JPH09289329A - Electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat dissipation property regarding a photoelectric conversion module which is one of electronic circuit modules. SOLUTION: A photoelectric conversion module 30 has a structure wherein an electronic circuit structure body 31 comprised of a circuit board 35, an IC element 36 and a pin electric terminal 37 and an auxiliary heat dissipation structure body 34 are contained inside shield case 32. The auxiliary heat dissipation structure body 34 is formed of a heat conducting plate 60 with a through hole 70 corresponding to the pin electric terminal 37 and a plurality of heat conducting pins 61 planted and fixed in the heat conducting plate 60 and the through hole 70 is provided fit to the pin electric terminal 37. In the photoelectric conversion module 30, the electric pin terminal 37 is electrically connected to a mother printed board 90 and the heat conducting pin 61 is fixed to the mother printed board 90 and mounted on the mother printed board 90, and heat generated in the IC element 36 is released to the other printed board 90 through the electric pin terminal 37 and is released to the mother printed board 90 through the heat conducting plate 60 and the heat conducting pin 61.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit module, and more particularly to a photoelectric conversion module forming a part of an optical communication device. The photoelectric conversion module that constitutes a part of the optical communication device has a configuration in which a semiconductor laser is incorporated. The temperature around the photoelectric conversion module of the optical communication device is
The maximum temperature is about 65 degrees C. Generally, a semiconductor laser has a characteristic that the optical output decreases when the temperature exceeds about 90 ° C. Therefore, the photoelectric conversion module is required to have good heat dissipation.

In recent years, in optical communication devices, signals have
It tends to increase from 00 Mbps to, for example, 600 Mbps. When the frequency of the signal increases, the power consumption of the IC that constitutes the photoelectric conversion module increases from about 1 W to about 5 W, and the temperature of the photoelectric conversion module rises. Therefore, in order to ensure the normal operation of the semiconductor laser, it is necessary for the photoelectric conversion module to have better heat dissipation.

[0003]

2. Description of the Related Art FIG. 16 shows an example of a conventional photoelectric conversion module 10. The photoelectric conversion module 10 includes an electronic circuit structure 11, a shield case 12 for shielding an electromagnetic wave, and a semiconductor laser element 13. The electronic circuit structure 11 has a circuit board 15, a semiconductor element 16 mounted on the circuit board 15, an upper end fixed to the circuit board 11 and extending downward, and protruding from a bottom surface of the shield case 12. It has a pin-shaped electric terminal 17.

The photoelectric conversion module 10 is mounted on the mother printed board 18 by inserting the pin-shaped electric terminals 17 into the holes of the mother printed board 18 and soldering them.
During operation, the heat generated in the semiconductor element 16 reaches the mother printed board 18, spreads into the mother printed board 18 as indicated by reference numeral 21, and is exposed to the atmosphere from the surface of the mother printed board 18 as indicated by reference numeral 22. Be escaped to. Here, heat conduction of the heat generated in the semiconductor element 16 to the mother printed board 18 is carried out exclusively by the electric terminals 17 as shown by reference numeral 20.
It is done by conducting inside. The maximum ambient temperature of the photoelectric conversion module 10 is 65 ° C.

[0005]

However, in the conventional photoelectric conversion module 10, since the heat generated in the semiconductor element 16 is conducted to the mother printed board 18 exclusively by the electric terminal 17, the semiconductor element is not formed. The thermal resistance R0 between 16 and the mother printed board 18 is relatively high. Therefore, the semiconductor element 16 is not efficiently cooled, and the semiconductor element 16 has a high temperature. For this reason, the semiconductor laser element 13 which itself generates heat is affected by the high temperature of the semiconductor element 16, and in some cases, the temperature exceeds about 90 ° C. As a result, the optical output decreases and There was a risk that communication could be adversely affected.

Therefore, an object of the present invention is to provide an electronic circuit module that solves the above problems.

[0007]

According to a first aspect of the present invention, there is provided an electronic circuit structure comprising a circuit board, a semiconductor element mounted on the circuit board, and pin electric terminals fixed to the circuit board. And a shield case for accommodating the electronic circuit structure inside, and the pin electric terminal projects from the bottom of the shield case to the outside of the shield case. The pin electric terminal is a mother printed board. In an electronic circuit module electrically connected to and mounted on the mother printed board, a heat conductive plate having through holes corresponding to the pin electric terminals, and a plurality of heat conductive plates planted and fixed on the heat conductive plate. A structure is provided in which an auxiliary heat dissipation structure including a heat conduction pin is provided by fitting the through hole with the pin electric terminal and projecting the heat conduction pin from the bottom of the case to the outside of the case. Then, the electric pin terminals are electrically connected to the mother printed board, and the heat conduction pins are fixed to the mother printed board to be mounted on the mother printed board. .

According to a second aspect of the present invention, there is provided an electronic circuit structure comprising a circuit board, a semiconductor element mounted on the circuit board, and pin electric terminals fixed to the circuit board, and the electronic circuit structure inside. A shield case for accommodating the circuit structure, wherein the pin electric terminal projects from the bottom of the shield case to the outside of the shield case, and the pin electric terminal is electrically connected to the mother printed board. In the electronic circuit module mounted on the mother printed board, the heat conductive plate having through holes corresponding to the pin electric terminals and the heat conductive plate is fixed by being planted through the heat conductive plate. An auxiliary heat dissipation structure composed of a plurality of heat conduction pins protruding upward and downward is fitted in the through hole with the pin electric terminal, and the heat conduction pin is inserted from the bottom of the case to the case. The heat conductive pin is brought into contact with the circuit board to electrically connect the electric pin terminal to the mother printed board, and The pin is fixed to the mother printed board and mounted on the mother printed board.

According to a third aspect of the present invention, there is provided an electronic circuit structure comprising a circuit board, a semiconductor element mounted on the circuit board, and pin electrical terminals fixed to the circuit board, and the electronic circuit structure inside. A shield case for accommodating the circuit structure, wherein the pin electric terminal projects from the bottom of the shield case to the outside of the shield case, and the pin electric terminal is electrically connected to the mother printed board. In the electronic circuit module mounted on the mother printed board, a protruding portion that is added to the pin electric terminal and protrudes above the circuit board, and a heat conducting plate fixed to the upper end of the protruding portion. On the mother printed board by electrically connecting the lower end of the electric pin terminal to the mother printed board. It is obtained by a mounted configurations.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1, 2 and 3 show a photoelectric conversion module 30 according to a first embodiment of the present invention. The photoelectric conversion module 30 includes an electronic circuit structure 31 and a metal shield case 32 for shielding electromagnetic waves.
And a semiconductor laser element 33, and a heat dissipation auxiliary structure 34 which is an essential part of the present invention. The electronic circuit structure 31 and the heat dissipation auxiliary structure 34 are housed in a shield case 32. Although the electronic circuit structure 31 and the heat dissipation auxiliary structure 34 are integrated prior to being assembled in the shield case 32, for convenience of description, the electronic circuit structure 31 and the heat dissipation auxiliary structure 34 are separate bodies. Explain as there is.

The electronic circuit structure 31 has a rectangular circuit board 35, an IC element 36 mounted on the upper and lower surfaces of the circuit board 35, and an upper end fixed to the circuit board 35 and extending downward. It has a pin-shaped electric terminal 37 aligned along the longitudinal edge of the circuit board 35, and a plate-shaped ground terminal 38 protruding from the circuit board 35. The power consumption of the electronic circuit structure 31 has increased to about 5 W along with the speeding up of signals.

The shield case 32 includes a case body 40 made of metal and a lid 41 made of metal. Case body 40
Has a frame-shaped flange 42 along the periphery of the lower surface, and a bracket 43 protruding inward from the side surface in the longitudinal direction.
Having. An opening 44 is formed inside the flange 42.

The electronic circuit structure 31 has a circuit board 35 fixed to a bracket 43 and is incorporated in a shield case 32. The pin-shaped electric terminal 37 projects downward from the bottom surface of the shield case 32 through the opening 44.
The plate-shaped ground terminal 38 is pressed against the inner surface of the case body 40.

The semiconductor laser element 33 includes a spherical lens 4
It is incorporated in the holder 46 together with 5 and the like. An optical fiber 47 is drawn out from the holder 46. The holder 46 is screwed to the case main body 48 and projects outside the case main body 48. Semiconductor laser device 33
The terminal 48 of is connected to the circuit board 35.

A heat dissipation auxiliary structure 34, which is an essential part of the present invention.
Is composed of a heat conduction plate 60 and a plurality of heat conduction pins 61 that are planted and fixed to the heat conduction plate 60 and extend downward. The heat conduction plate 60 has substantially the same size as the circuit board 35 described above, and as shown in FIGS.
It is composed of a rectangular plate body 62, a solid copper foil 63 on a front surface 62a of the plate body 62, and a solid copper foil 64 on a back surface 62b of the plate body 62. The solid copper foils 63 and 64 on the front surface 62a and the back surface 62b of the plate member 62 are provided for lowering thermal resistance to improve heat conduction and for soldering terminals. In addition, the plate body 62 has a region 65 along the longitudinal edge for convenience,
66 and a region 67 between the regions 65 and 66.

The plate member 62 includes a first through hole group 68 and a second through hole group 68.
Through-hole group 69. The first through-hole group 63 has a plurality of first through-hole groups 63 arranged in a row along the longitudinal edges of the plate body 62 in the regions 65 and 66, corresponding to the pin-shaped electric terminals 37. The through hole 70. The second through hole group 64 includes a plurality of second through holes 71 arranged in three rows in the area 67. Of the openings of the first through holes 70, the portion on the front side of the heat conduction plate 60 is the annular copper foil-free portion 7.
3 and the annular copper foil portion 74 is provided inside the annular copper foil-free portion 73. A portion of the opening of the first through hole 70 on the back side of the heat conduction plate 60 has an annular copper foil-free portion 75, and inside the annular copper foil-free portion 75,
It has a configuration having an annular copper foil portion 76. Circular copper foil part 7
4, 76 are electrically insulated from the solid copper foils 63, 64, respectively. The solid copper foils 63 and 64 face the openings of the second through holes 71.

The upper end of each heat conducting pin 61 is inserted into each second through hole 71 and fixed by solder 77,
It projects downward and is lined up in three rows. The solder 77 is located on the front side and the back side of the heat conductive plate 60, and the portion of the solid copper foil 63, 64 facing the opening of the second through hole 71 and the heat conductive pin 6 are disposed.
Connect with 1.

Here, the heat conducting pin 61 is a prism.
As shown in an enlarged view in FIG. 5, the heat conducting pin 61 and the second through hole 71 are inserted in the circular second through hole 71.
A gap 78 is left between and. However, the gap 76
The inside is filled with solder 75, and the heat conduction pin 61
The thermal resistance between the heat conducting plate 60 and the heat conducting plate 60 is small.

In the heat dissipation assisting structure 34 having the above-mentioned structure, all the first through holes 70 are fitted to the corresponding pin-shaped electric terminals 37, and are fixed at positions in the middle of the pin-shaped electric terminals 37 with solder 79. And is fixed at a position a distance a below the circuit board 35. The solder 77 connects the annular copper foil portions 73 and 75 to the pin-shaped electric terminal 37 on the front side and the back side of the heat conduction plate 60. The pin-shaped electric terminal 37 penetrates the first through hole 70. The pin-shaped electric terminal 37 and the heat conduction pin 61 are aligned. In addition, the lower end 3 of the pin-shaped electric terminal 37
7a and the lower end 61a of the heat conduction pin 61 are aligned at the same height.

Here, the pin-shaped electric terminal 37 is a prism, and, as shown in an enlarged view in FIG. 5, a circular first through hole 70.
In the state where the pin-shaped electric terminal 37 and the first through hole 70 are inserted, a gap 80 is left. But,
The space 80 is filled with solder 79, and the thermal resistance between the pin-shaped electric terminal 37 and the heat conduction plate 60 is small.

The heat conduction plate 60 of the heat dissipation auxiliary structure 34 having the above-mentioned structure has a frame-shaped flange 4 at the portion along the periphery of the lower surface.
It is fixed to 2. The heat conduction plate 60 is located inside the shield case 32 and closes the opening 44. The heat conduction pin 61 projects downward from the bottom surface of the shield case 32 through the opening 44.

Next, the photoelectric conversion module 30 having the above structure
The state in which is mounted on the mother printed board 90 and the heat dissipation of the IC element 36 during operation will be described. As shown in FIG. 1, the mother printed board 90 has holes 91 corresponding to the pin-shaped electric terminals 37, and heat-conducting pins 61.
Corresponding to the holes 92 are formed.

The photoelectric conversion module 30 is shown in FIGS.
, The pin-shaped electric terminal 37 is inserted into the hole 91, and the heat conduction pin 61 is inserted into the hole 92.
It is mounted on the mother printed board 90 in a state of being fixed by 3, and the case body 40 being in contact with the upper surface of the mother printed board 90.

As shown in FIG. 6, during operation, the IC element 36
The heat generated in 1 is conducted to the mother printed board 90, and the heat is generated from the front and back surfaces of the mother printed board 90 by the reference numeral 100.
As shown by, heat is radiated into the atmosphere. There are roughly two paths through which heat generated by the IC element 36 reaches the mother printed board 90.

One is the first path 101 of the IC element 36 → the circuit board 35 → the pin-shaped electric terminals 37 → the mother printed board 90. This is a path that also has a conventional photoelectric conversion module. The other is a pin-shaped electric terminal 37.
Is a path branched from a position 102 in the middle of the above, and is a second path 103 of the position 102 in the middle of the pin-shaped electric terminal 37 → heat conduction plate 60 → heat conduction pin 61 → mother printed board 90. The second route 103 is a newly added route.

The heat generated in the IC element 36 reaches the mother printed board 90 through the first path 101 and is radiated from the mother printed board 90, and the heat is generated from the middle of the first path 101 to the second path 103. After reaching the mother printed board 90, the heat is dissipated from there. Looking at the second path 103, a part of the heat that has been conducted to the position 102 in the middle of the pin-shaped electric terminal 37 is in all directions on the heat conducting plate 60 as shown by the arrow 104 in FIG. Spread and transmitted.
The heat spread to the heat conduction plate 60 in all directions is transmitted from all sides to the heat conduction pin 61 as indicated by an arrow 105.

Since the second path 103 is newly added as described above, the thermal resistance R1 between the IC element 36 and the mother printed board 90 is the same as the IC element 16 and the mother of the conventional photoelectric conversion module. It is smaller than the thermal resistance R0 with the printed board 18. As shown in FIG. 6B, the presence of the solder 79 reduces the thermal resistance between the pin-shaped electric terminal 37 and the heat conduction plate 60. Also,
The presence of the solder 75 reduces the thermal resistance between the heat conduction pin 61 and the heat conduction plate 60. This also reduces the thermal resistance R1.

Since the thermal resistance R1 between the IC element 36 and the mother printed board 90 is small, the heat generated by the IC element 36 is efficiently conducted to the mother printed board 90 and the IC
The element 36 is cooled more efficiently than before. Therefore, the temperature around the photoelectric conversion module 30 is 65 at maximum.
Even under severe conditions in which the electric power consumption of the electronic circuit structure 31 is increased to about 5 W, the IC
The temperature of the element 36 is suppressed to the same level as when the power consumption of the electronic circuit structure is about 2W. Therefore, the temperature of the semiconductor laser element 33 is suppressed to 90 degrees C or lower. As a result, the semiconductor laser device 33 continues to operate with a normal light output, and the optical communication maintains a normal state.

Instead of the heat dissipation auxiliary structure 34 described above, FIG.
You may use the heat dissipation auxiliary structure 34A shown in FIG. The heat dissipation auxiliary structure 34A has a structure in which the heat conduction plate 60A is made of metal and a plurality of heat conduction pins 61 are fixed to the metal. The pin-shaped electric terminal 37 is electrically insulated and fixed by the low melting point glass 110. Since the heat dissipation auxiliary structure 34A is made of metal as the heat conduction plate 60A, the heat resistance is smaller than the heat resistance of the heat dissipation auxiliary structure 34, which is convenient.

Next, a photoelectric conversion module 30A according to a second embodiment of the present invention will be described with reference to FIGS. 8, 9 and 10. The photoelectric conversion module 30A is the same as the photoelectric conversion module 3 described above except for the heat dissipation auxiliary structure 34B.
Same as 0. 8, 9, and 10, the same components as those shown in FIGS. 1, 2, and 3 are designated by the same reference numerals, and the description thereof will be omitted.

The heat dissipation auxiliary structure 34B includes a heat conduction pin 61.
In this structure, A projects above the heat conduction plate 60. As shown in FIG. 10, the heat dissipation auxiliary structure 34B is in a state where the upper ends 61Ab of the heat conduction pins 61A are pressed against the ground pattern 120 on the lower surface of the circuit board 35.

The heat generated by the IC element 36 reaches the mother printed board 90, as shown in FIG. Two are the first routes 10 described in the first embodiment.
1 and the second route 103. The other is IC element 3
6 → circuit board 35 → heat conduction pin 61A → third path 121 of mother printed board 90.

Since the third path 121 is newly added as described above, the thermal resistance R2 between the IC element 36 and the mother printed board 90 is the same as the IC element 16 and the mother of the conventional photoelectric conversion module. It is smaller than the thermal resistance R0 between the printed board 18 and the thermal resistance R1 between the IC element 36 of the photoelectric conversion module 30 and the mother printed board 90 of the first embodiment. Therefore, the IC element 36 is cooled more efficiently, and the temperature of the semiconductor laser element 33 is
It is surely suppressed by 90 degrees C or less. As a result, the semiconductor laser element 33 continues to operate with a normal light output,
That is, it is possible to more reliably ensure that the optical communication is maintained in the normal state.

The heat dissipation assisting structure 34B may be composed of a metal heat conducting plate 60A as in FIG. Next, the photoelectric conversion module 30 according to the third embodiment of the present invention.
B will be described with reference to FIGS. 12, 13, and 14.

The photoelectric conversion module 30B is substantially the same as the photoelectric conversion module 30 except for the heat dissipation auxiliary structure 34C. 12, 13, and 14, the same components as those shown in FIGS. 1, 2, and 3 are designated by the same reference numerals, and the description thereof will be omitted.

The heat dissipation assisting structure 34C includes a heat conducting pin 61.
And the pin-shaped electric terminal 37A is not provided.
5 also protrudes above (this part is the protrusion 3
7Ac), the upper end 37Ab of the pin-shaped electric terminal 37A
The heat conducting plate 60B is fixed to the heat conducting plate 60B, and the metal plate 131 to which the heat radiation fins 130 are fixed is screwed onto the upper surface of the heat conducting plate 60B. The pin-shaped electric terminal 37A and the heat conduction plate 60B are the upper end 37A of the pin-shaped electric terminal 37A.
b partially fits into the hole 132 of the heat conduction plate 60B,
The structure is fixed by the solder 133. There is a gap 134 between the upper end 37Ab of the pin-shaped electric terminal 37A and the lower surface of the metal plate 131, and the upper ends 37Ab of the pin-shaped electric terminal 37A are electrically insulated from each other.

The lid 41B has an opening 135 into which the metal plate 131 is fitted. The lid 41B has a metal plate 1 inside the opening 135.
It is attached in the state that 31 is set. The heat generated in the IC element 36 is conducted to the mother printed board 90, and is radiated from the front and back surfaces of the mother printed board 90 to the atmosphere as indicated by reference numeral 100, and at the same time, the radiating fin 1
Heat is radiated from the surface of 30 into the atmosphere as indicated by reference numeral 140.

The path through which the heat generated by the IC element 36 reaches the mother printed board 90 is the first path 101 described in the first embodiment, as shown in FIG. The path through which the heat generated by the IC element 36 reaches the heat radiation fin 130 is defined by the circuit board 3
The path 141 is formed of 5 → protruding portion 37Ac of the pin-shaped electric terminal 37 → heat conductive plate 60B → metal plate 131 → radiating fins 130.

Since the path 141 is newly added as described above, the mother printed circuit board 90 can be connected to the mother printed board 90 from the IC element 36.
Also, the amount of heat conducted to the radiation fins 130 is large, so that the IC element 36 is efficiently cooled, and the temperature of the semiconductor laser element 33 is suppressed to 90 ° C. or less. As a result, it can be guaranteed that the semiconductor laser device 33 continues to operate with a normal light output, that is, that the optical communication is maintained in a normal state.

The present invention is not limited to the above embodiments, but can be applied to an electronic circuit module having no semiconductor laser element 33 and an electronic circuit module having no case.

[0041]

As described above, according to the first aspect of the present invention,
A heat conduction plate having a through hole corresponding to the pin electric terminal, and an auxiliary heat dissipation structure consisting of a plurality of heat conduction pins planted and fixed in the heat conduction plate, by fitting the through hole with the pin electric terminal, Moreover, the heat conducting pin is provided so as to protrude from the bottom of the case to the outside of the case, the electric pin terminal is electrically connected to the mother printed board, and the heat conducting pin is fixed to the mother printed board. Since it is mounted on the mother printed board, a heat conduction path can be additionally provided between the semiconductor element and the mother printed board. Therefore, the thermal resistance between the semiconductor element and the mother printed board can be increased. Can be made smaller, and hence heat dissipation can be improved.

According to the second aspect of the present invention, the auxiliary heat dissipation structure is fixed by a plurality of heat conducting pins which penetrate through the heat conducting plate and are fixed, and project above and below the heat conducting plate. Then, abut the upper end of the heat conduction pin on the circuit board,
Since the electric pin terminals are electrically connected to the mother printed board and the heat conduction pins are fixed to the mother printed board to be mounted on the mother printed board,
Compared with the invention of claim 1, a heat conduction path can be additionally provided between the semiconductor element and the mother printed board,
Therefore, the thermal resistance between the semiconductor element and the mother printed board can be further reduced, and the heat dissipation can be further improved.

According to the third aspect of the present invention, the auxiliary heat dissipation structure is added to the pin electric terminal and protrudes above the circuit board, and the heat conduction is fixed to the upper end of the protrusion. The structure consists of a board and a heat-dissipating fin on the heat conduction plate, and the lower end of the electric pin terminal is electrically connected to the mother printed board to be mounted on the mother printed board. It can be conducted to the printed board and also to the radiation fins, so that the radiation performance can be improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a photoelectric conversion module according to a first embodiment of the present invention.

2 is a cross-sectional view of the photoelectric conversion module of FIG. 1 taken along the line II-II.

3 is a cross-sectional view taken along line II-II of the photoelectric conversion module shown in FIG. 1 with a case omitted.

FIG. 4 is a diagram showing a heat conduction plate.

5 is an enlarged plan view showing a portion indicated by reference sign A in FIG. 3. FIG.

6 is a diagram illustrating heat conduction (heat dissipation) of the photoelectric conversion module of FIG.

FIG. 7 is a diagram showing a modified example of the heat dissipation auxiliary structure in FIG.

FIG. 8 is an exploded perspective view of a photoelectric conversion module according to a second embodiment of the present invention.

9 is a sectional view of the photoelectric conversion module in FIG. 8 taken along line IX-IX.

10 is a cross-sectional view taken along line XX of the photoelectric conversion module shown in FIG. 8 with a case omitted.

FIG. 11: Heat conduction (heat dissipation) of the photoelectric conversion module of FIG.
FIG.

FIG. 12 is an exploded perspective view of a photoelectric conversion module according to a third embodiment of the present invention.

13 is a cross-sectional view of the photoelectric conversion module of FIG. 12, XIII-XIII.
It is sectional drawing which follows a line.

FIG. 14 is a cross-sectional view taken along line XIV-XIV of the photoelectric conversion module of FIG. 12 with a case omitted.

15 is a diagram for explaining heat conduction (heat dissipation) of the photoelectric conversion module in FIG.

FIG. 16 is a diagram showing a conventional example.

[Explanation of symbols]

 30, 30A, 30B Photoelectric conversion module 31 Electronic circuit structure 32 Metal shield case 33 Semiconductor laser element 34, 34A, 34B, 34C Heat dissipation auxiliary structure 35 Circuit board 36 IC element 37 Pin-shaped electric terminal 37Ac protruding portion 45 Spherical lens 46 Holder 47 Optical fiber 60, 60A Heat conduction plate 61, 61A Heat conduction pin 61Ab Upper end 62 Plate 63, 64 Solid copper foil 68 First through hole group 69 Second through hole group 70 First Through-hole 71 Second through-hole 73, 75 Ring-shaped copper foil-free portion 74, 76 Ring-shaped copper foil portion 77, 79 Solder 90 Mother printed board 130 Radiating fin 131 Metal plate

Claims (3)

[Claims] 1. An electronic circuit structure comprising a circuit board, a semiconductor element mounted on the circuit board, and pin electric terminals fixed to the circuit board, and the electronic circuit structure is housed inside. A shield case, wherein the pin electric terminal projects from the bottom of the shield case to the outside of the shield case, and the pin electric terminal is electrically connected to a mother printed board. In the electronic circuit module mounted on the above, an auxiliary heat dissipation structure including a heat conduction plate having through holes corresponding to the pin electric terminals, and a plurality of heat conduction pins planted and fixed in the heat conduction plate, The through hole is fitted to the pin electric terminal, and the heat conducting pin is provided so as to protrude from the bottom of the case to the outside of the case. By connected over the printed circuit board and the electrical and electronic circuit modules, characterized in that the heat conducting pin is fixed with the mother printed circuit board and configured to be mounted on said mother printed circuit board. 2. An electronic circuit structure comprising a circuit board, a semiconductor element mounted on the circuit board, and pin electrical terminals fixed to the circuit board, and the electronic circuit structure is housed inside. A shield case, wherein the pin electric terminal projects from the bottom of the shield case to the outside of the shield case, and the pin electric terminal is electrically connected to a mother printed board. In the electronic circuit module mounted on the heat conduction plate, the heat conduction plate having through holes corresponding to the pin electric terminals and the heat conduction plate are planted and fixed so as to extend above and below the heat conduction plate. An auxiliary heat dissipation structure composed of a plurality of protruding heat conduction pins is fitted in the through hole with the pin electric terminal, and the heat conduction pin is projected from the bottom of the case to the outside of the case. The upper end of the heat conduction pin is abutted against the circuit board to electrically connect the electric pin terminal to the mother printed board, and the heat conduction pin is connected to the mother board. An electronic circuit module, wherein the electronic circuit module is fixed to a printed board and mounted on the mother printed board. 3. An electronic circuit structure comprising a circuit board, a semiconductor element mounted on the circuit board, and pin electric terminals fixed to the circuit board, and the electronic circuit structure is housed inside. A shield case, wherein the pin electric terminal projects from the bottom of the shield case to the outside of the shield case, and the pin electric terminal is electrically connected to a mother printed board. In an electronic circuit module mounted on the above, a protruding portion that is added to the pin electric terminal and protrudes above the circuit board, a heat conducting plate fixed to an upper end of the protruding portion, and the heat conducting member. An auxiliary heat dissipation structure including heat dissipation fins on the board is provided, and the lower end of the electric pin terminal is electrically connected to the mother printed board to be mounted on the mother printed board. Electronic circuit module is characterized in that a.