JPH0913001A - Liquid adhesive for electronic component and adhesive tape for electronic component - Google Patents

Abstract

PURPOSE: To obtain a liquid adhesive for electronic components which performs bonding at relatively low temperatures and provides excellent heat resistance, reliability, etc., by dissolving an adhesive component comprising a specified siloxane-modified poly-amideimide resin in an organic solvent. CONSTITUTION: An adhesive component comprising a siloxane-modified polyamideimide resin having a weight-average molecular weight of 1,000-50,000 and having an arrangement comprising 0.1-99.8wt.% polyamideimide structural units having a weight-average molecular weight of 800-30,000 and represented by formula I, 0.1-99.8wt.% polysiloxaneimide structural units having a weight- average molecular weight of 500-15,000 and represented by formula II and 0.1-99.8wt.% imide structural units represented by formula III is thoroughly dissolved in an organic solvent (e.g. tetrahydrofuran) to obtain a liquid adhesive for bonding an electronic component (e.g. semiconductor chip). In formulas I, II and III, A<1> to A<4> are each a group of formula IV or V or the like; R<1> and R<2> are each H, a halogen, a lower alkyl or the like; and X is a direct bond, a 1-6 C alkylene or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component for use in bonding between members around a lead frame constituting a semiconductor device, for example, a lead pin, a substrate for mounting a semiconductor chip, a heat sink, a semiconductor chip itself, and the like. The present invention relates to an adhesive tape and a liquid adhesive.

[0002]

2. Description of the Related Art Conventionally, adhesive tapes and the like used in resin-sealed semiconductor devices include lead frame fixing adhesive tapes and TAB tapes. The lead frame fixing adhesive tape is for fixing the lead pins of the lead frame, and is intended to improve the production yield of the lead frame itself and the entire semiconductor assembly process, and at the same time improve the productivity. In general,
For resin-sealed semiconductor devices, the lead frame maker taps the lead frame fixing adhesive tape on the lead frame, and then the semiconductor device is brought to the semiconductor maker.
After mounting, it is resin-sealed. Therefore, the adhesive tape for fixing the lead frame has not only general reliability at the semiconductor level and workability at the time of taping, but also has sufficient room temperature adhesion immediately after taping and withstands heating in the semiconductor device assembling process. Sufficient heat resistance is required.

Conventionally, as an adhesive tape, for example, on a support film such as a polyimide film, a synthetic rubber resin such as polyacrylonitrile, polyacrylic ester, acrylonitrile-butadiene copolymer or the like is modified alone or with another resin. The above is used, or the one prepared by applying an adhesive mixed with other resin and in a B stage state is used.

In recent years, a resin-sealed semiconductor device (semiconductor package) having a structure as shown in FIGS. 1 to 3 has been developed or manufactured. In the resin-sealed semiconductor device shown in FIG. 1, the lead pins 3 and the plane 2 are connected by an adhesive layer 6, and the semiconductor chip 1 is mounted on the plane 2. Then, they have a structure in which they are sealed with resin 5 together with the bonding wires 4 between the semiconductor chip 1 and the lead pins 3. The resin-sealed semiconductor device shown in FIG. 2 has a structure in which the lead pins 3 are fixed by an adhesive layer 6 provided on the semiconductor chip 1 and is sealed by a resin 5 together with the bonding wires 4. ing. In the resin-sealed semiconductor device shown in FIG. 3, the semiconductor chip 1 is mounted on the die pad 7, the electrode 8 is fixed by the adhesive layer 6, and the semiconductor chip 1 and the electrode 8 are connected together. The space and the electrode 8 and the lead pin 3 are connected by a bonding wire 4 respectively, and they are sealed by a resin 5.

[0005]

Since the adhesive tape used as the adhesive layer 6 in FIGS. 1 to 3 is made of a polyimide resin or the like, it has a problem such as insufficient heat resistance. In particular, since it is used under severe temperature and pressure conditions, there is a risk of damaging the metal material such as the lead frame. Therefore, there is a demand for development of an adhesive that can be bonded under conditions that do not damage metal materials such as lead frames and that has sufficient heat resistance and reliability.

The present invention has been made in view of the above circumstances, and a liquid adhesive for electronic parts, which can be bonded under conditions that do not damage metal materials such as lead frames, and has sufficient heat resistance and reliability, and the same. An object of the present invention is to provide an adhesive tape for electronic parts, which comprises an adhesive layer containing

[0007]

The first liquid adhesive for electronic parts of the present invention is a liquid adhesive for electronic parts comprising an adhesive component and an organic solvent, wherein the adhesive component has the following general formula ( I-1) weight average molecular weight of 800 to 30,0
No. 00 polyamide-imide structural unit and the following general formula (I-
2) a polysiloxaneimide structural unit having a weight average molecular weight of 500 to 15,000 and the following general formula (I-
The imide structural unit represented by 3) includes 0.1 to 99.8% of polyamideimide structural units, 0.1 to 99.8% of polysiloxaneimide structural units, and 0.1 to 9 of imide structural units.
Weight average molecular weight 1, arranged at a weight ratio of 9.8%
A liquid adhesive for electronic parts, which is component (a) which is a siloxane-modified polyamide-imide resin of 000 to 50,000.

[0008]

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[In the formula, A ¹ and A ⁴ each independently represent a group selected from the following formulas (1) to (6),

[0010]

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(In the formula, R ¹ and R ² each represent a hydrogen atom, a halogen atom, a lower alkyl group or a lower alkoxy group, X is a direct bond, a C ₁ -C ₆ linear or branched alkylene group. ,

[0012]

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Wherein Y represents a C _{1 to} C ₆ linear or branched alkylene group or --C (CF ₃ ) _2- , and Al
k ¹ and AlK ² represents a linear or branched alkylene group C ₁ ~C _6, AlK ³ represents a linear or branched alkylene group C ₁ -C _12. ) A ² is a divalent saturated or unsaturated aliphatic hydrocarbon group of C ₂ -C _12, a divalent alicyclic hydrocarbon group, phenylene group, naphthylene group, or,

[0014]

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(In the formula, Z is a direct bond, a methylene group,-
O -, - S -, - SO 2 -, - CO-, or -C (C
F _{3) 2} - represents a. ) Represents a group represented by), A ³ is a lower alkylene group, or

[0016]

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(Wherein Alk ⁴ represents a lower alkylene group), and Ar represents

[0018]

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(Wherein W represents a direct bond, a C _{1 to} C ₄ linear or branched alkylene group, —O—, —SO ₂ —, or —CO—). Represents a group, m
Represents an integer of 1 to 45, and n represents an integer of 1 to 50. ].

The second liquid adhesive for electronic parts of the present invention comprises:
A liquid adhesive for electronic parts, comprising an adhesive component and an organic solvent, wherein the adhesive component comprises the component (a) and a compound represented by the following general formula (II-1) to formula (II-6). A component (b) comprising a compound having two or more selected maleimide groups,

[0021]

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[0022]

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It comprises an organic solvent and comprises the above-mentioned component (a) 10
A liquid adhesive for electronic parts, wherein the component (b) is added in an amount of 10 to 900 parts by weight with respect to 0 parts by weight.

The third liquid adhesive for electronic parts of the present invention comprises:
A liquid adhesive for electronic parts, comprising an adhesive component and an organic solvent, wherein the adhesive component comprises the component (a), the component (b) and a diamine compound represented by the following general formula (III), or a weight. A component (c) containing an amino group-containing siloxane compound represented by the following general formula (IV) having an average molecular weight of 200 to 7,000,

[0025]

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(In the formula, R ⁴ represents a divalent aliphatic group, aromatic group or alicyclic group.)

[0027]

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(In the formula, R ⁵ represents a divalent aliphatic group, an aromatic group or an alicyclic group, and s represents an integer of 1 to 9.) With respect to 100 parts by weight of the component (a). , (B) component and (c) component are added in a proportion of 10 to 900 parts by weight, and the maleimide group of the (b) component is 1 to 100 with respect to 1 mole equivalent of the amino group of the (c) component. It is a liquid adhesive for electronic parts, which is blended in a molar equivalent amount.

The adhesive tape for electronic parts of the present invention comprises a support and an adhesive layer provided on at least one surface of the support, and the adhesive layer is the liquid adhesive for electronic parts described in any one of the first to third aspects. It has an adhesive layer made of an agent, and the support is a heat resistant film or a peelable film.

Hereinafter, the liquid adhesive for electronic parts and the adhesive tape for electronic parts of the present invention will be described in more detail. First, the first liquid adhesive for electronic parts will be described. The weight average molecular weight of the siloxane-modified polyamideimide resin, which is the component (a) contained in the first liquid adhesive for electronic parts, is preferably in the range of 1,000 to 50,000, and 1,000 to 35, The range of 000 is more preferable. When the weight average molecular weight is lower than 1,000, the thermal stability becomes poor and the heat resistance decreases. On the other hand, when it is higher than 50,000, solvent solubility becomes poor, and melt viscosity increases, resulting in poor workability when used as an adhesive and poor adhesiveness.

The above siloxane-modified polyamide-imide resin has a weight average molecular weight of 500 to 500 having amino groups at both ends.
Polyamide of 15,000, weight average molecular weight having amino groups at both ends of 50 to 1,000 diamine compound, weight average molecular weight of having amino groups at both ends of 200 to 200
It can be produced by polycondensing 7,000 polysiloxane and tetracarboxylic dianhydride in an organic solvent to obtain a polyamic acid, and then ring-closing and imidizing the obtained polyamic acid. it can. As the raw material, a commercially available material can be appropriately selected and used.

As the solvent for dissolving the siloxane-modified polyamideimide resin, for example, N, N'-dimethylformamide, N, N'-dimethylacetamide, N
-Methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethylsulfoxide, hexamethylphosphoric triamide, hexane, benzene, toluene, xylene, methanol, ethanol, propanol, isopropanol, diethyl ether, tetrahydrofuran, methyl acetate, Examples thereof include ethyl acetate, acetonitrile, dichloromethane, trichloroethane and the like.

Next, the second liquid adhesive for electronic parts will be described. The second liquid adhesive for electronic parts is composed of the component (a), the component (b) described below, and an organic solvent. The second liquid adhesive for electronic parts has higher heat resistance and higher Young's modulus than the first liquid adhesive. The component (b) is a component containing a compound having two or more maleimide groups selected from the compounds represented by the formulas (II-1) to (II-6). The component (b) is preferably mixed in the range of 10 to 900 parts by weight, more preferably 20 to 800, relative to 100 parts by weight of the component (a). When the amount of the component (b) is lower than 10 parts by weight, the heat resistance and Young's modulus of the adhesive layer are significantly reduced after coating and curing, and when it is more than 900 parts by weight, the adhesive layer is cured up to the B stage. When I did
The adhesive layer itself becomes brittle, resulting in poor workability and poor adhesion to the heat-resistant film as a support.
The poor workability in this case means a phenomenon such that the tape cannot be punched into an accurate shape in the punching step, the flexibility of the tape is reduced, and the adhesive layer is easily broken.

The mixing of the above components (a) and (b) is
Perform in an organic solvent that dissolves both. Preferred organic solvents include, for example, N, N'-dimethylformamide,
N, N'-dimethylacetamide, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, dimethyl sulfoxide, hexamethylphosphoric triamide, hexane, benzene, toluene, xylene, methanol, ethanol, propanol, isopropanol ,
Diethyl ether, tetrahydrofuran, methyl acetate,
Examples thereof include ethyl acetate, acetonitrile, dichloromethane, trichloroethane and the like. These organic solvents may be used alone or as a mixed solvent.

In the second liquid adhesive for electronic parts, the following reaction accelerators may be added, if necessary, in order to accelerate the addition reaction between the above-mentioned components (b). Examples of the reaction accelerator include diazabicyclooctane, methyl ethyl ketone peroxide, cyclohexane peroxide, 3,3,5-trimethylcyclohexanone peroxide, methyl cyclohexanone peroxide, methyl acetoacetate peroxide, 1,1- (t -Butylperoxy) -3,3,3
5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclohexane, 2,2-bis (t-
Butylperoxy) octane, n-butyl-4,4-bis (t-butylperoxy) valate, 2,2-bis (t-butylperoxybutane), t-butylhydroperoxide, cumene hydroperoxide, The-
Isopropylbenzene hydroperoxide, p-methane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,1,3
3-tetramethylbutyl hydroperoxide, di-
t-butyl peroxide, t-butyl cumyl peroxide, di-cumyl peroxide, α, α′-bis (t-butylperoxy-m-isopropyl) benzene, 2,5-dimethyl-2,5- (t -Butylperoxy) hexane, 2,5-dimethyl-2,5- (t-butylperoxy) hexyne, acetyl peroxide, isobutyl peroxide, octanoyl peroxide, decanoyl peroxide, benzoyl peroxide, lauroyl per Oxide, 3,5,5-trimethylhexanoyl peroxide, succinic acid peroxide, 2,4-dichlorobenzoyl peroxide, m-toluoyl peroxide, di-isopropyl peroxydicarbonate, di-2-ethylhexyl peroxide Oxydicarbone , Di-n-propyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, di-myristyl peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-methoxyisopropyl Peroxydicarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, di-allylperoxydicarbonate, t-butylperoxyacetate, t-butylperoxyisobutyrate, t-butylperoxy Pivalate, t-butyl peroxy neodecanoate, cumyl peroxy neodecanoate, t-butyl peroxy-2-ethylhexanate, t-butyl peroxy-3,5,5-trimethylhexanate, t-butyl Peroxylaurate, t-butylpero Xybenzoate, di-t-butylperoxyisophthalate,
2,5-Dimethyl-2,5-di (benzoylperoxy) hexane, t-butylperoxymaleic acid, t-
Butyl peroxy isopropyl carbonate, cumyl peroxy octate, t-hexyl peroxy neodecanoate, t-hexyl peroxy pivalate, t-butyl peroxy neohexanate, t-hexyl peroxy neohexanate, cumyl peroxy Organic peroxides such as neohexanate, acetylcyclohexylsulfonyl peroxide, t-butylperoxyallyl carbonate, 1,2-dimethylimidazole, 1-methyl-2-ethylimidazole, 2-methylimidazole, 2-ethyl- 4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2
-Phenylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-phenylimidazole-trimellitic acid salt, 1-benzyl-2-ethylimidazole,
1-benzyl-2-ethyl-5-methylimidazole,
2-ethylimidazole, 2-isopyropyrimidazole, 2-phenyl-4-benzylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-isopropylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-
Methylimidazolium trimellitate, 1-cyanoethyl-2-ethyl-4-methylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methyl Imidazolyl- (1) ']-ethyl-S-triazine, 2,4-diamino-6- [2'-ethyl-4-methylimidazolyl- (1)']-ethyl-S-triazine, 2,4-diamino -6- [2'-Undecylimidazolyl- (1) ']-ethyl-S-triazine, 2-methylimidazolium isocyanuric acid adduct, 2-phenylimidazolium isocyanuric acid adduct, 2,4-
Diamino-6- [2'-methylimidazole-
(1) ′] Ethyl-S-triazine-isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4-benzyl −
5-hydroxymethylimidazole, 4,4'-methylene-bis- (2-ethyl-5-methyl-imidazole), 1-aminoethyl-2-methylimidazole, 1
-Cyanoethyl-2-phenyl-4,5-di (cyanoethoxymethyl) imidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 4,4 '
-Methylene-bis- (2-ethyl-5-methylimidazole), 2-methylimidazole-benzotriazole adduct, 1,2-dimethylimidazole-benzotriazole adduct, 1-aminoethyl-2-ethylimidazole, 1- (Cyanoethylaminoethyl) -2-methylimidazole, N, N '-[2-methylimidazolyl-
(1) -Ethyl] -adipoyldiamide, N, N'-bis- (2-methylimidazolyl-1-ethyl) urea, N
-[2-Methylimidazolyl-1-ethyl] urea, N,
N '-[2-Methylimidazolyl- (1) -ethyl] dodecanedioyldiamide, N, N'-[2-Methylimidazolyl- (1) -ethyl] eicosanedioyldiamide, 1-benzyl-2-phenylimidazole Examples thereof include hydrochlorates, imidazoles such as 1-cyanoethyl-2-phenyl-4,5-di (cyanoethoxymethyl) imidazole, and triphenylphosphines.

Next, the third liquid adhesive for electronic parts will be described. The third liquid adhesive for electronic parts further contains a component (c) in addition to the components (a) and (b) in the second liquid adhesive. The component (c) is a diamine compound represented by the general formula (III) or a weight average molecular weight of 200 to 200 represented by the general formula (IV).
It contains 7,000 amino group-containing polysiloxane compounds.

Examples of the diamine compound represented by the general formula (III) include the following compounds. N,
N'-bis (2-aminophenyl) isophthalamide,
N, N'-bis (3-aminophenyl) isophthalamide, N, N'-bis (4-aminophenyl) isophthalamide, N, N'-bis (2-aminophenyl) terephthalamide, N, N'- Bis (3-aminophenyl) terephthalamide, N, N'-bis (4-aminophenyl) terephthalamide, N, N'-bis (2-aminophenyl) phthalamide, N, N'-bis (3-aminophenyl ) Phthalamide, N, N'-bis (4-aminophenyl) phthalamide, N, N'-bis (2-aminophenyl) phthalamide, N, N'-bis (3-aminophenyl) phthalamide, N, N'- Bis (4-aminophenyl) phthalamide, N, N'-bis (4-amino-
3,5-dimethylphenyl) isophthalamide, N,
N'-bis (4-amino-3,5-dimethylphenyl)
Terephthalamide, N, N'-bis (4-amino-3,
5-dimethylphenyl) phthalamide, N, N′-bis (4-amino-3,5-dimethylphenyl) phthalamide, N, N′-bis (4-amino-n-butyl) cyisophthalamide, N, N ′ -Bis (4-amino-n-hexyl) isophthalamide, N, N'-bis (4-amino-n-dodecyl) isophthalamide, m-phenylenediamine, p-phenylenediamine, metatolylenediamine, 4,4 '-Diaminodiphenyl ether, 3,3'
-Dimethyl-4,4'-diaminodiphenyl ether,
3,3'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylthioether, 3,3'-dimethyl-4,4'-diaminophenylthioether, 3,3'-diethoxy-4,4 '-Diaminophenyl thioether, 3,3'-
Diaminodiphenyl thioether, 4,4'-diaminobenzophenone, 3,3'-dimethyl-4,4'-diaminobenzophenone, 3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3,3 '
-Dimethoxy-4,4'-diaminodiphenylmethane,
2,2'-bis (4-aminophenyl) propane, 2,
2'-bis (3-aminophenyl) propane, 4,4 '
-Diaminodiphenyl sulfoxide, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, benzidine, 3,3'-dimethylbenzidine, 3,3'-dimethoxybenzidine, 3,3'-diaminobiphenyl 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3-methyl-4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3-chloro -4- (4-aminophenoxy) phenyl] propane, 2,2-bis [3,5-
Dimethyl-4- (4-aminophenoxy) phenyl] propane, 1,1-bis [4- (4-aminophenoxy)
Phenyl] ethane, 1,1-bis [3-chloro-4-
(4-aminophenoxy) phenyl] ethane, bis [4
-(4-aminophenoxy) phenyl] methane, bis [3-methyl-4- (4-aminophenoxy) phenyl] methane, piperazine, hexamethylenediamine, heptamethylenediamine, tetramethylenediamine, p-
Xylylenediamine, m-xylenediamine, 3-methylheptamethylenediamine, 1,3-bis (4-aminophenoxy) benzene, 2,2-bis (4-aminophenyl) -1,1,1,3,3,3. 3-hexafluoropropane, 2,2-bis (4- (4-aminophenoxy) phenyl) -1,1,1,3,3,3-hexafluoropropane, 4,4 '-(1,4-phenylene Bis (1-methylethylidene)) bisaniline, 4,4 '-(1,3-
Phenylene bis (1-methylethylidene)) bisaniline, and 4,4 '-(1,4-phenylene bis (1-
Methylethylidene)) bis (2,6-dimethylylbisaniline) and the like.

The amino group-containing polysiloxane compound represented by the general formula (IV) having a weight average molecular weight of 200 to 7,000 is 1,3-bis (3-aminopropyl) -1,1,3,3. -Tetramethyldisiloxane,
α, ω-bis (3-aminopropyl) polydimethylsiloxane, 1,3-bis (3-aminophenoxymethyl)
-1,1,3,3-tetramethyldisiloxane, α, ω
-Bis (3-aminophenoxymethyl) polydimethylsiloxane, 1,3-bis (2- (3-aminophenoxy) ethyl) -1,1,3,3-tetramethyldisiloxane, α, ω-bis (2 -(3-Aminophenoxy) ethyl) polydimethylsiloxane, 1,3-bis (3-
(3-aminophenoxy) propyl) -1,1,3,3
-Tetramethyldisiloxane, and α, ω-bis (3
Examples include-(3-aminophenoxy) propyl) polydimethylsiloxane.

The mixing ratio of the components (a), (b) and (c) in the third liquid adhesive for electronic parts is such that the components (b) and (b) are mixed with 100 parts by weight of the component (a). More preferably, the total sum of (c) is set in the range of 10 to 900 parts by weight and 20 to 800. When the total amount of the component (b) and the component (c) is less than 10 parts by weight, the heat resistance and Young's modulus after coating and curing are significantly low, which is not preferable. On the other hand, when the amount is more than 900 parts by weight, the adhesive layer itself becomes brittle when the adhesive layer is cured to the B stage, and the workability described above is deteriorated, and the adhesiveness with the heat-resistant film as a support is deteriorated. It is not preferable because

Further, the blending ratio of the component (b) and the component (c) is based on 1 molar equivalent of the amino group of the component (c).
The maleimide group of the component (b) is set in the range of 1 to 100 molar equivalents, preferably 1 to 80. When the maleimide equivalent of the component (b) is less than 1 molar equivalent, gelation occurs during mixing, which makes it impossible to prepare an adhesive, which is not preferable. On the other hand, when the amount is more than 100 molar equivalents, the adhesive itself becomes brittle when the adhesive layer is cured to the B stage, resulting in poor workability and poor adhesion to the heat-resistant film as a support. Because,
Not preferred.

The components (a), (b) and (c) are mixed in an organic solvent which dissolves them. As the organic solvent, the same solvent as the solvent exemplified for the second liquid adhesive can be used.

Further, in order to accelerate the addition reaction between the contained components (b), the reaction accelerators exemplified above may be added, if necessary. Furthermore, the structural unit of the general formula (I-1), which constitutes the component (a) added to the first, second, and third liquid adhesives for electronic parts, and the general formula (I-2) ) And the general formula (I-
The arrangement state with the structure of 3) may be regular or irregular.

The first, second, and third liquid adhesives for electronic parts may contain a filler having a particle diameter of 1 μm or less in order to stabilize the taping characteristics of the adhesive. The filler content is more preferably in the range of 4 to 40% by weight and 9 to 24% by weight of the total solid content. When the content is lower than 4% by weight, the effect of stabilizing the taping property of the adhesive tape is small, and the content is 40% by weight.
When the amount is larger, the adhesive strength of the adhesive tape is lowered and the workability such as lamination is deteriorated, which is not preferable.
As the filler, for example, silica, quartz powder, alumina, calcium carbonate, magnesium oxide, diamond powder, mica, fluororesin powder, zircon powder and the like are used.

The first liquid adhesive, the second liquid adhesive, and the third liquid adhesive are put into a poor solvent as needed, and solid components are precipitated by reprecipitation, and then the organic solvent is added. You may wash | clean with a solvent, water, or the mixture of an organic solvent and water, and melt | dissolve in the said organic solvent again. By washing in this way, impurities such as reaction catalyst and unreacted monomers can be removed, so that the purity of the adhesive can be improved.

As the organic solvent which can be used for washing, acetone, methyl ethyl ketone, hexane, benzene, toluene, xylene, methanol, ethanol, propanol, diethyl ether, tetrahydrofuran,
Examples thereof include methyl acetate, ethyl acetate, acetonitrile, dichloromethane, chloroform, carbon tetrachloride, chlorobenzene, dichlorobenzene, dichloroethane, trichloroethane and the like.

Next, the adhesive tape for electronic parts of the present invention using the above liquid adhesives for electronic parts will be described. The adhesive tape for electronic parts of the present invention can be produced by applying the above-mentioned first to third liquid adhesives on one side or both sides of the heat resistant film or on one side of the peelable film, and then drying. it can. At that time, it is preferable that the coating thickness is in the range of 5 to 100 μm, preferably 10 to 50 μm.

Examples of the heat resistant film include films of heat resistant resins such as polyimide, polyphenylene sulfide, polyether, polyparabanic acid, and polyethylene terephthalate, epoxy resin-glass cloth, and epoxy resin-polyimide-glass cloth. A composite heat resistant film is used. Among these films, a polyimide resin film is particularly preferable. The thickness of the heat resistant film is more preferably set in the range of 7.5 to 130 μm, particularly 12.5 to 75 μm. When it is thinner than 7.5 μm, the rigidity of the adhesive tape becomes insufficient, and when it is thicker than 130 μm, the punching property of the adhesive tape becomes difficult, which is not preferable.

The above peelable film can be used as a support or as a protective film. Thickness ranges from 1 to 200 μm, and 10
A range of 100 is more preferable. Preferred peelable films include polypropylene film, fluororesin film, polyethylene film, polyethylene terephthalate film, paper, and those obtained by imparting peelability to these with a silicone resin or the like. These peelable films have a 90 ° peel peel strength of 0.01 to 7.0 g.
Is desirably within the range. If the amount is less than 0.01 g, there is a problem that the peelable film is easily peeled off during transportation of the adhesive tape, which is not preferable. Conversely, 7.
When it is higher than 0 g, the peelable film is not peeled off from the adhesive layer neatly and the workability is deteriorated, which is not preferable.

When the liquid adhesive is applied to one or both sides of the heat resistant film to form an adhesive layer,
You may further provide the protective film which consists of said peelable film on an adhesive layer.

[0050]

【Example】

<< Production Example of Liquid Adhesive >> (Example 1) Polyamideimide structural unit (m = 3) represented by the following formula (A-1) and polysiloxane structural unit (n represented by the following formula (B-1). = 1) and the following formula (C-
Imide structural unit represented by 1) is 5.4%,
A siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000, which is randomly bonded at a weight ratio of 90.9% and 3.7%, is sufficiently dissolved in tetrahydrofuran,
A liquid adhesive having a solid content of 40% by weight was obtained.

[0051]

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Example 2 Polyamideimide structural unit (m = 3) represented by the above formula (A-1) and the above formula (B-
1) a polysiloxane structural unit (n = 1),
A siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000 in which imide structural units represented by the above formula (C-1) are randomly bonded at a weight ratio of 5.4%, 90.9% and 3.7%, respectively. 80 parts by weight, the above formula (〓-1)
20 parts by weight of the compound represented by the formula (1) and 1 part by weight of benzoyl peroxide (a reaction accelerator of (B-1)) are added to and mixed in tetrahydrofuran to be sufficiently dissolved to obtain a solid content of 4
A 0% by weight liquid adhesive was obtained. (Example 3) In Example 2, 80 parts by weight of siloxane-modified polyamide-imide resin was added to 90 parts by weight of the above formula (〓
A liquid adhesive was obtained in the same manner as in Example 2 except that 20 parts by weight of the compound represented by -1) was replaced with 10 parts by weight. (Example 4) A liquid adhesive was obtained in the same manner as in Example 2 except that the compound represented by the formula (〓-1) was replaced with the compound represented by the formula (〓-2). . (Example 5) A liquid adhesive was obtained in the same manner as in Example 2 except that the compound represented by the formula (〓-1) was replaced with the compound represented by the formula (〓-3). .

(Embodiment 6) In the second embodiment, the formula (〓-
A liquid adhesive was obtained in the same manner as in Example 2 except that the compound represented by 1) was replaced with the compound represented by the formula (〓-4). (Example 7) A liquid adhesive was obtained in the same manner as in Example 2 except that the compound represented by the formula (〓-1) was replaced with the compound represented by the formula (〓-5). . (Example 8) In Example 2, except that the compound represented by the formula (〓-1) was replaced with MP2000X (manufactured by Mitsubishi Petrochemical Co., Ltd.) which is one of the compounds represented by the formula (〓-6). Is
A liquid adhesive was obtained in the same manner as in Example 2. (Example 9) Polyamideimide structural unit (m = 3) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the above formula (B-1), and the above formula ( C-
Imide structural unit represented by 1) is 5.4%,
80 parts by weight of a siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000, which is randomly bonded at a weight ratio of 90.9% and 3.7%, and 16.42 parts by weight of the compound represented by the formula (〓-1). And 1,3-bis (3-aminopropyl) -1,1,3,3-tetramethyldisiloxane 3.58 parts by weight (mol of maleimide group of the above formula (〓-1) per 1 molar equivalent of amino group) Equivalent is 2.00),
1 part by weight of benzoyl peroxide was added to tetrahydrofuran, mixed and dissolved sufficiently to obtain a liquid adhesive having a solid content of 40% by weight. (Example 10) Polyamideimide structural unit (m = 3) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the above formula (B-1), and the above formula (C-
The imide structural units represented by 1) and 5.4 are respectively 5.4
%, 90.9%, 3.7% by weight, and 90 parts by weight of a siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000, which is randomly bonded, and a compound of the formula (〓-1) 8.84. Parts by weight and 1.3-bis (3-aminopropyl) -1,1,3,3-tetramethyldisiloxane 1.16 parts by weight (the maleimide group of the above formula (〓-1) relative to 1 molar equivalent of amino group). The molar equivalent of 3.32)
And 1 part by weight of benzoyl peroxide were added and mixed in tetrahydrofuran to be sufficiently dissolved to obtain a liquid adhesive having a solid content of 40% by weight.

Example 11 The polyamideimide structural unit (m = 3) represented by the above formula (A-1) and the above formula (B-
The polysiloxane structural unit (n = 1) represented by 1) and the imide structural unit represented by the above formula (C-1) are contained in a weight ratio of 5.4%, 90.9% and 3.7%, respectively. 90 parts by weight of a siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000, which are randomly bonded, and the above-mentioned formula (〓-
1.84 parts by weight of the compound represented by 1) and 1.16 parts by weight of α, ω-bis (3-aminopropyl) polydimethylsiloxane (average degree of polymerization: 4) (the above formula (〓 The molar equivalent of the maleimide group of -1) is 1
3.50) and 1 part by weight of benzoyl peroxide were added and mixed in tetrahydrofuran to be sufficiently dissolved to obtain a liquid adhesive having a solid content of 40% by weight. (Example 12) Polyamideimide structural unit (m = 3) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the above formula (B-1), and the above formula (C-
The imide structural unit represented by 1) is 5.4
%, 90.9%, 3.7% by weight, and 90 parts by weight of a siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000, which is randomly bonded, and a compound of the formula (〓-1) 8.84. Parts by weight and 1.16 parts by weight of hexamethylenediamine (the molar equivalent of the maleimide group of the above formula (〓-1) is 3.10 with respect to 1 molar equivalent of the amino group),
1 part by weight of benzoyl peroxide was added to tetrahydrofuran, mixed and dissolved sufficiently to obtain a liquid adhesive having a solid content of 40% by weight. (Example 13) Polyamideimide structural unit (m = 5) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the above formula (B-1), and the above formula (C-
The imide structural unit represented by 1) is 20.2
%, 70.7%, 9.1% by weight, and a siloxane-modified polyamideimide resin having a weight average molecular weight of 11,000, which is randomly bonded, is sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight. Got Example 14 Polyamideimide structural unit (m = 4) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the above formula (B-1), and the following formula (C-
The imide structural unit represented by 1) is 20.4
%, 70.4%, 9.2% by weight, a siloxane-modified polyamide-imide resin having a weight average molecular weight of 13,000 randomly bonded thereto is sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight. Got (Example 15) Polyamideimide structural unit (m = 2) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the above formula (B-1), and the above formula (C-
The imide structural unit shown in 1) is 18.2 each.
%, 63.6%, 18.2% by weight, and a siloxane-modified polyamideimide resin having a weight average molecular weight of 14,000 randomly bonded at a weight ratio of sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight. Got

Example 16 The polyamideimide structural unit (m = 3) represented by the above formula (A-1) and the above formula (B-
The polysiloxane structural unit (n = 1) represented by 1) and the imide structural unit represented by the above formula (C-1) have a weight ratio of 15.7%, 69.4%, and 14.9%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 11,500 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight. (Example 17) Polyamideimide structural unit (m = 3) represented by the above formula (A-1), polysiloxane structural unit (n = 1) represented by the following formula (B-2), and the above formula (C-
The imide structural unit represented by 1) is 5.4
%, 90.9%, 3.7% by weight, a siloxane-modified polyamideimide resin having a weight average molecular weight of 13,000 randomly bonded to tetrahydrofuran is sufficiently dissolved in tetrahydrofuran to give a liquid adhesive having a solid content of 40% by weight. Got

[0056]

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Example 18 The polyamideimide structural unit (m = 3) represented by the above formula (A-1) and the above formula (B-
The polysiloxane structural unit (n = 5) represented by 2) and the imide structural unit represented by the above formula (C-1) are contained in a weight ratio of 5.4%, 90.9% and 3.7%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight. (Example 19) Polyamideimide structural unit (m = 3) represented by the above formula (A-1), polysiloxane structural unit (n = 9) represented by the above formula (B-2), and the above formula (C-
The imide structural unit represented by 1) is 5.4
%, 90.9%, 3.7% of a siloxane-modified polyamide-imide resin having a weight average molecular weight of 9,500, which is randomly bonded, is sufficiently dissolved in tetrahydrofuran.
A liquid adhesive having a solid content of 40% by weight was obtained. (Example 20) Polyamideimide structural unit (m = 3) represented by the above formula (A-1), polysiloxane structural unit (n = 5) represented by the above formula (B-2), and the following formula (C-
The imide structural unit shown in 2) is 5.4 each.
%, 90.9%, 3.7% by weight of siloxane-modified polyamideimide resin having a weight average molecular weight of 9,000 randomly bonded to tetrahydrofuran, sufficiently dissolved in tetrahydrofuran,
A liquid adhesive having a solid content of 40% by weight was obtained.

[0058]

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Example 21 Polyamideimide structural unit (m = 3) represented by the above formula (A-1) and the above formula (B-
The polysiloxane structural unit (n = 5) represented by 2) and the imide structural unit represented by the following formula (C-3) have a weight ratio of 5.4%, 90.9% and 3.7%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 11,000 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight.

[0060]

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Example 22 A polyamideimide structural unit (m = 3) represented by the following formula (A-2) and the above formula (B-
The polysiloxane structural unit (n = 1) represented by 1) and the imide structural unit represented by the above formula (C-1) have a weight ratio of 5.3%, 89.8%, and 4.9%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 15,000 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight.

[0062]

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Example 23 A polyamideimide structural unit (m = 3) represented by the following formula (A-3) and the above formula (B-
The polysiloxane structural unit (n = 1) represented by 1) and the imide structural unit represented by the above formula (C-1) have a weight ratio of 5.3%, 89.8%, and 4.9%, respectively. Randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 14,500 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight.

[0064]

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Example 24 A polyamideimide structural unit (m = 3) represented by the following formula (A-4) and the above formula (B-
The polysiloxane structural unit (n = 1) represented by 1) and the imide structural unit represented by the above formula (C-1) have a weight ratio of 5.4%, 90.9% and 3.7%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 9,500 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight.

[0066]

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Example 25 A polyamideimide structural unit (m = 3) represented by the following formula (A-5) and the following formula (B-
The polysiloxane structural unit (n = 1) represented by 3) and the imide structural unit represented by the following formula (C-4) are contained in a weight ratio of 5.4%, 90.9% and 3.7%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 10,000 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight.

[0068]

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[0069]

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[0070]

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Example 26 A polyamideimide structural unit (m = 3) represented by the following formula (A-6) and the following formula (B-
The polysiloxane structural unit (n = 1) represented by 4) and the imide structural unit represented by the following formula (C-5) have a weight ratio of 5.4%, 90.9%, and 3.7%, respectively. A randomly bonded siloxane-modified polyamideimide resin having a weight average molecular weight of 14,000 was sufficiently dissolved in tetrahydrofuran to obtain a liquid adhesive having a solid content of 40% by weight.

[0072]

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Example 27 A liquid adhesive was obtained by dispersing and mixing 100 parts by weight of the liquid adhesive obtained in Example 1 and 10 parts by weight of an alumina filler (manufactured by Showa Denko KK). (Example 28) A liquid adhesive was obtained by dispersing and mixing 100 parts by weight of the liquid adhesive obtained in Example 2 and 10 parts by weight of an alumina filler (manufactured by Showa Denko KK). (Example 29) A liquid adhesive was obtained by dispersing and mixing 100 parts by weight of the liquid adhesive obtained in Example 7 and 10 parts by weight of an alumina filler (manufactured by Showa Denko KK).

Comparative Example 1 As a liquid adhesive, a nylon epoxy adhesive (Toresin FS-410, manufactured by Teikoku Chemical Industry Co., Ltd.) (solid content 20%, solvent: isopropyl alcohol: methyl ethyl ketone = 2: 1) Prepared. (Comparative Example 2) As a liquid adhesive, a 20% by weight N-methylpyrrolidone solution of polyimide varnish (Lark TPI, manufactured by Mitsui Toatsu Chemicals, Inc.) was prepared.

<< Preparation Example of Adhesive Tape Using Liquid Adhesive Obtained in Examples >> The liquid adhesives obtained in Examples 1 to 29 are dried so that the thickness of the adhesive layer becomes 20 μm. Is applied to both sides of a polyimide film and to one side of a 38 μm-thick polyethylene terephthalate film whose surface has been subjected to release treatment with a silicone resin, and dried in a hot air circulation dryer at 160 ° C. for 5 minutes to produce electronic parts. An adhesive tape for use was produced. (Preparation Example 1 of Adhesive Tape Using Liquid Adhesive Prepared in Comparative Example 1) The adhesive prepared in Comparative Example 1 was applied to both sides of the polyimide film so that the thickness of the dried adhesive layer would be 20 μm. 15 at 150 ° C in a hot air circulation dryer
After drying for a minute, an adhesive tape was produced. (Preparation Example 2 of Adhesive Tape Using Liquid Adhesive Prepared in Comparative Example 2) The adhesive prepared in Comparative Example 2 was applied to both sides of the polyimide film so that the thickness of the adhesive layer after drying was 20 μm. 12 at 150 ° C in a hot air circulation dryer
An adhesive tape was prepared by drying for 0 minutes and then at 250 ° C. for 60 minutes.

<< Assembly Example of Lead Frame >> The lead frame of the resin-encapsulated semiconductor device shown in FIG. 1 was prepared under the working conditions shown in Table 1 by using the adhesive tape obtained in the above-mentioned adhesive tape production example. It was assembled in the following procedure.
However, when the polyethylene terephthalate film subjected to the release treatment was used as the support, the film was peeled off and the adhesive layer single layer was used as the adhesive tape used in the steps described below. (A) Punching of adhesive tape The adhesive tape 6 is punched in a ring shape with a die. (B) Temporary Adhesion of Adhesive Tape The plane 2 is placed on a hot plate, and under the conditions shown in Table 1 below, the adhesive tape 6 punched in a ring shape is pressed against the plane 2 with a metal rod for temporary adhesion. (C) Bonding of Lead Frames The plane 2 to which the adhesive tape 6 has been temporarily adhered in the above process is aligned with the lead frame body, and the planes 2 are heated and pressed on a heated hot plate under the conditions shown in Table 1 below. And the lead frame with the adhesive tape. (D) Adhesive Tape Cure The obtained lead frame is cured in a hot air circulation type oven with nitrogen substitution under the conditions shown in Table 1 below. The adhesive conditions and the curing conditions differ depending on the adhesive tape because the characteristics of each adhesive tape are different.

[0077]

[Table 1]

<< Assembly of Semiconductor Package >> Using the produced lead frame, a resin-sealed semiconductor device was assembled in the following procedure. In the following process, optimum adhesive conditions were selected for each adhesive tape, and the adhesive was cured based on them. (A) Die Bonding A semiconductor chip is bonded to a plane portion using a silver paste for die bonding and cured at 150 ° C. for 2 hours. (B) Wire bonding A wire bonder is used to wire the wire pad on the semiconductor chip and the silver-plated portion at the end of the inner lead wire using a gold wire. (C) Molding Transfer molding with an epoxy-based molding agent. (D) Finishing process Finish the package, including processes such as homing, die cutting, and plating of the outer lead portion.

<< Evaluation Results of Adhesive Tape and Semiconductor Package >> (a) Possible Taping Temperature Whether or not the adhesive tape can be easily and quickly adhered to the adherend, that is, the plane or the lead pin was evaluated. Specifically, the temperature range in which each adhesive tape can be bonded to the lead frame was measured with a taping machine. As a result, the adhesive tape for electronic parts of this example, and Comparative Example 1
The adhesive tape for electronic parts of was able to adhere in the temperature range of 100 to 250 ° C. However, in the case of Comparative Example 2, 350
A temperature of ℃ or more was required.

(B) Oxidation of Lead Frame Whether or not the surface of the lead frame was oxidized during the curing of the adhesive was evaluated by visual judgment of discoloration on the surface of the lead frame. As a result, the adhesive tape of this example did not oxidize. However, in the case of Comparative Example 2, discoloration was observed and the lead frame was oxidized. This is probably because the adhesion temperature was too high and it took a long time to be oxidized.

(C) Adhesive Strength After adhering (taping) an adhesive tape to a copper plate at 150 ° C., the 90 ° peel strength of a 10 mm wide tape was measured at room temperature. As a result, the adhesive tape for electronic components of this example had a weight of 25 to 40 g / 10 mm. On the other hand, in the case of Comparative Example 1, the adhesive strength is insufficient at 2 to 4 g / 10 mm, and in the case of Comparative Example 2, 10 to 40 g / 10 mm.
However, the adhesive strength was insufficient and the fluctuation range was large.

(D) Voids When the adhesive was cured, whether or not the voids generated in the adhesive were at a practically problematic level was evaluated by visual judgment using a microscope. As a result, the adhesive tape for electronic parts of this example did not have any voids. However, in the case of Comparative Example 1, generation of voids was recognized.

(E) Workability When assembling the lead frame, the taping of the adhesive tape for electronic parts, the handling property (curl, running property) during use, and the tackiness of the adhesive surface of the adhesive tape were evaluated. As a result, all the adhesive tapes for electronic parts according to this example had good handleability and did not cause surface tack. However, in the case of Comparative Example 2, it was confirmed that there is a problem in the handling property.

(F) Wire Bondability When assembling the resin-sealed semiconductor, the wire bondability on the lead frame during wire bonding of the gold wire was confirmed. As a result, when the adhesive tape of this example was used, no bonding failure was found in the 832 pin test. On the other hand, in the case of Comparative Example 1, bonding failure of 123 pins out of 832 pins was confirmed, and the bonding of the gold wire could not be made sufficiently strong.

(G) Evaluation of Semiconductor Package For the package obtained as described above, PCB was used.
A T test (Pressure Cooker Biased Test) was performed. The conditions were 5 V applied, 121 ° C., 2 atm, and 100% RH, and an electrical reliability test was performed. As a result, the adhesive tape for electronic parts of this example did not short even after 1000 hours.

As is clear from the above evaluation results, the liquid adhesive for electronic parts of this example can be adhered or cured at a relatively low temperature and has sufficient heat resistance and reliability.
Moreover, according to the adhesive tape for electronic parts of this embodiment, a good resin-sealed semiconductor can be manufactured. On the other hand, in the case of the adhesive tape for electronic parts obtained in Comparative Example, oxidation of the lead frame occurs, the bonding conditions are not suitable for assembly of the lead frame, and it is difficult to perform wire bonding of the gold wire. It was confirmed that it was not suitable for use in the production of electronic parts due to some problems.

[0087]

The liquid adhesive of the present invention can be bonded or cured at a relatively low temperature, and has sufficient heat resistance and reliability. Therefore, the adhesive tape for electronic parts of the present invention using the same is, for example, a lead frame fixing tape or TA.
It can be suitably used as a B tape or the like for bonding members around a lead frame constituting a semiconductor device, for example, a lead pin, a semiconductor chip mounting substrate, a heat sink, or the semiconductor chip itself.

[Brief description of the drawings]

FIG. 1 is a sectional view of an example of a resin-sealed semiconductor device using an adhesive tape of the present invention or a conventional adhesive tape.

FIG. 2 is a cross-sectional view of another example of the resin-sealed semiconductor device using the adhesive tape of the present invention or the related art.

FIG. 3 is a sectional view of still another example of a resin-sealed semiconductor device using the adhesive tape of the present invention or the related art.

[Explanation of symbols]

 1 ... Semiconductor chip 2 ... Plane 3 ... Lead pin 4 ... Bonding wire 5 ... Resin 6 ... Adhesive layer 7 ... Die pad 8 ... Electrode

Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location C09J 7/02 JKE C09J 7/02 JKE JKK JKK JLE JLE H01L 21/52 H01L 21/52 E 21/301 23 / 50 Y 23/50 21/78 M (72) Inventor Fumiyoshi Yamanashi 3-1, Somunecho, Shizuoka-shi, Shizuoka Prefecture Tomoegawa Paper Works Electronic Materials Division

Claims (12)

[Claims] 1. A liquid adhesive for electronic parts, comprising an adhesive component and an organic solvent, wherein the adhesive component is a polyamideimide represented by the following general formula (I-1) and having a weight average molecular weight of 800 to 30,000. The structural unit, the polysiloxane imide structural unit represented by the following general formula (I-2) having a weight average molecular weight of 500 to 15,000, and the imide structural unit represented by the following general formula (I-3) are polyamideimides. Structural unit 0.1-99.8
%, Polysiloxane imide structural unit 0.1 to 99.8
%, The imide structural unit is 0.1 to 99.8%, and the component (a) is a siloxane-modified polyamideimide resin having a weight average molecular weight of 1,000 to 50,000 arranged in a weight ratio of 0.1 to 99.8%. Liquid adhesive for electronic parts. Embedded image [In the formula, A ¹ and A ⁴ each independently represent a group selected from the following formulas (1) to (6), and (In the formula, R ¹ and R ² each represent a hydrogen atom, a halogen atom, a lower alkyl group or a lower alkoxy group, X represents a direct bond, a C ₁ -C ₆ linear or branched alkylene group, 3] And Y represents a C _{1 to} C ₆ linear or branched alkylene group or —C (CF ₃ ) ₂ —, and Alk ¹ and AlK ² are C _{1 to} C ₆ linear or branched alkylene. Represents a group, and AlK ³ represents a C _{1 to} C ₁₂ linear or branched alkylene group. A ² is a C ₂ -C ₁₂ divalent saturated or unsaturated aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, a phenylene group, a naphthylene group, or (Where Z is a direct bond, a methylene group, -O-, -S
_{-, - SO 2 -, -} CO-, or -C (CF _{3) 2} - represents a. ), A ³ is a lower alkylene group, or (In the formula, Alk ⁴ represents a lower alkylene group.), Ar represents: (In the formula, W is a direct bond, a C _{1 to} C ₄ linear or branched alkylene group, —O—, —SO ₂ —, or —CO—
Represents ) Represents a tetravalent group, m represents an integer of 1 to 45, and n represents an integer of 1 to 50. ] 2. A liquid adhesive for electronic parts, comprising an adhesive component and an organic solvent, wherein the adhesive component is a polyamideimide having a weight average molecular weight of 800 to 30,000 represented by the following general formula (I-1). The structural unit, the polysiloxane imide structural unit represented by the following general formula (I-2) having a weight average molecular weight of 500 to 15,000, and the imide structural unit represented by the following general formula (I-3) are polyamideimides. Structural unit 0.1-99.8
%, Polysiloxane imide structural unit 0.1 to 99.8
%, And a siloxane-modified polyamideimide resin having a weight average molecular weight of 1,000 to 50,000, which is arranged at a weight ratio of 0.1 to 99.8% of imide structural units, and (a) component; [In the formula, A ¹ and A ⁴ each independently represent a group selected from the following formulas (1) to (6), and (In the formula, R ¹ and R ² each represent a hydrogen atom, a halogen atom, a lower alkyl group or a lower alkoxy group, X represents a direct bond, a C ₁ -C ₆ linear or branched alkylene group, 9] And Y represents a C _{1 to} C ₆ linear or branched alkylene group or —C (CF ₃ ) ₂ —, and Alk ¹ and AlK ² are C
_{1 to} C ₆ represents a linear or branched alkylene group,
1K ³ represents a C _{1 to} C ₁₂ linear or branched alkylene group. A ² is a C _{2 to} C ₁₂ divalent saturated or unsaturated aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, a phenylene group, a naphthylene group, or (Where Z is a direct bond, a methylene group, -O-, -S
_{-, - SO 2 -, -} CO-, or -C (CF _{3) 2} - represents a. ) Represents a group represented by), A ³ is a lower alkylene group, or (In the formula, Alk ⁴ represents a lower alkylene group), and Ar represents (In the formula, W is a direct bond, a C _{1 to} C ₄ linear or branched alkylene group, —O—, —SO ₂ —, or —CO—
Represents ) Represents a tetravalent group, m represents an integer of 1 to 45, and n represents an integer of 1 to 50. A component (a) composed of a polyamideimide structural unit having a weight average molecular weight of 800 to 30,000 represented by the general formula (I-1) and the following general formulas (II-1) to (II-6). A component (b) consisting of a compound having two or more maleimide groups selected from the compounds; Embedded image Consisting of 100 parts by weight of the component (a), 1 part of the component (b)
A liquid adhesive for electronic parts, which is added in an amount of 0 to 900 parts by weight. 3. A liquid adhesive for electronic parts, comprising an adhesive component and an organic solvent, wherein the adhesive component is a polyamideimide represented by the following general formula (I-1) and having a weight average molecular weight of 800 to 30,000. The structural unit, the polysiloxane imide structural unit represented by the following general formula (I-2) having a weight average molecular weight of 500 to 15,000, and the imide structural unit represented by the following general formula (I-3) are polyamideimides. Structural unit 0.1-99.8
%, Polysiloxane imide structural unit 0.1 to 99.8
%, And a siloxane-modified polyamideimide resin having a weight average molecular weight of 1,000 to 50,000, which is arranged at a weight ratio of 0.1 to 99.8% of imide structural units, and (a) component; [Wherein A ¹ and A ⁴ each independently represent a group selected from the following formulas (1) to (6), and (In the formula, R ¹ and R ² each represent a hydrogen atom, a halogen atom, a lower alkyl group or a lower alkoxy group, X represents a direct bond, a C ₁ -C ₆ linear or branched alkylene group, 17] And Y represents a C _{1 to} C ₆ linear or branched alkylene group or —C (CF ₃ ) ₂ —, and Alk ¹ and AlK ² are C _{1 to} C ₆ linear or branched alkylene. Represents a group, and AlK ³ represents a C _{1 to} C ₁₂ linear or branched alkylene group. A ² is a C _{2 to} C ₁₂ divalent saturated or unsaturated aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, a phenylene group, a naphthylene group, or (Where Z is a direct bond, a methylene group, -O-, -S
_{-, - SO 2 -, -} CO-, or -C (CF _{3) 2} - represents a. ), A ³ is a lower alkylene group, or (In the formula, Alk ⁴ represents a lower alkylene group), and Ar represents: (In the formula, W is a direct bond, a C _{1 to} C ₄ linear or branched alkylene group, —O—, —SO ₂ —, or —CO—
Represents ) Represents a tetravalent group, m represents an integer of 1 to 45, and n represents an integer of 1 to 50. ], A component (b) comprising a compound having two or more maleimide groups selected from compounds represented by the following general formulas (II-1) to (II-6): Embedded image The diamine compound represented by the following general formula (III) or the following general formula (I) having a weight average molecular weight of 200 to 7,000.
V) and the component (c) containing an amino group-containing siloxane compound, and (In the formula, R ⁴ represents a divalent aliphatic group, aromatic group or alicyclic group.) (In the formula, R ⁵ represents a divalent aliphatic group, an aromatic group or an alicyclic group, and s represents an integer of 1 to 9.) (a)
The total amount of the components (b) and (c) is 10 to 900 parts by weight based on 100 parts by weight of the components,
A liquid adhesive for electronic parts, wherein the maleimide group of the component (b) is blended in an amount of 1 to 100 molar equivalents relative to 1 molar equivalent of the amino group of the component (c). 4. The liquid for electronic parts according to claim 1, further comprising a filler having a particle diameter of 1 μm or less in an amount of 4 to 40% by weight based on the total solid content. adhesive. 5. An adhesive tape for electronic parts, comprising a support and an adhesive layer provided on at least one surface thereof, wherein the support is a heat resistant film, and the adhesive layer is the adhesive component according to claim 1. An adhesive tape for electronic parts, which is made of 6. An adhesive tape for electronic parts, comprising a support and an adhesive layer provided on at least one surface thereof, wherein the support is a heat resistant film, and the adhesive layer is the adhesive component according to claim 2. An adhesive tape for electronic parts, which is made of 7. An adhesive tape for electronic parts, comprising a support and an adhesive layer provided on at least one surface thereof, wherein the support is a heat resistant film, and the adhesive layer is the adhesive component according to claim 3. An adhesive tape for electronic parts, which is made of 8. An adhesive tape for electronic parts, comprising a support and an adhesive layer provided on at least one surface thereof, wherein the support is a heat resistant film, and the adhesive layer is the adhesive component according to claim 4. An adhesive tape for electronic parts, which is made of 9. The adhesive tape for electronic parts according to claim 5, wherein the support is a peelable film. 10. The adhesive tape for electronic parts according to claim 6, wherein the support is a peelable film. 11. The adhesive tape for electronic parts according to claim 7, wherein the support is a peelable film. 12. The adhesive tape for electronic parts according to claim 8, wherein the support is a peelable film.