JPH11251335A - Mounting device for semiconductor element and mounting method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the mounting device of a semiconductor element and the mounting method capable of preventing the deviation of the semiconductor element, and accurately arranging it at a prescribed position even in the case that it is required to die-bond the semiconductor element with a minute interval, by turning thermosetting resin to a half set state at the time of initial die bonding. SOLUTION: A thermosetting adhesive material 12 supplied onto a substrate 11 is turned to the half set state by heat supplied from a collet through the semiconductor element 13 every time of loading the semiconductor element 13 and then, the thermosetting adhesive material 12 is hardened by an oven or a reflow furnace 15. Thus, even while die-bonding the other semiconductor elemet or during carriage for hardening die bonding paste, the deviation from the prescribed position obtained by image recognition is dissolved. Also, for the one with the need of die-bonding the semiconductor elements with the minute interval like an LED printing head, the defects of the deviation of a light emitting point and chip chipping, etc., are eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting apparatus for die-bonding a semiconductor device onto a circuit board using an adhesive resin, and a method for mounting the same.

[0002]

BACKGROUND ART Document name: VLSI packaging technology (lower) Nikkei BP pp. Conventionally, as a die bonding method using an adhesive resin, there has been the following method. FIG. 6 is a sectional view of such a conventional IC chip mounting process.

(1) First, as shown in FIG. 6 (a), a die bonding paste 52, which is a thermosetting resin, is dispensed at a predetermined position on a substrate 51 on which an IC chip 53 is mounted by a dispensing method, a stamping method, and screen printing. It is supplied in advance by a method or the like. The IC chip 53 is a die-bon collet 54
, And is aligned with the substrate 51 using image recognition or the like.

[0006] (2) Next, as shown in FIG. 6 (b), a predetermined load is applied by a die bond collet 54, and the IC chip 53 is mounted on the substrate 51. (3) The IC chips 53 are sequentially mounted on the substrate 51, and all the IC chips 53 are mounted as shown in FIG. (4) Thereafter, as shown in FIG. 6 (d), the die bond paste 52 is heated and cured using an oven or a reflow furnace 55.

[0005]

However, in the above-described conventional method for mounting an IC chip, during mounting of a plurality of IC chips on a substrate or during transfer to an oven or a reflow furnace to cure the die bond paste. Causes misalignment. For this reason, especially in the case where the IC chip needs to be bonded in very close contact with each other, such as an LED print head, white printing or contact between the IC chips occurs due to a shift in the light emitting point, which causes the IC chip crack. Had become.

The present invention eliminates the above-mentioned problems and requires that the thermosetting resin be in a semi-cured state at the time of the initial die bonding to prevent the semiconductor element from being displaced and to die-bond the semiconductor elements at minute intervals. It is an object of the present invention to provide a semiconductor device mounting apparatus and a mounting method thereof that can be accurately arranged at a predetermined position even in a certain case.

[0007]

According to the present invention, there is provided a method for mounting a semiconductor device, comprising: (1) a method of mounting a semiconductor device, wherein the semiconductor device is vacuum-adsorbed and a thermosetting adhesive is pressed onto a substrate by pressing a collet; A step of die bonding the semiconductor element using, and a step of heating the thermosetting adhesive to a semi-cured state by heating means, and transferring the substrate on which the semiconductor element is mounted to a heating furnace,
Curing the thermosetting adhesive.

[2] In the method for mounting a semiconductor element according to the above [1], the heating means is a collet having a heating mechanism, and the semiconductor element is heated in advance. [3] In the method for mounting a semiconductor element according to the above [1], the heating means is a heated stage, and heats a thermosetting adhesive previously attached to the semiconductor element. is there.

[4] In the method of mounting a semiconductor device according to the above [1], the heating means is hot air for externally heating the die bonding portion, and the thermosetting material attached to the semiconductor device in advance. The adhesive is heated. [5] The method for mounting a semiconductor element according to the above [3] or [4], wherein a thermosetting adhesive stored in a tray is attached to the semiconductor element.

[6] In the method of mounting a semiconductor device according to the above [3] or [4], a fixed amount of the thermosetting adhesive is discharged onto a die-bon paste supply stage, and the supply amount and the supply position are controlled. The thermosetting adhesive is attached to a semiconductor element. [7] A device for mounting a semiconductor element, comprising a collet having a vacuum suction means and a heating means for the semiconductor element, and a stage of the semiconductor element on which a thermosetting adhesive is formed.

[8] In the apparatus for mounting a semiconductor element according to the above [7], the collet is a pulse heat collet connected to a pulse heat power supply.

[9] In a semiconductor device mounting apparatus, a collet provided with a vacuum suction means for the semiconductor element, and a means for supplying a thermosetting adhesive to the semiconductor element sucked by the collet;
And a stage of a semiconductor element arranged on the constant heat.

[10] In a semiconductor device mounting apparatus,
A collet provided with a semiconductor element vacuum suction means, a means for supplying a thermosetting adhesive to the semiconductor element adsorbed by the collet, and an air supply section for blowing hot air during initial die bonding and a die bonding section heated. This is provided with a nozzle that performs the following.

[0013]

Embodiments of the present invention will be described below in detail. FIG. 1 shows a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a C-chip mounting process, and FIG. 2 is a configuration diagram of a collet used therein. FIG.
(B) is a bottom view of the collet.

The die bonding apparatus of this embodiment includes:
Although not shown, a die-bon paste supply unit is provided to supply a thermosetting die-bon paste 12 made of an epoxy resin or the like onto a substrate (circuit board) 11 in the same manner as in the above-described conventional method. Next, a die bond collet 14 which picks up an IC chip (semiconductor element) 13 and mounts it on the substrate 11
Is capable of generating heat due to the electric resistance of the die bond collet 14 itself when a current is applied.
As shown in (1), it is connected to a DC power supply (pulse heat power supply) 14A capable of pulse heating. Further, an opening 14B capable of vacuum suction is provided, and is connected to a vacuum pump.

Although the position of the substrate 11 and the IC chip 13 is not shown, a camera and lighting are provided so that general image recognition can be performed. that's all,
Each part is operable and controlled in a horizontal direction and a vertical direction by a pulse motor or the like. Hereinafter, the IC of the first embodiment will be described.
The chip mounting method will be described with reference to FIG.

(1) First, as shown in FIG. 1 (a), for example, the substrate 11 to which the die bond paste 12 is supplied by the dispensing method, the stamping method, or the screen printing method as in the above-described conventional method is used. It is fixed at a predetermined position of the die bonding apparatus. The IC chip 13 is picked up from a tray or a wafer by vacuum suction using a pulse heat collet 14.

(2) Next, the mounting position of the substrate 11 and the IC chip 13 are aligned by image recognition (not shown) or the like. After the completion of the alignment, as shown in FIG. 1B, a predetermined load is applied to the IC chip 13 by the pulse heat collet 14, and the IC chip 13 is mounted on the substrate 11. At the same time, an electric current is applied to the pulse heat collet 14 to generate heat, and the die bond paste 12 is brought into a semi-cured state.

(3) Subsequently, other IC chips 13 are die-bonded in the same manner, and as shown in FIG.
The chip 13 is mounted. (4) Next, as shown in FIG. 1 (d), the die bond paste 12 is set in an oven or a reflow furnace 15 and cured. As described above, according to the first embodiment, the displacement of the semiconductor element from the predetermined position obtained by the image recognition is performed even during the die bonding of another IC chip or during the transportation for curing the die bond paste. Can be eliminated. In addition, for IC print heads that need to be die-bonded at minute intervals, such as LED print heads,
Defects such as displacement of light emitting points and chipping are eliminated.

Next, a second embodiment of the present invention will be described. FIG. 3 is a sectional view showing an IC chip mounting process according to a second embodiment of the present invention. In the die bonding apparatus of this embodiment, a stage heater 25 that is constantly heated is provided, and the substrate 21 is arranged on the stage heater 25 to raise the temperature to a constant temperature. In addition, die bond collet 2
4 is provided with an opening (not shown) for vacuum-sucking the IC chip 23, and this opening is connected to a vacuum pump so that the IC chip 23 can be picked up.

The die bond 22 is made of a thermosetting adhesive and is stored in the tray 20. The die-bond paste supply unit is provided with a mechanism for bringing the die-bond paste 22 into contact with the back surface of the IC chip 23 as a mechanism for directly supplying the die-bond paste 22 to the IC chip 23. Although the position of the substrate 21 and the IC chip 23 is not shown, a camera and illumination are provided so that general image recognition can be performed.

As described above, each section can be operated and controlled in the horizontal and vertical directions by a pulse motor or the like. Hereinafter, an IC chip mounting method according to the second embodiment will be described with reference to FIG. (1) First, as shown in FIG. 3A, the substrate 21 is fixed on a stage heater 25 controlled to a constant temperature and heated.

(2) Next, as shown in FIG.
The C chip 23 is vacuum-adsorbed from a tray or a wafer (not shown) by a die bond collet 24 and picked up.
Thereafter, the die-bonding paste 22 is brought into contact with the die-bonding paste 22 contained in the tray (die-bon paste storage) 20 to supply the die-bonding paste 22 to the back surface of the IC chip. (3) Next, as shown in FIG. 3C, the die bond paste 22 adheres to the back surface of the picked-up IC chip 23.

(4) Therefore, the mounting position of the substrate 21 and the IC
The position of the chip 23 is adjusted by image recognition (not shown) or the like. After the completion of the alignment, as shown in FIG. 3D, a predetermined load is applied to the IC chip 23 by the die bond collet 24, and the IC chip 23 is mounted on the substrate 21. At this time, since the substrate 21 is heated to a predetermined temperature by the stage heater 25, the die bond paste 22 can be brought into a semi-cured state.

(5) Subsequently, the other IC chips are die-bonded in the same manner, and after all the IC chips are mounted, an oven or a reflow furnace 26 is mounted.
And the die bond 22 is cured. As described above, according to the second embodiment, it is possible to eliminate the deviation of the semiconductor element from the predetermined position obtained by the image recognition even during the die bonding of the IC chip or during the transportation for curing the die bond paste. Can be.

Also, as in the case of an LED print head, an IC
With respect to chips that need to be die-bonded at minute intervals, defects such as displacement of light emitting points and chipping are eliminated. Further, in this embodiment, a large power supply such as the pulse heat power supply shown in the first embodiment becomes unnecessary.
Next, a third embodiment of the present invention will be described.

FIG. 4 is a sectional view showing an IC chip mounting process according to a third embodiment of the present invention. In the die bonding apparatus of this embodiment, the die bond 32 is accommodated in a syringe 37 as a die bond paste supply unit, and the syringe 3 is supplied.
Reference numeral 7 is connected to a pump for pushing out a fixed amount from the lower part of the die-bon paste supply stage 38. The die-bon paste supply stage 38 has an opening through which the extruded die-bon paste 32 is discharged. The die-bon paste 32 discharged from the opening is applied to the IC chip 33.
It is configured to be supplied in contact with the back surface. Another configuration is the second
This is the same as the embodiment.

Hereinafter, a method of mounting an IC chip according to the third embodiment will be described with reference to FIG. (1) First, as shown in FIG. 4A, the substrate 31 is fixed on a stage heater 35 controlled to a constant temperature and heated. (2) Next, as shown in FIG.
Is vacuum-adsorbed from a tray or a wafer by a die-bon collet 34 and picked up. IC picked up
The chip 33 extrudes a certain amount of the die-bon paste 32 from the syringe 37 containing the die-bon paste 32 below the die-bon paste supply stage 38 by, for example, gas pressure, and contacts the discharged die-bon paste 32 to the back surface of the IC chip 33. Supply.

(3) Next, as shown in FIG. 4C, the mounting position of the IC chip 33 on the substrate 31 and the IC chip 33 are aligned by image recognition or the like. After alignment is completed,
The die bond collet 34 is provided between the IC chip 33 and the substrate 31.
A predetermined load is applied to. At this time, since the substrate 31 is heated to a predetermined temperature by the stage heater 35, the die-bon paste 32 is in a semi-cured state.

(4) Next, as shown in FIG. 4 (d), the other IC chips 33 are die-bonded in the same manner, and after all the IC chips 33 are mounted, they are put into an oven or a reflow furnace 36.
The die-bon paste 32 is cured. Thus, the third
According to the embodiment, it is possible to eliminate the deviation of the semiconductor element from a predetermined position obtained by the image recognition even during the die bonding of the IC chip or during the transportation for curing the die bond paste. Furthermore, a fixed amount of the die bond paste is supplied to a predetermined position on the back surface of the chip, and the amount of the die bond paste protruding from the outer periphery of the IC chip can be controlled.
In addition, when the IC chip needs to be die-bonded at a minute interval, such as an LED print head, the displacement of the light emitting point and the rise of the die bond paste are eliminated.
Defects such as a decrease in light emission amount and chipping are eliminated.

Next, a fourth embodiment of the present invention will be described. FIG. 5 is a sectional view showing an IC chip mounting process according to a fourth embodiment of the present invention. In the die bonding apparatus of this embodiment, the substrate is fixed at a predetermined position, and the die bond collet 44 is provided with an opening (not shown) for vacuum-sucking and picking up the IC chip 43.
The die-bon paste supply unit may be configured to supply the substrate to the substrate in the same manner as in the conventional method, or to provide a supply unit to supply the back surface of the IC chip as in the second and third embodiments.

Further, in this embodiment, a nozzle 45 for blowing hot air 46 is provided near the die bond collet 44.
Is provided. Although the position of the substrate 41 and the IC chip 43 is not shown, a camera and lighting are provided so that general image recognition can be performed. As described above, the respective units can be operated in the horizontal and vertical directions by a pulse motor or the like and are controlled.

Hereinafter, a method of mounting an IC chip according to the fourth embodiment will be described with reference to FIG. (1) First, as shown in FIG.
Is vacuum-adsorbed from a tray or a wafer by a die-bon collet 44 and picked up. Daibon paste 42
Is supplied to the substrate 41 by a dispensing method, a stamping method, a screen printing method, or the like similar to the conventional method. When the die bond paste 42 is supplied to the IC chip 43, it is supplied to the back surface of the chip as shown in the second or third embodiment. Here, the IC of the substrate 41
The chip mounting position is aligned with the IC chip 43 by image recognition or the like.

(2) Next, as shown in FIG. 5B, after the alignment is completed, a predetermined load is applied to the IC chip 43 by the die bond collet 44, and the IC chip 4 is applied to the substrate 41.
3 is installed. At this time, hot air 46 of a predetermined temperature is blown out from the nozzle 45 to bring the die-bon paste 42 into a semi-cured state. (3) Next, other IC chips are die-bonded in the same manner, and all the IC chips 43 are mounted as shown in FIG.

(4) Next, as shown in FIG.
2 is cured. Thus, according to the fourth embodiment, I
Even during the die bonding of the C chip or during the transportation for curing the die bond paste, the deviation of the semiconductor element from a predetermined position obtained by image recognition can be eliminated.

Also, an IC such as an LED print head can be used.
With respect to chips that need to be die-bonded at minute intervals, defects such as displacement of light emitting points and chipping are eliminated. Further, in the method of the first embodiment, a large current is required by the pulse heating power supply, and in the second and third embodiments, the stage heater is large, so that a large capacity heater is required. However, as shown in the present embodiment, when the die-bon paste is semi-cured by blowing hot air from a nozzle, the equipment can be made compact and power can be saved.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

[0037]

As described above, according to the present invention, the following effects can be obtained. (A) According to the first aspect of the present invention, a deviation from a predetermined position obtained by image recognition is eliminated even during die bonding of another semiconductor element or during transportation for curing the die bond paste. be able to. In addition, when the semiconductor element needs to be die-bonded at minute intervals, such as an LED print head, it is possible to eliminate defects such as a shift of a light emitting point and chipping.

(B) According to the second or seventh aspect of the present invention, in addition to the effect of the above (A), the semiconductor element is heated via the collet at the same time as the adsorption by the collet, and the die bonding is performed during the initial die bonding. Since the paste can be made into a semi-cured state, the displacement of the semiconductor element can be prevented,
Even when the semiconductor elements need to be die-bonded at minute intervals, they can be accurately arranged at predetermined positions.

(C) According to the third or ninth aspect of the present invention, in addition to the effect of the above (A), it is not necessary to attach a heating means to the collet only by disposing a heater on the stage of the semiconductor substrate. Thus, the configuration can be simplified. (D) According to the invention of claim 4, in addition to the effect of the above (A), the die-bond paste can be semi-cured at the initial die bonding by hot air for externally heating the die bonding portion. As a result, the equipment can be made compact and power can be saved.

(E) According to the fifth aspect of the invention, in addition to the effects of (C) or (D), a thermosetting adhesive can be easily attached to the semiconductor element. (F) According to the invention of claim 6, in addition to the effect of (C) or (D), a predetermined amount of thermosetting adhesive can be supplied to the semiconductor element. (G) According to the invention of claim 8, in addition to the effect of the above (B), the die bond paste is instantaneously brought into a semi-cured state at the time of initial die bonding by the pulse heat collet connected to the pulse heat power supply. be able to.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an IC chip mounting process according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a collet used in an IC chip mounting step according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing an IC chip mounting process according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing an IC chip mounting process according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing an IC chip mounting process according to a fourth embodiment of the present invention.

FIG. 6 is a sectional view of a conventional IC chip mounting process.

[Explanation of symbols]

11, 21, 31, 41 Substrate (circuit board) 12, 22, 32, 42 Die bond paste (thermosetting resin) 13, 23, 33, 43 IC chip (semiconductor element) 14, 24, 34, 44 Die bond collet ( Pulse heat collet) 14A DC power supply (pulse heat power supply) 14B Vacuum adsorbable opening 15, 26, 36, 47 Oven or reflow furnace (heating furnace) 20 Tray (die-bon paste reservoir) 25, 35 Stage heater 37 Syringe 38 Die-bon Paste supply stage 45 Nozzle 46 Hot air

Continuation of the front page (72) Inventor Yuko Kitayama 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (10)

[Claims] 1. A method for mounting a semiconductor device, comprising:
(B) vacuum-adsorbing the semiconductor element, die-bonding the semiconductor element onto the substrate by pressing a collet using a thermosetting adhesive, and bringing the thermosetting adhesive into a semi-cured state by heating means; A) transferring the substrate on which the semiconductor element is mounted to a heating furnace and curing the thermosetting adhesive. 2. The method according to claim 1, wherein the heating means is a collet having a heating mechanism, and the semiconductor element is heated in advance. 3. The method of mounting a semiconductor device according to claim 1, wherein the heating unit is a heated stage.
A method for mounting a semiconductor element, comprising heating a thermosetting adhesive previously attached to the semiconductor element. 4. The method of mounting a semiconductor device according to claim 1, wherein said heating means is hot air for externally heating said die bonding portion, and said thermosetting adhesive previously attached to said semiconductor device. A method for mounting a semiconductor element, comprising heating an agent. 5. The method of mounting a semiconductor device according to claim 3, wherein a thermosetting adhesive stored in a tray is attached to the semiconductor device. 6. The method for mounting a semiconductor device according to claim 3, wherein a fixed amount of the thermosetting adhesive is discharged onto a die-bon paste supply stage, and a supply amount and a supply position are controlled. A method for mounting a semiconductor element, comprising attaching a thermosetting adhesive. 7. An apparatus for mounting a semiconductor element, comprising:
A semiconductor device mounting apparatus comprising: a collet having vacuum suction means and heating means for a semiconductor element; and (b) a semiconductor element stage on which a thermosetting adhesive is formed. 8. The semiconductor device mounting apparatus according to claim 7, wherein the collet is a pulse heat collet connected to a pulse heat power supply. 9. A semiconductor device mounting apparatus comprising:
A collet comprising vacuum suction means for a semiconductor element,
(B) means for supplying a thermosetting adhesive to the semiconductor element adsorbed by the collet; and (c) a semiconductor element stage arranged on constant heat. apparatus. 10. In a semiconductor device mounting apparatus,
(A) a collet provided with a vacuum suction means for the semiconductor element; (b) a means for supplying a thermosetting adhesive to the semiconductor element adsorbed by the collet; and (c) hot air blowing at the time of initial die bonding. An apparatus for mounting a semiconductor element, comprising: a nozzle for heating an air supply unit and a die bonding unit.