CN104486930A - PCB (Printed Circuit Board) heat dissipation mounting seat - Google Patents
PCB (Printed Circuit Board) heat dissipation mounting seat Download PDFInfo
- Publication number
- CN104486930A CN104486930A CN201410731954.XA CN201410731954A CN104486930A CN 104486930 A CN104486930 A CN 104486930A CN 201410731954 A CN201410731954 A CN 201410731954A CN 104486930 A CN104486930 A CN 104486930A
- Authority
- CN
- China
- Prior art keywords
- seat
- heat
- pcb
- pcb board
- cold plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of manufacturing of electronic products, in particular to a PCB (Printed Circuit Board) heat dissipation mounting seat. The mounting seat comprises a fixed seat, a heat conduction seat, a connector and a refrigerating board, wherein the connector and the refrigerating board are matched with a PCB heat dissipation lead-out pin; the connector is provided with a heat conduction pin; the heat conduction pin is connected to the heat conduction seat through the fixed plate; the heat conduction seat is embedded into the refrigerating board; side edges of a PCB are clamped on the fixed seat; the fixed seat is fixedly arranged on an outer frame; the outer frame is fixedly arranged on the refrigerating board; the refrigerating board comprises a upper supporting seat, a lower supporting seat and refrigerating fins; the refrigerating fins are slantwise, crosswise and fixedly arranged between the upper supporting seat and the lower supporting seat. The mounting seat has the beneficial effects that heat on the PCB is introduced into the refrigerating board for cooling, noise-free refrigeration can be realized, and the PCB is clamped through the outer frame and is prevented from shaking.
Description
Technical field
The invention belongs to Electronic products manufacturing field, particularly pcb board heat radiation mount pad.
Background technology
Pcb board and printed circuit board, also known as printed circuit board (PCB), printed substrate, be called for short wiring board, take insulation board as base material, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components.Because this plate adopts electron printing to make, therefore be called as " printing " circuit board; Single sided board, double sided board, four laminates, six laminates and other multilayer circuit board can be divided into according to the wiring board number of plies.Due to pcb board can be installed a large amount of electronic devices and components, like this along with the work of pcb board, electronic devices and components will produce a large amount of heats, and on pcb board, high integrated circuit structure can cause very large impact to heat radiation, therefore, heat dissipation problem is the large problem of pcb board always.
Summary of the invention
The object of the invention is to solve present pcb board to be not easy to heat radiation and to cause electronic devices and components heat to be stored up on pin, cause electronic device to be easy to the problem burnt out, thus a kind of pcb board heat radiation mount pad being convenient to dispel the heat is provided.
To achieve these goals, pcb board heat radiation mount pad provided by the invention, comprise holder, heat conducting seat, to dispel the heat the connector and cold plate that leading foot coordinates with pcb board, described connector is provided with heat conduction pin, described heat conduction pin is connected on heat conducting seat by fixed head, heat conducting seat is embedded into cold plate inside, pcb board side is connected on holder, holder stator is on housing, and housing is fixed on cold plate, described cold plate comprises upper support seat, lower support seat and cooling piece, described cooling piece inclination intersection is fixed between upper support seat and lower support seat.
The pcb board heat radiation mount pad of this programme when in use, pcb board is provided with radiating insulating layer manufacturing its inside in layer, radiating insulating layer extends out and forms heat radiation leading foot, the leading foot that will dispel the heat inserts on the connectors, the heat conduction pin of connector is put together by heat conducting seat and is incorporated into cold plate inside, to passing into cold air in cold plate or passing into other this cold medium, effectively can realize the heat radiation of PCB, and occurring to prevent pcb board rocking, by housing, PCB both sides being fixedly clamped.
The invention has the advantages that: the heat on pcb board is introduced on cold plate and cool, noiseless refrigeration can be realized, and by housing, pcb board is clamped, prevent pcb board from occurring rocking.
As preferred scheme, the upper support seat of described cold plate is provided with the prefabricated socket of many rows for heat conducting seat insertion, by seal cap sealing on socket, can be used for polylith pcb board to dispel the heat simultaneously, when socket does not use, can be sealed by seal cover.
As preferred scheme, the upper support seat of described cold plate is aluminium sheet, because aluminium sheet has good thermal conductivity, temperature can be neutralized by aluminium sheet.
As preferred scheme, the broad-adjustable fixed cover of described housing upper end thereof one, by the adjustment of fixed cover, can regulate having the pcb board of a small amount of error.
Accompanying drawing explanation
Fig. 1 is the structural representation of pcb board heat radiation mount pad.
Reference numeral is enumerated: pcb board 1, connector 2, heat conducting seat 3, cold plate 4, housing 5, holder 6, upper cover 7, adjusting bolt 8.
Embodiment
Below by embodiment, the present invention is further detailed explanation by reference to the accompanying drawings:
Pcb board 1 as shown in Figure 1 dispels the heat mount pad, comprise holder 6, connector 2 that heat conducting seat 3, the leading foot that to dispel the heat with pcb board 1 coordinate and cold plate 4, connector 2 be provided with heat conduction pin, heat conduction pin is connected on heat conducting seat 3 by fixed head 9, it is inner that heat conducting seat 3 is embedded into cold plate 4, pcb board 1 side is connected on holder 6, holder 6 stator is on housing 5, and housing 5 is fixed on cold plate 4, cold plate 4 comprises upper support seat, lower support seat and cooling piece, and cooling piece inclination intersection is fixed between upper support seat and lower support seat.
When in use, pcb board 1 is provided with radiating insulating layer manufacturing its inside in layer, radiating insulating layer extends out and forms heat radiation leading foot, the leading foot that will dispel the heat inserts on the connectors, the heat conduction pin of connector is put together by heat conducting seat and is incorporated into cold plate inside, to passing into cold air in cold plate or passing into other this cold medium, effectively can realize the heat radiation of PCB, and occurring to prevent pcb board rocking, by housing, PCB both sides being fixedly clamped.
The upper support seat of cold plate 4 is provided with the prefabricated socket of many rows for heat conducting seat insertion, by seal cap sealing on socket, can be used for polylith pcb board to dispel the heat simultaneously, when socket does not use, can be sealed by seal cover.The upper support seat of cold plate 4 is aluminium sheet, because aluminium sheet has good thermal conductivity, temperature can be neutralized by aluminium sheet.The broad-adjustable fixed cover 7 of housing 5 upper end thereof one, the adjustment of upper cover is realized by adjusting bolt 8, and adjusting bolt 8 is rotated and realized drawing in gradually in the middle part of upper cover 7 making upper cover 7 be carried out by housing drawing in and then clamping pcb board 1.
Above-described is only the preferred embodiment of the present invention; should be understood that; for a person skilled in the art; under the prerequisite not departing from structure of the present invention; some distortion and improvement can also be made; these also should be considered as protection scope of the present invention, and these all can not affect effect of the invention process and practical applicability.
Claims (4)
1.PCB plate heat radiation mount pad, it is characterized in that, comprise holder, connector that heat conducting seat, the leading foot that to dispel the heat with pcb board coordinate and cold plate, described connector be provided with heat conduction pin, described heat conduction pin is connected on heat conducting seat by fixed head, heat conducting seat is embedded into cold plate inside, pcb board side is connected on holder, holder stator is on housing, and housing is fixed on cold plate, described cold plate comprises upper support seat, lower support seat and cooling piece, and described cooling piece inclination intersection is fixed between upper support seat and lower support seat.
2. pcb board heat radiation mount pad according to claim 1, is characterized in that: the upper support seat of described cold plate is provided with many rows for the prefabricated socket of heat conducting seat insertion, and socket passes through seal cap sealing.
3. pcb board heat radiation mount pad according to claim 2, is characterized in that: the upper support seat of described cold plate is aluminium sheet.
4. pcb board heat radiation mount pad according to claim 3, is characterized in that: the broad-adjustable fixed cover of described housing upper end thereof one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410731954.XA CN104486930A (en) | 2014-12-06 | 2014-12-06 | PCB (Printed Circuit Board) heat dissipation mounting seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410731954.XA CN104486930A (en) | 2014-12-06 | 2014-12-06 | PCB (Printed Circuit Board) heat dissipation mounting seat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104486930A true CN104486930A (en) | 2015-04-01 |
Family
ID=52761414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410731954.XA Pending CN104486930A (en) | 2014-12-06 | 2014-12-06 | PCB (Printed Circuit Board) heat dissipation mounting seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104486930A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108542416A (en) * | 2018-05-24 | 2018-09-18 | 明峰医疗系统股份有限公司 | A kind of fixed structure of pet detector pcb board |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2639764A1 (en) * | 1988-11-25 | 1990-06-01 | Nec Corp | Structure for cooling heat-generating components |
| US5014904A (en) * | 1990-01-16 | 1991-05-14 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
| JPH09289329A (en) * | 1996-04-22 | 1997-11-04 | Fujitsu Ltd | Electronic circuit module |
| JP2004072959A (en) * | 2002-08-09 | 2004-03-04 | Hitachi Ltd | Power conversion device |
| JP2007214556A (en) * | 2006-01-16 | 2007-08-23 | Swcc Showa Device Technology Co Ltd | Circuit terminator |
| JP2008016567A (en) * | 2006-07-04 | 2008-01-24 | Calsonic Kansei Corp | Automotive electronic component cooling apparatus |
| US20080218970A1 (en) * | 2002-08-30 | 2008-09-11 | Themis Computer | Thermal Management for a Ruggedized Electronics Enclosure |
| JP2009026780A (en) * | 2007-07-17 | 2009-02-05 | Hitachi Ltd | Electronic control device |
| CN201547576U (en) * | 2009-11-13 | 2010-08-11 | 珠海华博科技工业有限公司 | LED lamp with radiating structure |
| US20130093270A1 (en) * | 2011-10-18 | 2013-04-18 | Hamilton Sundstrand Corporation | High temperature environment capable motor controller |
| WO2013067843A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| JP3189708U (en) * | 2014-01-14 | 2014-03-27 | アルプス電気株式会社 | Electronics |
| CN203633032U (en) * | 2013-10-31 | 2014-06-04 | 芜湖市安曼特微显示科技有限公司 | Heat-radiating device for electronic parts and components |
| CN204259342U (en) * | 2014-12-06 | 2015-04-08 | 重庆市库格尔电子有限公司 | Pcb board heat radiation mount pad |
-
2014
- 2014-12-06 CN CN201410731954.XA patent/CN104486930A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2639764A1 (en) * | 1988-11-25 | 1990-06-01 | Nec Corp | Structure for cooling heat-generating components |
| US5014904A (en) * | 1990-01-16 | 1991-05-14 | Cray Research, Inc. | Board-mounted thermal path connector and cold plate |
| JPH09289329A (en) * | 1996-04-22 | 1997-11-04 | Fujitsu Ltd | Electronic circuit module |
| JP2004072959A (en) * | 2002-08-09 | 2004-03-04 | Hitachi Ltd | Power conversion device |
| US20080218970A1 (en) * | 2002-08-30 | 2008-09-11 | Themis Computer | Thermal Management for a Ruggedized Electronics Enclosure |
| JP2007214556A (en) * | 2006-01-16 | 2007-08-23 | Swcc Showa Device Technology Co Ltd | Circuit terminator |
| JP2008016567A (en) * | 2006-07-04 | 2008-01-24 | Calsonic Kansei Corp | Automotive electronic component cooling apparatus |
| JP2009026780A (en) * | 2007-07-17 | 2009-02-05 | Hitachi Ltd | Electronic control device |
| CN201547576U (en) * | 2009-11-13 | 2010-08-11 | 珠海华博科技工业有限公司 | LED lamp with radiating structure |
| US20130093270A1 (en) * | 2011-10-18 | 2013-04-18 | Hamilton Sundstrand Corporation | High temperature environment capable motor controller |
| WO2013067843A1 (en) * | 2011-11-09 | 2013-05-16 | 东莞勤上光电股份有限公司 | Heat sink structure for high-power led |
| CN203633032U (en) * | 2013-10-31 | 2014-06-04 | 芜湖市安曼特微显示科技有限公司 | Heat-radiating device for electronic parts and components |
| JP3189708U (en) * | 2014-01-14 | 2014-03-27 | アルプス電気株式会社 | Electronics |
| CN204259342U (en) * | 2014-12-06 | 2015-04-08 | 重庆市库格尔电子有限公司 | Pcb board heat radiation mount pad |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108542416A (en) * | 2018-05-24 | 2018-09-18 | 明峰医疗系统股份有限公司 | A kind of fixed structure of pet detector pcb board |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150401 |