JPH08316365A - Method and system for producing semiconductor - Google Patents

Abstract

PURPOSE: To bond solder balls surely to a semiconductor device in a short time without requiring any flux or reflow furnace. CONSTITUTION: A semiconductor device 1 is mounted on a stage 7 and the image thereof is picked up by means of a camera 13. Based on the data thus picked up, a recognizing section 14 adjusts the position of the stage 7 finely through a stage moving motor 9. Subsequently, a jig 10 sucking a solder ball Bb at the suction part 10a thereof is moved downward to be superposed on a pad 2b of the semiconductor device 1. The jig 10 is then subjected to ultrasonic vibration by means of an ultrasonic oscillator while applying a constant load thus bonding the solder ball Bb to the pad 2b. With such system, coating work of flux, bonding work in reflow furnace and cleaning work of flux are eliminated resulting in the reduction of cost and the shortening of work time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing method and device, and more particularly to a technique effective when applied to joining solder balls in a semiconductor device.

[0002]

2. Description of the Related Art According to a study conducted by the present inventor, a BGA (Ball Gri) is used as a semiconductor device in which spherical solder, that is, a solder ball is used as a bonding material.
There is a d array) type semiconductor device.

In this BGA type semiconductor device, solder balls are arranged in an array on the back surface of a printed wiring board to replace the leads.

The solder balls in this BGA type semiconductor device are treated with a mask or the like for arranging the solder balls in an array by previously applying flux to the gold-plated pad portions for connecting the solder balls on the back surface of the printed wiring board. The solder balls are aligned with the gold-plated portion on the back surface of the printed circuit board using a tool, and are joined by passing through a reflow oven.

Incidentally, examples of the surface mounting type semiconductor device described in detail are:
Issued September 1, 1994, "Electronic Materials" September issue (Vol. 33, No. 9), P37-P43.
The features and characteristics of a plastic BGA using a CB substrate are described.

[0006]

However, the present inventor has found that the solder ball joining technique in the above BGA type semiconductor device has the following problems.

That is, as a pre-process for joining the solder balls, flux is applied to the pad portion of the printed wiring board to improve solder wetting, and the solder balls are joined by heating through a solder reflow furnace. After that, a cleaning step for cleaning the flux is required again, which causes a problem of increased cost and longer working time.

Further, with the increase in the number of pins in a semiconductor device in recent years, the spacing between solder balls becomes finer, and there is a risk that corrosion of the solder balls and the like or deterioration of insulation will occur due to residual flux.

The object of the present invention is to eliminate the need for flux,
It is an object of the present invention to provide a semiconductor manufacturing method and device capable of reliably bonding a solder ball to a semiconductor device in a short time without using a reflow furnace.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, the semiconductor manufacturing method of the present invention is to bond the solder ball to the electrode portion of the semiconductor device by applying ultrasonic energy while pressing the solder ball to the electrode portion.

In the semiconductor manufacturing method of the present invention, the solder ball is pressed against the electrode part of the semiconductor device while heating the electrode part, and ultrasonic energy is applied to bond the solder ball to the electrode part.

Further, in the semiconductor manufacturing apparatus of the present invention, the mounting means for mounting the semiconductor device, the solder ball holding means for holding the solder balls, the solder balls held by the solder ball holding means, and the mounting means. It is composed of a solder ball crimping means for superposing a load by superimposing an electrode portion of the semiconductor device placed on the substrate and an ultrasonic wave oscillating means for applying ultrasonic wave energy to the solder ball holding means.

Further, in the semiconductor manufacturing apparatus of the present invention, the placing means is provided with heating means for heating the electrode portion of the semiconductor device.

Further, in the semiconductor manufacturing apparatus of the present invention, the solder ball holding means comprises a vacuum suction mechanism and holds the solder balls by vacuum suction.

Further, the semiconductor manufacturing apparatus of the present invention recognizes the position of the electrode section in the semiconductor device based on the image data of the image pickup device and the image pickup device for taking an image of the semiconductor device placed on the placing device. And a moving means for moving at least one of the solder ball holding means and the placing means to a position where the solder ball and the electrode portion overlap with each other based on a signal from the recognizing means.

[0018]

According to the above-described semiconductor manufacturing method of the present invention, the solder ball can be reliably bonded to the electrode portion by applying ultrasonic energy while pressing the solder ball to the electrode portion of the semiconductor device.

Further, according to the above-described semiconductor manufacturing method of the present invention, the solder balls are pressed to the electrode portions of the semiconductor device while heating the electrode portions, and ultrasonic energy is applied to the solder balls more reliably. It can be bonded to the electrode part.

Further, according to the above semiconductor manufacturing apparatus of the present invention, the solder ball pressure bonding means polymerizes the electrode portion of the semiconductor device mounted on the mounting means and the solder ball held by the solder ball holding means. While applying a load while the ultrasonic wave oscillating means applies ultrasonic energy to the solder ball holding means, the solder ball and the electrode portion can be reliably bonded.

Further, according to the above-described semiconductor manufacturing apparatus of the present invention, the heating means provided in the placing means heats the electrode portion of the semiconductor device placed on the placing means while applying the load and the load. By applying the sonic energy, it is possible to more reliably and efficiently bond the solder ball and the electrode portion.

Further, according to the above-described semiconductor manufacturing apparatus of the present invention, since the solder balls are held by the vacuum suction of the vacuum suction mechanism, the solder balls can be securely held and transported without being damaged.

Further, according to the above-described semiconductor manufacturing apparatus of the present invention, the semiconductor device mounted on the mounting means is photographed by the photographing means, and the recognizing means makes an electrode in the semiconductor device based on the image data of the photographing means. At the time of joining the solder ball and the electrode portion, since the position of the solder ball is recognized and the moving means is driven to move at least one of the solder ball holding means and the placing means to a position where the solder ball and the electrode portion overlap. The deviation in can be eliminated.

[0024]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is an explanatory diagram of a solder ball joining apparatus for joining a solder ball to a BGA type semiconductor device according to an embodiment of the present invention.

In the present embodiment, in the BGA type semiconductor device 1, for example, a semiconductor chip 3 is bonded and fixed to a central portion of the surface of a printed wiring board 2 made of glass epoxy with a predetermined adhesive material.

In the vicinity of the peripheral portion of the semiconductor chip 3 on the printed wiring board 2, the pad 2 serving as a connecting portion is formed.
a is provided, and the pad 2a and the electrode portion formed on the semiconductor chip 3 are connected by the bonding wire 4.

Further, pads (electrode portions) 2b serving as connecting portions are also provided in an array on the back surface of the printed wiring board 2, and each pad 2a is formed by a predetermined pad 2b and wiring provided on the printed wiring board 2. It is electrically connected.

Solder balls, which will be described later, are connected to these pads 2b in place of the leads.

The semiconductor chip 3 mounted on the printed wiring board 2 is sealed with, for example, a mold resin to form a package 5.

Next, the solder ball joining device 6 which is a semiconductor manufacturing device for arranging and supplying solder balls to the pads 2b of the printed wiring board 2 in the BGA type semiconductor device 1 in an array form and joining the solder balls is located below the semiconductor device. A stage (mounting means) 7 for mounting 1 is provided, and a vacuum suction pipe 8 for suction-fixing the package 5 of the semiconductor device 1 by vacuuming is provided on the stage 7.

The stage 7 has a Y (horizontal) direction and a Y direction.
A stage moving motor (moving means) 9 for moving in the (vertical) direction and the θ (rotation) direction is provided, and a solder ball suction jig (solder ball holding means) 10 is provided above the stage 7. Has been.

On the bottom surface of the solder ball suction jig 10,
The suction portions 10a formed of hemispherical holes are provided in an array at the same intervals as the pads 2b in the semiconductor device 1,
Each suction portion 10a is connected to a vacuum pipe 10b so that the solder balls Bb supplied to the semiconductor device 1 are sucked.

The vacuum pipe 10b is connected to the vacuum pump V.
It is connected to P and these suction parts 10a and vacuum piping 1
0b and vacuum pump VP, vacuum suction mechanism V
M is configured.

Further, at a predetermined position of the vacuum pipe 10b, a solenoid valve 10 for making the inside of the vacuum pipe 10b atmospheric pressure is provided.
c is provided.

Further, the solder ball suction jig 10 is provided with an ultrasonic oscillator (ultrasonic oscillator) 11 for applying ultrasonic vibration.

Further, the solder ball suction jig 10 is
A moving motor (solder ball crimping means) 12 is provided, and the moving motor 12 allows the solder ball suction jig 10 to move in the X direction, the Y direction, and the Z (vertical) direction.

In the vicinity of the stage 7, the stage 7
A camera (photographing means) 13 such as a CCD camera for photographing the semiconductor device 1 mounted on the camera is provided, and the photographing data photographed by the camera 13 is recognized by a recognition unit (recognition means). ) 14 is input.

Further, the control unit 15 controls all the controls of the vacuum pump VP, the ultrasonic oscillator 11, the moving motor 12, the recognition unit 14, and the like in the solder ball joining device 6.

Next, the operation of this embodiment will be described.

First, when the semiconductor device 1 is placed on the stage 7, the controller 15 uses the vacuum suction pipe 8 to cause the semiconductor device 1 to move.
Is fixed by adsorption.

Then, the controller 15 drives the moving motor 12 to rotate the solder ball suction jig 10 so that a large number of solder balls Bb are accommodated in a box-shaped box (not shown). Position above.

Next, the control unit 15 drives the vacuum pump VP to suck the suction unit 10a while moving the motor 1 for movement.
The solder ball suction jig 10 is moved downward by 2 to attract the solder balls Bb to the respective suction portions 10a.

Further, when the solder ball suction jig 10 is sucked, if the solder ball suction jig 10 is shaken by the moving motor 12, the solder ball Bb can be more surely moved.
Will be adsorbed to the adsorption part 10a.

The solder ball suction jig 10 that has sucked the solder balls Bb is moved above the stage 7 on which the semiconductor device 1 is mounted, by the control of the movement motor 12 by the controller 15.

Then, the semiconductor device 1 on the stage 7 is photographed by the camera 13, the recognition unit 14 recognizes the position of the pad 2b in the semiconductor device 1 based on the photographed data, and the solder ball positioned above the stage 7 is recognized. Adsorption jig 1
The control unit 15 outputs a signal so that the individual solder balls Bb adsorbed on 0 and the respective pads 2b of the semiconductor device 1 are reliably overlapped with each other, and the stage moving motor 9 finely adjusts the position of the stage 7. To do.

Next, the control unit 15 drives the moving motor 12 to move it downward so that the solder balls Bb adsorbed on the adsorbing unit 10a and the pads 2b of the semiconductor device 1 are overlapped with each other.

When the solder ball Bb and the pad 2b are polymerized, the control section 15 ultrasonically vibrates the solder ball suction jig 10 by the ultrasonic oscillator 11 to bond the solder ball Bb to the pad 2b. Also, the solder ball Bb and the pad 2
The control unit 15 drives the moving motor 12 so that a constant load is applied even after the b and b are polymerized.

Therefore, the solder ball Bb is bonded to the pad 2b while applying load and ultrasonic energy.

Then, when the joining of the solder balls Bb by the load for a predetermined time and the ultrasonic energy is completed, the controller 1
In No. 5, the solenoid valve 10c is opened to make the pressure in the vacuum pipe 10b equal to the atmospheric pressure, and the movement motor 12 is driven while the solder ball Bb and the suction portion 10a are easily separated.
Move the solder ball suction jig upward.

As a result, according to the present embodiment, the solder ball joining device 6 surely joins the solder balls Bb to the pads 2b while applying load and ultrasonic energy. Therefore, joining using a reflow furnace and application of flux. In addition, the flux cleaning work becomes unnecessary, and the cost and the working time can be shortened.

Further, since no flux is used, the corrosion of solder balls and the like and the deterioration of the insulation due to the residual flux are eliminated, and the reliability of the semiconductor device 1 can be improved.

Further, in this embodiment, the solder ball Bb is bonded to the pad 2b while applying load and ultrasonic energy. For example, as shown in FIG.
A heater (heating means) 16 and a power source 17 such as a variable stabilizing power source are provided at a predetermined position of the control unit 15 while controlling the power source 17 so that the stage 7 is heated to a constant temperature. By adding B, the solder balls Bb can be reliably joined in a shorter time.

Although the present invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, although the BGA type semiconductor device in which the package is formed of the mold resin is used in the above embodiment, the BGA type semiconductor device in which the package is formed of ceramic is used.
GA type semiconductor devices and MCC (Micro Carri)
When used in a semiconductor device such as an er for LSI Chips type semiconductor device in which solder balls are bonded, the solder balls Bb can be bonded reliably in a short time.

[0056]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

(1) According to the present invention, ultrasonic energy is applied to the electrode portion of the semiconductor device while pressing the solder ball to the electrode portion to surely bond the solder ball to the electrode portion.
This eliminates the need for joining in the reflow furnace, application of flux and cleaning of flux, which can shorten working time and cost, and can prevent corrosion of solder balls and the like and deterioration of insulation due to residual flux.

(2) Further, in the present invention, the working time is further improved by heating the electrode part, superposing the solder ball on the electrode part of the semiconductor device, applying a load, and applying ultrasonic energy for bonding. It can be shortened.

(3) Further, in the present invention, the reliability of the semiconductor device can be improved by the above (1) and (2).

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a solder ball joining device for joining a solder ball to a BGA type semiconductor device according to an embodiment of the present invention.

FIG. 2 is an explanatory view of a solder ball joining apparatus for joining solder balls to a BGA type semiconductor device according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Printed wiring board 2a Pad 2b Pad (electrode part) 3 Semiconductor chip 4 Bonding wire 5 Package 6 Solder ball joining device 7 Stage (mounting means) 8 Vacuum suction pipe 9 Stage moving motor (moving means) 10 Solder Ball adsorption jig (solder ball holding means) 10a Adsorption part 10b Vacuum piping 10c Solenoid valve 11 Ultrasonic oscillation device (ultrasonic oscillation means) 12 Moving motor (solder ball crimping means) 13 Camera (imaging means) 14 Recognition part ( Recognition unit) 15 Control unit 16 Heater (heating unit) 17 Power supply Bb Solder ball VP Vacuum pump VM Vacuum suction mechanism

Front Page Continuation (72) Inventor, Yoshiyuki Shirai 2326 Imai, Ome City, Tokyo Inside Hitachi, Ltd. Device Development Center

Claims (6)

[Claims] 1. A method of manufacturing a semiconductor, wherein the solder ball is bonded to the electrode portion by applying ultrasonic energy while applying pressure to the electrode portion of the semiconductor device. 2. The semiconductor manufacturing method according to claim 1, wherein the solder ball is bonded to the electrode portion by heating the electrode portion. 3. A mounting means for mounting a semiconductor device, a solder ball holding means for holding a solder ball, the solder ball held by the solder ball holding means, and the solder placed on the mounting means. A semiconductor manufacturing apparatus comprising: a solder ball crimping means for superposing a load by superimposing an electrode portion in a semiconductor device and an ultrasonic wave oscillating means for applying ultrasonic wave energy to the solder ball holding means. 4. The semiconductor manufacturing apparatus according to claim 3, wherein the placing means is provided with heating means for heating the electrode portion of the semiconductor device. 5. The semiconductor manufacturing apparatus according to claim 3, wherein the solder ball holding means comprises a vacuum suction mechanism, and holds the solder ball by vacuum suction. 6. The semiconductor manufacturing apparatus according to claim 3, 4 or 5, wherein the photographing means for photographing the image of the semiconductor device placed on the placing means, and the image data of the image taking means are used for the photographing. Recognition means for recognizing the position of the electrode portion in the semiconductor device, and at least one of the solder ball holding means or the placement means at the position where the solder ball and the electrode portion are superposed on the basis of a signal from the recognition means. And a moving means for moving the semiconductor.