JPH10236041A - Electronic component supplying device for ic card, weblike component supplying medium, weblike component supplying medium housing cartridge, ic card production system, the second sheet for ic card, the second sheet housing cartridge for ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To supply an electronic component for IC card with a sheet for IC card at an accurate position with a simple structure by transferring the electronic component for IC card bonded to a component supplying medium to a sheet for IC card to supply the electronic component for IC card with the sheet for IC card. SOLUTION: A sheet web 13 for IC card has an adhesion member having higher adhesion than an adhesion part of the weblike component supply sheet 33 at a surface thereof. When the electronic component 18 for IC card on the weblike component supply sheet 33 is subjected a contact bonding to a surface of a sheet web 13 for IC card, the electronic component 18 for IC card is transferred from the weblike component supply sheet 33 to a sheet web 13 for IC card to be adhered to a surface of the sheet web 13 for IC card by a difference of adhesion between the weblike component supply sheet 33 and the sheet web 13 for IC card. In this manner, the electric component 18 for IC card is supplied from the weblike component supply sheet 33 to the sheet web 13 for IC card.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card electronic component supply apparatus for supplying IC card electronic components to an IC card sheet when an IC card is manufactured. The present invention also relates to an IC card manufacturing system having the IC card electronic component supply device.

[0002]

2. Description of the Related Art As a conventional IC card manufacturing system, the one shown in FIG. 1 is known. FIG. 1 is an overall schematic diagram of a conventional IC card manufacturing system.

[0003] The card manufacturing system 100 is provided with an IC card sheet web 13 by an adhesive supply means 19A.
A bonding apparatus A for temporarily bonding the IC card sheet web 13 and the second IC card sheet web 20 to supply the adhesive on the top and level the adhesive on the IC card sheet web 13. , Pasted IC card sheet web 1
3 and a peeling device 21 for peeling off the second IC card sheet web 20, and after peeling, the IC card sheet web 1
The electronic component supply device B supplies the electronic component supply sheet 18 to the IC card electronic component 18 from the electronic component supply sheet 16, and supplies the IC card electronic component 18 to the IC card sheet web 13, and then returns to the second IC card sheet web 20. Bonding apparatus C for bonding the sheet to the IC card sheet web 13
An image receiving layer forming apparatus D for forming an image receiving layer by bonding a web-shaped image receiving layer sheet 23 to the surface of the bonded second IC card sheet web 20; and a second IC card sheet web 20 and a web-shaped image receiving layer. The sheet 23 is cut to a card size by a cutter 24 after the sheet 23 is bonded, and an image-unrecorded IC
A cutting device E for producing the card 27, and a thermal transfer recording device F for recording an image such as a photographic image or a character image on the IC card 27 with no image recorded thereon by the sublimation thermal transfer.
And

[0004] I in a conventional IC card manufacturing system
A method of supplying the C card electronic component 18 will be described with reference to FIGS.

FIG. 2 is a perspective view of an electronic component supply sheet, and FIG. 3 is a schematic view of an electronic component supply device B.

A conventional electronic component supply apparatus B is a web-type electronic component supply sheet 16 wound into a roll and a card component by cutting the web-like electronic component supply sheet 16 on an IC card sheet web 13. Electronic component supply cutter 3 for supplying the electronic component 18 for IC cards as a part
And 2.

As shown in FIG. 2, the web-shaped electronic component supply sheet 16 is provided with a plurality of holes 47, and each of the holes 47 has an IC chip 2 and an antenna 3 therein. The IC card electronic components 18 are connected to the web-shaped electronic component supply sheet 16 by four connecting rods 17. By cutting these four connecting rods 17, I
The C-card electronic component 18 can be separated from the web-shaped electronic component supply sheet 16.

In the electronic component supply apparatus B of FIG. 3, a web-like electronic component supply sheet 16 wound in a roll shape
Is transported by the web-shaped electronic component supply sheet transport roller 110 and reaches a predetermined position. The connection rod 17 is cut by the electronic component supply cutter 32 above the IC card sheet web 13. When the connecting rod 17 is cut, the IC card electronic component 18 is separated from the web-like electronic component supply sheet 16 and falls onto the IC card sheet web 13. As a result, the IC card electronic component 18 is supplied onto the IC card sheet web 13.
Since the adhesive is uniformly applied to the IC card sheet web 13, the position of the IC card electronic component 18 on the IC card sheet web 13 is fixed to the drop point. The web-shaped electronic component supply sheet 16 from which the IC card electronic components 18 are separated is transported by the web-shaped electronic component supply sheet transport roller 110 and wound up in a roll shape. As described above, in the conventional electronic component supply device B, the IC card electronic components 18 are supplied on the IC card sheet web 13.

[0009]

However, the conventional IC card manufacturing system has the following problems.

A first problem relates to an electronic component supply device for an IC card. An electronic component supply device for an IC card used in a conventional IC card manufacturing system includes:
By cutting the connecting rod of the web-shaped electronic component supply sheet at a predetermined position on the IC card sheet, the electronic component for the IC card is dropped on the IC card sheet to which the adhesive is applied, so that the web-shaped The electronic component for the IC card is supplied from the electronic component supply sheet to the IC card sheet. Therefore, while a complicated control mechanism such as control of the cutting timing for accurately cutting the web-shaped electronic component supply sheet is required, the configuration for dropping and supplying the electronic component sheet enables accurate placement of the IC card electronic component. There is a problem that it is difficult.

Further, when manufacturing a web-shaped electronic component supply sheet, it is necessary to connect the IC card electronic component and a sheet having a hole in which an empty IC card electronic component is arranged with a connecting rod. In some cases, the production of the web-shaped electronic component supply sheet itself required a complicated mechanism.

Further, since the sheet after supplying the IC card electronic parts is a waste material, there is a problem that a large amount of the waste material is produced with the manufacture of the IC card.

The second problem is that the connecting rod must be cut when supplying the electronic components for the IC card, and at that time, debris and dust such as cut pieces are generated. There is a problem that the IC card surface becomes uneven by entering between the sheet and the second IC card sheet.

[0014] The third problem relates to the entire IC card manufacturing system. In the conventional IC card manufacturing system, it is necessary to supply an adhesive in order to bond the IC card electronic component to the IC card sheet before supplying the IC card electronic component. In addition, a step of temporarily bonding and peeling the second IC card sheet is required. Then, after supplying the IC card electronic component to the IC card sheet, a step of supplying the adhesive once again is necessary in order to bond the second IC card sheet again. Therefore, there is a problem that the whole IC card manufacturing system becomes complicated due to the configuration of supplying the adhesive twice, bonding the IC card sheet and the second IC card sheet twice, and the like.

The present invention has been made in view of the above situation.

The present invention has a simple structure and an accurate position I
An object of the present invention is to provide an IC card electronic component supply device, an IC card manufacturing system, a web-like adhesive member, and a second IC card sheet, which can supply a C card electronic component to an IC card sheet. .

The present invention also provides an IC card electronic component supply apparatus, an IC card manufacturing system, a web-like adhesive member, and a second IC, which are capable of reducing or eliminating waste materials when supplying IC card electronic components. The purpose is to provide a card sheet.

The present invention provides an IC card which has a simple structure and which can eliminate dust generated when supplying electronic components for an IC card, and which can manufacture an IC card having no irregularities on its surface. Electronic component supply device, IC card manufacturing system, web-shaped adhesive member, and second IC card sheet.

Further, the present invention makes it possible to reduce the number of times of supplying an adhesive and the number of times of bonding an IC card sheet and a second IC card sheet in an IC card manufacturing system. Supply of IC card electronic components to the IC card and bonding of the IC card sheet and the second IC card sheet at the same time, the configuration of the IC card manufacturing system can be simplified, and It is an object of the present invention to improve the production efficiency of card production and to enable production at low cost.

[0020]

SUMMARY OF THE INVENTION The object of the present invention is achieved by the following claims.

[Claim 1] [In an IC card electronic component supply apparatus for supplying an IC card electronic component including an IC chip to an IC card sheet when manufacturing an IC card, the IC card electronic component is adhered to a component supply medium. An electronic component supply device for an IC card, wherein the electronic component for an IC card is supplied to the sheet for an IC card by transferring the electronic component for an IC card to the sheet for the IC card. The electronic components for IC cards adhered to the component supply medium
Since the IC card electronic components are supplied to the IC card sheet by being transferred to the C card sheet, it is possible to supply the IC card electronic components to the IC card sheet at an accurate position with a simple structure. And IC
It is possible to reduce or eliminate waste materials when supplying electronic components for cards.

Further, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

Further, since dust and dirt adhere to the adhesive supply medium, there is also a cleaning effect.

[Claim 2] "Humidity control for controlling the humidity so that the relative humidity when transferring the IC card electronic component from the component supply medium to the IC card sheet is 50% to 70%." 2. The electronic component supply device for an IC card according to claim 1, further comprising means. ] Since the humidity is above a certain level, IC
When the electronic component for a card is peeled off, it is possible to prevent the IC from being charged and destroyed due to charging of the electronic component for an IC card.
Further, since the humidity is equal to or lower than the predetermined humidity, it is possible to prevent water drops from adhering to the IC card electronic components.

[Claim 3] "When transferring the IC card electronic component from the component supply medium to the IC card sheet, the IC card electronic component to which the component supply medium is transferred is adhered. The IC according to claim 1, further comprising a blowing unit that blows air to the portion.
Electronic component supply device for cards. When the electronic components for the IC card are transferred from the component supply medium to the sheet for the IC card, air is blown to the part of the component supply medium to which the IC card electronic components are adhered, so that the adhesiveness of the adhesive member is reduced. In addition, the electronic component for the IC card is easily separated from the component supply medium, and the electronic component for the IC card is smoothly transferred.

According to a fourth aspect of the present invention, it is preferable that the blower blows a wind containing ions having a charge opposite to a charge of the electronic component for an IC card when the electronic component is separated from the component supply medium. The electronic component supply device for an IC card according to claim 3, wherein: Since wind containing ions of the opposite charge to the charge of the IC card electronic component when the IC card electronic component is separated from the component supply medium is sent, the charge breakdown of the IC due to the charging of the IC card electronic component can be prevented.

[5] The electronic component supply device for an IC card according to any one of [1] to [4], wherein the component supply medium is a web-like component supply medium. ] A plurality of IC card electronic components can be adhered,
The handling of the component supply medium is easy, and the configuration of the IC card electronic component supply device itself is also simplified.

[Claim 6] "The component supply medium is a loop component supply medium, and the device has an adhesive device for adhering the IC card electronic component to the loop component supply medium. Said I adhered to the supply medium
The IC card electronic component is brought into contact with the IC card sheet, and the IC card electronic component is transferred from the loop-shaped component supply medium to the IC card sheet. Supplying the IC card electronic component to the loop-shaped component supply medium again by the adhesive device on the loop-shaped component supply medium having lost the IC card electronic component after supplying to the card sheet; The electronic component supply device for an IC card according to any one of claims 1 to 5, wherein: By simply supplying IC card electronic components to the adhesive device, a plurality of IC card electronic components can be easily and efficiently supplied to the IC card sheet. Also, the replacement frequency of the component supply medium can be reduced as compared with other components.

[Claim 7] "The IC card sheet has a part or all of its surface having adhesiveness, and has a higher adhesive strength than the adhesive member. The electronic component supply device for an IC card according to any one of claims 1 to 6, wherein: ] Since the adhesive member of the IC card sheet has a higher adhesive strength than the adhesive member that has adhered the IC card electronic component to the component supply medium, the transfer of the IC card electronic component can be performed smoothly. Also, the position of the electronic component for IC card after transfer is stabilized.

[Claim 8] [In an IC card electronic component supply apparatus for supplying an IC card electronic component including an IC chip to an IC card sheet when an IC card is manufactured, the IC card electronic component is held by a component supply medium. The IC card electronic component is supplied to the IC card sheet by transferring the IC card electronic component to the IC card sheet, and the component supply medium returns to the IC card electronic device after the transfer. An electronic component supply device for an IC card, which is capable of holding components. The electronic component for IC card held by the component supply medium is
Since the IC card electronic components are supplied to the IC card sheet by transferring to the C card sheet, it is possible to supply the IC card electronic components to the IC card sheet with a simple structure. The parts supply medium is
Since the electronic components for the IC card can be held again after the transfer, it is possible to reduce or eliminate waste materials when supplying the electronic components for the IC card.

Further, since there is no need to cut the component supply sheet when supplying the IC card electronic components, no dust is generated when the IC card electronic components are supplied, and the IC card has no irregularities on the surface. Can be manufactured.

(9) The component supply medium holds the electronic component for an IC card by a shape memory alloy or a shape memory resin.
Electronic component supply device for an IC card according to item 1. ] Depending on the temperature, from the holding state of the IC card electronic parts,
Since the holding state can be changed to the released state, the control of the holding and the release can be performed accurately and easily. Further, when supplying the IC card electronic component, the IC card electronic component does not peel off from the component supply medium, so that the IC card electronic component can be prevented from being charged and destroyed by being charged.

[Claim 10] "The holding of the electronic component for IC card by the shape memory alloy or the shape memory resin
10. The IC card according to claim 9, wherein the IC card electronic component is released by being heated when the shape memory alloy or the shape memory resin is heated to a predetermined temperature or higher, and the IC card electronic component is transferred to the IC card sheet. Electronic parts supply equipment. ] Depending on the temperature, from the holding state of the IC card electronic parts,
Since the holding state can be changed to the released state, the control of the holding and the release can be performed accurately and easily. Further, when supplying the IC card electronic component, the IC card electronic component does not peel off from the component supply medium, so that the IC card electronic component can be prevented from being charged and destroyed by being charged.

[11] The electronic component supply device for an IC card according to [10], wherein the heating of the shape memory alloy or the shape memory resin is started a predetermined time before the transition. By starting the heating a predetermined time before the transition, the shape memory alloy or the shape memory resin can be changed from the holding state of the electronic component for IC card to the state where the holding is released just when the transition is performed. In addition, it is possible to accurately supply electronic components for IC cards.

[Claim 12] An IC card manufacturing system comprising the IC card electronic component supply device according to any one of claims 1 to 11. The electronic component for IC card adhered to the component supply medium or the electronic component for IC card held is transferred to the IC card sheet, so that the electronic component for IC card is converted to an IC.
Since the IC card is supplied to the card sheet, it is possible to supply the IC card electronic component to the IC card sheet at an accurate position with a simple structure, and further reduce waste materials when supplying the IC card electronic component. Or it can be eliminated.

Also, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

[Claim 13] [Used in the electronic component supply device for an IC card according to the fifth aspect, wherein an adhesive member is provided on all or a part of the surface, and a plurality of the IC card electronic components are fixed. A web-like part supply medium, wherein the medium is adhered to the adhesive member at intervals. [Claim 14] "Used in the electronic component supply device for an IC card according to claim 5, wherein the electronic component for an IC card has an adhesive member on all or a part of the surface thereof, and A plurality of the IC card electronic parts are adhered at regular intervals. The invention according to claim 13 or 14 supplies the IC card electronic component to the IC card sheet by transferring the IC card electronic component adhered to the component supply medium to the IC card sheet, With a simple structure, it is possible to supply an IC card electronic component to an IC card sheet at an accurate position, and it is also possible to reduce or eliminate waste materials when supplying an IC card electronic component.

Further, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

Also, since it is in the form of a web, a plurality of IC card electronic components can be adhered, the handling of the component supply medium is easy, and the configuration of the IC card electronic component supply device itself is simple. Become.

[15] The IC card electronic device according to the above [13] or [14], wherein the web-like component supply medium according to the above (13) or (14) is accommodated and set in the IC card electronic component supply device according to the above (5). A web-like component supply medium storage cartridge, wherein the web-like component supply medium to which the IC card electronic component is adhered is supplied to a component supply device. Since the component supply medium is accommodated in the cartridge, handling is easy, and dust and dust can be prevented from adhering to the IC card electronic components. Further, it is possible to prevent the charged dust from adhering to the electronic component for the IC card and causing the IC to be charged and destroyed.

[Claim 16] In an IC card electronic component supply apparatus for supplying an IC card electronic component including an IC chip to an IC card sheet when manufacturing an IC card, The device has the IC card electronic component in advance, and the second IC card sheet wound in a roll shape, or the second IC card electronic component that has the IC card electronic component in advance and is contained in the cartridge.
An IC card electronic component supply device, wherein the IC card sheet is supplied to the IC card sheet by bonding the IC card sheet to the IC card sheet. By bonding the second IC card sheet to which the IC card electronic components are adhered and the IC card sheet,
Since the IC card electronic components are supplied to the IC card sheet, it is possible to supply the IC card electronic components to the IC card sheet at a precise position with a simple structure, and furthermore, to supply the IC card electronic components. It is possible to reduce or eliminate waste materials at the time.

Further, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

Further, when supplying the IC card electronic component, the IC card electronic component does not peel off from the second IC card sheet, so that the IC card electronic component can be prevented from being charged and destroyed by being charged.

Further, it is possible to reduce the number of times of supplying the adhesive and the number of times of bonding the IC card sheet and the second IC card sheet.
Supply of electronic components for card, IC card sheet and second
By enabling simultaneous bonding with the IC card sheet, the configuration of the IC card manufacturing system can be simplified, the production efficiency of IC card manufacturing can be improved, and low-cost manufacturing can be achieved. I do.

[Claim 17] "IC according to claim 16"
A second IC card sheet used in a card electronic component supply device, wherein the second IC card sheet has a web shape and contains a plurality of the IC card electronic components at regular intervals. By bonding the second IC card sheet to which the IC card electronic components are adhered and the IC card sheet,
Since the IC card electronic components are supplied to the IC card sheet, it is possible to supply the IC card electronic components to the IC card sheet at a precise position with a simple structure, and furthermore, to supply the IC card electronic components. It is possible to reduce or eliminate waste materials at the time.

Also, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

Further, since the IC card electronic component does not separate from the second IC card sheet when the IC card electronic component is supplied, it is possible to prevent the charge breakdown of the IC due to the charging of the IC card electronic component.

Further, it is possible to reduce the number of times of supplying the adhesive and the number of times of bonding the IC card sheet and the second IC card sheet.
Supply of electronic components for card, IC card sheet and second
By enabling simultaneous bonding with the IC card sheet, the configuration of the IC card manufacturing system can be simplified, the production efficiency of IC card manufacturing can be improved, and low-cost manufacturing can be achieved. I do.

Also, an IC is provided inside the second IC card sheet.
Since the electronic component for the card is included, the thickness of the sheet for the second IC card is constant, and the IC having excellent flatness can be easily obtained.
Cards can be manufactured.

[Claim 18] "IC according to claim 16"
Used in a card electronic component supply device, in the form of a web, having an adhesive member on all or part of its surface,
A second IC card sheet, wherein card electronic components are adhered at regular intervals. [Claim 19] The electronic component supply device for an IC card according to claim 16, wherein the IC card electronic component has an adhesive member on all or a part of its surface, and the adhesive member A plurality of the IC card electronic parts are adhered at regular intervals, and have a web shape.
IC card sheet. The invention according to claim 18 or 19 supplies the IC card electronic component to the IC card sheet by bonding the second IC card sheet to which the IC card electronic component is adhered and the IC card sheet. With a simple structure, it is possible to supply IC card electronic components to the IC card sheet at an accurate position with a simple structure, and it is also possible to reduce or eliminate waste materials when supplying IC card electronic components. And

Further, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no uneven surface. Is possible.

Further, since the IC card electronic component does not separate from the second IC card sheet when the IC card electronic component is supplied, it is possible to prevent the IC from being damaged due to charging of the IC card electronic component.

Further, the number of times of supplying the adhesive and the number of times of bonding the IC card sheet and the second IC card sheet can be reduced, and the IC
Supply of electronic components for card, IC card sheet and second
By enabling simultaneous bonding with the IC card sheet, the configuration of the IC card manufacturing system can be simplified, the production efficiency of IC card manufacturing can be improved, and low-cost manufacturing can be achieved. I do.

[20] The sheet for a second IC card according to any one of [17] to [19], wherein the sheet contains an elastic material. When bonding the IC card sheet and the second IC card sheet, the electronic components for the IC card sink into the second IC card sheet.
An IC card having excellent flatness can be manufactured.

[Claim 21] "The second IC card sheet according to claim 20, characterized by containing a foaming resin. According to the invention as set forth in claims 20 and 21, when the IC card sheet and the second IC card sheet are bonded to each other, the IC card electronic components sink into the second IC card sheet, so that the flatness is excellent. An IC card can be manufactured.

[Claim 22] "The IC card electronic device according to any one of claims 17 to 21 is accommodated and set in the IC card electronic component supply device, whereby the IC card electronic device is supplied. A second IC card sheet storage cartridge, wherein the second IC card sheet having the IC card electronic component is supplied to a component supply device. Since the second IC card sheet is contained in the cartridge, handling is easy, and dust and dust can be prevented from adhering to the IC card electronic components. Further, it is possible to prevent the charged dust from adhering to the electronic component for the IC card and causing the IC to be charged and destroyed.

[Claim 23] In an IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, the adhesive member is adhered to a component supply medium by an adhesive member. A method for manufacturing an IC card, comprising: transferring an electronic component for an IC card to the sheet for an IC card by transferring the electronic component for the IC card to the sheet for the IC card. The electronic components for IC cards adhered to the component supply medium
Since the IC card electronic components are supplied to the IC card sheet by being transferred to the C card sheet, it is possible to supply the IC card electronic components to the IC card sheet at an accurate position with a simple structure. And IC
It is possible to reduce or eliminate waste materials when supplying electronic components for cards.

Further, since the component supply sheet is not cut when supplying the electronic components for the IC card, it is possible to manufacture an IC card which does not generate dust when supplying the electronic components for the IC card and has no irregularities on the surface. Is possible.

According to a twenty-fourth aspect of the present invention, in an IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic part including an IC chip to an IC card sheet, the IC card electronic part held by a component supply medium is provided. The part is
By transferring to the C card sheet, the IC card electronic component is supplied to the IC card sheet, and the component supply medium can hold the IC card electronic component again after the transfer. A method of manufacturing an IC card, comprising: The electronic component for IC card held by the component supply medium is
Since the IC card electronic components are supplied to the IC card sheet by transferring to the C card sheet, it is possible to supply the IC card electronic components to the IC card sheet with a simple structure. The parts supply medium is
Since the electronic components for the IC card can be held again after the transfer, it is possible to reduce or eliminate waste materials when supplying the electronic components for the IC card.

Further, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

Further, when supplying the IC card electronic component, the IC card electronic component does not peel off from the component supply medium, so that the IC card electronic component is charged.
The charge breakdown of C can be prevented.

[Claim 25] [In an IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, a part supply medium is formed by a shape memory alloy or a shape memory resin. The IC card according to claim 24, wherein the IC card electronic component is supplied to the IC card sheet by transferring the held IC card electronic component to the IC card sheet. Production method. ] Depending on the temperature, from the holding state of the IC card electronic parts,
Since the holding state can be changed to the released state, the control of the holding and the release can be performed accurately and easily. Further, when supplying the IC card electronic component, the IC card electronic component does not peel off from the component supply medium, so that the IC card electronic component can be prevented from being charged and destroyed by being charged.

[Claim 26] In an IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, the method further comprises the step of: The second IC card sheet wound in a shape or the second IC card which has the IC card electronic component in advance and is housed in the cartridge.
By bonding the C card sheet and the IC card sheet together, the IC card electronic component is attached to the IC card sheet.
A method for producing an IC card, comprising supplying the IC card sheet and bonding the IC card sheet and the second IC card sheet to produce an IC card. By bonding the second IC card sheet to which the IC card electronic components are adhered and the IC card sheet,
Since the IC card electronic components are supplied to the IC card sheet, it is possible to supply the IC card electronic components to the IC card sheet at a precise position with a simple structure, and furthermore, to supply the IC card electronic components. It is possible to reduce or eliminate waste materials at the time.

Also, since the component supply sheet is not cut when supplying the IC card electronic components, it is possible to produce an IC card which does not generate dust when supplying the IC card electronic components and has no irregularities on the surface. Is possible.

Further, when supplying the IC card electronic component, the IC card electronic component does not peel off from the second IC card sheet, so that it is possible to prevent the IC from being damaged due to charging of the IC card electronic component.

Further, it is possible to reduce the number of times of supplying the adhesive and the number of times of bonding the IC card sheet and the second IC card sheet.
Supply of electronic components for card, IC card sheet and second
By enabling simultaneous bonding with the IC card sheet, the configuration of the IC card manufacturing system can be simplified, the production efficiency of IC card manufacturing can be improved, and low-cost manufacturing can be achieved. I do.

[Explanation of Terms] The term "component supply medium" as used in the present invention refers to a medium that temporarily holds IC card electronic components and supplies the IC card electronic components to the IC card sheet.

For example, a component supply medium for temporarily holding an electronic component for an IC card with an adhesive member, a shape memory alloy, a shape memory resin, a magnet, or the like can be used.

The “sheet for IC card” in the present invention refers to a sheet on a thin flat surface used as a material when an IC card is manufactured by an IC card manufacturing system. You may. The IC card sheet may be a single sheet or a sheet in which a plurality of sheets are bonded. Further, the IC card sheet may be used as a core sheet, a top sheet or a back sheet, and is not particularly limited.

The “second IC card sheet” in the present invention.
The term “IC card sheet” refers to an IC card sheet used when a plurality of IC card sheets are attached to each other to manufacture an IC card, and may be in a web shape or a card size. Further, the second IC card sheet may be a single sheet or a sheet obtained by laminating a plurality of sheets. Further, the second IC card sheet may be used as a core sheet, a top sheet or a back sheet, and is not particularly limited.

The second IC card sheet may be exactly the same as the IC card sheet, or may be different in material, thickness and the like.

In the case where three or more IC card sheets are pasted together to manufacture an IC card, a second IC card sheet may be used as the third or later IC card sheet.

[0073]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto. Also,
The following embodiments show preferred examples of the present invention,
It does not limit the meaning or technical scope of the terms of the present invention.

The IC card according to the present embodiment is one in which an IC chip for storing information is stored in a part of a base made of a synthetic resin such as a vinyl chloride resin. IC cards have a larger storage capacity than conventional magnetic cards and the like, and sublimation thermal transfer recording of character information and image information on the surface is performed.
It is being considered for use in cards and the like. For example,
Cards including business cards, name plates, passports, medical examination cards, identification cards, driver's licenses, commuter passes, cash cards, student IDs, and the like can be given. Generally, it is about the size of a hand and is often carried and used.

The IC card is classified into a contact type and a non-contact type according to the manner of electrical contact between the IC and an external circuit. However, if the contact terminals are exposed on the card surface as in the case of the contact type, the contact surface is degraded, the contact is poor, etc., and power supply to the IC card and input / output of data signals are not performed. Occurs.

Therefore, an IC card having a configuration in which an antenna coil for transmitting and receiving an electric signal in a non-contact manner generates and / or receives an electromagnetic wave has appeared.

Specifically, as an example in which an IC card is used as an ID card, an example of an employee card of a company in which an image is provided on the surface of a non-contact type IC card by thermal transfer recording will be described with reference to FIG.

FIG. 4A is a plan view of a non-contact type thermal transfer recording IC card used as an employee card of a company, that is, an ID card.

The thermal transfer recording IC card 1 includes an IC chip 2 for storing information such as ID information and an antenna 3 as a signal transfer section for R / W (read / write) of the thermal transfer recording IC card 1. It is provided inside. The key information 4 is attribute identification information for identifying the thermal transfer recording IC card 1 from another card, and is recorded by, for example, a code number. The character image 5 is a name, a workplace, an issue date, etc. attached to the surface of the thermal transfer recording IC card 1, and the photographic image 6 is a color photographic image such as a face image of an employee. ID
To be used as a card, a photographic image such as a face image is preferably a color image having gradation, but may be a monotone image.

FIG. 4B shows a non-contact type thermal transfer recording IC.
FIG. 3 shows a cross-sectional view of the card. The present thermal transfer recording IC card is composed of a plurality of layers, and specifically, an IC card sheet 10 made of a synthetic resin and a second IC card sheet 8 are bonded via an adhesive layer 9, 2nd IC
On the card sheet 8, an image receiving layer 7 for performing thermal transfer recording is provided. And IC card sheet 1
0 and the second IC card sheet 8, the IC chip 2
The antenna 3 and the antenna 3 are provided on the IC card sheet 10, are embedded in the adhesive layer 9, and are fixed by the adhesive layer 9.

As shown in FIG. 5, a writing layer 12 may be provided via an adhesive layer 11 so that information can be written and recorded on the back surface of the IC card sheet 10. .

The details of the IC card sheet 10, the second IC card sheet 8, the image receiving layer 7, and the writing layer 12 as the card base are described in JP-A-7-88974. Preferably, at least a part of the second IC card sheet 8 is a biaxially stretched polyester film, or a film made of ABS or polyester / biaxially stretched polyester film, but may be vinyl chloride.

(Embodiment 1) In this embodiment, the thermal transfer recording IC card 1 is an IC in which the electronic component supply device B in the IC card manufacturing system shown in FIG. 1 is replaced with an electronic component supply device B2 according to the present embodiment. It is manufactured by a card manufacturing system.

The card manufacturing system 100 manufactures the thermal transfer recording IC card 1 as follows.

First, the IC card sheet web 13 is
The sheet is conveyed to the laminating apparatus A, where the adhesive is supplied onto the IC card sheet web 13 by the adhesive supply means 19A so that the adhesive is uniform on the IC card sheet web 13. Then, the IC card sheet web 13 and the second IC card sheet web 20 are pasted together.

Thereafter, the IC card sheet web 13 and the second IC card sheet web 20 are peeled off by the peeling device 21, and the IC card sheet web 13 is replaced by the electronic component supply device B2 (B in FIG. 1). , This portion becomes B2 shown in FIG. 8).

In the electronic component supply device B2, the IC card electronic components 18 are supplied to the IC card sheet web 13. The electronic component supply device B2 and the supply mechanism will be described later in detail.

The IC card electronic component 18 supplied with the IC
The C card sheet web 13 is conveyed to the second bonding apparatus C, where the adhesive is supplied by the adhesive supply means 19C in the second bonding apparatus C, and the second IC card sheet web 20 and the IC card The sheet web 13 is bonded.

Subsequently, the second bonding device C bonded by the second bonding device C
The IC card sheet web 20 and the IC card sheet web 13 are conveyed to the image receiving layer forming apparatus D, where the adhesive is supplied by the adhesive supply means 19D, and the web image receiving layer sheet is provided. 23 are laminated to form an image receiving layer.

After the image receiving layer is formed, the sheet is conveyed to the cutting device E, where the IC card sheet web 13, the second IC card sheet web 20, and the web-shaped image receiving layer sheet 23 are bonded. This is cut to a card size by a cutter 24, and an IC card 27 is manufactured.

[0091] The IC card 27 is
And the color image information is transferred to the sublimable ink ribbon 2.
5 and the thermal transfer recording head 26, the sublimation thermal transfer recording is performed, and the thermal transfer recording IC card 1 is manufactured. As described above, the thermal transfer recording IC card 1 is manufactured by the present IC card manufacturing system 100.

The IC card manufacturing system 100 may be one in which each device is integrated, or one in which each device is separate. Further, a system without the thermal transfer recording device F may be used.

FIG. 8 is a schematic diagram of an electronic component supply device B2 according to the present invention. The electronic component supply device B2 is configured to press the component supply sheet cartridge 36 containing a web component supply sheet as a component supply medium and the web component supply sheet 33 to the IC card sheet web 13 to press the IC card electronic component. It has a pressure roller 40 for transferring the component 18, a humidifier 43 for humidifying according to the detection result of the humidity sensor 44, and a blowing device 41 for blowing the wind charged by the charging device 42.

FIG. 6 is a perspective view of a web-like component supply sheet used in the electronic component supply apparatus according to the present invention, and FIG. 7 is a side view of a cartridge for the component supply sheet containing the web-like component supply sheet. FIG.

The web-like component supply sheet 33 is provided with a plurality of adhesive portions 35 which are slightly larger than the IC card electronic component 18 at regular intervals.
Having an IC chip 2 and a coiled antenna 3
Card electronic components 18 are adhered at regular intervals. The web-shaped part supply sheet 33 is provided with a plurality of sprockets 14 on both sides for accurately transporting.

Incidentally, the entire surface of the web-shaped component supply sheet 33 may be used as an adhesive portion.

The web-shaped component supply sheet 33 is wound in a roll shape and accommodated in a component supply sheet cartridge 36. The web-shaped part supply sheet 33 is provided with guide rollers 39 at the entrance and exit of the part supply sheet cartridge 36.
, It is possible to always take it out stably from a certain position of the entrance and exit.

In the electronic component supply device B2, a plurality of ICs housed in the component supply sheet cartridge 36
The web-shaped component supply sheet 33 to which the card electronic component 18 is adhered is pulled out via the guide roller 39. Then, the IC card electronic component 18 on the web-shaped component supply sheet 33 is attached to the IC card sheet web 13 conveyed from the bonding device A by the pressure roller 40.
Is crimped. The IC card sheet web 13 has an adhesive member having a higher adhesiveness than the adhesive portion 35 of the web-like component supply sheet 33 on the surface. When pressed on the surface of the sheet web 13 for IC card, the electronic component 18 for IC card
Due to the difference in adhesiveness with the card sheet web 13, the transfer is performed from the web-shaped part supply sheet 33 to the IC card sheet web 13 and adheres to the surface of the IC card sheet web 13. In this manner, the IC card electronic component 18 is supplied from the web-shaped component supply sheet 33 to the IC card sheet web 13. Since the IC card electronic component 18 is adhered to the surface of the IC card sheet web 13, the coil of the antenna 3 maintains a stable position without being disturbed.

Since the antenna is often coil-shaped and flexible, it tends to bend if it is mechanically held and supplied, and if bent, the thickness of the antenna changes and the surface of the IC card is formed when the IC card is formed. The possibility of unevenness was high. In the present embodiment, not only the IC chip but also the coiled antenna can be held in a natural shape, so that the shape of the coiled antenna is lost.
Irregularities on the surface of the card can be prevented.

The web-like component supply sheet 34 having lost the IC card electronic components 18 is conveyed and accommodated in another component supply sheet cartridge 36B.

When all the web-like component supply sheets 34 are pulled out from the component supply sheet cartridge 36,
The part supply sheet cartridge 36B which is full of the web-shaped part supply sheet 34 having lost the IC card electronic parts 18 is removed, and the empty part supply sheet cartridge 36 is replaced with the part supply sheet cartridge 36B. The component supply sheet cartridge containing the new web-shaped component supply sheet is set at the position where the component supply sheet cartridge 36 was located, so that the component supply sheet cartridge 36 and the web-shaped component supply sheet are set. 33 can be exchanged. Further, the IC card electronic component 18 is again adhered to the web-shaped component supply sheet from which the IC card electronic component 18 has been lost, so that the IC card electronic component 18 can be reused and waste materials can be reduced.

The web-like component supply sheet 33 is applied to the IC card sheet web 13 by the pressure roller 40.
When the upper IC card electronic component 18 is crimped, since the air is blown toward the crimping position by the blower 41, the IC card electronic component 18 is further peeled off from the web-shaped component supply sheet 33. And transfer is performed efficiently. The blowing from the blowing device 41 is performed by the charging device 4.
2, when the electronic component for IC card 18 is peeled off from the web-shaped component supply sheet 33, in order to apply a charge opposite to the electric charge of the electronic component for IC card 18,
The air containing the oppositely charged ions cancels the electrification of the IC card electronic component 18 and removes the IC when the IC card electronic component 18 is separated from the web-shaped component supply sheet 33.
This prevents the IC chip 18 from being charged and the IC chip 18 being charged, thereby preventing the IC chip from being charged.

The relative humidity in the electronic component supply device B2 is constantly measured by the humidity sensor 44. When the relative humidity becomes 50% or less, the humidifier 43 is operated to perform humidification, and the relative humidity becomes 70%. %, The humidifier 43 is stopped, and the relative humidity is always adjusted to 50% to 70%. By maintaining such a relative humidity that water droplets are not generated, charging during peeling can be prevented.

The IC card sheet web 13 has an IC
Depressions into which the card electronic components 18 enter may be provided at regular intervals.

In order to hold the antenna 3 integrated with the IC chip 2 of the web-like component supply sheet 33, as shown in FIG. When bonding the second IC card sheet, the IC chip 2 and the antenna 3 may be brought into contact with the second IC card sheet almost simultaneously.

(Embodiment 2) In the present embodiment, the thermal transfer recording IC card 1 is the same as the present invention except that the electronic component supply device B in the IC card manufacturing system shown in FIG. 1 is replaced with an electronic component supply device B3 according to the present invention. It is manufactured by such an IC card manufacturing system.

The flow of production of the thermal transfer recording IC card 1 in the IC card production system is the same as that in the first embodiment, and will not be described.

FIG. 9 is a schematic view of an electronic component supply device B3 according to the present invention. The electronic component supply device B3 contains a component supply loop 46, an IC card electronic component 18, and supplies the IC card electronic component 18 to the component supply loop 46, and a component supply loop. 46 is pressed against the sheet web 13 for IC card,
Crimping roller 40 for transferring electronic component 18 for C card
And a humidifier 43 for humidifying the air in accordance with the detection result of the humidity sensor 44, and a blower 41 for blowing the wind charged by the charging device 42.

In the electronic component supply device B3, the IC card electronic components 18 are attached to the component supply loop 46 at regular intervals from the electronic component attaching device 47 containing a plurality of IC card electronic components 18. The parts supply loop 4
Reference numeral 6 denotes an adhesive part on the entire surface, but a part of the adhesive part may be used at regular intervals.

Then, the component supply loop 46 to which the IC card electronic component 18 is attached is conveyed to the pressure roller 40. The IC card electronic component 18 on the component supply loop 46 is crimped to the IC card sheet web 13 conveyed from the bonding device A by the pressure roller 40. The IC card sheet web 13 has on its surface an adhesive member having higher adhesiveness than the adhesive portion 35 of the component supply loop 46, and the IC card electronic component 18 on the component supply loop 46 is used for the IC card. When pressed onto the surface of the sheet web 13, the IC card electronic component 18 moves from the component supply loop 46 to the IC card sheet web 13 due to the difference in adhesiveness between the component supply loop 46 and the IC card sheet web 13. It is transferred and adheres to the surface of the IC card sheet web 13. Thus, the IC card electronic component 18 is supplied from the component supply loop 46 to the IC card sheet web 13. Since the IC card electronic component 18 is adhered to the surface of the IC card sheet web 13, the coil of the antenna 3 maintains a stable position without being disturbed.

When the IC chip 2 and the antenna 3 are arranged as shown in FIG. 17, an excessive force is not applied to the antenna 3 when the IC card electronic component is pushed into the adhesive, and the IC chip 2 and the antenna 3 are connected to each other. Since no unreasonable load is applied to the joint portion of the antenna 3, the lower surface of the antenna 3 and the lower surface of the IC chip 2 are held in substantially the same plane, and the occurrence of irregularities on the surface of the IC card can be prevented.

The component supply loop 46 having lost the IC card electronic component 18 is transported, and the IC card electronic component 18 is attached again in the electronic component attaching device 47. Then, supplying the IC card electronic component 18 to the IC card sheet web 13 is repeated again.

When the adhesiveness of the surface of the component supply loop 46 is weakened by repeated use, the component supply loop 46 can be replaced.

The IC roller sheet web 13 is attached to the IC card sheet web 13 by the pressure roller
When the card electronic component 18 is crimped, since the air is blown toward the crimping position by the blower 41, the IC card electronic component 18 is more easily peeled off from the component supply loop 46, and is transferred. Is performed efficiently. The air blown from the blower 41 is charged by the charging device 42 when the electronic component 18 for an IC card is separated from the component supply loop 46,
In order to apply the opposite charge, the air in the IC card electronic component 18 is canceled by blowing air containing ions of the opposite charge, and the IC card electronic component 18 is discharged from the component supply loop 46.
This prevents the IC chip electronic component 18 from being charged when the IC chip is peeled off, thereby preventing the IC chip from being charged and destroyed.

Further, the relative humidity in the electronic component supply device B3 is constantly measured by the humidity sensor 44. When the relative humidity becomes 50% or less, the humidifier 43 is operated to perform humidification, and the relative humidity is always kept. It is adjusted to be 50% to 70%. By maintaining such a relative humidity that water droplets are not generated, charging during peeling can be prevented.

The IC card sheet web 13 has an IC
Depressions into which the card electronic components 18 enter may be provided at regular intervals.

Further, in the first and second embodiments, an adhesive member is used in order to hold an electronic component for an IC card on a component supply medium such as a web-shaped component supply sheet or a component supply loop. The electronic component for the IC card may be held in the component supply medium by a shape memory alloy or a shape memory resin instead of the member.

For example, when a temperature of 50 ° C. is applied for 2 seconds or more, the shape memory resin that changes from the first shape to the second shape is used to supply a component supply medium such as a web-like component supply sheet or a component supply loop. The electronic component for the IC card is held, and the heating roller is brought into contact with a predetermined position of the sheet for the IC card on the surface opposite to the holding surface of the component supply medium, by irradiating an infrared lamp, or blowing hot air. 50 ° C. from 3 seconds before the IC card electronic components are supplied to the IC card sheet
Heat to Since the heat conduction from the back surface to the front surface also depends on the thickness of the component supply medium, it is necessary to appropriately change the heating start time. Due to this heating, the shape memory resin changes to the second shape, the holding form of the shape memory resin is released, and the IC card electronic component is supplied to a predetermined position of the IC card sheet.

At this time, cooling air may be blown to the held IC card electronic components to protect the IC card electronic components.

The electronic component for IC card may be held on the component supply medium by a magnet instead of the adhesive member.

(Embodiment 3) This embodiment is different from Embodiments 1 and 2 in that in the electronic component supply device, an IC card electronic component and an IC card
The sheet web for the C card is supplied at the same time.

In this embodiment, the thermal transfer recording IC card 1 is manufactured by the IC card manufacturing system according to the present invention shown in FIG.

The thermal transfer recording IC card 1 is manufactured by the card manufacturing system 200 as follows.

First, the IC card sheet web 13 is
The sheet is conveyed to the electronic component supply device B4, where the IC component electronic component 18 is supplied, and at the same time, the second IC card sheet web 48A is bonded. Details of the electronic component supply device B4 will be described later.

The IC card electronic component 18 is supplied, and the IC card sheet web 13 to which the second IC card sheet web 48A is bonded is conveyed to the image receiving layer forming apparatus D. Adhesive supply means 19
D, the adhesive is supplied, and the web-like image receiving layer sheet 2
3 to form an image receiving layer.

After the image receiving layer is formed, the sheet is conveyed to the cutting device E, where the IC card sheet web 13, the second IC card sheet web 48A, and the web-shaped image receiving layer sheet 23 are bonded. What is cutter 24
Then, the card is cut to a card size, and the IC card 27 is manufactured.

[0127] The IC card 27 is
And the image information is subjected to sublimation thermal transfer recording by the sublimable ink ribbon 25 and the thermal transfer recording head 26, and the thermal transfer recording IC card 1 is manufactured. As described above,
The thermal transfer recording IC card 1 is manufactured by the IC card manufacturing system 200.

In the IC card manufacturing system 200, each device may be integrated, or each device may be separate. Further, a system without the thermal transfer recording device F may be used.

FIG. 12 is a schematic view of an electronic component supply device B4 according to the present invention. The electronic component supply device B4 is an IC
A grounding neutralization brush 53 for removing charges on the surface of the card sheet web 13;
A cleaning device 56 for removing dust on the three surfaces, and an IC
An adhesive supply device 19B for supplying an adhesive to the surface of the card sheet web 13, and a second IC containing a second IC card sheet web 48A having an IC card electronic component
It has a card sheet cartridge 51 and a pressure roller 57 for pressing and bonding the second IC card sheet web 48A having the IC card electronic components to the IC card sheet web 13 supplied with the adhesive. .

FIG. 10 is a perspective view of a second IC card sheet web to which an IC card electronic component according to the present invention is adhered, and FIG. 11 is a second IC card sheet web containing the second IC card sheet web. FIG. 3 is a partial cross-sectional view of a side portion of the sheet cartridge.

The second IC card sheet web 48A is:
It is bonded to the IC card sheet web 13 to form one layer of the IC card. In the present embodiment, it is the second IC card sheet 8 in FIG. And
The second IC card sheet web 48 </ b> A of the present embodiment is provided with a plurality of adhesive portions 49 slightly larger than the IC card electronic component 18.
The IC card electronic component 18 having the IC chip 2 and the antenna 3 is adhered. In addition, a plurality of sprockets 14 for accurate conveyance are provided on both sides of the second IC card sheet web 48A.

The entire surface of the second IC card sheet web may be used as an adhesive portion, or the second IC card sheet web is not provided with an adhesive portion, but the IC card electronic component 18 is provided with an adhesive portion. You may make it adhere to a sheet web.

The second IC card sheet web 48A having the plurality of IC card electronic components 18 is wound in a roll shape and accommodated in the second IC card sheet cartridge 51. The second IC card sheet web 48A is
Since the sheet cartridge 51 for the second IC card is sandwiched between the guide rollers 52 at the entrance and exit, the cartridge can always be stably taken out from a certain position of the entrance and exit.

In the electronic component supply device B4, the charge on the surface of the conveyed IC card sheet web 13 is first removed by the contact of the charge removing brush 53 with the surface of the IC card sheet web 13. The removal of the electric charge makes it difficult for dust and dirt to adhere to the sheet surface, and makes it easier to remove dirt and dust that have adhered to the sheet surface.

The cleaning device 56 removes the dust on the surface of the IC card sheet web 13 from which the charge has been removed and from which the dust has been easily removed.

The cleaning device 56 includes an adhesive roller 54
And a cleaning blade 55. By bringing the adhesive roller 54 of the cleaning device 56 into contact with the IC card sheet web 13, dust on the IC card sheet web 13 is adhered to the adhesive roller 54 and removed. The dust adhered to the adhesive roller 54 is removed by the cleaning blade 55, and the cycle in which the removed adhesive roller 54 comes in contact with the IC card sheet web 13 again is repeated.

After the dust on the IC card sheet web 13 is removed by the cleaning device 56, the adhesive is supplied by the adhesive supply device 19B. After the adhesive is supplied, the second IC card sheet cartridge 5
The second IC card sheet web 48A to which the IC card electronic component 18 accommodated in the first IC card 1 is adhered is pulled out of the cartridge via the guide roller 52 at the cartridge entrance, is conveyed, and is pressed by the pressure roller 57 to form the IC web.
The IC card sheet web 13 and the second IC card sheet web 48A are bonded together by pressure bonding so that the surface to which the card electronic component 18 is adhered and the surface of the IC card sheet web 13 are brought into contact. After pasting, it is transported to the image receiving layer forming section C.

Thus, the present electronic component supply device B4
Thereby, the IC card electronic component 18 is supplied to the IC card sheet web 13 and at the same time, the second IC card sheet web 48A is bonded.

The second IC card sheet web 48A
14 is made of an elastic member, for example, a foaming resin.
As shown in (b), when the IC card electronic component 18 is embedded in the second IC card sheet web 48A when the IC card sheet web 13 and the IC card sheet web 13 are bonded via the adhesive layer 58, the It is preferable from the viewpoint of improving the flatness of the card surface.

Further, the second IC card sheet web 48
A is an elastic member having a property of being hardened by heat, ultraviolet rays, chemical addition, etc., and embedded in the second IC card sheet web 48A, and then cured by heat, ultraviolet rays, chemical addition, etc. It may be.

Alternatively, the IC card sheet web 13 may be provided with depressions for the IC card electronic components 18 at regular intervals.

(Embodiment 4) This embodiment corresponds to Embodiment 3
Only the second IC card sheet web used is different, and other configurations such as the electronic component supply device B4 are the same as those of the third embodiment.

FIG. 13A shows the 2nd I used in this embodiment.
FIG. 13B is a perspective view of the C card sheet web, and FIG.
2 shows a cross-sectional view of the second IC card sheet web used in the present embodiment.

The second IC card sheet web 48B used in this embodiment does not have the IC card electronic component 18 adhered to the surface, but has the IC card electronic component 18 inside the second IC card sheet web 48B. Things.

This second IC card sheet web 48B
For the second IC card sheet 51 accommodating the
Is used in the electronic component supply device B4 to bond the second IC card sheet web 48B and the IC card sheet web 13 to thereby form the IC card sheet web 13
At the same time, the IC card electronic component 18 is supplied, and the second IC card sheet web 48A is bonded.

Since the second IC card sheet web 48B having the IC card electronic components 18 therein is used in advance, it becomes easy to manufacture an IC card having excellent surface flatness.

[0147]

According to the present invention, it is possible to supply an IC card electronic component to an IC card sheet at a precise position with a simple structure, and to reduce waste materials when supplying an IC card electronic component. , Or can be eliminated.

[0148] Also, the IC by cutting according to the conventional method is used.
When supplying electronic components for a card, dirt due to dropping of a cut piece of a connecting rod or the like is reduced, and in the case of a supply medium having an adhesive member, dust and dust are adhered to the supply medium, so cleaning is performed. An effect also occurs.

Further, according to the present invention, in the IC card manufacturing system, the number of times of supplying the adhesive and the number of times of bonding the IC card sheet and the second IC card sheet can be reduced. Of IC card electronic components to IC card sheet and IC card
Lamination with the C card sheet can be performed at the same time, the configuration of the IC card manufacturing system can be simplified, and the manufacturing can be performed at low cost.

[Brief description of the drawings]

FIG. 1 is an overall schematic diagram of an IC card manufacturing system.

FIG. 2 is a perspective view of a conventional web-shaped part supply sheet.

FIG. 3 is a schematic diagram of a component supply unit of a conventional IC card manufacturing system.

FIG. 4 is a plan view and a cross-sectional view of a non-contact type thermal transfer recording IC card.

FIG. 5 is a cross-sectional view of another example of a non-contact type thermal transfer recording IC card.

FIG. 6 is a perspective view of a web-shaped component supply sheet used in the electronic component supply device according to the present invention.

FIG. 7 is a partial cross-sectional view of a side portion of the cartridge for component supply sheets accommodating the web-like component supply sheet according to the present invention.

FIG. 8 is a first embodiment of the electronic component supply device according to the present invention.
Schematic diagram of an example.

FIG. 9 is a schematic view of another example of the embodiment of the electronic component supply device according to the present invention.

FIG. 10 is a perspective view of a second IC card sheet web to which an IC card electronic component according to the present invention is adhered.

FIG. 11 is a partial cross-sectional view of a side portion of a second IC card sheet cartridge accommodating the second IC card sheet web according to the present invention.

FIG. 12 is a schematic view of another example of the embodiment of the electronic component supply device according to the present invention.

FIG. 13 is a perspective view and a cross-sectional view of a second IC card sheet web having an IC card electronic component according to the present invention therein.

FIG. 14 is a cross-sectional view showing a state in which the IC card sheet web and the second IC card sheet web according to the present invention are bonded to each other.

FIG. 15 shows another example of an IC card manufacturing system according to the embodiment of the present invention.

FIG. 16 is a schematic side view after an IC card electronic component is supplied to an IC card sheet web.

FIG. 17 is a schematic side view after an IC card electronic component is supplied to an IC card sheet web.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thermal transfer recording IC card 2 IC chip 3 Antenna 13 IC card sheet web 18 IC card electronic component 33 Web-shaped component supply sheet 35 Adhesive part 36 Component supply sheet cartridge 46 Component supply loop 48A, 48B Second IC card sheet web 51 Second IC card sheet cartridge 100, 200 Card manufacturing system B2, B3, B4 Electronic component supply device

 ──────────────────────────────────────────────────続 き Continuation of the front page (54) [Title of the invention] Electronic component supply device for IC card, web-like component supply medium, cartridge containing web-like component supply medium, IC card manufacturing system, second IC card sheet, 2 IC card sheet storage cartridge, IC card manufacturing method

Claims (26)

[Claims] 1. An IC card electronic component supply device for supplying an IC card electronic component including an IC chip to an IC card sheet when an IC card is manufactured. By transferring electronic components to the IC card sheet, the IC
An electronic component supply device for an IC card, wherein the electronic component for a card is supplied to the IC card sheet. 2. A humidity control means for controlling the humidity so that the relative humidity when transferring the IC card electronic component from the component supply medium to the IC card sheet is 50% to 70%. The electronic component supply device for an IC card according to claim 1, wherein: 3. When transferring the IC card electronic component from the component supply medium to the IC card sheet,
The electronic component supply device for an IC card according to claim 1 or 2, further comprising a blowing unit that blows air to a portion where the electronic component for an IC card to which the component supply medium is transferred is adhered. 4. The air blowing means blows air containing ions having a charge opposite to a charge of the electronic component for an IC card when peeling off from the component supply medium. Item 4. An electronic component supply device for an IC card according to Item 3. 5. The electronic component supply device for an IC card according to claim 1, wherein the component supply medium is a web-like component supply medium. 6. The component-supplying medium is a loop-shaped component-supplying medium, and has an adhesive device for adhering the IC card electronic component to the loop-shaped component-supplying medium. The IC card electronic component is contacted with the IC card sheet, and the IC card electronic component is transferred from the loop component supply medium to the IC card sheet, whereby the IC card sheet is transferred.
The IC card sheet is supplied to the IC card sheet, and after the IC card sheet is supplied, the IC card electronic component is lost to the loop component supply medium, and the adhesive device is again used to attach the IC card to the loop component supply medium. The electronic component supply device for an IC card according to any one of claims 1 to 5, wherein the electronic component is attached. 7. The IC card sheet according to claim 1, wherein a part or the entire surface of the sheet has adhesiveness, and has a higher adhesive strength than the adhesive member. Item 7. An electronic component supply device for an IC card according to any one of Items 1 to 6. 8. An IC card electronic component supply device for supplying an IC card electronic component including an IC chip to an IC card sheet when manufacturing an IC card, wherein the IC card is held by a component supply medium. By transferring electronic components to the IC card sheet, the IC
Supplying card electronic components to the IC card sheet;
The electronic component supply device for an IC card, wherein the component supply medium is capable of holding the electronic component for an IC card again after the transfer. 9. The IC according to claim 8, wherein the component supply medium holds the electronic component for an IC card with a shape memory alloy or a shape memory resin.
Electronic component supply device for cards. 10. The holding of the IC card electronic component by the shape memory alloy or the shape memory resin is released when the shape memory alloy or the shape memory resin is heated to a predetermined temperature or higher, and the IC card electronic component is released. The electronic component supply device for an IC card according to claim 9, wherein the component is transferred to the IC card sheet. 11. The electronic component supply device for an IC card according to claim 10, wherein the heating of the shape memory alloy or the shape memory resin is started a predetermined time before the transition. 12. An IC card manufacturing system comprising the IC card electronic component supply device according to claim 1. Description: 13. An IC card electronic component supply apparatus according to claim 5, wherein said IC card electronic component supply device has an adhesive member on all or a part of its surface, and a plurality of said IC card electronic components are adhered at regular intervals. A web-like part supply medium, which is adhered to a conductive member. 14. The IC card electronic component supply device according to claim 5, wherein the IC card electronic component has an adhesive member on all or a part of a surface thereof, and the adhesive member allows the electronic component to be attached to the IC card. A web-like component supply medium, wherein a plurality of electronic components for an IC card are adhered at regular intervals. 15. An electronic component supply device for an IC card by storing the web-shaped component supply medium according to claim 13 or 14 and setting the medium in the electronic component supply device for an IC card according to claim 5. And supplying the web-shaped component supply medium to which the IC card electronic component is adhered. 16. An IC card electronic component supply device for supplying an IC card electronic component including an IC chip to an IC card sheet when manufacturing an IC card. A second IC card sheet having the IC card electronic component and wound in a roll, or a second IC card sheet having the IC card electronic component in advance and housed in a cartridge; An IC card electronic component supply apparatus, wherein the IC card electronic component is supplied to the IC card sheet by bonding the IC card sheet to the IC card sheet. 17. A plurality of the ICs used in the electronic component supply device for an IC card according to claim 16, wherein the plurality of ICs are web-shaped.
A second IC card sheet containing card electronic components at regular intervals. 18. The electronic component supply device for an IC card according to claim 16, which is in the form of a web, has an adhesive member on all or a part of its surface, and holds a plurality of said electronic components for an IC card. Second IC characterized by being adhered at intervals
Card sheet. 19. The IC card electronic component supply device according to claim 16, wherein the IC card electronic component has an adhesive member on all or a part of a surface thereof, and the adhesive member causes the IC member to have the adhesive member. A plurality of IC card electronic components are adhered at regular intervals and have a web shape.
IC card sheet. 20. The second IC according to claim 17, further comprising a material having elasticity.
Card sheet. 21. The second IC card sheet according to claim 20, further comprising a foaming resin. 22. The second IC card sheet according to claim 17, which is accommodated in the second IC card sheet and set in the IC card electronic component supply device, thereby providing the second IC card sheet.
A second IC card sheet storage cartridge, wherein the second IC card sheet having the IC card electronic component is supplied to a card electronic component supply device. 23. An IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, wherein the IC card electronic device is adhered to a component supply medium by an adhesive member. Parts
An IC card manufacturing method, wherein the IC card electronic component is supplied to the IC card sheet by transferring the IC card sheet to the IC card sheet. 24. An IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, wherein the IC card electronic component held by a component supply medium is provided. By transferring to the IC card sheet, the IC card electronic component can be supplied to the IC card sheet, and the component supply medium can hold the IC card electronic component again after the transfer. A method of manufacturing an IC card, comprising: 25. An IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, wherein the IC card is held on a component supply medium by a shape memory alloy or a shape memory resin. The IC card manufacturing method according to claim 24, wherein the IC card electronic component is supplied to the IC card sheet by transferring the IC card electronic component to the IC card sheet. 26. An IC card manufacturing method for manufacturing an IC card by supplying an IC card electronic component including an IC chip to an IC card sheet, wherein the IC card electronic component is provided in advance and is wound into a roll. The second IC card sheet, or the second IC card sheet previously containing the IC card electronic components and housed in a cartridge, is bonded to the IC card sheet to form the IC card. Electronic components to the IC card sheet, and the IC card sheet and the second
An IC card manufacturing method, which comprises bonding an IC card sheet to manufacture an IC card.