JPH08332436A - Production of sheet coated body and production apparatus therefor - Google Patents

Abstract

PURPOSE: To attain the compatibility of the excellent coating film grade of a sheet substrate rotating method with the excellent coating liquid utilization efficiency and productivity of a linear coating application method by setting a stage for forming coating films on substrates by using a linear coating application method and a stage for forming the thinner coating films by rotating the substrates. CONSTITUTION: Materials 1 to be coated, such as glass substrates, are attracted and fixed onto a transporting stage 2 of a die coater 30. At this time, the transporting stage 2 is engaged at its central part with a ball screw 16 and is made movable laterally by a motor 15. On the other hand, the coating liquid is supplied from a coating liquid tank 3 through a supply piping 4 to a die head 6 by a fixed delivery pump 5. The materials 1 which are to be coated and on which the prescribed film thicknesses are formed in the first stage are transferred and transported by one sheet each onto a rotary stage 10 of a spin coater 9 by a transfer robot B. The materials 1 to be coated are thereafter rotated and the coating films 7 temporarily formed on the materials 1 to be coated are diffused radially and made uniform by centrifugal force.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating technique capable of uniformly and efficiently applying a liquid coating solution to a single substrate to be coated with a desired film thickness. INDUSTRIAL APPLICABILITY The present invention can be effectively used in a wide range of fields such as color coating of color filters, surface coating of optical filters, and mask coating of printed circuit boards and silicon wafers.

[0002]

2. Description of the Related Art Recently, various kinds of coating liquids have been applied to single-wafer substrates such as substrates for silicon wafers, plastic substrates for optical filters and glass substrates for color filters, which are used for semiconductors, to prepare single-wafer coated bodies. In the manufacturing field,
The coating liquid is, for example, from 5 to 5 because of the necessity of uniformity of film thickness and economical efficiency.
It is desired to develop a coating technique that can be applied uniformly over the entire surface of the coating film in a state where the coating liquid is as thin as about 500 μm and the coating liquid loss is as small as possible.

As such a conventional coating technique,
A so-called linear coating method represented by a roll coater, a bar coater, a curtain flow coater, a die coater, a spray coater, a nozzle coater, etc. (for example, JP-A-63-373).
No. 04) and a so-called single-wafer substrate rotating method represented by a spin coating method (for example, JP-A-63-107769).
No. 2). In order to industrially coat such a substrate with a thin film, a single-wafer coating method is adopted in which the material to be coated is supplied to a coater one by one, the coating liquid is applied, and the substrate is conveyed to the next step such as drying. Has been.

As a method of applying the coating liquid in a thin film in this manner, for example, a spin coater of a single-wafer substrate rotating method, a roll coater of a linear coating method, a bar coater, a curtain flow coater, a die coater, a spray coater, a nozzle coater and the like can be mentioned. However, the outline is as follows.

The spin coater is a widely used method for photoresist coating of semiconductor wafers. The coating liquid is dropped on the center of the surface of the rotating coating material to form a coating film.
With this method, the film thickness will be uniform if a coating liquid is selected, but since excess coating liquid is discarded due to centrifugal force due to rotation, the amount of coating liquid used to obtain a prescribed film thickness is large and economical. There is a problem of chipping. In addition, since the coating material is hermetically rotated in the device at high speed so that the discarded coating liquid does not scatter around, the number of rotations from mounting or removal of the coating material or from the stopped state to the high speed range is high. Since it takes a lot of time to increase the coating temperature, the tact time, which is the time required for coating one coated material, becomes longer than that of other coating methods, and there is a problem that productivity is reduced. Further, in order to obtain a takt time equivalent to that of other coating methods, it is necessary to increase the number of equipments, which causes a problem of increasing the manufacturing cost of the coated body. On the other hand, the roll coater of the linear coating method is a method of transferring the coating liquid to the glass substrate via a rubber roll, and it is possible to coat not only a short flat plate but also a long substrate or a sheet rolled into a roll. Is. However, this roll coater inherently has a problem in that a pattern of roll eyes is likely to occur in a horizontal step and continuous vertical stripes are likely to occur.

The bar coater is a method for applying a coating liquid onto a material to be coated by using a bar in which a thin wire is wound around a rod (for example, Japanese Patent Laid-Open No. 138097/1993). However, there is a drawback that streaks are likely to occur in the coating film because it comes into contact with the material to be coated.

The curtain flow coater is a method of forming a thin film-shaped liquid curtain by a die head or a flow box, and dipping the material to be coated in the curtain curtain (for example, Japanese Patent Publication No. 49-24133). Problems with this method include curtain curtain breaks, streaks, and air entrapment when coming into contact with the material to be coated.

The die coater, which is a kind of curtain flow coater, holds the distance between the tip of the die lip, which is called a die head, T die, or slit die, and the material to be coated in a gap close to the coating film thickness, and runs relatively. This is a method in which a coating liquid pool called a bead is formed between the materials to be coated, and in that state, the coating liquid is drawn out together with the material to be coated and applied. A coating film can be continuously formed by supplying the coating liquid in the same amount as the coating liquid consumed for forming the coating film from the die. In the curtain flow coating method and the die coating method, basically, all of the supplied coating material is used for manufacturing the coating film, so the amount of coating liquid used can be minimized. In the case of quantity, it has the feature that the equipment cost is low.

However, when a thin film is applied to a material to be coated by a curtain flow coater or a die coater, the coating state is not stable at the coating start portion and the coating end portion, and this film thickness matches the desired film thickness. A film thickness defect region occurs. Alternatively,
Even in the film thickness in the die width direction, there is a problem that a film thickness defect region where a desired film thickness cannot be obtained occurs at the end of the material to be coated due to the influence of the die end.

In the spray coater and the nozzle coater, one or a plurality of nozzles for spraying or discharging the coating liquid are arranged at positions intersecting with the traveling direction of the material to be coated, and the lower portion of the coating liquid spraying or discharging the coating liquid is disposed. This is a method in which coating is performed by diving the coating material (for example, EP0347058).
A2 publication).

These coaters have a simple apparatus, and it is not necessary to strictly set and control the apparatus precision and coating conditions, but it is difficult to manufacture a coating film that requires precise uniformity.

That is, all of the above linear coating methods have a common quality defect that a defective film thickness region occurs.

[0013]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and in the production of a single-wafer coated article, an excellent coating quality of a single-wafer substrate rotating method,
An object of the present invention is to provide a method for producing a single-wafer coated article and an apparatus for producing the same, which can achieve both excellent coating liquid utilization efficiency and productivity of the straight-line application method.

[0014]

In order to achieve the above object, the method for producing a single-wafer coated article according to the present invention comprises a first step of forming a coating film on a single-wafer substrate by using a linear coating method. When,
The second step of rotating the single-wafer substrate on which the coating film is formed into a thin film by rotating the substrate on a plane parallel to the substrate surface while the coating film is not dried.

The contents of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a process flow diagram for explaining a method for manufacturing a single-wafer coated article according to the present invention, including (a) method and
(B) shows two representative example embodiments of the method.

First, in the method (a), a plurality of single-wafer substrates in a single-wafer unit are sequentially transferred by, for example, a robot transfer means, a manual operation by an operator, etc., and a coating material supply step A is performed. On the other hand, a linear coating step B for forming an intermediate coating film having a predetermined film thickness on a single substrate one by one, and a single substrate coated with a coating solution are sequentially received, and the next single substrate rotating step is performed. The transfer step C for transferring and the received single-wafer substrate are rotated in a plane parallel to the substrate surface while the coating film is not dried, and the coating liquid is shaken off by a centrifugal force to form a thin film. It consists of a single-wafer substrate rotating step D for manufacturing a thick single-wafer coated body, and these steps are connected in series. In this coating method, the linear coating step B and the single-wafer substrate rotating step D correspond to the first step and the second step of the present invention, respectively. The above is the outline of the method (a).
The method for realizing the linear coating step B of the step is not particularly limited as long as it is a method for moving the single-wafer substrate and / or the coating material supply means in one direction relatively to form a coating film on the single-wafer substrate. However, the roll coating method, the bar coating method, the curtain flow coating method, the die coating method, the spray coating method, or the nozzle coating method described above can be used. Further, as the single-wafer substrate rotating step D of the second step, a known spin coating method can be used.
As conditions for connecting both the first step and the second step to operate smoothly without trouble, the film thickness of the coating film after the completion of the first step is 1. 1-5
It is preferable to carry out the coating treatment in the second step after the doubling range. Further, the distance from the rotation center of the substrate to the farthest side edge of the substrate in the second step is preferably in the range of 50 to 500 mm because of the moving ability related to the viscosity of the coating liquid. Further, the rotation speed of the substrate in the second step is preferably in the range of 100 to 3000 rotations per minute.

On the other hand, the method (b) is a manufacturing method in which, unlike the method (a), the carrying step C is not provided between the linear coating step B and the single-wafer substrate rotating step D, and the linear coating step B ( The first step) and the single-wafer substrate rotating step D (second step) are continuously performed without moving the single-wafer substrate.
Specifically, it is a method of sequentially applying the coating in one apparatus having the functions of both steps like the apparatus of Example 2 described later.

In any of the methods, after the final film thickness is formed on the single-wafer substrate, it is transferred to the next step such as a drying step by an appropriate single-wafer transfer means such as the robot, and the color filter, Intermediate products such as optical disks, silicon wafers, and other single-wafer coated bodies are manufactured. The film thickness of the coating film of the present invention is not particularly limited, but the film thickness after coating is 1
It is particularly advantageously used for thin film coating in the range of ˜500 μm.

Next, in order to achieve the above object, the apparatus for manufacturing a single-wafer coated body of the present invention comprises a linear coating means for forming a coating film on the single-wafer substrate by a linear coating method, and the single-wafer substrate on the substrate surface. And a single-wafer substrate rotating means for rotating the film in a plane parallel to the above to thin the coating film.

The contents of the present invention will be specifically described below with reference to the drawings.

2 to 4 are views showing one embodiment of the apparatus for manufacturing a single-wafer coated body according to the present invention, of which the apparatus of FIGS. 2 and 3 is a linear coating means. An apparatus in which a certain die coater 20, a transfer robot 8 that is a transfer means, and a spin coater 9 that is a single-wafer substrate rotating means are connected in series in this order. The transfer robot 8 is omitted in the apparatuses of FIGS. 4 and 5. The linear coater 30 is incorporated in the spin coater 9 to be integrated.

First, the former apparatus will be described. FIG. 2 is a front view and FIG. 3 is a plan view. In both figures, a coating material 1 such as a glass substrate is printed by a transfer robot loader (not shown). The transfer stage 2 of the die coater 30 by the leaf system
It is mounted on and is fixed by suction by a stage connected to a vacuum source (not shown). The transport stage 2 is supported by the guide rods 2a at two positions on both sides in the width direction so as to be able to move back and forth in the horizontal direction, and the central portion thereof is engaged with the ball screw 16, and the motor 15 connected to the ball screw end is used. It can be moved left and right in the figure.

On the other hand, the coating liquid is provided in the coating liquid tank 3 and is supplied to the die head 6 through a supply pipe 4 by a metering pump 5 such as a gear pump or a syringe pump. Below the die head 6, slits 6a having a narrow interval in the width direction (direction orthogonal to the paper surface) are adjustable so that the coating liquid supplied from the tank 3 to the die 6 is widened in the width direction, and The coating liquid adjusted to a predetermined thickness is ejected in a film form from the tip of the die. Also, die 6
Is detachable in the vertical direction of FIG. 2 by means not shown so that the distance from the surface of the coating material 1 on the table to the tip of the die can be adjusted to a desired value. Therefore, the material 1 to be coated moves horizontally with respect to the die set to the predetermined distance, whereby a predetermined film thickness is formed on the material to be coated.

The coating material 1 having a predetermined film thickness formed in the first step is transferred and transported by the transfer robot 8 one by one onto the rotary stage 10 of the spin coater 9. And
In the spin coater 9, the material to be coated 1 is attracted to the rotary stage 10 and rotated according to a predetermined program, and the coating film 7 temporarily formed on the material to be coated 1 is diffused in the radial direction by centrifugal force. If uniform, tighten. Thereafter, the material to be coated 1 is conveyed to the next drying step by a transfer robot (not shown).

Next, the latter device will be described with reference to FIGS. 4 and 5. In the figure, FIG. 4 is a front view and FIG. 5 is a plan view.

In the spin coater 9 of the apparatus of this embodiment, a rotary table 11 having a horizontal mounting surface 11a of a material 14 to be coated is integrally connected to a vertical rotary shaft 11b, and this rotary shaft is rotatably supported by a bearing 11c. Has been done. The lower end of the rotary shaft is
In addition to being connected to the motor 21, the motor base 21a is connected to the cylinder elevating means 20 composed of an actuator such as an air cylinder. Therefore, the rotary table 11 can be rotated at a predetermined rotation speed by the motor 21, and the entire table can be lifted and lowered by the cylinder lifting means 20.

On the other hand, on the upper part of the rotary table, a ball screw 16 is rotatably provided in parallel with the surface of the rotary table, and can be driven by a servomotor 15. The die head 6 having the above-described configuration is engaged with the ball screw 16. That is, the apparatus of this embodiment has a configuration in which the die coater 30 which is a linear coating means is arranged and integrated on the spin coater 9 which is a single-wafer substrate rotating means without providing the conveying means, and the die head 6 is used.
Can be moved horizontally. Although the die coater is used as the linear coating means in the apparatus of this embodiment, it may be a roll coater, a bar coater, a curtain flow coater, a die coater, a spray coater or a nozzle coater.

In using the apparatus of this embodiment, first, the rotary stage 11 is raised by the motor lifting cylinder 20. In this state, the material to be coated 14 is the rotary stage 1
It is mounted by a transfer robot on the lift pin protruding above 1. Next, the lift pins descend and are fixed to the rotary stage 11 by suction. Then, the die head is moved to the position of the tip of the material to be coated 14 by the ball screw 16 caused by the rotation of the servo motor 15. After that, the coating liquid is supplied from the coating liquid tank 3 (FIG. 2) through the supply pipe 4 to the metering pump 5
Is supplied to the die head 12. The coating liquid 13 is obtained by moving the die head 12 on the rotating stage 11 while discharging the coating liquid using this coating liquid supply system. The coating conditions at this time are exactly the same as in the case of the die coater of Example 1. Next, the table is lowered by the cylinder elevating means 20 while the material to be coated 14 is being adsorbed on the rotary stage 11. The motor 21 is actuated to rotate the rotary stage 11 with the material 14 to be attracted and fixed thereto at a predetermined number of rotations and for a predetermined time, and stop the rotation. Thereafter, the rotary stage 11 is moved up and down by the motor lifting cylinder 20, the lift pins are raised, and the material to be coated 14 is transferred to the next process by the transfer robot. The above operation completes one cycle.

[0030]

According to the method for manufacturing a single-wafer coated article of the present invention as defined in claims 1 to 8, in the first step, the coating liquid on the single-wafer substrate has a film thickness slightly larger than that of the conventional linear coating method. Although the coating liquid is applied thickly, the amount of the coating liquid used for coating can be minimized because the coating liquid leaking from the substrate is still thin. However, there may be slight defects such as horizontal streaks and streaks on the coating film. In the second step of the next step, the single substrate coated with the coating liquid is rotated at a high speed to separate the excess coating liquid from the substrate by the centrifugal force, but the coating liquid adheres to the entire substrate in advance. Because
A uniform final film thickness is reached with minimal separation of coating liquid. Therefore, according to the present invention, it is possible to obtain the advantages of the linear coating method and the single-wafer substrate rotating method at the same time, which has the minimum consumption of the coating liquid but has no quality defect.

According to the manufacturing apparatus for a single-wafer coated body of the present invention as defined in claims 9 to 13, both the means for linear coating and the means for rotating the single-wafer substrate are provided. Can be easily obtained. In particular, according to the apparatus for manufacturing a single-wafer coated body of the present invention of claim 11, since both of the above means are integrated without providing a conveying device, it is of course possible to obtain the above-mentioned actions at the same time, as well as the tact. The effect that the time becomes a short nucleus occurs.

[0032]

【Example】

Example 1 An example using the manufacturing apparatus shown in FIGS. 2 and 3 will be described.

Polyamic acid, which is a polyimide precursor, was used as a binder, N-methyl-2-pyrrolidone was used as a solvent, and chlorobrominated phthalocyanine green (CI Pigment Green 36) was mixed and dispersed to obtain a weight solid content concentration. A coating liquid for forming a green colored coating film having 8 wt% and a viscosity of 47 cps is obtained. A 370 mm × 470 mm × 0.7 mm non-alkali glass substrate OA-2 (manufactured by Nippon Electric Glass Co., Ltd.) is selected as the material to be coated 1, and the single-wafer coating is performed using the coating body manufacturing apparatus shown in FIG. I went. At this time, the slit gap of the die head 6 was adjusted to 100 μm, and the clearance between the material to be coated 1 and the die head 6 was adjusted to 75 μm. A gear pump was used as the metering pump 5. A servo motor 15 for rotating a ball screw 16 is used to drive the substrate transfer stage 2,
The transfer stage 2 was moved by drive control by a sequencer.

First, the material to be coated 1 is lifted by a lift pin (not shown) for transfer built in the transfer stage 2 to be received by a transfer robot (not shown) at this position, and then the lift pin is lowered to be transferred. Place it in the designated place on Stage 2. Further, the material to be coated 1 is fixed on the transport stage 2 by vacuum suction of the material to be coated 1. Next, the transfer stage 2 is moved to move the material to be coated 1 directly below the die head 6. Detecting that the transfer stage 2 has reached directly under the die head 6 by the number of steps of the stage driving servo motor, the metering pump 5 is driven to start the discharge of the coating liquid, and the transfer stage 2 is driven to apply the coating liquid. Coating was performed by relatively moving the work material 1. Through this coating, the driving speed of the stage was 3 m / min, and the liquid feeding speed of the coating liquid was 41 cc / min. When the material to be coated 1 reached the coating end position, the driving of the metering pump 5 was stopped. The transfer stage 2 is further moved to a predetermined position for transfer to the next process and stopped, the vacuum suction is released and the lift pin is lifted to lift the workpiece 1, and the transfer robot 8 is moved to that position. Hand over the coated material 1. The transfer stage 2 accommodates the lift pins so as to receive the next substrate and reversely moves to a predetermined position.

Next, the transfer robot 8 places the material 1 to be coated at a predetermined position on the rotary stage 10 of the spin coater. Subsequently, the material 1 to be coated is vacuum-sucked to fix the material 1 to be coated on the rotary stage 10. Then, it takes 3 seconds to increase the rotation speed to 400 rpm and then 4 minutes
Hold for 3 seconds at 00 revolutions. Furthermore, it takes 100 seconds per 3 minutes
Increase the number of revolutions to 0, and then 5 at 1000 revolutions per minute
Hold for seconds. After that, it takes another 3 seconds to complete the rotation. Then, after positioning the coating material 1 at a predetermined position, the coating material 1 is further dried by a transfer robot (not shown) in a drying oven of the next step at 120 ° C. for 20 minutes to be green. A colored coating film was obtained. The above operation was sequentially repeated to form a coating film on 100 substrates. The resulting coating film has a film thickness of 1.5 ±
The coating film was of excellent quality with a uniform film surface of 0.03 μm and no defect in appearance. The theoretical effective utilization rate of the coating liquid used was about 65%. Production takt time is 30 seconds /
It was a sheet.

Embodiment 2 Next, an embodiment using the manufacturing apparatus shown in FIGS. 4 and 5 will be described.

In this embodiment, first, the rotary stage 11 in the spin coater 9 is raised by the motor lifting cylinder 20. In this state, the material to be coated 14 is supplied by the transfer robot (not shown) onto the lift pin (not shown) protruding onto the rotary stage 11, and the lift pin descends to be attracted onto the rotary stage 11. Fixed.
Then, the die head is moved to the position of the tip of the material to be coated 14 by the ball screw 16 caused by the rotation of the servo motor 15. Thereafter, the coating liquid is supplied from the coating liquid tank 3 (FIG. 2) to the die head 12 through the supply pipe 4 by the metering pump 5 (FIG. 2). A coating film 13 is obtained by moving the die head 12 on the rotary stage 11 while discharging the coating liquid using this coating liquid supply system. The coating conditions at this time are exactly the same as the coating by the die coater of Example 1. next,
With the material 14 to be coated adsorbed on the rotary stage 11, the motor elevating cylinder 20 is lowered, and under the conditions exactly the same as the rotation conditions of the rotary stage by the spin coater 9 of Example 1, according to a predetermined program. As a result of rotation, the coating film 13 formed on the material to be coated 14 could be made uniform by diffusion due to centrifugal force. By transporting the thus-obtained coated body to the subsequent drying step, the obtained coating film has a uniform film surface with a film thickness of 1.5 ± 0.03 μm as in Example 1. The coating film was of excellent quality with no visual defects. The theoretical effective utilization rate of the coating liquid used was about 65%. The production takt time was 26 seconds / sheet.

By using such a device, it is possible to eliminate the chance of foreign matter being mixed in during transfer / transportation, and the facility itself can be simply and inexpensively manufactured. In addition, since the area where the excess coating liquid to be discarded can be minimized, there is an advantage that the maintenance and maintenance of the apparatus becomes very easy.

As described above, in the above embodiment, the coating film formation of the color filter particularly used for the liquid crystal display application has been described, but the present invention is not limited to these.

[0040]

COMPARATIVE EXAMPLE Comparative Example 1 A coated body was obtained by forming a coating film on a material to be coated in the same manner as in the above specific example except that the die coater 30 was used alone as a coating method. . The coating conditions by the die coater are as follows: the slit gap of the die head 6 is 100 μm, the clearance between the material to be coated 1 and the die head 6 is 75 μm, the driving speed is 3 m / min, the coating liquid delivery is using the gear pump 5, and the speed is 29 cc. Per minute. The resulting coating film had a film thickness of 1.5 except the coating start and coating end portions of 30 mm.
The film surface was ± 0.2 μm. A slight horizontal step corresponding to the gear eye of the gear pump in appearance was seen. The theoretical effective utilization rate of the coating liquid used was about 93%, and the production takt time was 30 seconds / sheet. However, there was a thick film portion having a film thickness exceeding 3 μm at the coating start portion and the coating end portion.

Comparative Example 2 In Comparative Example 2, a coating film was formed on a material to be coated in the same manner as in the above Example except that only the spin coater 17 was used as a coating method to obtain a coated body. . As for the supply of the coating liquid, 52 cc was dropped onto the center of the substrate 1 on the rotary table 10 using a dispense nozzle without rotating the substrate. When the amount of dropping is smaller than this, an uncoated area occurs at a rate of one out of several sheets. With respect to the coating conditions of the spin coater 17, the motor 19 takes 3 seconds from the stopped state to increase the rotation speed up to 400 rpm, and holds 400 rpm for 3 seconds. The number of revolutions is increased to 1500 revolutions per minute by further taking 3 seconds, and 1500 revolutions per minute is maintained for 17 seconds. After that, it was a condition that the rotation was finished by further taking 3 seconds. The obtained coating film had a uniform film surface with a thickness of 1.5 ± 0.03 μm and was a very excellent quality film with no external defects.
The theoretical effective utilization rate of the coating liquid used was about 8%. The production takt time was 45 seconds / sheet.

Therefore, in the method and apparatus of the embodiment of the present invention, as compared with Comparative Example 1, with respect to the film thickness which was a problem of the conventional linear coating method, the thickness unevenness ± 0.2 μm is ± 0.
It decreased to 03 μm, no horizontal row occurred, the application efficiency of the coating solution, which was a problem of the conventional linear coating method, increased 6 to 8 times, and the production tact time It can be seen that a remarkable effect such as shortening by 2/3 to 1/2 is easily obtained at the same time.

[0043]

Since the inventions of claims 1 and 9 use the first step of the linear coating method and the second step of the single-wafer substrate rotating method, they are compared with the conventional spin coating method alone. Therefore, the amount of coating liquid used for coating can be significantly reduced, and since it is not necessary to rotate for a long time, the tact time can be shortened. A method for producing a single-wafer coated article having excellent properties can be obtained. In addition, the conventional roll coating method, bar coating method, curtain flow coating method, die coating method, spray coating method, and nozzle coating method are used to improve the potential defects of the coating film quality, and to cover the entire coating film. The unique effect that a uniform and excellent-quality coating film can be obtained is exhibited.

According to the second aspect of the present invention, in the first step, the film thickness is in the range of 1.1 to 5 times the desired film thickness of the single-wafer coated article to be obtained after the second step. Since the coating liquid is applied on the material to be coated by the linear coating method, the final utilization efficiency of the coating liquid can be improved.

According to the third aspect of the present invention, the coating material supplied in the single-wafer method has a distance from the center of rotation in the second step to the furthest point of the coating material in the range of 50 to 500 mm. Since the coating liquid is applied onto a certain material to be coated, it is possible to further improve the utilization efficiency of the material to be coated, which had to be wastefully discarded a large amount of the coating liquid by the spin coating method.

According to the fourth aspect of the present invention, since the material to be coated supplied in the single-wafer system rotates the rotation in the second step within the range in which the maximum number of revolutions reached is 100 to 3000 revolutions per minute, The centrifugal force can be used to sufficiently diffuse the coating liquid, which causes problems in the first step, such as horizontal rolls, continuous vertical stripes, curtain curtain traces, air entrapment marks, and It is possible to eliminate the defective film thickness region existing in the coating film on the coating material and obtain a uniform and high-quality coating film.

The inventions of claims 5 and 12 are the first
And a second step of applying a coating liquid onto the material to be coated by a method selected from a roll coating method, a bar coating method, a curtain flow coating method, a die coating method, a spray coating method, a nozzle coating method, and the like. As a manufacturing method including a step of continuously rotating the coating material around an axis perpendicular to the coating liquid adhering surface before the coating liquid is dried, a roll coating method, a bar coating method, a curtain flow method. It is said that both excellent economics such as coating method, die coating method, spray coating method and nozzle coating method and excellent coating performance realized by spin coating method can be realized at the same time without impairing each other. Has a unique effect.

The seventh and eleventh aspects of the present invention provide both excellent economic efficiency of a roll coater, bar coater, curtain flow coater, die coater, spray coater, nozzle coater, etc. and excellent coating performance realized by a spin coater. , It has a unique effect that it can be realized at the same time without damaging each other.

According to the ninth aspect of the present invention, the effect of the eighth aspect of the invention can be easily obtained by simply connecting the known coating means to the linear coating means and the single-wafer substrate rotating means of the conventional apparatus.

[Brief description of drawings]

FIG. 1 is a process flow diagram illustrating a method for manufacturing a single-wafer coated article according to the present invention.

FIG. 2 is a front view of an embodiment of a single-wafer coated body manufacturing apparatus according to the present invention.

FIG. 3 is a plan view of the device of FIG.

FIG. 4 is a front view of another embodiment of the single-wafer coated body manufacturing apparatus according to the present invention.

FIG. 5 is a plan view of the device of FIG. 4;

[Explanation of symbols]

1: Coating material 12: Die head 2: Transfer stage 13: Coating film 3: Coating liquid tank 14: Coating material 4: Supply piping 15: Servo motor 5: Metering pump 16: Ball screw 6: Die head 17: Spin coater 7 : Coating film 18: Dispensing nozzle 8: Transfer robot 19: Motor 9: Spin coater 20: Motor lifting cylinder 10: Rotating stage 21: Motor 11: Rotating table 30: Linear coating means

Claims (13)

[Claims] 1. A first step of forming a coating film on a single substrate by using a linear coating method, and a single substrate on which the coating film is formed is parallel to the substrate surface while the coating film is not dried. And a second step of rotating in-plane. 2. A coating process in the second step after the film thickness of the coating film after the completion of the first step is within a range of 1.1 to 5 times the film thickness after the completion of the second step. The method for producing a single-wafer coated article according to claim 1, 3. The single-wafer coated article according to claim 1 or 2, wherein the distance from the rotation center of the substrate in the second step to the farthest side edge of the substrate is in the range of 50 to 500 mm. Manufacturing method. 4. The number of rotations of the substrate in the second step is set to 1 per minute.
The method for producing a single-wafer coated article according to any one of claims 1 to 3, wherein the range is from 00 to 3000 rotations. 5. A roll coating method, a bar coating method, a curtain flow coating method, a die coating method, a spray coating method or a nozzle coating method is used as the linear coating method in the first step. The method for producing a single-wafer coated article according to any one of the above. 6. The method for manufacturing a single-wafer coated article according to claim 1, wherein a spin coating method is used as the single-wafer substrate rotating method in the second step. 7. The single-wafer coated article according to claim 1, wherein the first step and the second step are continuously performed without moving the single-wafer substrate. Production method. 8. The method for producing a single-wafer coated article according to claim 1, wherein the single-wafer coated article is a color filter. 9. A straight-line coating means for forming a coating film on the single-wafer substrate by a straight-line coating method, and a single-wafer substrate rotating means for rotating the single-wafer substrate in a plane parallel to the substrate surface. Equipment for manufacturing single-wafer coated bodies. 10. The production of a single-wafer coated article according to claim 9, wherein the linear coating means and the single-wafer substrate rotating means are connected in this order through the single-wafer substrate conveying means. apparatus. 11. The single-wafer coating according to claim 9, wherein the linear coating means and the single-wafer substrate rotating means are integrally formed without providing a single-wafer substrate conveying means. Body manufacturing equipment. 12. The production of a single-wafer coated article according to claim 8, wherein the linear coating means is a roll coater, a bar coater, a curtain flow coater, a die coater, a spray coater or a nozzle coater. apparatus. 13. The apparatus for manufacturing a single-wafer coated body according to claim 8, wherein the single-wafer substrate rotating means is a spin coater.