JPH10125410A - High-frequency probe device and high-frequency connector used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency probe device that can be formed simply and compactly (shortly) with the minimum number of part items. SOLUTION: A high-frequency probe device comprises a coaxial probe 40 connected to a measuring instrument and a high-frequency connector 30. The high-frequency connector 30 is serially connected to a high-frequency signal path and has a pair of contacts 50 and 60 mutually erected opposite to each other and a grounding conductor 31 around there. An insulation rod 46 at a tip end of a center conductor 41 of the probe 40 is inserted between the contacts 50 and 60, a high-frequency signal path is interrupted, and probing is made possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency probe device, and more particularly to a device for inserting and connecting a probe device to a high-frequency signal path and a high-frequency connector used for the device.

[0002]

BACKGROUND OF THE INVENTION Portable telephones and electronic In the device transmitting and receiving antenna of the high-frequency amplifier, the modulation and demodulation circuit includes an output amplifier circuit and the like, especially high-frequency circuit gigahertz (GH _Z)
The circuit is configured to handle high frequency signals of the order. These high-frequency circuits have a stripline, microstripline, or coaxial circuit configuration so that the characteristic impedance is constant, for example, (50Ω).

[0003] With the spread of such portable telephones and the like,
A miniaturization for improving the portability and an inexpensive configuration for improving price competitiveness are essential.

[0004]

For example, it is conceivable to form a high-frequency signal path by connecting a coaxial connector to a high-frequency signal path, connecting a probe during probing, and short-circuiting the probe in a normal state. However, in a conventional electronic device such as a portable telephone, it is difficult to measure (probing) a high-frequency signal such as a reception output or a transmission output of an antenna by a probe of a measuring device when necessary during an assembly and manufacturing process. there were.

[0005] That is, the conventional probe device as described above not only has poor probing workability, but also has disadvantages in miniaturization and economy. Accordingly, an object of the present invention is to provide a high-frequency probe device free from such a drawback and a high-frequency connector used for the same.

[0006]

In order to achieve the above-mentioned object, a high-frequency probe device according to the present invention is provided with a pair of contacts connected in series to a high-frequency signal path and in elastic contact with each other, and disposed outside these contacts. A high-frequency connector having a ground conductor, and a probe having a concentric center conductor and an outer conductor and having an insulating member protruding from the end of the center conductor.

When this probe is inserted between a pair of contacts of a high-frequency connector, the contact between the contacts in a normal state is interrupted, and one of the contacts comes into contact with the center conductor of the probe. Can also be probed to the high-frequency signal path because the outer conductors of the first and second conductors are also in contact with each other. On the other hand, when the probing is completed, only the probe is pulled out, and the pair of contacts come into contact with each other due to their elasticity to form a normal high-frequency signal path.

According to the high frequency connector of the present invention,
It includes a pair of contacts having one end connected to the high-frequency signal path, the other end standing upright and in elastic contact with each other, and a ground conductor formed outside these contacts. When the insulator at the tip of the probe is inserted between the contacts, the contact between the contacts is interrupted, one of the contacts comes into contact with the center conductor of the probe, and the ground conductor and the outer conductor of the probe also come into contact with each other for probing.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a high-frequency probe device of the present invention and a high-frequency connector used therein will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a schematic block diagram showing an application example of the high-frequency probe device of the present invention. For example, a high-frequency connector 30 is connected in series to a high-frequency signal path H between a first high-frequency circuit 10 as an antenna and a second high-frequency circuit 20 as a high-frequency amplifier. A probe 40 including a measuring instrument can be connected to the high-frequency connector 30 when necessary.

[0011] RF connector 30 is shown as a switch connected in series to the GH _Z order of a transmit radio frequency signal, for example stripline, or coaxial circuit such as a high-frequency signal paths H. The high-frequency connector 30 transmits a high-frequency signal from the first high-frequency circuit 10 to the second high-frequency circuit 20 via the high-frequency signal path H under normal conditions. That is, the movable contact of the high-frequency connector 30 is connected to the position shown by the solid line. However, when the need for probing occurs, the movable contact of the high-frequency connector 30 is switched upward to cut off the output of the first high-frequency circuit 10 from the second high-frequency circuit 20 and connect to the probe 40 (ie, probing). . Therefore, the output of the first high-frequency circuit 10 can be measured and evaluated by the probe 40.

The use of the high-frequency probe device having the high-frequency connector 30 configured as described above allows the high-frequency output of the first high-frequency circuit 10 to be changed to the second high-frequency circuit 2 under normal conditions.
0 can be transmitted well. However, when probing is required, the probe 40 can be easily probed on the high-frequency connector 30. According to such a configuration, it is possible to achieve the object without making the circuit configuration complicated and expensive, and without causing attenuation or noise in the high-frequency signal.

A preferred embodiment of a high-frequency probe device of the present invention and a high-frequency connector used for the probe device will be described below with reference to FIGS.

FIG. 2 shows a preferred embodiment of the high-frequency connector 30 of the present invention, wherein (A) is a top or plan view, (B) is a bottom view, and (C) is a cross section along line CC of (A). FIG.

In a specific example, the high-frequency connector 30 is, for example, a square of 3.4 mm square and has a height of about 2 mm.
Very small to the extent. As is clear from the upper (or flat) plan view of FIG. 2A, a ground conductor 31 of a conductive metal plate having a round hole 32 having a diameter of about 2.3 mm formed in the center is disposed on the upper surface. In this round hole 32 an insulating housing 34 having a rectangular opening 33 is visible. In the center of the opening 33, a pair of elastic contacts 50 and 60 that stand from the bottom surface of the insulating housing 34a toward the top surface are arranged.

As best shown in FIG. 2C, the resilient contacts 50, 60 are insert molded, respectively, into inner housings 35, 36 which are preferably retained within an insulative housing 34. The elastic contacts 50 and 60 are soldered portions 51 and 61 exposed on the bottom surface of the insulating housing 34, and fixed portions 52 and 62 fixed to the inner housings 35 and 36.
And upright portions 53, 63 extending substantially vertically therefrom. Above the upright portions 53, 63, there are contact portions 54, 64 and free end portions 55, 65 that are curved toward each other. As is clear from FIGS. 2A and 2C, the contact portions 54 and 64 of the elastic contacts 50 and 60 are formed with notches in which the center portions are cut out in a substantially U-shape.

The two resilient contacts 50, 60 are configured such that the contact portions 54, 64 come into contact with each other by elasticity in a normal state where no external force is applied. Under this normal state, a substantially rectangular hole 56 is formed in the center of the contact portions 54 and 64 due to the notch of the contact portions 54 and 64 described above. The dimensions of this hole 56 in the preferred embodiment are approximately 0.4 x 0.6 mm. The free end 65 of one contact 60 extends from the free end 55 of the other contact 50, and serves as a contact point with the center conductor of the probe described later.

As can be seen from the bottom view of FIG. 2B, the grounding conductor 31 has four grounding tongues 38 extending to the bottom surface via the side surface of the insulating housing 34. When attached to the board, it is connected by soldering to a ground conductor (run) formed on the surface of the board. Similarly, the soldering portions 51 and 61 of the contacts 50 and 60 are also connected by soldering to the conductor pads of the high-frequency signal path formed on the substrate surface. Such solder connection of the ground conductor 31 and the contacts 50 and 60 is preferably performed by a known reflow solder connection.

Next, referring to FIGS. 3A and 3B, FIG.
The probing for connecting the probe 40 to the high-frequency connector 30 of the present invention shown in FIG. FIG. 3A is a sectional view showing a state immediately before connecting the probe 40 to the high-frequency connector 30, and FIG.
FIG. 6 is a cross-sectional view showing a state in which a probe 40 is completely connected to FIG.

First, the configuration of the probe tip of the probe 40 will be described. The probe 40 has a coaxial cable section connected to a measuring instrument (not shown). The cable portion of the probe 40 is a general coaxial cable in which a center conductor 41 and an outer conductor 42 are coaxially arranged via a dielectric 43. However, a guide sleeve 44 is provided at the tip of the probe. A taper 45 is provided on the inner surface of the distal end of the guide sleeve 44 so that a probing operation with the high-frequency connector 30 described later can be performed smoothly. Further, a concave portion 46 is formed at the tip of the center conductor 41, and a cylindrical insulating rod 47 is fixed therein by press-fitting or an adhesive, for example.

In order to probe the probe 40 having the above-described structure into the high-frequency connector 30, the probe 40 is pushed from above the high-frequency connector 30 toward the high-frequency connector 30, as shown in FIG. Probe 40
Is guided by the taper 45 of the guide sleeve 44 to the outer edge of the square high-frequency connector 30 as described above, for example, to be correctly aligned. Probe 4 in this state
When the “0” is slightly depressed, the sharp tip of the insulating rod 47 fixed to the concave portion 46 at the tip of the center conductor 41 becomes free ends 55 and 65 curved outwardly of the pair of contacts 50 and 60 of the high-frequency connector 30. 3 (A).

When the probe 40 is further pushed toward the high-frequency connector 30, the insulating rod 47 is inserted into the holes 56 formed in the contact portions 54, 64 of the pair of contacts 50, 60 as shown in FIG. Press-fit. As a result, FIG.
As shown by a broken line in FIG.
Is slightly bent outwardly against its elasticity, so that the contact portions 54 and 64 are separated from each other at a minute interval. This gives 1
The high-frequency signal path including the pair of contacts 50, 60 is interrupted. Further, as shown in FIG. 3B, the contact formed at the free end 65 of one contact 60 comes into contact with the tip of the center conductor 41 of the probe 40 to make an electrical connection. Further, the tip of the outer conductor 42 of the probe 40 contacts the ground conductor 31 formed on the upper surface of the high-frequency connector 30.

As is apparent from FIG. 3B, the high-frequency signal is guided to the center conductor 41 of the probe 40 via one contact 60, the ground conductor 31 is connected to the outer conductor 42 of the probe 40, and the high-frequency signal is It is led to the probe 40. At this time, the high-frequency signal path formed by the contact 60 and the ground conductor 31 is of course configured to have good characteristic impedance and to generate noise such as minimum signal attenuation and reflection. At this time, the contact 50 and the circuit connected thereto are completely disconnected from the high-frequency signal path on the contact 60 side.

As apparent from FIGS. 2A and 3B, the guide sleeve 44 with the taper 45 at the tip of the probe 40 and the contact portion 5 of the pair of contacts 50 and 60 are provided.
Probing of the probe 40 to the high-frequency connector 30 is extremely smooth due to the holes 56 of 4 and 64. Further, since the bending of the pair of contacts 50 and 60 is a necessary minimum and the gap between the contact portions 54 and 64 is extremely small, even if the high-frequency connector 30 has an extremely low-profile structure (low profile) (that is, 1). Pair contacts 50, 60
Note that the required elasticity is obtained (even if the dimensions of the are short).

The probing is performed only when necessary, such as when assembling or repairing the equipment. When the need for probing is eliminated, the probe 40 is withdrawn upward. As a result, the contact portions 54, 64 of the pair of contacts 50, 60 return to the normal state due to their elasticity and come into contact with each other. As a result, the state shown in FIG. 2C is established, and the high-frequency signal path including the contacts 50 and 60 is established again.

The high-frequency probe device of the present invention and the high-frequency connector used therein have been described in detail based on the preferred embodiments. However, the present invention should not be limited to only such specific examples, and those skilled in the art can easily understand that various modifications can be made according to specific applications.

For example, in the above-described example, the insulating housing of the high-frequency connector 30 is formed of the inner and outer separate housings, but may be formed as an integral structure.
The contact is made of a gold-plated copper alloy, at least the contact portion of the ground conductor with the external conductor of the probe is made of a silver-plated copper alloy, and the housing is made of a liquid crystal polymer (LC).
Preferably, the mold P) is used, but other suitable materials may be used.

[0028]

As will be understood from the above description, the high-frequency probe device of the present invention is composed of a small number of parts, so that it can be manufactured small and inexpensively. In addition, since the high-frequency connector uses a pair of opposed contacts having a hole formed in the center of the contact portion, the amount of bending of the contact during probing is very small, so a low-profile structure of, for example, about 2 mm is required. Enough performance to be obtained.

Accordingly, the present invention is suitable as a high-frequency probe device which requires a very small and lightweight design such as a portable telephone, but can be applied to other devices having the same requirements.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an application example of a high-frequency probe device according to the present invention.

FIG. 2 shows a preferred example of a high-frequency connector used in the high-frequency probe device of the present invention, wherein (A) is a top view, (B) is a bottom view, and (C) is a longitudinal sectional view.

FIGS. 3A and 3B are cross-sectional views for explaining probing of the high-frequency probe device of the present invention, wherein FIG.
(B) is a complete probing state.

[Explanation of symbols]

 Reference Signs List 30 High frequency connector 31 Ground conductor 50, 60 Contact 40 Probe 41 Center conductor 42 External conductor 47 Insulating member (rod)

Claims (2)

[Claims] 1. A high-frequency probe device for connecting a probe by interrupting a high-frequency signal path when necessary, comprising: a pair of contacts connected in series to said signal path and elastically contacting each other; and a ground conductor disposed outside said contact. And a probe having a concentric center conductor and an outer conductor, and a probe having an insulating member protruding at the end of the center conductor. When the probe is probed to the high-frequency connector, the pair of A high-frequency probe device configured to block contact between contacts and connect one of the contacts to the center conductor. 2. A high-frequency connector which is connected in series to a high-frequency signal path, inserts a probe when necessary, cuts off the signal path, and connects the probe, wherein one end is connected to the signal path and the other end is erected. And a pair of contacts that elastically contact each other, and a grounding conductor disposed outside the contacts. When the probe is inserted, the pair of contacts is separated from each other and the probe is separated from the pair of contacts. A high-frequency connector characterized by being configured to be connectable.