JPH11213365A - Recording/reproducing head supporting mechanism and actuator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the positional change of a recording/reproducing head caused by temperature change in a device in a recording/reproducing head supporting mechanism for a magnetic disk device or an optical disk device. SOLUTION: This recording/reproducing head is provided with a slider having an electromagnetic conversion element or an optical module, and a suspension. In this case, wiring patterns including conductor lines connected to the electromagnetic conversion element or the optical module are provided in both main surfaces of the suspension. Alternatively, the wiring pattern is provided in one main surface of the suspension by a structure where a resin cover is provided in the conductor line, and a resin pattern is provided in the other surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording / reproducing head support mechanism for a recording / reproducing apparatus such as a hard disk drive (hereinafter abbreviated as HDD) or an optical disk drive, and a mechanism for minutely displacing a slider. Actuator.

[0002]

2. Description of the Related Art In general, a conventional magnetic head supporting mechanism used for an HDD supports a slider provided with an electromagnetic transducer by a suspension, and provides a wiring pattern connected to the electromagnetic transducer on a surface of the suspension. .

The electromagnetic transducer has a magnetic pole and a coil for mutually converting an electric signal and a magnetic signal, and in addition to these, a magnetoresistive element for converting a magnetic signal into a change in current. These are formed by a thin film forming technique, an assembling processing technique, or the like. The slider is A
It is composed of a non-magnetic ceramic such as l ₂ O ₃ —TiC or CaTiO _3, or a magnetic material such as ferrite, and has a substantially rectangular parallelepiped shape. It is processed into a shape suitable for generating pressure for floating at a large distance. The suspension that supports the magnetic head is formed by subjecting an elastic stainless steel plate or the like to processing such as bending or punching. In general,
The wiring pattern has a structure in which a conductor wire is covered with a resin coating.

[0006] In the HDD, as the miniaturization and the recording density increase, the flying height of the magnetic head is reduced and the flying stability is required to be improved. The problem in this case is a temperature change inside the HDD. H
The temperature inside the DD changes in the range of about 20 to 80 ° C. during use. Since the thermal expansion coefficient of the resin coating of the wiring pattern and the stainless steel plate of the suspension are significantly different, if the wiring pattern is formed on only one side when viewed from the longitudinal center line of the suspension, the surface will be affected by temperature changes. In the inside, the position of the electromagnetic transducer is shifted. For this reason, Japanese Patent Application Laid-Open No. 8-102
In Japanese Patent Publication No. 162, the wiring pattern is arranged so as to be substantially symmetrical in physical characteristics with respect to a longitudinal center line of the suspension.

As described above, by disposing the wiring patterns symmetrically with respect to the longitudinal center line of the suspension, the displacement of the electromagnetic transducer due to the torsion of the suspension can be suppressed. However, in the magnetic head suspension described in the publication, since the wiring pattern is arranged only on one main surface of the suspension, the suspension is warped in the head flying direction due to a temperature change. As a result, the load characteristics of the magnetic head change, and the flying height becomes unstable. That is, since the spacing between the electromagnetic transducer and the medium becomes unstable, there arises a problem that the recording / reproducing characteristics are not stable.

Recently, studies have been made on a magnetic head called a pseudo contact type head having an extremely small flying height, and a contact type head in which the magnetic head always contacts the disk medium. A load is applied to these heads in a direction toward the surface of the medium so as to have a constant contact pressure. A factor that causes a flying height variation in a flying head is a factor that changes the contact pressure in a pseudo contact head or a contact head. When the contact pressure changes in these heads, the frictional force changes, which adversely affects seek control and track following control. Further, if the contact pressure changes in a direction in which the contact pressure increases, the surface of the medium may be damaged, dust may be generated, or the electromagnetic transducer may be damaged.

In the above, the magnetic head of the recording / reproducing head has been described. However, the above-mentioned problems relating to the fluctuation of the flying height of the magnetic head and the fluctuation of the contact pressure similarly occur in the recording / reproducing head for an optical disk device. . 2. Description of the Related Art A conventional optical disk device utilizes an optical pickup including an optical module having at least a lens. In this optical pickup, the lens is mechanically controlled so that the recording surface of the optical disc is focused. Recently, however, near-field recording has been proposed as a method for dramatically increasing the recording density of optical disks [NIKKEI E
LECTRONICS 1997.6.16 (no. 691), p. 99]. In this near-field recording, a flying head is used. This flying head uses the same slider as the flying magnetic head,
The slider incorporates an optical module having a hemispherical lens called a solid immersion lens (SIL), a magnetic field modulation recording coil, and a prefocus lens. A flying head for near field recording is also described in US Pat. No. 5,497,359. In such a flying head, strict management of the flying height is essential.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to suppress a change in the position of a recording / reproducing head due to a temperature change in the apparatus in a recording / reproducing head support mechanism of a magnetic disk device or an optical disk device.

[0009]

This and other objects are achieved by the present invention described below. (1) A slider provided with an electromagnetic transducer or an optical module, and a suspension. The slider is connected to the distal end of the suspension. A recording / reproducing head support mechanism, wherein there is a wiring pattern extending in a direction connecting the sides, and at least one of the wiring patterns includes a conductor wire connected to an electromagnetic conversion element or an optical module. (2) The recording / reproducing head support mechanism according to the above (1), wherein the wiring pattern is obtained by providing a resin coating on a conductor wire. (3) The recording / reproducing head support mechanism according to (1) or (2), wherein the number of conductor lines included in the wiring pattern is the same on one main surface side and the other main surface side of the suspension. (4) The recording / reproducing head support mechanism according to any one of (1) to (3), wherein the wiring pattern is provided symmetrically with respect to a straight line connecting the base end side and the end side of the suspension. (5) The recording / reproducing head support mechanism according to any one of the above (1) to (4), wherein the wiring patterns on both main surfaces of the suspension are plane-symmetric with respect to the suspension. (6) a slider provided with an electromagnetic transducer or an optical module, and a suspension, wherein the slider is connected to a distal end of the suspension, and a base end of the suspension is provided on at least one main surface of the suspension; There is a wiring pattern extending in a direction connecting the terminal side, and the wiring pattern is obtained by providing a resin coating on a conductor wire, and the resin pattern is present on at least the other main surface of the suspension, and At least one of the recording / reproducing head supporting mechanisms includes a conductor wire connected to the electromagnetic conversion element or the optical module. (7) The recording / reproducing head support mechanism according to (6), wherein the resin pattern has a larger coefficient of thermal expansion than the resin coating of the wiring pattern. (8) The recording / reproducing head support mechanism according to (6) or (7), wherein the resin pattern is thicker than the wiring pattern. (9) The recording / reproducing head support mechanism according to any one of (6) to (8), wherein the area of the resin pattern is larger than the area of the wiring pattern. (10) The slider and the suspension are connected via an actuator for displacing the slider, and at least one of the wiring patterns includes a conductor wire connected to the actuator. The recording / reproducing head support mechanism. (11) An integrated circuit element is present on at least one main surface of the suspension, and at least one of the wiring patterns includes a conductor line connected to the integrated circuit element. Recording / playback head support mechanism. (12) The recording / reproducing head support mechanism according to any one of (1) to (11), wherein the wiring pattern includes a dummy wiring that is not electrically connected. (13) A slider provided with an electromagnetic transducer or an optical module, and a suspension, the slider being connected to an end side of the suspension via an actuator for displacing the slider, and at least one of the mains of the suspension. A wiring pattern is present on the surface, at least one of the wiring patterns includes a conductor wire connected to an electromagnetic conversion element or an optical module, and an extended wiring pattern connecting the conductor wire and the electromagnetic conversion element or the optical module, A recording / reproducing head support mechanism provided on a surface of the actuator. (14) An actuator used in the recording / reproducing head support mechanism of (13).

[0010]

FIG. 1A and FIG. 1B show an example of the configuration of the recording / reproducing head support mechanism of the present invention. FIG.
(A) is a plan view seen from the disk medium facing surface side, FIG.
(B) is a plan view seen from the back side. FIG. 1 (a)
The magnetic head support mechanism shown in FIG. 1B includes a slider 2 provided with an electromagnetic transducer and a suspension 3. The slider 2 is connected to an end of the suspension 3. A wiring pattern 6 and a wiring pattern 5 connected to the electromagnetic transducer are provided on the surface of the suspension 3 facing the disk medium and on the back surface, respectively.

In the present invention, the suspension 3
Since the wiring patterns are formed on both main surfaces of the suspension 3, warpage of the suspension 3 in the floating direction due to a difference in the coefficient of thermal expansion between the suspension and the wiring pattern is suppressed, and fluctuations in the floating amount are less likely to occur. Therefore, stable recording and reproducing characteristics are realized.

Further, according to the present invention, FIG.
As shown in (b), the wiring pattern 5 is provided only on one main surface of the suspension, and the resin pattern 7 is provided on the other main surface.
May be provided. Also in this case, the difference in stress between the two main surfaces of the suspension is reduced, and a similar effect is realized.

The present invention is effective not only for the flying head but also for the above-mentioned pseudo contact head and contact head. If the present invention is applied when providing a wiring pattern on a pseudo contact type or contact type head, fluctuations in contact pressure can be suppressed, and stable track following control can be performed. Can be prevented, and the electromagnetic conversion element can be prevented from being damaged, so that the reliability can be improved.

In the above, the case where the present invention is applied to a magnetic head has been described. However, the present invention is also applicable to a recording / reproducing head used in a recording / reproducing apparatus for an optical recording medium such as an optical disk. In such a case, a similar effect is realized. A recording / reproducing head (optical head) for an optical recording medium to which the present invention can be applied has a slider similar to the above-described magnetic head, and an optical module is incorporated in the slider, or the slider itself is constituted by the optical module. It is. The optical module has at least a lens, and further incorporates a lens actuator, a magnetic field generating coil, and the like as necessary. As such an optical head, specifically, for example, a flying head used in the near-field recording described above (US Pat.
No. 7,359), but the present invention is also applicable to an optical head in which a slider slides on the surface of a recording medium, that is, a pseudo contact type or contact type optical head. The invention can be applied. When the present invention is applied to an optical head, it can be easily understood if the electromagnetic transducer is read as an optical module.

In the present specification, the recording / reproducing head is a concept including a recording / reproducing head, a recording-only head, and a reproducing-only head, and the recording / reproducing device is also a recording / reproducing device, a recording-only device, and a reproducing-only device. The concept includes a dedicated device. The recording medium is not limited to a recordable medium, and includes a read-only medium such as a read-only optical disk.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below by taking a magnetic head as an example. However, as described above, the present invention can be applied to an optical head.

FIG . 1: Wiring patterns on both main surfaces of the suspension
Configuration FIG 1 to provide a chromatography emissions (a) and 1 (b), shows a configuration example of a magnetic head supporting mechanism of the present invention. FIG. 1A is a plan view as viewed from the disk medium facing surface side, and FIG. 1B is a plan view as viewed from the side opposite to the disk medium facing surface. FIG.
FIG. 1C shows a cross-sectional view taken along line IC-IC of FIG. The magnetic head supporting mechanism shown in each of these figures has a slider 2 provided with an electromagnetic transducer and a suspension 3 supporting the slider. The suspension 3 has a base plate portion 31 having the highest rigidity and attached to the head drive mechanism of the magnetic disk drive from the base end to the end.
And a spring part 32 with low rigidity and a load beam part 33 with relatively high rigidity.

On one main surface of the suspension 3, a wiring pattern 5 including two conductor wires connected to a reproducing magnetoresistive head (MR head) included in the electromagnetic transducer is provided. On the other main surface, there is provided a wiring pattern 6 including two conductor wires connected to an inductive head for recording included in the electromagnetic transducer. The wiring patterns 5 and 6 extend in a direction connecting the base end side and the end side of the suspension 3. The shapes of the wiring patterns 5 and 6 are symmetric with respect to the center line of each main surface, and are symmetric with respect to the suspension.

The suspension 3 is generally made of an elastic metal material such as stainless steel. On the other hand, the wiring patterns 5 and 6 generally have a structure in which the conductor lines are covered with a resin coating. The method of forming the wiring pattern having such a structure is not particularly limited. For example, a resin film is formed as an insulating film on the surface of the suspension 3, a conductor wire is formed thereon, and a resin film is formed as a protective film. Or a method of bonding a wiring film formed of a laminate of such a resin film and a conductor wire to the suspension 3. As shown in FIG. 1C, the wiring patterns 5 and 6 in the illustrated example are insulating films 5a and 6a.
A wiring film sandwiching the conductor wires 5b and 6b between the protective films 5c and 6c is bonded to the suspension 3. The resin used for the wiring pattern is not particularly limited,
Usually, it is preferable to use a heat-resistant resin such as polyimide.

As described above, when a wiring pattern having a resin coating is provided on the surface of a suspension made of metal, the suspension may be warped or twisted as described above due to a difference in the coefficient of thermal expansion between the two. And FIG.
As shown in (b), the wiring pattern existing from the base end side to the end side of the suspension 3 is provided not only on one main surface of the suspension 3 but also on both main surfaces, and preferably both main surfaces are provided. By making the number of conductor lines included in each wiring pattern the same,
Warpage in the flying direction of the suspension due to a change in environmental temperature can be suppressed, and a decrease in durability and a change in recording / reproducing characteristics due to a change in the flying height can be suppressed. Further, by providing a wiring pattern symmetrically with respect to a straight line (the center line of the suspension in the illustrated example) connecting the base end side and the end side of the suspension on at least one main surface, more preferably on both main surfaces, It is possible to prevent a decrease in reproduction efficiency due to a track position shift of the electromagnetic transducer due to the torsion of the suspension. Further, by providing the wiring patterns on both main surfaces so as to be plane-symmetric with respect to the suspension as shown in the figure, the warpage suppressing effect is further enhanced.

FIG . 2 and FIG. 3: Configuration in which a resin pattern is provided. According to the present invention, a wiring pattern including at least a conductor wire connected to an electromagnetic transducer is formed on at least one main surface of a suspension at the base end and the end of the suspension. This also includes a configuration in which a resin pattern is provided on at least the other main surface of the suspension, extending in a direction connecting the sides. In addition,
The wiring pattern in this configuration is obtained by providing a conductor wire with a resin coating.

FIG. 2 shows a configuration example in which a resin pattern is provided.
(A), FIG. 2 (b) and FIG. 2 (c). FIG.
2A is a plan view as viewed from the disk medium facing surface side, FIG. 2B is a plan view as viewed from the side opposite to the disk medium facing surface, and FIG. 2C is FIG. 2B. IIC-II
It is a C line sectional view.

In this magnetic head supporting mechanism, FIG.
As shown in FIG. 1, a wiring pattern 5 including four conductor wires connected to the MR head and the induction type head of the electromagnetic transducer is provided on one main surface of the suspension 3. The wiring pattern 5 extends in a direction connecting the base end side and the end side of the suspension 3 and is symmetric with respect to the center line of the main surface. As shown in FIG. 2C, the cross-sectional structure of the wiring pattern 5 includes a resin insulating film 5a, a conductor wire 5 from the suspension side.
b, and a protective film 5c made of resin in this order, in which the conductor wire 5b is covered with a resin film. On the other hand, FIG.
As shown in (b), on the other main surface of the suspension 3, as in the case of the wiring pattern 5, it extends in a direction connecting the base end side and the end side of the suspension 3, and extends with respect to the center line of the main surface. A symmetrical resin pattern 7 is provided. As described above, by providing the wiring pattern having the resin coating on one main surface of the suspension and providing the resin pattern on the other main surface, the stress generated on the other main surface is reduced by the one main surface. Since the generated stress can be approximated and the two stresses can be equalized, the warpage of the suspension can be reduced or prevented, and the fluctuation of the flying height can be suppressed.

2 (a) and 2 (b), the resin pattern 7 is used as the wiring pattern 5 in order to easily explain that the stress can be canceled on both main surfaces of the suspension 3 by providing the resin pattern 7. FIG. The cross-sectional shape and the planar shape of the resin pattern 7 are substantially the same as the cross-sectional shape of the wiring pattern 5. However, actually, in order to cancel the stress due to the wiring pattern including the conductor line only by the resin pattern, the resin pattern is made thicker than the wiring pattern, the area of the resin pattern is made larger than the area of the wiring pattern, It is preferable to make the thermal expansion coefficient of the resin constituting the resin pattern larger than that of the resin constituting the wiring pattern. Further, these may be used in combination. This is the same as FIG. 3A and FIG.
The same applies to the configuration example of FIG.

The method for forming the resin pattern is not particularly limited, and may be any of coating, pasting, and the like.

In the magnetic head supporting mechanism shown in FIGS. 2 (a) and 2 (b), the structure other than the wiring pattern and the resin pattern is the same as that of the magnetic head supporting mechanism shown in FIGS. 1 (a) and 1 (b). The same is true.

FIGS. 3A and 3B show another example of a configuration in which a resin pattern is provided. FIG. 3A is a plan view seen from the disk medium facing surface side, and FIG.
FIG. 4 is a plan view as seen from the side opposite to the disk medium facing surface. As shown in FIG. 3A, in this configuration, the integrated circuit element 8 (signal processing IC: read / write IC) is fixed on one main surface of the load beam portion 33 of the suspension 3, and From the element 8, a wiring pattern 51 including four conductor lines connected to the electromagnetic transducer is extended to the end side of the suspension 3 and includes six conductor lines connected to an external circuit in the magnetic disk drive. Wiring pattern 5
2 extends to the proximal end side of the suspension 3. on the other hand,
As shown in FIG. 3B, a resin pattern 7 is provided on the other main surface of the suspension 3 as in FIG. 2B. The planar shape of the resin pattern 7 is
And the wiring pattern 52 are almost the same. Wiring patterns 51 and 52 and resin pattern 7
Are symmetrical with respect to the center line of the suspension main surface. The wiring patterns 51 and 52 have the same cross-sectional structure as the wiring pattern shown in FIG. Note that the number of conductor lines included in the wiring pattern is not particularly limited.

When the signal processing IC is provided on the suspension 3 as described above, in addition to the signal line, the power supply line and the IC control line are drawn out from the signal processing IC toward the base end of the suspension. The number of wirings to be performed increases, and the stress generated in the suspension 3 also increases. Therefore, the present invention is particularly effective. The reason why the signal processing IC is provided on the suspension is to reduce the length of the wiring pattern from the electromagnetic transducer to the signal processing IC, thereby reducing the capacitance of the wiring pattern and increasing the resonance frequency.

FIG . 4: Magnetic head having an actuator
4. Support Mechanism FIGS. 4, 5A and 5B show another configuration example of the magnetic head support mechanism of the present invention. The magnetic head supporting mechanism shown in each of these figures has a slider 2 provided with an electromagnetic transducer 1 and a suspension 3 supporting the slider 2, and an actuator 4 is provided between the slider 2 and the suspension 3. Things. 4 is an exploded perspective view, FIG. 5 (a) is a perspective view seen from the side opposite to the disk medium facing surface, and FIG. 5 (b) is a perspective view seen from the disk medium facing surface side. FIG. 6A is a perspective view of the suspension 3 as viewed from the side opposite to the disk medium facing surface.
FIG. 6B is a perspective view of the suspension 3 as viewed from the disk medium facing surface side.

The actuator 4 is for slightly displacing the slider 2 with respect to the suspension 3.
Gimbal part 3a provided at the end of suspension 3
It is fixed by bonding or the like. The actuator 4 will be described later in detail. The gimbal portion 3a is formed by providing a punched groove by etching or the like, and absorbs torsion, stress, and the like caused by following the disk medium surface, and prevents unnecessary external force from being applied to the actuator and the slider.

6 (a) and 6 (b), a wiring pattern 5 including four conductor wires connected to the actuator 4 is provided on one main surface of the suspension 3, and on the other main surface. A wiring pattern 6 including four conductor wires connected to the electromagnetic transducer 1 is provided. Both wiring patterns 5 and 6 are
As in the configuration example shown in FIGS. 1A and 1B, the suspension 3 extends in a direction connecting the base end side and the end side,
Each is symmetric with respect to the center line of each main surface,
Since the wiring pattern 5 and the wiring pattern 6 are plane-symmetric with respect to the suspension 3, FIGS. 6A and 6B
In the configuration shown in FIG. 1, the same effect as the configuration shown in FIGS. 1A and 1B can be obtained.

In FIGS. 6A and 6B, FIG.
Although the resin coating of the wiring pattern is not shown, a wiring pattern in which the conductor wires are covered with the resin coating is used as in the case of FIGS. 1A and 1B.

FIG. 7A and FIG. 7B show the actuator 4. FIG. 7A is a perspective view seen from the side opposite to the disk medium facing surface, and FIG. 7B is a perspective view seen from the side facing the disk medium. This actuator 4
Has a fixed part 43 and a movable part 44, and further has two rod-shaped displacement generating parts 41, 41 connecting these parts. The displacement generating section 41 is provided with at least one piezoelectric / electrostrictive material layer having an electrode layer on both sides, and is configured to generate expansion and contraction by applying a voltage to the electrode layer. The piezoelectric / electrostrictive material layer is made of a piezoelectric / electrostrictive material that expands and contracts by an inverse piezoelectric effect or an electrostrictive effect. Displacement generator 41
Is connected to the suspension via a fixed portion 43, and the other end of the displacement generating portion 41 is connected to a slider via a movable portion 44. The slider is displaced by the expansion and contraction of the displacement generating portion 41, and the electromagnetic conversion element is moved. It is configured to be displaced in an arc shape so as to intersect the recording track of the disk medium.

Wiring pattern 5 for driving actuator
Are connected to terminal electrodes provided on the fixed portion 43 of the actuator 4. This terminal electrode is connected to the internal electrode layer of the actuator and is not shown in FIG. 7A, but is a side end surface of the fixed portion 43 (a side surface opposite to the side surface to which the displacement generating portion is connected). It is provided in. FIG.
As shown in (b), an extension wiring pattern 92 is provided from the other side surface of the fixed portion 43 of the actuator 4 to the fixed portion 43, the displacement generating portion 41 and the movable portion 44 facing the disk medium. The extension wiring pattern 92 is shown in FIG.
As shown in (b), the slider 2
Are connected to terminal electrodes 93 provided on the surface on which the electromagnetic transducer 1 is formed. The terminal electrode 93 is an electrode connected to the electromagnetic transducer 1. That is, the wiring pattern 6 provided on the disk medium facing surface of the suspension 3 is connected to the electromagnetic transducer 1 via the extension wiring pattern 92 and the terminal electrode 93.

In the present invention, when an actuator for slightly displacing the slider is used, the suspension 3
The present invention is particularly effective because the number of wirings arranged thereon increases and the stress generated in the suspension 3 also increases. Since the effect of the present invention does not depend on the structure of the actuator, it is not limited to the integrated actuator having the structure shown in FIG. 7A and FIG. Any of an actuator using an electromagnetic force and an actuator using an electromagnetic force may be used.

The wiring pattern shown in each figure is an effective wiring pattern having conductor lines that are all electrically connected to each other, such as for an actuator drive signal and a recording / reproducing signal. And a dummy wiring pattern having conductor lines that are not electrically connected. The dummy wiring pattern is obtained by covering a conductor wire with a resin coating, similarly to the effective wiring pattern.

In the case where an actuator is provided, since the actuator is interposed between the suspension and the slider, the wiring pattern on the surface of the suspension cannot be directly connected to the terminal electrode of the slider.
In this case, the wiring pattern on the surface of the suspension and the terminal electrode of the slider may be connected via a wire. However, for example, as shown in FIG. It is preferable to connect the wiring pattern on the suspension surface and the terminal electrode of the slider via the extended wiring pattern 92. As a result, the following effects are realized.

1) Since the wire connection work is not required and the assembling work is easy, the cost can be reduced. 2) When connected by wires, the mass and rigidity of the wires may adversely affect the displacement performance and vibration characteristics of the actuator, and the positioning accuracy may be reduced. Since the connection can be made without using, the function of the actuator is not hindered. 3) Compared to the case of using a wire, there is substantially no fear of disconnection, and the reliability is improved.

The effect of providing the above-described extended wiring pattern on the actuator surface is the same as that of the recording / writing method of the present invention described above.
A reproducing head supporting mechanism, that is, a recording / reproducing head supporting mechanism in which wiring patterns are provided on both main surfaces of a suspension, and a wiring pattern is provided on one main surface of the suspension and the resin pattern is provided on the other main surface. Record /
The present invention is not limited to the reproducing head support mechanism, and can be applied to, for example, a recording / reproducing head supporting mechanism in which a wiring pattern is provided only on one main surface of a suspension.

FIG . 8: Arrangement of Actuator When positioning operation is performed by swinging the suspension using the VCM or the like, if there is an imbalance in mass between the upper surface and the lower surface of the suspension, the movement of the slider becomes improper due to generation of torsion and moment. May be stable. In order to improve this, it is preferable to adopt the configuration shown in FIGS. 8, 9A and 9B. 8 is an exploded perspective view, FIG. 9A is a perspective view seen from the side opposite to the disk medium facing surface, and FIG. 9B is a perspective view seen from the disk medium facing surface side. In the magnetic head supporting mechanism shown in each of these drawings, the actuator 4
Since the slider 2 is disposed on the lower surface of the suspension 3, the imbalance is improved and the slider 2 can move stably.

In the illustrated example, in order to provide a space between the slider 2 and the actuator 4 for disposing the suspension 3, a connecting member 4a thicker than the suspension 3 is bonded to the movable portion 44 of the actuator 4, Although the connecting member 4 a is interposed between the slider 44 and the slider 2, the connecting member 4 a may be formed integrally with the actuator 4. However, it is most preferable that a protrusion or a notch is provided on the surface of the slider 2 facing the actuator 4 to provide a gap in which the suspension 3 can be arranged.

Details of Actuator Here, details of the actuator 4 shown in FIGS. 7A and 7B will be described.

In the actuator 4, when the piezoelectric / electrostrictive material layer is made of a so-called piezoelectric material such as PZT in the displacement generating section 41, the piezoelectric / electrostrictive material layer usually has Polarization processing has been performed. The polarization direction by this polarization processing is the thickness direction of the actuator. When the direction of the electric field when a voltage is applied to the electrode layer matches the direction of the polarization, the piezoelectric / electrostrictive material layer between the two electrodes extends in the thickness direction (piezoelectric longitudinal effect), and in the in-plane direction, Shrink (piezoelectric lateral effect). On the other hand, when the direction of the electric field is opposite to the direction of the polarization, the piezoelectric / electrostrictive material layer contracts in its thickness direction (piezoelectric longitudinal effect) and elongates in its in-plane direction (piezoelectric transverse effect).

In the actuator shown in FIGS. 7 (a) and 7 (b), when a voltage for causing contraction is alternately applied to one of the displacement generating portions and the other displacement generating portion, the displacement of one of the displacement generating portions is reduced. The ratio between the length and the length of the other displacement generator changes, whereby both displacement generators flex in the same direction in the plane of the actuator. Due to this bending, the movable portion 44 swings relative to the fixed portion 43 in a direction indicated by an arrow in FIG. This swing is a displacement in which the movable section 44 draws an arc-shaped trajectory in a direction substantially perpendicular to the direction of expansion and contraction of the displacement generating section 41, and the swing direction exists in the plane of the actuator. Therefore, the electromagnetic transducer also swings along an arc-shaped trajectory.
At this time, since the direction of the voltage is the same as that of the polarization, there is no fear of the polarization decay, which is preferable. Even if the voltage applied alternately to the two displacement generating portions causes the displacement generating portions to extend, similar swinging occurs.

Further, in this configuration, voltages may be simultaneously applied to both displacement generators so as to cause displacements opposite to each other. That is, an alternating voltage may be simultaneously applied to one displacement generating unit and the other displacement generating unit such that when one expands, the other contracts, and when one contracts, the other expands. The swing of the movable portion 44 at this time is centered on the position where no voltage is applied. In this case, the amplitude of the swing when the driving voltage is the same is about twice that in the above case where the voltage is applied alternately. However, in this case, the displacement generating portion is extended on one side of the swing, and the driving voltage at this time is opposite to the direction of the polarization. Therefore, when the applied voltage is high or when the voltage is continuously applied, the polarization of the piezoelectric / electrostrictive material may be attenuated. Therefore, by applying a constant DC bias voltage in the same direction as the polarization and superimposing the alternating voltage on the bias voltage as the drive voltage, the direction of the drive voltage may be opposite to the direction of the polarization. Not to be. In this case, the swing is centered on the position when only the bias voltage is applied.

The actuator shown in FIGS. 7 (a) and 7 (b) is obtained by forming a hole and a notch in a plate of a piezoelectric / electrostrictive material provided with an electrode layer at a predetermined position.
The displacement generator 41, the fixed part 43, and the movable part 44 are formed integrally. Therefore, the rigidity and dimensional accuracy of the actuator can be increased, and there is no fear that an assembly error occurs. Further, since no adhesive is used for manufacturing the actuator, the adhesive layer does not exist in a portion where stress is generated by deformation of the displacement generating portion. Therefore, problems such as transmission loss due to the adhesive layer and aging of the adhesive strength do not occur.

As used herein, the term “piezoelectric / electrostrictive material” means a material that expands and contracts due to the inverse piezoelectric effect or the electrostrictive effect. The piezoelectric / electrostrictive material may be any material as long as it can be applied to the displacement generating portion of the actuator as described above. However, because of its high rigidity, PZT [Pb (Z
_{r, Ti) O 3],} PT (PbTiO 3), PLZT
A ceramic piezoelectric / electrostrictive material such as [(Pb, La) (Zr, Ti) O ₃ ] or barium titanate (BaTiO ₃ ) is preferable. When the actuator is made of a ceramic piezoelectric / electrostrictive material, it can be easily manufactured using a thick film method such as a sheet method or a printing method. Note that the actuator can also be manufactured by a thin film method. When the piezoelectric / electrostrictive material has a crystal structure, it may be a polycrystal or a single crystal.

The method for forming the electrode layer is not particularly limited, and may be appropriately selected from various methods such as firing of the conductive paste, sputtering, and vapor deposition in consideration of the method for forming the piezoelectric / electrostrictive material layer.

The actuator may have a structure in which at least one piezoelectric / electrostrictive material layer sandwiched between electrode layers on both sides is present in the displacement generating section, but preferably such a piezoelectric / electrostrictive material layer is used. Is preferably a laminated type in which two or more layers are laminated. The amount of expansion and contraction of the piezoelectric / electrostrictive material layer is proportional to the electric field strength. However, if the above-mentioned laminated type is used, the piezoelectric / electrostrictive material layer becomes thin, so that the required electric field strength can be obtained at a low voltage, and the Voltage can be reduced. If the same driving voltage is used as in the case of the single-layer structure, a larger amount of expansion and contraction can be obtained. The thickness of the piezoelectric / electrostrictive material layer is not particularly limited, and may be appropriately determined according to various conditions such as a driving voltage, a required amount of expansion and contraction, and ease of manufacturing, but is usually 5 to 50 μm.
It is preferred that it is about. There is no particular upper limit on the number of stacked piezoelectric / electrostrictive material layers, and the upper limit may be appropriately determined so that a displacement generating portion having a desired thickness is obtained. Note that a piezoelectric / electrostrictive material layer as a cover portion is usually provided further outside the outermost electrode layer.

Experimental Example In order to confirm the effect of the present invention, an experiment described below was performed.

First, as shown in FIG. 1A, a suspension having a wiring pattern extending in a direction connecting the base end side and the end side of the suspension on one main surface was manufactured. This wiring pattern is obtained by covering a conductor wire 6b made of Cu with a polyimide insulating film 6a and a polyimide protective film 6c, similarly to the wiring pattern 6 shown in FIG. This suspension was designated as Sample A.

On the other main surface of the sample A, the same wiring pattern as that provided on the one main surface was formed.

On the other main surface of the sample A, a resin pattern having the same planar shape and thickness as the above-mentioned wiring pattern but not including the conductor wire was provided.
And This resin pattern was made of the same polyimide (linear expansion coefficient: 24.3 ppm / ° C.) as the wiring pattern.

Further, polyimide having a higher linear expansion coefficient than the polyimide used for the wiring pattern (linear expansion coefficient 2
6.3 ppm / ° C.), and a sample C2 having a resin pattern formed on the other main surface of the suspension was prepared in the same manner as in the sample C1 except that the resin pattern was formed from the suspension.

A sample C3 was prepared in the same manner as the sample C1, except that the width of the resin pattern was 1.25 times.

Next, the temperature of the environment where each sample was placed was set to 2
By raising the temperature from 5 ° C. to 80 ° C. and measuring the relative displacement of the slider bonding portion with respect to the base plate portion, the amount of warpage of the suspension was obtained. As a result, 36.4 × 10 ⁻³ mm in sample A and 0.04 in sample B.
4 × 10 ⁻³ mm, 1.47 × 10 ⁻³ mm for sample C1,
It was 1.07 × 10 ⁻³ mm for sample C2 and 1.09 × 10 ⁻³ mm for sample C3. From these results, the effect of the present invention is clear.

[Brief description of the drawings]

FIG. 1 shows a configuration example of a magnetic head support mechanism of the present invention,
(A) and (b) are plan views, and (c) is a cross-sectional view taken along line IC-IC of (b).

FIG. 2 shows a configuration example of a magnetic head support mechanism of the present invention,
(A) and (b) are plan views, (c) of (b)
It is IIC-IIC sectional view.

FIGS. 3A and 3B are plan views showing a configuration example of a magnetic head support mechanism of the present invention.

FIG. 4 is an exploded perspective view showing a configuration example of a magnetic head support mechanism of the present invention.

FIGS. 5A and 5B are perspective views showing a configuration example of a magnetic head support mechanism of the present invention.

FIGS. 6A and 6B are perspective views showing a configuration example of a suspension in the magnetic head support mechanism of the present invention.

FIGS. 7A and 7B are perspective views showing a configuration example of an actuator in the magnetic head support mechanism of the present invention.

FIG. 8 is an exploded perspective view showing a configuration example of a magnetic head support mechanism of the present invention.

FIGS. 9A and 9B are perspective views showing a configuration example of a magnetic head support mechanism of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electromagnetic conversion element 2 Slider 3 Suspension 31 Base plate part 32 Spring part 33 Load beam part 3a Gimbal part 4 Actuator 4a Connecting material 41 Displacement generating part 43 Fixed part 44 Movable part 5, 51, 52 Wiring pattern 5a Insulating film 5b Conductor wire 5c Protective film 6 Wiring pattern 6a Insulating film 6b Conductor wire 6c Protective film 7 Resin pattern 8 Integrated circuit element 92 Extended wiring pattern 93 Terminal electrode

Continued on the front page (72) Inventor Yutake Sato 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation

Claims (14)

[Claims] A suspension provided with an electromagnetic conversion element or an optical module, and a suspension, wherein the slider is connected to a distal end side of the suspension; and a base end side of the suspension on both main surfaces of the suspension. A recording / reproducing head support mechanism, wherein there is a wiring pattern extending in a direction connecting the terminal and the terminal side, and at least one of the wiring patterns includes a conductor wire connected to an electromagnetic conversion element or an optical module. 2. The recording / reproducing head support mechanism according to claim 1, wherein the wiring pattern is formed by providing a resin coating on a conductor wire. 3. The recording / reproducing head support mechanism according to claim 1, wherein the number of conductor lines included in the wiring pattern is the same on one main surface side and the other main surface side of the suspension. 4. The recording / reproducing head support mechanism according to claim 1, wherein said wiring pattern is provided symmetrically with respect to a straight line connecting the base end side and the end side of the suspension. 5. The recording / reproducing head support mechanism according to claim 1, wherein the wiring patterns on both main surfaces of the suspension are plane-symmetric with respect to the suspension. 6. A suspension provided with an electromagnetic transducer or an optical module, and a suspension, wherein the slider is connected to a distal end of the suspension, and a base end of the suspension is provided on at least one main surface of the suspension. There is a wiring pattern extending in the direction connecting the side and the end side, this wiring pattern is provided with a resin coating on the conductor wire, at least on the other main surface of the suspension, the resin pattern is present, A recording / reproducing head support mechanism in which at least one of the wiring patterns includes a conductor wire connected to the electromagnetic transducer or the optical module. 7. The recording / reproducing head support mechanism according to claim 6, wherein the resin pattern has a larger coefficient of thermal expansion than the resin coating of the wiring pattern. 8. The recording / reproducing head support mechanism according to claim 6, wherein said resin pattern is thicker than said wiring pattern. 9. The recording / reproducing head support mechanism according to claim 6, wherein an area of said resin pattern is larger than an area of said wiring pattern. 10. The slider and the suspension are connected via an actuator for displacing the slider, and at least one of the wiring patterns includes a conductor wire connected to the actuator. Recording / reproducing head support mechanism. 11. The recording according to claim 1, wherein an integrated circuit element is present on at least one main surface of the suspension, and at least one of the wiring patterns includes a conductor line connected to the integrated circuit element. / Reproduction head support mechanism. 12. The recording / reproducing head support mechanism according to claim 1, wherein the wiring pattern includes a dummy wiring that is not electrically connected. 13. A slider provided with an electromagnetic transducer or an optical module, and a suspension, wherein the slider is connected to an end of the suspension via an actuator for displacing the slider, and at least one of the suspensions. A wiring pattern exists on the main surface of at least one of the wiring patterns, at least one of the wiring patterns includes a conductor wire connected to an electromagnetic conversion element or an optical module, and an extended wiring pattern connecting the conductor wire to the electromagnetic conversion element or the optical module. Is a recording / reproducing head support mechanism provided on the surface of the actuator. 14. An actuator used in the recording / reproducing head support mechanism according to claim 13.