JPH1027656A - High frequency testing device and electronic equipment using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently transmit a ultra high frequency signal in a normal condition and temporarily shut off and switch a signal path, if required, in a small-scale and low-profile structure at a lower manufacturing cost by providing a pair of contact members, a movable member and a conductive shell. SOLUTION: In a high frequency testing device 10, a movable member 60 is energized upward in a normal condition by an elastic material 70 and contact portions 23, 33 are short-circuited between a pair of contacts (contact members) 20, 30 into a conductive condition by the member 60. A high frequency signal transmission path is formed with these contacts 20, 30 and a conductive shell 50 to encircle these at a constant space. When a tesing probe 80 probes (thrusts and contacts), an outer conductor 81 for the probe 80 contacts the top of the shell 50. A center conductor 82 contacts and thrusts downward the member 60 via an access opening 51 and the portion 33 contacts a non-conductive area 65, so that a circuit between the contacts 20, 30 is opened and the member 20 is connected to the conductor 82 for the probe 80 for probing with a measuring instrument, if required.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a high-frequency test apparatus,
In particular, the present invention relates to a test probe device which is arranged in a high-frequency signal path and enables connection of a measuring instrument or the like.

[0002]

2. Description of the Related Art An electronic device such as a portable telephone is composed of a plurality of circuits or circuit blocks. For example, a reception unit including a reception antenna, a high-frequency amplification circuit, a demodulation circuit and a low-frequency amplification circuit, and a transmission unit including an audio signal amplification circuit from a transmitter, a modulation circuit, and a high-frequency output amplification circuit transmitted from the antenna. Equipped.

Generally, a received signal received from an antenna is amplified to a predetermined amplitude by a high-frequency amplifier circuit via a high-frequency coaxial connector.

In the manufacturing process of such a portable telephone,
It is common to measure whether or not each part of the telephone performs a predetermined operation, for example, at a stage prior to a high-frequency amplifier circuit or a demodulation circuit of the receiving unit.

For this purpose, a high-frequency switch is inserted in series with such a high-frequency signal path, a signal received from an antenna or the like is cut off from a subsequent stage, and the signal is switched to a measuring device probed to a connection terminal for a high-frequency level meter or the like. It is common.
With such a configuration, for example, various characteristics such as reception sensitivity, directivity, and noise of the antenna circuit can be measured.

An outline of a configuration for performing this measurement will be described with reference to FIG. Antenna 1 is for very high frequency reception example 1.9GH _Z, connects its output signal to the changeover switch 3 generally through a high-frequency coaxial cable 2. The switch 3 selectively switches the output signal of the antenna to the receiving circuit 4 or the measuring device 5.

With this configuration, as described above, in the normal state, the received signal of the antenna 1 is input to the receiving circuit 4 via the switch 3, and the measuring device is separated from the receiving circuit 4 when the evaluation of operation characteristics or the like is necessary. 5 can be input. However, a very high frequency of GH _Z-order In the portable communication device such as a PHS as described above is received (or transmitted) signal, for example 1.9GH _Z. Therefore, it is extremely difficult to switch and connect such a high-frequency signal to the measuring device 5 or the receiving circuit 4 with minimum loss and minimum characteristic deterioration.

An example of such a connector having a switching function for switching the ultrahigh frequency signal path is disclosed in Japanese Patent Application Laid-Open No. 6-236785. This connector with a switch is suitable for switching an internal / external antenna of a communication device such as a cellular phone.

This switch-equipped connector has a pair of resilient contacts disposed opposite to each other in a cylindrical outer shell, and the free ends of both contacts are usually in contact with each other and connected to the internal antenna circuit. . When switching to an external antenna, a contact of a connector connected to the external antenna is inserted between a pair of elastic contacts. This contact is a conductor on one side and is connected to one of the pair of elastic contacts, and the other side is an insulator, so that the other of the pair of elastic contacts is open. This makes it possible to switch and connect the internal antenna connected to the other of the pair of elastic contacts and the external antenna connected to one of the contacts via the connector.

An example of a similar high-frequency connector with a switch is disclosed in US Pat. No. 5,267,871.

[0011]

However, when such a conventional connector with a switch is used, particularly in the case of a small and low-profile structure, a pair of elastic contacts are excessively deformed, and the contact pressure between the two elastic contacts is insufficient. This causes contact instability, that is, lacks contact stability and reliability. In addition, miniaturization is limited due to the structure of such an elastic contact. Furthermore, since a pair of elastic contacts are arranged in the cylindrical shell, the contact and the shell are not completely coaxial, and there is a possibility that signal loss or deterioration may occur.

More importantly, the above-described switching mechanism is used only temporarily, for example, in the assembly and manufacturing process of a portable communication device. In a normal state, only the signal transmission function is used, and the switching function is not used. is there. The use of expensive and large-area components for such transient use is a waste of resources and is preferably avoided.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a small, low-profile structure capable of efficiently transmitting an ultra-high-frequency signal under normal conditions and temporarily interrupting or switching the ultra-high-frequency signal path when necessary, and at a low cost. An object of the present invention is to provide a high-frequency test device that can be manufactured and an electronic device that uses such a device.

[0014]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems and to achieve the above-mentioned object, a high-frequency test apparatus of the present invention for temporarily cutting off a high-frequency signal path and connecting a measuring instrument or the like has the following configuration. Have requirements. A pair of contact members which stand from the high-frequency signal path of the circuit board and face each other. A movable member that is slidably disposed between the contact members and is constantly in contact with the pair of contact members and selectively connected to and disconnected from the other. A conductive shell member surrounding the contact member and having an opening for accessing the movable member.

The electronic device of the present invention has a plurality of circuits interconnected by a high-frequency signal path.
A high-frequency test device is connected to this high-frequency signal path. This high-frequency test apparatus has a pair of contact members arranged opposite to each other, a movable member sliding between the contact members, and a conductive shell member surrounding the contact members. With this high-frequency test apparatus, a part of a plurality of circuits can be cut off to measure (test) the operating characteristics thereof.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a high-frequency test apparatus of the present invention and an electronic apparatus using the same will be described below with reference to the accompanying drawings, particularly FIG.
This will be described in detail with reference to FIGS.

FIG. 1 is a longitudinal (or side) sectional view of a preferred embodiment of a high frequency test apparatus according to the present invention. FIG. 2 is a longitudinal sectional view of the high-frequency test apparatus of FIG. 1 in a direction orthogonal to FIG.
FIG. 3 is a sectional view similar to FIG. 1 for explaining an operation when a test probe is probed in the high-frequency test apparatus of FIG. 4 shows the appearance of the high-frequency test apparatus of FIG. 1, wherein (A) is a plan view (top), (B) is a side view, and (C) is a bottom view.

The high-frequency test apparatus 10 of the present invention is used by being placed (for example, connected by soldering) on a well-known high-frequency circuit board (not shown). This circuit board includes various ICs (integrated circuits) similar to conventional electronic devices such as portable communication devices.
And active elements such as a resistor and a capacitor are connected by surface mounting (SMT) to form a circuit.

As best shown in FIG. 1, the high-frequency test apparatus 10 of the present invention has a pair of contacts (contact members) 20 and 30 that stand from the circuit board and face each other. The contacts 20 and 30 are horizontally soldered to the high-frequency signal path (run) of the circuit board, that is, the soldering portion 2 parallel to the surface of the circuit board.
1, 31 and an upright portion 2 which stands substantially perpendicularly thereto.
2, 32 and contact portions 23, 33 formed at their free ends.
And a transition portion 2 between the upright portions 22 and 32 and the contact portions 23 and 33.
4, 34. Standing part 2 of both contacts 20, 30
The reference numerals 2 and 32 are substantially parallel to each other at a relatively large interval.
On the other hand, the contact portions 23 and 33 face each other at a relatively small interval.

The contacts 20 and 30 are formed by stamping and forming (stamping and forming) an elastic copper alloy in the same manner as a general connector contact. At least the opposing surfaces of the contact portions 23 and 33 are plated with a noble metal such as gold, for example, so as to obtain good electrical contact characteristics (low contact resistance).

A cylindrical insulating housing 40 is formed and arranged so as to surround the pair of contacts 20 and 30. The outer surface of the insulating housing 40 is covered with a conductive shell (or case) 50. Both the insulating housing 40 and the conductive shell 50 have an access opening 51 at the center. It is preferable that the pair of contacts 20, 30 and the conductive shell 50 be maintained at a substantially constant interval, and that the characteristic impedance be maintained at a substantially constant value over the entire length of the contacts 20, 30.

A movable contact member (movable member) 60 is slidably provided between the contact portions 23 and 33 of the pair of contacts 20 and 30 via the access opening 51. As can be understood from FIG. 2, the movable contact member 60 is a substantially flat conductor, and the access opening 51 of the insulating housing 40 is provided.
And a relatively narrow top portion (probing portion) 61 corresponding to the substantially upper surface of the insulating housing 40, and shoulders 62 and 63 formed on both sides below the top portion. The shoulders 62, 63 engage the shoulders 42, 43 of the insulating housing 40 and act as stoppers for upward movement. Lower end 64 of movable member 60
A non-conductive elastic body 70 such as an elastomer is disposed. The elastic body 70 abuts on the lower end 64 of the movable member 60 and urges (or biases) the movable member 60 upward under normal conditions. As a result, the shoulders 62, 63 of the movable member 60 are in contact with the shoulders 42, 43 of the insulating housing 40.

The movable member 60 includes the contact members 20 and 30.
For example, a conductive metal of approximately 1 mm, which substantially corresponds to the distance between the contact portions 23 and 33, is preferably plated with a good conductive metal such as gold on the surface. 1, the entire surface of the movable member 60 is conductive on the right side, but has a non-conductive region 65 partially on the left surface. The non-conductive region 65 may be formed by forming a non-conductive plastic film such as Teflon on the surface of the movable member 60. Alternatively, the movable member may be formed of a normal small circuit board having a conductive layer formed on the entire surface, and only the non-conductive region 65 may be etched by a normal technique.

In order to mount the high-frequency test apparatus 10 of the present invention on a circuit board, a part of the outer periphery of the conductive shell 50 is exposed from the garden of the insulating housing 40 and soldered, as best shown in FIG. The portion 55 can be formed and connected to the ground pad of the circuit board by soldering using the SMT (reflow) technique (see FIGS. 4A to 4C).

The operation of the high-frequency test apparatus 10 according to the present invention will be described with reference to FIGS. In the high-frequency test apparatus 10, the movable member 60 is urged upward by the elastic body 70 in a normal state. Therefore, a pair of contacts 2
Since the contact portions 23 and 33 are short-circuited by the movable member 60 between 0 and 30, they are in a conductive state. A high-frequency signal transmission path is formed by the pair of contacts 20 and 30 and the conductive shell 50 surrounding the contacts at regular intervals.

However, as shown in FIG. 3, when the test probe 80 is probed (pressed contact) with the high frequency test apparatus 10, the outer conductor 81 of the test probe 80 contacts the top of the conductive shell 50. Also, the center conductor 82
Contacts the movable member 60 via the access opening 51 and presses downward. Here, the contact portion 33 of the contact member 30 contacts the non-conductive region 65 of the movable member 60. As a result, the circuit between the pair of contacts 20 and 30 is opened, and the contact member 20 is connected to the center conductor 82 of the test probe 80. When the test probe 80 is separated from the high frequency test apparatus 10, the movable member 60 is pushed up by the elastic body 70 and returns to the normal state in FIG.

Next, an electronic apparatus 100 using the high frequency test apparatus 10 of the present invention will be described. This high frequency test apparatus 10 is used, for example, instead of the changeover switch 3 of the portable communication device shown in FIG. One contact 20 is connected to the antenna 1 and the other contact 30 is connected to the receiving circuit 4. In the electronic device 100 configured as described above, the high-frequency reception signal from the antenna 1 is transmitted to the reception circuit 4 via the high-frequency signal path including the contacts 20 and 30 with a minimum loss in a normal state. When the user wants to probe the measuring device 5, the tip of a test probe 80, which is a high-frequency coaxial cable connected to the measuring device 5, is pressed against the high-frequency test apparatus 10. As a result, the antenna 1 is disconnected from the receiving circuit 4, and the test probe 80,
Connected to Note that the antenna 1 can be directly connected to the soldered portion 21 of the contact 20.

The preferred embodiments of the high-frequency test apparatus of the present invention and the electronic equipment using the same have been described above. However, the present invention should not be limited to only such specific forms,
It will be appreciated that various modifications are possible and many other applications are possible. For example, it is understood that the elastic body 70 is not necessarily required to be an elastomer, but may be a leaf spring, a coil spring, or the like made of a plastic material. Further, the non-conductive region of the movable member may be replaced with a non-conductive film to form a flat surface by filling a concave portion formed by etching or the like on the surface of the conductive metal with a non-conductive material. Furthermore, the shape of the contact can be any shape depending on the application.

[0032]

As will be understood from the above description, the high-frequency test apparatus of the present invention adds a switch function without substantially sacrificing high-frequency signal transmission characteristics, and enables probing of a measuring instrument when necessary. to enable. Moreover, since the configuration is relatively simple, small, and inexpensive to manufacture, it is suitable for small, high-density electronic devices such as portable communication devices. Also one
Since the contact portions of the pair of contacts are always at regular intervals, it is possible to provide a small and low-profile structure without having a large size having a large bending like a conventional switch contact.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a preferred example of a high-frequency test apparatus according to the present invention.

FIG. 2 is a longitudinal sectional view of the high-frequency test apparatus of FIG. 1 in a direction orthogonal to FIG.

FIG. 3 is a sectional view for explaining an operation when probing a measuring instrument to the high frequency test apparatus shown in FIG. 1;

FIG. 4 shows the appearance of the high-frequency test apparatus of FIG. 1,
(A), (B) and (C) show a plan view, a side view and a bottom view, respectively.

FIG. 5 is a block diagram of a conventional electronic device with a test switch.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 High frequency test apparatus 20, 30 Contact member (contact) 50 Conductive shell 51 Access opening 60 Movable member (movable contact) 100 Electronic equipment

Claims (2)

[Claims] 1. A high-frequency test apparatus for temporarily interrupting a high-frequency signal to enable connection of a measuring instrument or the like, comprising: a pair of contact members rising from a circuit board and facing each other; A movable member that is always slidably disposed and is in constant contact with one of the pair of contact members and selectively connected to and disconnected from the other of the contact members; and an opening that surrounds the contact member and accesses the movable member. A high-frequency test device comprising a conductive shell. 2. An electronic apparatus having a plurality of circuits interconnected by a high-frequency signal path, wherein the electronic apparatus is disposed in the high-frequency signal path and surrounds a pair of contact members, a movable member between the contacts, and the contact member. An electronic apparatus, comprising: a high-frequency test device including a conductive shell member, wherein a part of the circuit can be tested via the high-frequency test device.