JPH08204333A - Manufacture of printed wiring board - Google Patents

Abstract

PURPOSE: To wire and mount in high density by laminating and integrating an insulating sheet with a final conductive metal positive pattern, and then selectively removing a first conductive metal positive pattern by etching. CONSTITUTION: After a metal film is formed on a conductive base material surface, a photosensitive insulating film 3 is laminated. Then, after the film 3 is patterned, a plated solder layer 4 is formed on the metal film, a copper layer 5 is further precipitated to form a first positive pattern 6. Again, a photosensitive insulating film 3' is laminated, a through hole pattern 7 is formed, a photosensitive insulating film 3" is laminated, and negatively patterned. Then, it is electrically copper-plated to form a second positive pattern. Thereafter, after the insulating sheet is laminated and integrated, the conductive base material and the metal layer are removed to obtain a printed wiring board in which the pattern 6 having the solder layer 4 on the surface is buried in the insulator layer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a highly reliable printing which has a structure in which wiring layers are connected by a penetrating conductor portion and enables high-density wiring and mounting. The present invention relates to a method of manufacturing a wiring board with a good yield.

[0002]

2. Description of the Related Art In a double-sided printed wiring board or a multi-layered printed wiring board, electrical connection between wiring layers such as double-sided conductive patterns is made as follows. That is,
In the case of a double-sided printed wiring board, first, a perforation process (perforation process) is performed on a predetermined position of a double-sided copper foil-clad substrate, and a chemical plating process is performed on the entire surface including the inner wall surface of the perforated hole. After that, electroplating is further performed to increase the reliability by thickening the metal layer on the inner wall surface of the hole, and electrical connection between the wiring layers is performed.

In the case of a multilayer printed wiring board, the copper foils stretched on both sides of the substrate are each patterned, and then the copper foils are laminated and arranged on the patterned surface via an insulating sheet (eg, prepreg). Then, after applying heat and pressure to integrate them, similar to the case of the above-mentioned double-sided printed wiring board, electrical connection between wiring layers by drilling and plating, patterning of the surface copper foil, and multilayer type Got a printed wiring board. In the case of a multilayer printed wiring board having more wiring layers, it can be manufactured by a method of increasing the number of double-sided printed wiring boards inserted in the middle.

In the method of manufacturing a printed wiring board, as a method for electrically connecting wiring layers without using a plating method, a double-sided copper foil-clad substrate is punched at a predetermined position, and a conductive paste is printed in the hole. There is also a method in which the resin component of the conductive paste poured into the holes is cured by a method or the like to electrically connect the wiring layers.

[0005]

By the way, in response to demands for higher performance and compactness of electronic devices, printed wiring boards are required to have highly reliable high-density wiring or fine wiring. ing. That is, in order to improve the functionality of the wiring circuit or the mounting circuit device, it is important to increase the wiring density or fine wiring of the printed wiring board, and it is important to easily ensure the reliability of the circuit function. More specifically, for example, fine wires are surely separated from each other as long as the required insulation can be maintained,
The terminals of the electronic components to be mounted are connected to the connection pads of the printed wiring board.
It is desired that an electrical connection be achieved without causing a short circuit with an adjacent connecting portion.

However, using a copper foil-clad substrate as a material,
In the case of a method for manufacturing a printed wiring board including means for patterning the wiring of the copper foil by photolithography or photoetching, there are the following inconvenient problems. That is, in either case of the double-sided type or the multilayer wiring type, as a so-called protective film on the outermost wiring pattern forming surface,
The solder resist layer is formed by printing to cover the signal pattern surface. Here, when this type of printed wiring board is used for forming a mounted circuit device by mounting and mounting required electronic components on the surface of the printed wiring board, the input / output terminals of the electronic components are connected. The connection pads need to be selectively exposed. The connecting pad usually has a form protruding from the surface of the solder resist layer by padding or the like. In other words, when the connecting pads are fine and have a narrow pitch, it is difficult to print the solder resist layer in such a manner that the connecting pads are insulated from each other. The structure is adopted.

Thus, if the connection pads on the printed wiring board surface project from the insulating layer (solder resist layer) surface, at this point, an insulation separation between adjacent connection pads can be secured. The problem that a so-called solder bridge is likely to occur between adjacent connecting pads when the input / output terminals of electronic parts are made to correspond to these connecting pads and electrical and mechanical connection is made by soldering or the like. There is. And, the problem of the solder bridge generation becomes more remarkable when the connection pads are made finer or the pitch is made narrower, so that a serious problem occurs in the trend of high-density wiring or high-density mounting. Will be raised.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a printed wiring board capable of highly reliable and high-density wiring and mounting by a simple process.

[0009]

According to a first aspect of the present invention, there is provided a step of depositing a metal film on at least one main surface of a conductive base material, and a first electrically insulating negative film on the metal film surface. A patterning step and a plating process using the conductive base material as one of the electrodes are performed to form a first conductive metal and a second conductive metal different from the first conductive metal on the exposed surface of the metal film. A step of sequentially stacking and forming positive patterns, and a second electrically insulating layer having a connection hole for connecting to the positive pattern of the second conductive metal on the positive pattern forming surface of the second conductive metal. A step of performing negative patterning, a step of forming a conductive layer on the second electrically insulating positive pattern surface, a plating treatment using the conductive base material as one electrode, and a third conductive layer on the conductive layer surface. A step of forming a positive metal pattern, and A step of removing the conductive base material and the metal film after laminating and integrating the insulating sheet layer on the positive pattern forming surface of the conductive metal, and the first conductive metal positive pattern exposed by the removal of the metal film. And a step of selectively removing by etching.

According to a second aspect of the present invention, a step of depositing a metal film on at least one main surface of the conductive base material, and a step of forming a first electrically insulating negative pattern on the metal film surface. Forming a positive pattern of a solder metal and a first conductive metal on the exposed surface of the metal film by sequentially plating the conductive base material as one of the electrodes;
A step of forming a second electrically insulating negative pattern having a connection hole connected to the positive pattern of the first conductive metal on the surface of the positive pattern of the conductive metal, A step of forming a first conductive layer on the positive pattern surface, and a plating treatment using the conductive base material as one electrode to form a positive pattern of a second conductive metal on the first conductive layer surface. A third electrically insulating negative patterning step in which a contact hole for connecting to the positive pattern of the second conductive metal is provided on a surface of the second conductive metal positive pattern forming surface; Forming a second conductive layer on the electrically insulative positive pattern surface of No. 3, and performing plating treatment using the conductive base material as one electrode, and forming a third conductive metal on the second conductive layer surface. The step of forming a positive pattern of A method for manufacturing a printed wiring board, comprising: a step of removing an electrically conductive base material and a metal film after laminating and integrating an insulating layer on a positive pattern forming surface of an electrically conductive metal. .

According to a third aspect of the present invention, there is provided a printed wiring board characterized in that, as the conductive base material according to the first or second aspect, a conductive base material having a good releasability is used and is peeled and removed. It is a manufacturing method.

According to a fourth aspect of the present invention, a step of depositing a metal film on at least one main surface of the conductive base material, and a step of forming a first electrically insulating negative pattern on the metal film surface. , The conductive base material is used as one electrode for plating, and a positive pattern of a first conductive metal and a second conductive metal different from the first conductive metal is sequentially laminated on the exposed surface of the metal film. And a step of forming a second electrically insulating negative pattern in which a connection hole for connecting to the positive pattern of the second conductive metal is provided in the positive pattern formation surface of the second conductive metal. And a step of forming a second conductive layer on the second electrically insulating positive pattern surface, a plating process is performed using the conductive base material as one electrode, and a third conductive layer is formed on the second conductive layer surface. Forming a positive pattern of a conductive metal of A step of forming a required connecting bump on the positive pattern surface of the conductive metal, and a wiring pattern surface of another wiring board element is arranged to face the connecting bump forming surface via an insulating sheet layer. A method for manufacturing a printed wiring board, comprising a step of laminating and integrating and a step of peeling and removing the conductive base material and the metal film.

According to a fifth aspect of the present invention, a step of depositing a metal film on at least one main surface of the conductive base material, and a step of forming a first electrically insulating negative pattern on the metal film surface. Forming a positive pattern of a solder metal and a first conductive metal on the exposed surface of the metal film by sequentially plating the conductive base material as one of the electrodes;
A step of forming a second electrically insulating negative pattern having a connection hole connected to the positive pattern of the first conductive metal on the surface of the positive pattern of the conductive metal, A step of forming a first conductive layer on the positive pattern surface, and a step of performing a plating process using the conductive base material as one electrode to form a positive pattern of a second conductive metal on the surface of the first conductive layer. And a third electrically insulating negative patterning step in which a contact hole for connecting to the positive pattern of the second conductive metal is provided on the surface of the second conductive metal positive pattern forming surface. Forming a second conductive layer on the electrically insulative positive pattern surface, and performing a plating process using the conductive metal layer as one electrode to form a positive electrode of the third conductive metal on the second conductive layer surface. A step of forming a pattern, and the conductive gold Forming a desired connection bump on the positive pattern surface of, and arranging and laminating the wiring pattern surface of another wiring board element facing each other through the insulating sheet layer on the connection bump forming surface. A method of manufacturing a printed wiring board, comprising a step of integrating and a step of peeling and removing the conductive base material and the metal film.

According to a sixth aspect of the present invention, there is provided a printed wiring board characterized in that, as the conductive base material according to the fourth or fifth aspect, a conductive base material having a good releasability is used and peeled off. It is a manufacturing method.

In the present invention, as the conductive base material, for example, a stainless steel plate, a surface-treated stainless steel plate or other thin plate having good releasability (separability), or a conductive metal such as a copper plate or a surface-treated copper plate. There is a board. In other words, the conductive base material functions as a support that also serves as one of the electrodes during the electroplating process,
Finally, peeling removal or etching removal is performed. Therefore, in consideration of such functions and roles, the conductive substrate should be a slightly thicker one that is hard to cause deformation or damage when it is peeled off and reused, or a support when it is removed by etching. It is preferable to select a thin plate having such a function as described above. In addition, the metal film formed on the surface of the conductive base material has a function or role of separating the multilayer wiring layer laminated / formed on the metal film from the side of the conductive base material. A metal that is easy to remove, such as Cu, Ni, or solder, is selected.

In the present invention, when a positive pattern is formed on the surface of a metal film on the conductive substrate by electroplating, the electrically insulating negative pattern forming material for forming a negative pattern is, for example, a silicone resin. , Fluororesin, epoxy resin, polycarbonate resin, polysulfone resin, polyester resin, phenoxy resin, phenol resin, polyimide resin, or those obtained by imparting photosensitivity with these resins as main components. Then, the negative pattern is formed by, for example, applying a resin layer and performing selective exposure / development, applying and curing the resin layer, and then selectively decomposing and removing by ultraviolet irradiation,
Alternatively, a means for selectively depositing the negative pattern resin layer by a printing method or the like may be used. Further, this negative pattern mask is made to function as an insulator constituting a printed wiring board by pressure integration.

In the present invention, the conductive base material on which the electrically insulating negative pattern mask is formed is used as one electrode, and the exposed surface (positive pattern formation surface) of the metal film provided on the conductive base material surface is plated. First metal, second metal and third
Examples of the metal include copper, silver, gold, solder, nickel, tin, chromium, and other metals, or solder-copper, tin-
Examples include composite systems of copper, gold-copper, nickel-copper, gold-nickel-copper, palladium-nickel-copper, platinum-nickel-copper, and the like. In forming the positive pattern by electroplating, when the conductive substrate or the metal film is finally removed by etching, a metal layer having a selective etching property with respect to the metal film is used as a base, and the first metal layer is used. In the case of removing by etching as well, in consideration of the selective etching property with respect to the second metal layer, plating is performed in advance. When a gold or nickel layer is provided as the first or second metal layer, the exposed surface of the positive pattern is covered with these metal layers, so that the positive pattern is stabilized and solderability is improved. Can be improved.

Further, in the present invention, for each insulating negative pattern, the conductive layer which functions as a base layer in forming the wiring circuit portion on the positive pattern by the plating method is formed, for example, by the sputtering method or the electroless method. It is performed by a plating method or the like. Then, if the conductive layer is selectively formed in a predetermined region in a form of being electrically insulated and separated,
The aspect is not particularly limited.

In the present invention, the conductor bumps (conductor bump group) formed at predetermined positions on the positive pattern surface are, for example, conductive powders such as silver, gold, copper, solder powders, alloy powders or composite powders (mixtures) thereof. ) A conductive composition prepared by mixing metal powder with a binder component such as polycarbonate resin, polysulfone resin, polyester resin, epoxy resin, melamine resin, phenoxy resin, phenol resin, or polyimide resin. When forming the bump group with a conductive composition, a conductor bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask, and the height of the conductor bump group is Generally, about 50 to 300 μm is desirable. When the bump group is formed of a conductive composition, the process can be further simplified as compared with the case where it is performed by a method such as a plating method, which is effective in terms of cost reduction.

In the present invention, examples of the insulating prepreg in which the tip end portions of the conductor bumps are press-fitted to form the through-type conductor portion (electrical connection portion) are, for example, polycarbonate resin, polysulfone resin, thermoplastic polyimide. Sheets of resin, polyetherimide resin, tetrafluoropolyethylene resin, tetrafluoroethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin, etc.
Alternatively, a sheet formed by combining with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper can be used. Others, butadiene rubber, butyl rubber,
Sheets of raw rubber such as natural rubber, neoprene rubber and silicone rubber may also be used.

[0021]

According to the first aspect of the invention, since the required wiring is patterned by so-called electroplating, not only a fine wiring pattern having a high wiring density can be easily formed, but also
On the surface from which the metal film on the side of the conductive base material has been removed, for example, the connection pads are reliably insulated and separated from each other, and a concave surface is formed with respect to the insulation layer. A printed wiring board can be obtained in which the occurrence of solder bridges between pads for use can be easily avoided.

According to the second aspect of the present invention, a printed wiring has a structure in which a solder layer has already been formed on the connection pad surface of the main surface, and this solder layer is embedded in an insulating layer to form a flat surface. A board is obtained. That is, it is possible to easily obtain a printed wiring board having a structure in which the pads are finely divided from each other and the solder is prevented from flowing out even if the pads are fine connection pads or at a narrow pitch.

According to the invention of claim 3, in the above-mentioned claim 1 and claim 2, the manufacturing process is simplified.

According to the inventions of claims 4 to 6, the claims 1 to
In addition to the effect of the third aspect, a multilayer printed wiring board can be easily obtained in a more simplified process.

[0025]

EXAMPLES Examples of the present invention will be described below with reference to FIGS.

Example 1 FIGS. 1 to 14 schematically show an embodiment of this example.

First, as the conductive substrate 1, for example, the thickness is
Prepare a 1 mm conductive stainless steel plate, and as shown in the cross-section in Fig. 1, coat one surface of this conductive stainless steel plate by electroplating or sputtering to a Cu thickness of about 2 to 3 µm.
After forming the metal film 2, a photosensitive insulating film 3 having a thickness of about 50 μm was laminated as shown in a sectional view in FIG.
Here, instead of sticking the photosensitive insulating film 3, a photosensitive resin layer may be formed by coating.

Next, the photosensitive insulating film 3 was subjected to selective exposure / development treatment and patterned as shown in a sectional view in FIG. Then, the conductive stainless steel plate 1 is immersed in a solder plating solution as one of the electrodes, and an electric current of about 1.8 to 2.5 A / dm ² is applied to perform electroplating treatment, as shown in a sectional view in FIG. After forming the plating solder layer 4 on the exposed metal film 2 surface, further immersing in the high-speed copper sulfate plating solution, 20 A / dm ²
An electric current is applied by applying a current of about 30 μm to selectively deposit a copper layer 5 having a thickness of 35 μm on the plated solder layer 4 (wiring pattern forming region) as shown in a sectional view of FIG. The first positive pattern 6 was formed.

A photosensitive insulating film 3'having a thickness of about 35 .mu.m is attached again to the surface on which the first positive pattern 6 is formed, and as shown in a sectional view of FIG.
A through hole pattern 7 connected to the above was formed, and this through hole pattern 7 portion was filled with copper by electroplating. After embedding the through hole pattern 7 parts with copper,
A photosensitive insulating film 3 ″ having a thickness of about 35 μm was laminated, and a selective exposure / development process was performed to perform negative patterning as shown in a sectional view in FIG. As shown in a sectional view in FIG. 8, a conductive layer 8 made of NiO _x , for example, is formed by a sputtering method, and the conductive layer 8 ′ on the positive pattern surface is used as a plating nucleus to perform electrolytic copper plating under the same conditions as described above. Do the processing
As shown in a sectional view in FIG. 9, a second positive pattern 6'is formed.

Then, the conductive layer 8 remaining on the surface on which the second positive pattern 6'is formed is removed by selective soft etching shown in cross section in FIG. On the forming surface, as shown in cross section in FIG. 11,
An insulating film (insulating sheet) 9 is laminated and integrated. When increasing the number of wiring layers, the insulating sheet 9
Prior to stacking and unifying, the steps shown in FIGS. 6 to 10 may be appropriately repeated. In this way, after the final positive pattern surface is covered by laminating and integrating the insulating sheet 9, the conductive base material 1 is peeled off and the metal layer 2 is removed by soft etching, or the conductive base material 1 is removed. By sequentially peeling and removing the metal layer 2 and the metal layer 2, the first positive pattern 6 having the solder layer 4 on the surface is embedded in the insulator layer 2 to form a flat surface, as shown in a sectional view in FIG. A printed wiring board was obtained.

In the above manufacturing method, when the inner layer wiring is formed during the manufacturing process, dummy through-hole patterns are provided in the insulating layer formed between the inner layer wiring and the metal layer 2
You may employ | adopt the structure electrically connected with the electroconductive base material 1 via.

In the process of manufacturing the printed wiring board, for example, when the second positive pattern 6'is formed, a silver-based conductive material such as an epoxy resin is used as a binder on the surface of the second positive pattern 6 '. The conductive paste is printed, and after this printed conductive paste is dried, the method of printing again at the same position using the same mask is repeated.
By heating and curing in an oven at 0 ° C., a conical conductor bump 10 having a height of 0.3 mm and a bottom diameter of about 0.35 mm was formed (shaped) as shown in a sectional view in FIG.

The printed wiring board material 11 on which the conductor bumps 10 are thus formed is used, for example, as an epoxy resin-based prepreg layer.
As shown in a cross-sectional view in FIG. 14, the conductor bumps 10 were laminated via the layers 12 so as to correspond to each other, and integrated under pressure. In the process of pressurizing and integrating, the tip ends of the conductor bumps 10 are press-fitted into the prepreg layers 12, respectively, so that the tip portions of each other are so-called plastically deformed to form an electrically reliable connection between wiring layers. Was.

In the printed wiring boards constructed as described above, the insulation between adjacent connection pads is sufficiently ensured even when the connection pads on the surface are 75/75 mm and the pitch interval is 0.15 mm. Further, even when the input / output terminals of the electronic component were connected by soldering, no solder bridge was observed, and highly reliable mounting was possible.

Example 2 FIGS. 1 to 15 schematically show an embodiment of this example. Basically, since it is common to the case of the first embodiment,
The above-mentioned FIGS. 1 to 14 are incorporated.

First, as the conductive base material 1, for example, the thickness is
Prepare a 1 mm conductive stainless steel plate, and as shown in the cross-section in Fig. 1, coat one surface of this conductive stainless steel plate by electroplating or sputtering to a Cu thickness of about 2 to 3 µm.
After forming the metal film 2, a photosensitive insulating film 3 having a thickness of about 50 μm was laminated as shown in a sectional view in FIG.
Here, instead of sticking the photosensitive insulating film 3, a photosensitive resin layer may be formed by coating.

Next, the photosensitive insulating film 3 was subjected to selective exposure / development treatment, and negative patterning was performed as shown in a sectional view in FIG. Then, the electroconductive stainless steel plate 1 was immersed in a Ni plating solution as one electrode, and an electric current of about 2.5 to 3.0 A / dm ² was applied to perform electroplating, as shown in a sectional view in FIG. After forming the Ni layer 4'on the exposed metal film 2 surface, it is further immersed in a high-speed copper sulfate plating solution, and an electric current of about 20 A / dm ² is applied to perform electroplating treatment. As shown in cross section in FIG. 5, on the Ni layer 4 '(wiring pattern forming region)
Then, a copper layer 5 having a thickness of 35 μm was selectively deposited to form a first positive pattern 6. Here, the Ni layer 4'is the copper layer 5
A metal that can be selectively etched is selected.

On the surface on which the first positive pattern 6 is formed, a photosensitive insulating film 3'having a thickness of about 35 μm is attached again, and as shown in a sectional view in FIG. 6, the first positive pattern 6 is formed.
A through hole pattern 7 connected to the above was formed, and this through hole pattern 7 portion was filled with copper by electroplating. After embedding the through hole pattern 7 parts with copper,
A photosensitive insulating film 3 ″ having a thickness of about 35 μm was laminated, and selective exposure / development processing was performed to perform negative insulating patterning as shown in a sectional view in FIG. As shown in a sectional view in FIG. 8, a conductive layer 8 made of NiO _x , for example, is formed on the 3 ″ surface by a sputtering method, and the conductive layer 8 ′ on the positive pattern surface is used as a plating nucleus under the same conditions as described above. Electrolytic copper plating was performed to form a second positive pattern 6'as shown in a sectional view in FIG.

Then, the conductive layer 8 remaining on the surface on which the second positive pattern 6'is formed is removed by selective soft etching shown in cross section in FIG. An insulating film (insulating sheet) 9 is laminated and integrated on the formation surface, as shown in a sectional view in FIG. When the number of wiring layers is increased, the steps shown in FIGS. 6 to 10 may be appropriately repeated prior to stacking and integrating the insulating sheets 9. In this way, after the final positive pattern surface is covered by laminating and integrating the insulating sheet 9, the conductive base material 1 is peeled off and the metal layer 2 is removed by soft etching, or the conductive base material 1 is removed. Then, the metal layer 2 is sequentially peeled and removed. In this way, after the Ni layer 4'of the first positive pattern 6 is exposed and the Ni layer 4'is selectively removed by etching, as shown in a sectional view in FIG. A printed wiring board having a first positive pattern 6 in which the insulating layer 2 is provided with a dam and the dam is provided, so to speak, is obtained.

In the manufacturing method, when the inner layer wiring is formed in the middle of the manufacturing process, dummy through-hole patterns are provided in the insulating layer formed between them to form the metal layer 2
You may employ | adopt the structure electrically connected with the electroconductive base material 1 via. Further, when the metal layer 2 is removed by soft etching, the Ni layer 4'may be removed by selective etching at the same time.

In the process of manufacturing the printed wiring board, for example, at the stage where the second positive pattern 6'is formed, the surface of the second positive pattern 6'is made of silver-based conductive material such as epoxy resin as a binder. The conductive paste is printed, and after this printed conductive paste is dried, the method of printing again at the same position using the same mask is repeated.
By heating and curing in an oven at 0 ° C., a conical conductor bump 10 having a height of 0.3 mm and a bottom diameter of about 0.35 mm was formed (shaped) as shown in a sectional view in FIG.

The printed wiring board material 11 on which the conductor bumps 10 are formed in this manner is used, for example, as an epoxy resin prepreg layer.
Through 12, the conductor bumps 10 are laminated so as to correspond to each other,
Pressure integrated. In the process of pressurizing and integrating, the tip ends of the conductor bumps 10 are press-fitted into the prepreg layers 12, respectively, so that the tip portions of each other are so-called plastically deformed to form an electrically reliable connection between wiring layers. Was.

In the printed wiring boards having the configurations respectively manufactured above, even if the connection pads on the surface are 75/75 mm and the pitch interval is 0.15 mm, insulation between adjacent connection pads is sufficiently ensured, Further, even when the input / output terminals of the electronic component were connected by soldering, no solder bridge was observed, and highly reliable mounting was possible.

Although representative examples have been described above as examples, the present invention is not limited to these examples.
Various modifications can be made without departing from the spirit of the present invention. That is, the same result can be obtained even if the conductive base material, the metal layer, the insulating negative pattern forming material, the positive pattern forming metal, and the like are combined other than those exemplified in the above-mentioned embodiment.

[0045]

As can be seen from the above description, according to the present invention, when the input / output terminals of the electronic component are soldered to the connection pad surface, solder outflow in the plane direction is suppressed / prevented. It is possible to easily obtain a printed wiring board in which the occurrence of bridges and the like is wholly avoided. In other words,
While ensuring mutual insulation such as connection pads,
Since the soldering part is substantially dammed and the outflow in the planar direction is prevented, it is possible to obtain a printed wiring board suitable for a highly reliable mounting circuit device configuration by simple means. Become.

[Brief description of drawings]

FIG. 1 schematically shows an embodiment of a manufacturing method according to the present invention, and is a cross-sectional view of a state in which a metal layer is formed on the surface of a conductive base material.

FIG. 2 schematically shows an embodiment of a manufacturing method according to the present invention, and is a cross-sectional view of a state in which a first insulating film layer is attached to a metal layer surface.

FIG. 3 schematically shows an embodiment of a manufacturing method according to the present invention, and is a cross-sectional view showing a state in which a first insulating negative pattern is formed.

FIG. 4 schematically shows an embodiment of a manufacturing method according to the present invention, and is a cross-sectional view of a state in which a plated solder layer is formed on a metal layer surface.

FIG. 5 schematically shows an embodiment of a manufacturing method according to the present invention, and is a cross-sectional view of a state in which a first positive pattern is formed on the plated solder layer surface.

FIG. 6 schematically shows an embodiment of a manufacturing method according to the present invention, and is a cross-sectional view of a state in which an insulating edging film layer forming a through-hole pattern is stuck to a first positive pattern forming surface.

FIG. 7 schematically shows an embodiment of the manufacturing method according to the present invention, and is a cross-sectional view of a state in which a second insulating edging film layer is formed on a surface on which a through hole pattern is formed and negative patterning is performed.

FIG. 8 is a cross-sectional view schematically showing an embodiment of the manufacturing method according to the present invention, showing a state in which a conductive layer is formed on the negative patterned surface of the second insulating edging film.

FIG. 9 is a cross-sectional view schematically showing an embodiment of the manufacturing method according to the present invention, in a state in which a second positive pattern is formed on the conductive layer surface on the positive pattern of the second insulating edge film.

FIG. 10 schematically shows an embodiment of the manufacturing method according to the present invention, and is a cross-sectional view showing a state where the conductive layer on the positive pattern of the second insulating edging film is removed.

FIG. 11 schematically shows an embodiment of the manufacturing method according to the present invention, and is a cross-sectional view of a state in which an insulating sheet is laminated and integrated on the second positive pattern forming surface.

FIG. 12 is a cross-sectional view schematically showing the embodiment of the manufacturing method according to the present invention, in a state where the conductive base material and the metal film are removed.

FIG. 13 is a cross-sectional view schematically showing another embodiment of the manufacturing method according to the present invention, in which conductive bumps are formed on the second positive pattern surface.

FIG. 14 is a sectional view schematically showing still another embodiment of the manufacturing method according to the present invention, in a state where the conductive base material and the metal film are removed.

FIG. 15 schematically shows still another embodiment of the manufacturing method according to the present invention, in which conductive bumps formed on the second positive pattern surface are opposed to each other via an insulating prepreg layer,
Sectional drawing in the state of being laminated and integrated.

[Explanation of symbols]

1 ... Conductive substrate 2 ... Metal film 3, 3 ',
3 ″ ... Insulating sheet layer 4 ... Plating solder layer
4 '... plated metal layer 5 ... copper plated layer
6,6 '... Positive pattern 7 ... Through hole pattern 8,8' ... Conductive layer 9 ... Insulating sheet 10 ... Conductive bump

Claims (6)

[Claims] 1. A step of depositing a metal film on at least one main surface of a conductive base material, a step of forming a first electrically insulating negative pattern on the metal film surface, and the conductive base material. Plating as one of the electrodes and sequentially forming a positive pattern of the first conductive metal and a second conductive metal different from the first conductive metal on the exposed surface of the metal film. A second electrically insulating negative patterning step of providing a connection hole connected to the positive pattern of the second conductive metal on the positive pattern formation surface of the second conductive metal; A step of providing a conductive layer on the electrically insulating positive pattern surface, and performing a plating treatment with the conductive base material as one electrode,
A step of forming a positive pattern of a third conductive metal on the surface of the conductive layer; and a step of stacking and integrating an insulating sheet layer on the surface of the final positive pattern of the conductive metal, and then forming a conductive base material and a metal. A method of manufacturing a printed wiring board, comprising: a step of removing a film; and a step of selectively etching away the first conductive metal positive pattern exposed by the removal of the metal film. 2. A step of depositing a metal film on at least one main surface of a conductive base material, a step of performing a first electrically insulating negative patterning on the metal film surface, and the conductive group. A step of forming a positive pattern of a solder metal and a first conductive metal on the exposed surface of the metal film by plating using the material as one electrode, and a positive pattern formation surface of the first conductive metal. A second electrically insulating negative patterning step of providing a connection hole for connecting to the positive pattern of the first electrically conductive metal, and a first electrically conductive layer on the surface of the second electrically insulative positive pattern. And a step of performing a plating process using the conductive substrate as one electrode,
Forming a positive pattern of a second conductive metal on the surface of the first conductive layer; and connecting to a positive pattern of the second conductive metal on a surface of the positive pattern of the second conductive metal. A step of forming a third electrically insulating negative pattern having holes, a step of providing a second electrically conductive layer on the surface of the second electrically insulative positive pattern, and the electrically conductive substrate as one electrode A step of performing a plating treatment to form a positive pattern of a third conductive metal on the surface of the second conductive layer, and laminating and integrating an insulating sheet layer on the surface of the final positive pattern of the conductive metal And a step of removing the conductive base material and the metal film. 3. A method for producing a printed wiring board, which comprises using a conductive base material having good releasability as the conductive base material according to claim 1 or 2, and peeling and removing the conductive base material. 4. A step of depositing a metal film on at least one main surface of a conductive base material, a step of performing a first electrically insulating negative patterning on the metal film surface, and the conductive group. A step of performing a plating process using the material as one electrode to sequentially form a positive pattern of a first conductive metal and a second conductive metal different from the first conductive metal on the exposed surface of the metal film. And a second electrically insulating negative patterning step, in which a contact hole for connecting to the positive pattern of the second conductive metal is provided on the positive pattern formation surface of the second conductive metal, A step of providing a first conductive layer on the electrically insulating positive pattern surface of, and a plating process using the conductive base material as one electrode,
Forming a positive pattern of a second conductive metal on the surface of the first conductive layer; forming a required connection bump on the positive pattern surface of the second conductive metal; Through the insulating sheet layer on the bump forming surface,
A printed wiring board comprising: a step of arranging and laminating the wiring pattern surfaces of other wiring board elements so as to face each other and integrating them; and a step of peeling and removing the conductive base material and the metal film. Manufacturing method. 5. A step of depositing a metal film on at least one main surface of a conductive base material, a step of performing a first electrically insulating negative patterning on the metal film surface, and the conductive group. A step of forming a positive pattern of a solder metal and a first conductive metal on the exposed surface of the metal film by plating using the material as one electrode, and a positive pattern formation surface of the first conductive metal. A second electrically insulating negative patterning step of providing a connection hole for connecting to the positive pattern of the first electrically conductive metal, and a first electrically conductive layer on the surface of the second electrically insulative positive pattern. And a step of performing a plating process using the conductive substrate as one electrode,
Forming a positive pattern of a second conductive metal on the surface of the first conductive layer; and connecting to a positive pattern of the second conductive metal on a surface of the positive pattern of the second conductive metal. A step of forming a third electrically insulating negative pattern having holes, a step of providing a second electrically conductive layer on the surface of the third electrically insulative positive pattern, and the electrically conductive substrate as one electrode Plating treatment,
A step of forming a positive pattern of a third conductive metal on the surface of the second conductive layer; a step of forming a required connection bump on the final positive pattern surface of the conductive metal; and a step of forming the connection bump. And a step of arranging and laminating the wiring pattern surfaces of other wiring board elements so as to face each other with an insulating sheet layer interposed therebetween on the formation surface, and a step of peeling and removing the conductive base material and the metal film. A method of manufacturing a printed wiring board, comprising: 6. A method for producing a printed wiring board, which comprises using a conductive base material having a good mold releasability as the conductive base material according to claim 4 or 5, and peeling and removing the conductive base material.