JPH11171954A - Production of naphthol resin - Google Patents

Production of naphthol resin

Info

Publication number
JPH11171954A
JPH11171954A JP36238197A JP36238197A JPH11171954A JP H11171954 A JPH11171954 A JP H11171954A JP 36238197 A JP36238197 A JP 36238197A JP 36238197 A JP36238197 A JP 36238197A JP H11171954 A JPH11171954 A JP H11171954A
Authority
JP
Japan
Prior art keywords
naphthol
formaldehyde
reaction
resin
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP36238197A
Other languages
Japanese (ja)
Other versions
JP3935584B2 (en
Inventor
Katsuhiko Oshimi
克彦 押見
Yoshitaka Kajiwara
義孝 梶原
Kenichi Kuboki
健一 窪木
Yasumasa Akatsuka
泰昌 赤塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP36238197A priority Critical patent/JP3935584B2/en
Publication of JPH11171954A publication Critical patent/JPH11171954A/en
Application granted granted Critical
Publication of JP3935584B2 publication Critical patent/JP3935584B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Phenolic Resins Or Amino Resins (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a naphthol resin having a controlled molecular weight distribution, excellent in a cost and useful for a raw material of an epoxy resin, etc., by reacting naphthols with formaldehyde, etc., under a basic condition in the presence of phenolics to generate a methylol substance and reacting the system under an acidic condition. SOLUTION: (B) Preferably, naphthols such as β-naphthol, etc., is reacted with (C) formaldehyde or a formaldehyde generating source substance under a basic condition and preferably, in the presence of (A) phenolics such as o- cresol at 10-35 deg.C for usually 5 min-5 hrs to generate a methylol substance, then the reaction system is made to an acidic condition and the system is reacted preferably at 30-130 deg.C for usually 10 min-5 hrs to obtain a resin useful as a hardener, etc., of an epoxy resin. A charging ratio of the components A to C is preferably 0.7-1.5 mol of the component A and 1.0-1.2 mol of the component C as formaldehyde to 1 mol of the component B.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は特定の構造を有する
ナフトール樹脂の製造方法に関するものである。
TECHNICAL FIELD The present invention relates to a method for producing a naphthol resin having a specific structure.

【0002】[0002]

【従来の技術】ナフトール樹脂はナフトール骨格を有す
る樹脂の特徴である耐熱性、耐湿性などの優れた物性等
により、エポキシ樹脂の原料又はその硬化剤として電気
・電子部品等の分野で幅広く用いられている。そして、
これらの樹脂の低粘度化をはかり、硬化物の耐熱性を向
上させるためには、これらの分子量分布を狭く制御する
ことに効果があると考えられる。分子量分布を制御する
方法としては次の方法が知られている。
2. Description of the Related Art A naphthol resin is widely used in the field of electric and electronic parts as a raw material of an epoxy resin or a curing agent thereof due to its excellent properties such as heat resistance and moisture resistance which are characteristics of a resin having a naphthol skeleton. ing. And
In order to reduce the viscosity of these resins and improve the heat resistance of the cured product, it is considered effective to control the molecular weight distribution to be narrow. The following methods are known as methods for controlling the molecular weight distribution.

【0003】例えば、塩基性触媒の存在下でフェノール
類とホルムアルデヒドを反応させた後、中和し、次いで
酸性触媒の存在下でナフトール類と反応させる方法が、
特開平3−163128号公報に記載されている。
For example, a method of reacting phenols with formaldehyde in the presence of a basic catalyst, neutralizing the reaction, and then reacting with naphthols in the presence of an acidic catalyst,
It is described in JP-A-3-163128.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前記方
法では高価であるナフトール類を大量に用いなければな
らず、また原料の仕込み回数が増えるなど操作が煩雑に
なり、得られたナフトール樹脂も高価なものになってし
まう。そこで、分子量分布を制御し、コスト的に優れた
ナフトール樹脂を製造する方法が待ち望まれている。
However, in the above method, a large amount of expensive naphthols must be used, and the operation becomes complicated, such as an increase in the number of charging of raw materials, and the obtained naphthol resin is expensive. It becomes something. Therefore, a method for controlling the molecular weight distribution and producing a naphthol resin excellent in cost has been long-awaited.

【0005】[0005]

【課題を解決するための手段】本発明者らはこうした実
情に鑑み、分子量分布を制御したナフトール樹脂の簡便
な製造方法を求めて鋭意検討した結果、本発明を完成さ
せるに至った。
Means for Solving the Problems In view of such circumstances, the present inventors have intensively studied for a simple method for producing a naphthol resin having a controlled molecular weight distribution, and as a result, have completed the present invention.

【0006】即ち本発明は、(1)フェノール類の存在
下、ナフトール類を塩基性条件下でホルムアルデヒド又
はホルムアルデヒド発生源物質と反応させメチロール体
を生成させた後、次いで反応系を酸性条件下にした後、
反応を行うことを特徴とするナフトール樹脂の製造方
法、(2)ナフトール類が、β−ナフトールである上記
(1)記載のナフトール樹脂の製造方法、(3)フェノ
ール類が、o−クレゾール、p−クレゾールあるいはそ
れらの混合物である上記(1)または(2)記載のナフ
トール樹脂の製造方法に関するものである。
That is, the present invention relates to (1) a method of reacting naphthols with formaldehyde or a formaldehyde-generating substance in the presence of phenols under basic conditions to form a methylol compound, and then reacting the reaction system under acidic conditions. After doing
A method for producing a naphthol resin, wherein (2) the method for producing a naphthol resin according to the above (1), wherein the naphthol is β-naphthol; -The method for producing a naphthol resin according to the above (1) or (2), which is cresol or a mixture thereof.

【0007】[0007]

【発明の実施の形態】以下、本発明を詳細に説明する。
本発明において用いうるナフトール類の具体例として
は、α−ナフトール、β−ナフトール等が挙げられる。
なかでもβ−ナフトールは、反応活性点を2個有するα
−ナフトールに比べて反応活性点が1個と少なく、目的
とするナフトール樹脂の製造に際して、高分子量体の生
成が抑制され分子量の分布が容易で、しかも原料として
安価であるので特に好ましい。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
Specific examples of naphthols that can be used in the present invention include α-naphthol and β-naphthol.
Among them, β-naphthol is an α having two reactive sites.
It is particularly preferable because the number of reaction active sites is as small as one compared with naphthol, and the production of a high molecular weight substance is suppressed, the molecular weight distribution is easy, and the raw material is inexpensive when producing the target naphthol resin.

【0008】本発明において用いうるフェノール類の具
体例としては、フェノール、o−クレゾール、m−クレ
ゾール、p−クレゾール、2,5−ジ−tertブチル
フェノール、2,6−ジメチルフェノール、2,4−ジ
メチルフェノール、2−tertブチルフェノール、2
−tertブチル−5−メチルフェノール、2−ter
tブチル−4−メチルフェノール、p−オクチルフェノ
ール等の炭素数1〜10のアルキル基を有する置換フェ
ノール、臭素化フェノール等のハロゲン原子を有する置
換フェノール、2−アリルフェノール等のアリル基を有
する置換フェノール等が挙げられ、なかでもフェノー
ル、o−クレゾール、m−クレゾール、p−クレゾール
が好ましい。これらフェノール類は、単独で又は2種以
上を混合して使用することが出来る。
Specific examples of phenols usable in the present invention include phenol, o-cresol, m-cresol, p-cresol, 2,5-di-tertbutylphenol, 2,6-dimethylphenol, 2,4-dimethylphenol and 2,4-dimethylphenol. Dimethylphenol, 2-tertbutylphenol, 2
-Tertbutyl-5-methylphenol, 2-ter
Substituted phenols having an alkyl group having 1 to 10 carbon atoms, such as t-butyl-4-methylphenol and p-octylphenol, substituted phenols having a halogen atom such as brominated phenol, substituted phenols having an allyl group such as 2-allylphenol And the like, among which phenol, o-cresol, m-cresol and p-cresol are preferred. These phenols can be used alone or in combination of two or more.

【0009】本発明において用いるホルムアルデヒド発
生源物質とは、下記するようなメチロール化反応におい
てホルムアルデヒドを生成する物質であり例えばパラホ
ルムアルデヒド、トリオキサン、テトラオキサン等が挙
げられる。
The formaldehyde-generating substance used in the present invention is a substance that forms formaldehyde in a methylolation reaction as described below, and examples thereof include paraformaldehyde, trioxane, tetraoxane and the like.

【0010】ナフトール類、フェノール類、ホルムアル
デヒド又はホルムアルデヒド発生源物質の仕込み比率は
ナフトール類1モルに対して、フェノール類は通常0.
5〜2.0モル、好ましくは0.7〜1.5モル、ホル
ムアルデヒド又はホルムアルデヒド発生物質はホルムア
ルデヒドとして通常0.9〜1.3モル、好ましくは
1.0〜1.2モルである。
The charge ratio of naphthols, phenols, formaldehyde or a formaldehyde-generating substance is usually 0.1 mol per 1 mol of naphthols.
5 to 2.0 mol, preferably 0.7 to 1.5 mol, formaldehyde or formaldehyde-generating substance is usually 0.9 to 1.3 mol, preferably 1.0 to 1.2 mol, as formaldehyde.

【0011】反応は、無溶剤下、あるいは溶剤の存在下
で行うことが出来る。溶剤を使用する場合の具体例とし
ては、トルエン、キシレン、メチルイソブチルケトン、
水等が挙げられ、これらは単独で用いても良く、2種以
上用いてもよい。溶剤の使用量は仕込んだ原料の総重量
に対して通常30〜300重量%、好ましくは50〜2
50重量%である。
The reaction can be carried out in the absence of a solvent or in the presence of a solvent. Specific examples of using a solvent include toluene, xylene, methyl isobutyl ketone,
Water and the like are mentioned, and these may be used alone or in combination of two or more. The amount of the solvent used is usually 30 to 300% by weight, preferably 50 to 2% by weight based on the total weight of the charged raw materials.
50% by weight.

【0012】反応は、所定量のフェノール類、ナフトー
ル類、ホルムアルデヒドあるいはホルムアルデヒド発生
源物質及び塩基性触媒を仕込み反応系を塩基性条件下で
行う。塩基性条件下では、原料のメチロール体が生成す
る。メチロール化の反応温度は通常5〜40℃、好まし
くは10〜35℃、反応時間は通常5分〜5時間であ
る。
The reaction is carried out under a basic condition by charging a predetermined amount of phenols, naphthols, formaldehyde or a formaldehyde generating substance and a basic catalyst. Under basic conditions, a starting methylol form is formed. The reaction temperature for methylolation is usually 5 to 40C, preferably 10 to 35C, and the reaction time is usually 5 minutes to 5 hours.

【0013】塩基性触媒にはアルカリ金属水酸化物又は
アルカリ金属炭酸塩を用いる。具体例としては、水酸化
ナトリウム、水酸化カリウム、炭酸ナトリウム、炭酸カ
リウム等が挙げられ、水酸化ナトリウムが好ましい。塩
基性触媒の添加量はメチロール化反応が進行するのに充
分な量であれば良く、ナフトール類1モルに対して通常
0.02〜1.5当量、好ましくは0.05〜1.2当
量である。塩基性触媒は、固形のままでも、水溶液の状
態で添加してもよいが水溶液である方が好ましい。水溶
液として添加する場合の濃度は通常10〜50重量%、
好ましくは15〜45重量%である。
As the basic catalyst, an alkali metal hydroxide or an alkali metal carbonate is used. Specific examples include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate and the like, with sodium hydroxide being preferred. The addition amount of the basic catalyst may be an amount sufficient for the methylolation reaction to proceed, and is usually 0.02 to 1.5 equivalents, preferably 0.05 to 1.2 equivalents, per 1 mol of naphthols. It is. The basic catalyst may be added as a solid or in the form of an aqueous solution, but is preferably an aqueous solution. When added as an aqueous solution, the concentration is usually 10 to 50% by weight,
Preferably it is 15 to 45% by weight.

【0014】メチロール化反応終了後、塩酸、硫酸等の
酸性物質を中和剤として用い中和処理を行い反応系のp
H値を4〜7、好ましくは5〜7に調節しておく。中和
処理をすることにより発生した塩は水洗で除去しなくて
もよいが、水洗を行う場合は常法に従って行えばく、例
えば反応混合物中に水を加え分液抽出操作を繰り返す。
After the completion of the methylolation reaction, a neutralization treatment is carried out using an acidic substance such as hydrochloric acid or sulfuric acid as a neutralizing agent, and p of the reaction system is reduced.
The H value is adjusted to 4 to 7, preferably 5 to 7. The salt generated by the neutralization treatment does not have to be removed by washing with water, but when washing with water, it may be carried out according to a conventional method. For example, water is added to the reaction mixture, and the separation and extraction operation is repeated.

【0015】次いで、生成したメチロール体を酸性触媒
を添加して酸性条件下で更に反応させる。酸性触媒とし
ては種々のものを使用出来るが、塩酸、硫酸、p−トル
エンスルホン酸、シュウ酸等の無機あるいは有機酸、三
弗化ホウ素、無水塩化アルミニウム、塩化亜鉛等のルイ
ス酸が好ましく、特に塩酸、硫酸、p−トルエンスルホ
ン酸が好ましい。これらの酸触媒の使用量は特に限定さ
れるものではないが、原料のナフトール類100重量部
に対して通常0.05〜50重量部、好ましくは0.1
〜20重量部である。
Next, the resulting methylol compound is further reacted under acidic conditions by adding an acidic catalyst. As the acidic catalyst, various catalysts can be used, and preferred are inorganic or organic acids such as hydrochloric acid, sulfuric acid, p-toluenesulfonic acid, and oxalic acid, and boron trifluoride, anhydrous aluminum chloride, and Lewis acids such as zinc chloride. Hydrochloric acid, sulfuric acid and p-toluenesulfonic acid are preferred. The use amount of these acid catalysts is not particularly limited, but is usually 0.05 to 50 parts by weight, preferably 0.1 to 100 parts by weight for the raw material naphthols.
-20 parts by weight.

【0016】上記反応を行う際の温度は、通常5〜18
0℃、好ましくは30〜130℃、反応時間は通常10
分〜5時間である。縮合反応終了後、必要により上記の
酸触媒を更に添加し、反応系の温度を60〜130℃に
昇温し後反応を行うのが好ましい。この場合の反応時間
は通常0.5〜30時間、好ましくは1〜25時間であ
る。なお、縮合反応中生成する水を分留管を用いて反応
系外に除去することは、反応を速やかに行う上で好まし
い。
The temperature for carrying out the above reaction is usually 5 to 18
0 ° C., preferably 30 to 130 ° C., and the reaction time is usually 10
Minutes to 5 hours. After the completion of the condensation reaction, it is preferable to further add the above-mentioned acid catalyst if necessary, raise the temperature of the reaction system to 60 to 130 ° C., and carry out the reaction. The reaction time in this case is usually 0.5 to 30 hours, preferably 1 to 25 hours. In addition, it is preferable to remove water generated during the condensation reaction out of the reaction system by using a fractionating tube in order to quickly perform the reaction.

【0017】反応終了後、中和処理あるいは水洗処理を
行って生成物のpH値を3〜7、好ましくは5〜7に調
節しておく。水洗処理を行う場合は水酸化ナトリウム、
水酸化カリウムなどのアルカリ金属水酸化物、アンモニ
ア、ジエチレントリアミン、トリエチレントリアミン、
アニリン、フェニレンジアミンなどの有機アミンなどの
様々な塩基性物質等を中和剤として用いて処理してもよ
い。また水洗処理の場合は常法に従って行えばよい。例
えば反応混合物中に上記中和剤を溶解した水を加え分液
抽出操作を繰り返す。
After completion of the reaction, the pH value of the product is adjusted to 3 to 7, preferably 5 to 7 by performing a neutralization treatment or a water washing treatment. Sodium hydroxide for water washing,
Alkali metal hydroxides such as potassium hydroxide, ammonia, diethylenetriamine, triethylenetriamine,
The treatment may be performed using various basic substances such as aniline and organic amines such as phenylenediamine as a neutralizing agent. In the case of a water washing treatment, it may be carried out according to a conventional method. For example, water in which the neutralizing agent is dissolved is added to the reaction mixture, and the liquid separation extraction operation is repeated.

【0018】中和又は水洗処理を行った後、減圧加熱下
で溶剤及び未反応物質を留去し生成物の濃縮を行い、分
子量分布を制御したナフトール樹脂を得ることが出来
る。
After neutralization or washing with water, the solvent and unreacted substances are distilled off under reduced pressure and the product is concentrated to obtain a naphthol resin having a controlled molecular weight distribution.

【0019】[0019]

【実施例】次に本発明を実施例により更に具体的に説明
するが、以下において部は特に断りのない限り重量部で
ある。
Next, the present invention will be described in more detail with reference to examples. In the following, parts are by weight unless otherwise specified.

【0020】実施例1 撹拌機、コンデンサー、温度計を取り付けた丸底フラス
コにβ−ナフトール288部、メチルイソブチルケトン
(以下MIBK)841部を仕込み撹拌溶解後、30重
量%水酸化ナトリウム水溶液53部、o−クレゾール1
08部を加えた。この溶液にパラホルムアルデヒド(9
2%)67部を添加し、25℃で2時間反応を行った。
反応終了後、35%塩酸約41部を加え中和した。つい
でp−トルエンスルホン酸5.7部を添加し25℃で2
時間、80℃で2時間反応を行った。その後、反応液が
中性になるまで水洗を行い、油層中のMIBKを加熱減
圧下で留去し、目的のナフトール樹脂416部を得た。
収率は99%であった。得られたナフトール樹脂の15
0℃におけるICI溶融粘度は7.6P、軟化点は10
5℃、水酸基当量は140g/eqであった。
Example 1 A round-bottom flask equipped with a stirrer, a condenser and a thermometer was charged with 288 parts of β-naphthol and 841 parts of methyl isobutyl ketone (hereinafter MIBK), and dissolved by stirring. , O-cresol 1
08 parts were added. Add paraformaldehyde (9
(2%) 67 parts was added and reacted at 25 ° C. for 2 hours.
After completion of the reaction, about 41 parts of 35% hydrochloric acid was added for neutralization. Then, 5.7 parts of p-toluenesulfonic acid was added and the mixture was added at 25 ° C for 2 hours.
The reaction was carried out at 80 ° C. for 2 hours. Thereafter, water washing was performed until the reaction solution became neutral, and MIBK in the oil layer was distilled off under heating and reduced pressure to obtain 416 parts of a target naphthol resin.
The yield was 99%. 15 of the obtained naphthol resin
ICI melt viscosity at 0 ° C is 7.6P, softening point is 10
At 5 ° C, the hydroxyl equivalent was 140 g / eq.

【0021】実施例2 o−クレゾールの代わりにp−クレゾール108部を使
用した以外は実施例1と同様に仕込み、同様の方法で反
応を行った。目的のナフトール樹脂415部を得て、収
率は99%であった。また、得られたナフトール樹脂の
150℃におけるICI溶融粘度は8.0P、軟化点は
109℃、水酸基当量は140g/eqであった。
Example 2 The procedure of Example 1 was repeated except that 108 parts of p-cresol was used instead of o-cresol, and the reaction was carried out in the same manner. 415 parts of the desired naphthol resin was obtained, and the yield was 99%. The obtained naphthol resin had an ICI melt viscosity at 150 ° C. of 8.0 P, a softening point of 109 ° C., and a hydroxyl equivalent of 140 g / eq.

【0022】[0022]

【発明の効果】本発明によれば分子量分布を制御したナ
フトール樹脂を簡便に製造することができ、工業的価値
は大である。また、このような製法で得られたナフトー
ル樹脂はナフトール骨格を有する樹脂の特徴である耐熱
性、耐湿性などの優れた物性に加えて低粘度であるた
め、エポキシ樹脂の原料、及びエポキシ樹脂の硬化剤と
して好適であり、電気・電子部品等の分野で幅広く用い
ることができる。
According to the present invention, a naphthol resin having a controlled molecular weight distribution can be easily produced, and its industrial value is great. In addition, the naphthol resin obtained by such a production method has low viscosity in addition to excellent physical properties such as heat resistance and moisture resistance, which are characteristics of the resin having a naphthol skeleton. It is suitable as a curing agent and can be used widely in the fields of electric and electronic parts.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】フェノール類の存在下、ナフトール類を塩
基性条件下でホルムアルデヒド又はホルムアルデヒド発
生源物質と反応させメチロール体を生成させた後、次い
で反応系を酸性条件下にした後、反応を行うことを特徴
とするナフトール樹脂の製造方法。
(1) In the presence of a phenol, a naphthol is reacted with formaldehyde or a formaldehyde-generating substance under a basic condition to form a methylol compound, and then the reaction is carried out under an acidic condition. A method for producing a naphthol resin.
【請求項2】ナフトール類が、β−ナフトールである請
求項1記載のナフトール樹脂の製造方法。
2. The method for producing a naphthol resin according to claim 1, wherein the naphthol is β-naphthol.
【請求項3】フェノール類が、o−クレゾール、p−ク
レゾールあるいはそれらの混合物である請求項1または
2記載のナフトール樹脂の製造方法。
3. The method for producing a naphthol resin according to claim 1, wherein the phenol is o-cresol, p-cresol or a mixture thereof.
JP36238197A 1997-12-12 1997-12-12 Method for producing naphthol resin Expired - Fee Related JP3935584B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36238197A JP3935584B2 (en) 1997-12-12 1997-12-12 Method for producing naphthol resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36238197A JP3935584B2 (en) 1997-12-12 1997-12-12 Method for producing naphthol resin

Publications (2)

Publication Number Publication Date
JPH11171954A true JPH11171954A (en) 1999-06-29
JP3935584B2 JP3935584B2 (en) 2007-06-27

Family

ID=18476702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36238197A Expired - Fee Related JP3935584B2 (en) 1997-12-12 1997-12-12 Method for producing naphthol resin

Country Status (1)

Country Link
JP (1) JP3935584B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010242107A (en) * 2007-04-06 2010-10-28 Osaka Gas Co Ltd Phenol resin and method for producing the same
JP2014065829A (en) * 2012-09-26 2014-04-17 Dic Corp Cresol-naphthol resin, curable resin composition, cured material of the composition, and printed circuit board
JP2014065791A (en) * 2012-09-25 2014-04-17 Dic Corp Cresol-naphthol resin, curable resin composition, cured product thereof, and printed wiring board
JP2014114352A (en) * 2012-12-07 2014-06-26 Dic Corp Active ester resin, curable resin composition, cured product thereof, and printed wiring board
JP2014114411A (en) * 2012-12-12 2014-06-26 Dic Corp Active ester resin, curable resin composition, cured product thereof, and printed wiring board
WO2015125780A1 (en) * 2014-02-21 2015-08-27 日本化薬株式会社 Epoxy resin, epoxy resin composition, and cured product thereof
WO2015137299A1 (en) * 2014-03-11 2015-09-17 日本化薬株式会社 Epoxy resin mixture, curable resin composition, cured product thereof, and semiconductor device
CN113929846A (en) * 2021-10-22 2022-01-14 西北工业大学 High-carbon-formation-rate water-soluble phenolic resin and preparation method thereof

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010242107A (en) * 2007-04-06 2010-10-28 Osaka Gas Co Ltd Phenol resin and method for producing the same
JP2014065791A (en) * 2012-09-25 2014-04-17 Dic Corp Cresol-naphthol resin, curable resin composition, cured product thereof, and printed wiring board
JP2014065829A (en) * 2012-09-26 2014-04-17 Dic Corp Cresol-naphthol resin, curable resin composition, cured material of the composition, and printed circuit board
JP2014114352A (en) * 2012-12-07 2014-06-26 Dic Corp Active ester resin, curable resin composition, cured product thereof, and printed wiring board
JP2014114411A (en) * 2012-12-12 2014-06-26 Dic Corp Active ester resin, curable resin composition, cured product thereof, and printed wiring board
WO2015125780A1 (en) * 2014-02-21 2015-08-27 日本化薬株式会社 Epoxy resin, epoxy resin composition, and cured product thereof
KR20160125347A (en) * 2014-02-21 2016-10-31 닛뽄 가야쿠 가부시키가이샤 Epoxy resin, epoxy resin composition, and cured product thereof
WO2015137299A1 (en) * 2014-03-11 2015-09-17 日本化薬株式会社 Epoxy resin mixture, curable resin composition, cured product thereof, and semiconductor device
JP2015172105A (en) * 2014-03-11 2015-10-01 日本化薬株式会社 Epoxy resin mixture, curable resin composition, cured product thereof, and semiconductor device
CN105980441A (en) * 2014-03-11 2016-09-28 日本化药株式会社 Epoxy resin mixture, curable resin composition, cured product thereof, and semiconductor device
CN113929846A (en) * 2021-10-22 2022-01-14 西北工业大学 High-carbon-formation-rate water-soluble phenolic resin and preparation method thereof

Also Published As

Publication number Publication date
JP3935584B2 (en) 2007-06-27

Similar Documents

Publication Publication Date Title
JPH02245010A (en) Preparation of novolak and use of said novolak
JPH11171954A (en) Production of naphthol resin
CA1218189A (en) Reaction products prepared from a phenol, an aniline and aldehydes or ketones
JPH0521925B2 (en)
JP2631560B2 (en) Novolak epoxy resins with phenols and their production
JP3982661B2 (en) Naphthol resin, epoxy resin, epoxy resin composition and cured product thereof
US4137220A (en) Preparation of novolak epoxy resins
JPS6252764B2 (en)
JP2897850B2 (en) Method for producing high-purity tetrakisphenolethane
JPS58118812A (en) Manufacture of granular novolak resin and aqueous dispersion
US2897175A (en) Process for the production of epoxy resins
US4055546A (en) Novel thermosetting resins and process for preparing the same
JP2865439B2 (en) Epoxy resin and its cured product
JP2887213B2 (en) New compounds, resins, resin compositions and cured products
JPS63264622A (en) Polyfunctional epoxy resin
JP3604866B2 (en) Method for producing phenol-novolak condensate
JP2000273144A (en) Preparation of epoxy resin
JP2823056B2 (en) Epoxy resin composition and cured product thereof
JP2752498B2 (en) Method for producing hydroxycarboxylic acid derivative
JPH09268218A (en) Production of epoxy resin, epoxy resin composition and irs cured material
JP4039598B2 (en) Method for producing phenol aralkyl resin
JPH05155978A (en) Production of high-purity epoxy resin
JPH04225012A (en) Tetra-nuclear phenolic novolak and its production
JPH06329741A (en) Resin, epoxy resin, its production, resin composition and cured product of said composition
US3483164A (en) Trisphenols and epoxide resins prepared therefrom

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20031211

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060607

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060802

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070319

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070320

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100330

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130330

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130330

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20160330

Year of fee payment: 9

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees