temperature of the cold junction 7) can be taken out.

Since the thermopile type temperature sensor 1 has the above structure, it has the following features. Since the thin-film thermistor 13 is formed on the surface of the heat sink 2 opposite to the surface on which the thermopile is formed, the thermopile 9 and the thin-film thermistor 13 can be arranged in the same occupied area as the thermopile 9. The size can be very small. In particular, when used as an ear thermometer, by reducing the size of the thermopile type temperature sensor 1, the temperature sensor 1 can be inserted near the eardrum where the most accurate body temperature can be detected, and the body temperature can be accurately measured. it can. further,
Since the chip size can be reduced, the number of chips that can be obtained from one silicon wafer increases, and the cost of the temperature sensor 1 can be reduced.

Since the thin film thermistor 13 is provided on the surface opposite to the thermopile 9, the thermopile 9
When the heat sink 2 does not transmit the infrared light even if the heat sink 2 does not transmit the infrared light, the infrared light is blocked by the heat sink 2 and the hot-junction support film 4, and when the heat sink 2 is transparent to the infrared light, By providing the aluminum thin film 11 as described above, infrared rays can be blocked. Therefore, the thin film thermistor 13 can accurately detect the temperature of the cold junction 7 without being affected by infrared rays at all, and the temperature measurement accuracy of the thermopile type temperature sensor 1 is also improved.

Further, on the upper surface of the sensor mounting board 16,
Since the recesses 17 are provided so that the thin film thermistor 13 does not contact the sensor mounting board 16, even if a temperature change occurs in the sensor mounting board 16, the thin film thermistor 13 is affected by the sensor mounting board 16. Therefore, the temperature of the cold junction 7 can be accurately detected.

Further, since the thin-film thermistor 13 is used as a temperature measuring element on the lower surface of the heat sink 2, it is possible to manufacture the thermopile type temperature sensor 1 with a volume almost equal to that of the heat sink 2 forming the thermopile 9. That is, even if an element for measuring the temperature of the cold junction 7 is integrated with the heat sink 2, the thermopile temperature sensor 1 does not become large, and the thermopile temperature sensor 1 that is small and has high measurement accuracy can be obtained.

Further, when the thermopile type temperature sensor 1 is mounted on the sensor mounting substrate 16, if the conductive adhesive 19 is used, the sensor mounting substrate 1 of the thermopile type temperature sensor 1 can be used.
6 and the electrical connection between the thin film thermistor 13 and the wiring pattern 18 can be performed simultaneously, and the number of working steps can be reduced.

Next, the thermopile type temperature sensor 1
6A to 6G will be described.
First, aluminum is sputtered on the back surface of the silicon substrate 20 serving as the heat sink 2 to form an aluminum thin film 1.
1 [FIG. 6 (a)]. Then, insulating thin films 4a and 12 such as a silicon oxide film and a silicon nitride film are deposited on both surfaces of the silicon substrate 20 by a CVD apparatus or the like [FIG.
(B)], a thin film thermistor 13 and its lead wires 14 and 15 are formed on the insulating thin film 12, and are patterned [FIG. 6 (c)]. Thereafter, a thermopile 9 having a hot junction 8 and a cold junction 7 is connected in series to the surface of the silicon substrate 20 by dissimilar metals, for example, polysilicon (first thermoelectric material 5) and aluminum (second thermoelectric material 6). Form [FIG.
(D)]. Further, an oxide film is deposited on both surfaces of the silicon substrate 20 by a CVD apparatus or the like, and the oxide film 2 is formed on both front and back surfaces.
After [FIG. 6 (e)], the region under the thermopile 9 on the surface of the silicon substrate 20 is partially removed by wet etching [FIG. 6 (f)]. At this time, although not shown in the figure, fine holes, slits, and the like are formed in the insulating thin film 4a on the surface, and the etching solution comes into contact with the silicon substrate 20 through the gap, and the concave portion 3 is formed in the silicon substrate 20. Etching is performed, and a hot-junction support film 4 composed of a part of the insulating film 4a is formed thereon. Finally, when the oxide film 21 deposited on the substrate surface is removed by wet etching with hydrofluoric acid or the like, the thermopile type temperature sensor 1 is completed [FIG.
(G)].

(Second Embodiment) FIGS. 7 and 8 are sectional views showing states before and after mounting a thermopile type temperature sensor 31 on a sensor mounting board 16 according to another embodiment of the present invention. The thermopile type temperature sensor 31 is characterized in that one of the lead-out wirings 15 of the thin film thermistor 13 is electrically connected to the thermistor pad (wire bonding pad) 32 on the upper surface thereof via the heat sink 2.

For this purpose, first, one of the lead wirings 15
Must be electrically connected to the heat sink 2. That is, the heat sink 2 and one of the lead-out wires 15 of the thin film thermistor 13 are electrically connected as follows. For example, when using an n-type silicon substrate as the heat sink 2, phosphorus (P) is doped on the back surface of the silicon substrate (heat sink 2) to form an n ⁺ layer. An aluminum thin film 11 is formed on the n ⁺ layer.
Is formed, the silicon substrate and the aluminum thin film 11 are ohmically connected by heat treatment. Further, a thin film thermistor 13 and a lead wiring (aluminum electrode) 14, 1 are provided on an insulating thin film 12 formed on the aluminum thin film 11.
At the time of forming 5, a window is opened in the insulating thin film 12 at the position of the one extraction wiring 15, so that one extraction wiring 15 of the thin film thermistor 13 is connected to the aluminum thin film 11. As a result, one of the lead wires 15 of the thin film thermistor 13 is electrically connected to the heat sink 2.

On the other hand, the insulating thin film 4a formed on the upper surface of the heat sink 2 is opened, and the thermistor pads 3 are formed thereon.
2, and the thermistor pad 32 and the heat sink 2 are ohmically joined by heat treatment. In this way, the one outgoing wiring 15 of the thin film thermistor 13 formed on the lower surface of the heat sink 2 is electrically connected to the thermistor pad 32 on the upper surface of the heat sink 2. The insulating thin film 12
The surface of the thin film thermistor 13 formed thereon is further covered with the insulating thin film 12, and only the other extraction wiring 14 is exposed from the insulating thin film 12.

The sensor mounting board 16 of this embodiment includes
There is no recess 17 and a strip-shaped wiring pattern 18 is provided on a flat surface. Then, as shown in FIG.
A conductive adhesive 19 is applied to a region of the upper surface of the sensor mounting substrate 16 where the wiring pattern 18 passes, as large as the area of the thermopile type temperature sensor 31, and as shown in FIG.
A thermopile-type temperature sensor 31 is bonded and fixed thereon.

In such a structure, there is only one lead wire 14 on the lower surface of the thermopile type temperature sensor 31, so that the thermopile type temperature sensor 31 is attached to the sensor mounting board 1.
Severe alignment is not required when die-bonding to No. 6, making work easier and improving work efficiency. In addition, no special processing is required for the sensor mounting substrate 16, which leads to cost reduction. Note that the thermopile type temperature sensor 31 of this embodiment may be mounted on the sensor mounting board 16 as shown in FIG.

Since one of the lead wires 15 is electrically connected to the heat sink 2 by being connected to the aluminum thin film 11, the lead wire 15 can be easily connected to the aluminum thin film at an arbitrary position regardless of the shape of the thin film thermistor 13. 11 can be connected.

(Third Embodiment) FIGS. 9 and 10 are cross-sectional views showing states before and after mounting a thermopile type temperature sensor 41 on a sensor mounting board 16 according to still another embodiment of the present invention. . This thermopile type temperature sensor 4
1, a concave portion 42 is formed on the lower surface of the heat sink 2 so as to face the concave portion 3 on the upper surface, and the thin film thermistor 13 is provided on the top surface in the concave portion 42 on the lower surface via the aluminum thin film 11 and the insulating thin film 12. I have. This thin film thermistor 1
One of the lead-out lines 15 is electrically connected to the thermistor pad 32 on the upper surface thereof through the heat sink 2 in the same manner as in the second embodiment, and the other lead-out line 14 is located outside the recess 3. Is guided to the lower surface of the heat sink 2.

In this embodiment, a case where a metal substrate is used as the sensor mounting substrate 16 is shown, and a thermopile type temperature sensor 41 is die-bonded by applying a conductive adhesive 19 on the upper surface of the sensor mounting substrate 16. By
The thermopile-type temperature sensor 41 is fixed by bonding.
The lower wiring 14 is electrically connected to the sensor mounting board 16.

Although the drawing wiring 15 of the thin film thermistor 13 is connected to the heat sink 2 through the infrared cut aluminum thin film 11 in the drawing, the drawing wiring 1
If an aluminum electrode is used as 5, it is possible to directly join the heat sink 2 at a portion where the aluminum thin film 11 does not exist. Further, if the aluminum thin film 11 between the thin film thermistor 13 and the heat sink 2 is omitted, and the lead wiring 15 of the thermistor 13 is electrically connected directly to the heat sink 2 by using an aluminum electrode, the influence of infrared irradiation is exerted. However, the number of manufacturing steps can be reduced.

In this embodiment, since a metal substrate is used as the sensor mounting substrate 16, the connecting point of the lead-out wiring 14 of the thin film thermistor 13 is free, and the connection work is also facilitated. Further, the sensor mounting substrate 16 does not require any processing, and a commercially available sensor mounting substrate 16 (sensor stem)
Can be used. In the first and second embodiments, a similar effect can be obtained even if a metal substrate is used as the sensor mounting substrate 16.

Further, since the concave portion 42 is provided on the lower surface of the heat sink 2 and the thin film thermistor 13 is provided in the concave portion 42, the thin film thermistor 13 can be mounted on the sensor And the cold junction temperature can be accurately detected by the thin film thermistor 13.

In the method of manufacturing the thermopile type temperature sensor 41 of this embodiment, if the concave portion 42 is first formed on the lower surface of the silicon substrate, then the same method as that shown in FIG. 6 is used. be able to.

(Fourth Embodiment) FIGS. 11 and 12 are sectional views showing the structure of thermopile type temperature sensors 51 and 61 according to still another embodiment of the present invention. In the thermopile type temperature sensors 51 and 61, a sensor chip 52 having a thermopile 9 formed on the upper surface of a heat sink 2 is joined to the upper surface of a commercially available thermistor 53.

When the heat sink 2 and the thermistor 53 have substantially the same chip size as in the thermopile type temperature sensor 51 of FIG. 11, when the sensor chip 52 is die-bonded on the thermistor 53, the lower surface of the heat sink 2 of the sensor chip 52 Is connected to the upper surface electrode of the thermistor 53 by a conductive adhesive 54, and the thermistor pad 32 on the upper surface of the sensor chip 52 is connected.
Pull out. Similarly, the lower surface electrode of the thermistor 53 is fixed to the sensor mounting substrate 16 by the conductive adhesive 19 and is electrically connected.

Alternatively, like the thermopile type temperature sensor 61 shown in FIG.
When the chip size of 3 is large, the thermistor 53 protrudes from the sensor chip 52, so that the upper electrode of the thermistor 53 can be directly taken out by wire bonding at the portion 62 protruding from the sensor chip 52.

When the shape of the thermistor 53 is larger than the sensor chip 52 as shown in FIG. 12, a conventional thermopile type temperature sensor can be used as the sensor chip 52. Conventional sensor used as thermistor 5
The mounting area on the sensor 3 reduces the area required for the die bonding of the entire sensor, and the manufacturing process is simplified by extracting the electrode on the thermistor 53 directly from the thermistor 53 by wire bonding. For example, thermistor 5
3 and the sensor chip 52, the aluminum thin film 11 for infrared cut is formed.
The need for ohmic connection between the heat sink 1 and the heat sink 2 is eliminated.

If there is a commercially available thermistor 53 that can be purchased at a low price by mass purchase or the like, adopting the structure as in this embodiment will reduce the total thickness of the thin film thermistor 13 on the lower surface of the heat sink 2. It is also possible that the cost will be lower. Since the cost can be easily calculated, a low-cost thermopile-type temperature sensor can be provided by using a commercially available thermistor 53 or a thin-film thermistor 13 for the sensor substrate.

(Fifth Embodiment) FIG. 13 is a sectional view showing the structure of a thermopile type temperature sensor 71 according to still another embodiment of the present invention. This embodiment shows a case where a small thermistor 53 among commercially available thermistors 53 is used. When the sensor chip 52 is placed on a small thermistor 53, it is unstable. Therefore, the structure is as follows.

A concave portion 42 having a depth substantially equal to the height of the thermistor 53 is formed on the lower surface of the heat sink 2 of the sensor chip 52.
Is formed on the top surface of the concave portion 42, and the aluminum thin film 11 is electrically connected to the heat sink 2 by heat treatment. Also,
On the upper surface of the heat sink 2, together with the thermopile 9, a thermistor pad 32 electrically connected to the heat sink 2 is provided. Then, a conductive adhesive 72 is applied on the sensor mounting substrate (metal substrate) 16, and the lower surface electrode of the thermistor 53 is fixed to the sensor mounting substrate 16 and electrically connected by the conductive adhesive 72. Next, the conductive adhesive 5 is applied to the sensor mounting substrate 16 and the upper surface of the thermistor 53, respectively.
4 and 72 are applied, and the aluminum thin film 11 on the lower surface of the sensor chip 52 is adhered to the upper electrode of the thermistor 53 for electrical conduction. Is fixed. At this time, the sensor chip 52 and the sensor mounting board 16
The insulating thin film 4 on the sensor chip 52 side
Are formed, the sensor chip 52 and the sensor mounting board 16 are electrically insulated.

[Brief description of the drawings]

FIG. 1 is a sectional view of a thermopile type temperature sensor according to an embodiment of the present invention before being mounted on a sensor mounting board.

FIG. 2 is a cross-sectional view of the same thermopile type temperature sensor after being mounted on a sensor mounting board.

FIG. 3 is a top view of the thermopile type temperature sensor according to the first embodiment;

FIG. 4 is a bottom view of the thermopile type temperature sensor.

FIG. 5 is a plan view of the sensor mounting board according to the first embodiment;

FIGS. 6 (a) to 6 (g) are diagrams illustrating a manufacturing process of the thermopile type temperature sensor according to the first embodiment.

FIG. 7 is a cross-sectional view of a thermopile type temperature sensor according to another embodiment of the present invention before being mounted on a sensor mounting board.

FIG. 8 is a cross-sectional view after mounting the thermopile type temperature sensor on the sensor mounting board.

FIG. 9 is a cross-sectional view of a thermopile type temperature sensor according to still another embodiment of the present invention before being mounted on a sensor mounting board.

FIG. 10 is a cross-sectional view of the same thermopile-type temperature sensor after being mounted on a sensor mounting board.

FIG. 11 is a cross-sectional view of a thermopile type temperature sensor according to still another embodiment of the present invention after being mounted on a sensor mounting board.

FIG. 12 is a cross-sectional view of a thermopile type temperature sensor according to still another embodiment of the present invention after being mounted on a sensor mounting board.

FIG. 13 is a sectional view of a thermopile type temperature sensor according to still another embodiment of the present invention after being mounted on a sensor mounting board.

[Explanation of symbols]

 Reference Signs List 2 heat sink 4 insulating thin film 7 cold junction 8 hot junction 9 thermopile 11 aluminum thin film 13 thin film thermistor 16 sensor mounting substrate 19 conductive adhesive 20 silicon substrate 42 recess 53 thermistor

Claims (3)

[Claims] 1. A thermopile type temperature sensor in which a thermopile having a hot junction and a cold junction is formed on a sensor substrate, wherein a temperature measuring element such as a thermistor is provided on a surface of the sensor substrate opposite to a surface on which the thermopile is formed. A thermopile type temperature sensor characterized by comprising: 2. A sensor substrate on which a thermopile having a hot junction and a cold junction is formed is placed on a temperature measuring element such as a thermistor on a surface opposite to a surface on which a thermopile is formed, and integrated. A thermopile-type temperature sensor characterized in that: 3. The thermopile type temperature sensor according to claim 1, wherein an infrared shielding layer is provided between the thermopile and the temperature measuring element.