JPH08148541A - Wafer transfer system - Google Patents
Wafer transfer systemInfo
- Publication number
- JPH08148541A JPH08148541A JP28835794A JP28835794A JPH08148541A JP H08148541 A JPH08148541 A JP H08148541A JP 28835794 A JP28835794 A JP 28835794A JP 28835794 A JP28835794 A JP 28835794A JP H08148541 A JPH08148541 A JP H08148541A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- concave surface
- water
- wafer transfer
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばウエハ搬送ライ
ンとウエハ研磨装置等のウエハ処理装置との間でウエハ
を搬送するウエハ搬送装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer apparatus for transferring a wafer between a wafer transfer line and a wafer processing apparatus such as a wafer polishing apparatus.
【０００２】[0002]
【従来の技術】図５は、半導体製造ラインの要部を示す
模式的平面図である。図中１はベルト1a上にウエハ２を
載置して、ウエハ２を白抜き矢符方向へ搬送する搬送ラ
インである。この搬送ライン１の側部には、研磨等のウ
エハ２の処理を行うウエハ処理装置の円形の回転テーブ
ル３が設置されている。回転テーブル３上には複数のウ
エハ保持台４が設けられており、ウエハ保持台４上にウ
エハ２を載置して処理を行うようになっている。搬送ラ
イン１と回転テーブル３との間にはウエハ搬送装置５が
設置されている。2. Description of the Related Art FIG. 5 is a schematic plan view showing a main part of a semiconductor manufacturing line. In the figure, reference numeral 1 denotes a transfer line for mounting the wafer 2 on the belt 1a and transferring the wafer 2 in the outline arrow direction. A circular rotary table 3 of a wafer processing apparatus that processes the wafer 2 such as polishing is installed on the side of the transfer line 1. A plurality of wafer holders 4 are provided on the rotary table 3, and the wafers 2 are placed on the wafer holder 4 for processing. A wafer transfer device 5 is installed between the transfer line 1 and the rotary table 3.
【０００３】図６は、従来のウエハ搬送装置５を示す模
式的縦断面図であり、特開平４−206946号公報に開示さ
れたものである。ウエハ搬送装置５はアーム部６とウエ
ハ保持部７とを備え、アーム部６の一端を回動軸として
ウエハ保持部７を回動することが可能である。ウエハ保
持部７は、複数の空気路21a を備えるセラミックスプレ
ート21の下面に、空気路21a に連通する空気孔22a を備
える含水吸着パッド22が取り付けられ、さらに含水吸着
パッド22の下面にウエハ２に外嵌するリング状のリテー
ナ23が取り付けられた構成をなす。空気路21a はアーム
部６の空気路6aに連通している。FIG. 6 is a schematic vertical sectional view showing a conventional wafer transfer device 5, which is disclosed in Japanese Patent Laid-Open No. 4-206946. The wafer transfer device 5 includes an arm portion 6 and a wafer holding portion 7, and the wafer holding portion 7 can be turned with one end of the arm portion 6 as a turning shaft. In the wafer holder 7, the water-containing adsorption pad 22 having the air holes 22a communicating with the air passage 21a is attached to the lower surface of the ceramic plate 21 having the plurality of air passages 21a, and the wafer 2 is attached to the lower surface of the water-containing adsorption pad 22 on the wafer 2. A ring-shaped retainer (23) for external fitting is attached. The air passage 21a communicates with the air passage 6a of the arm portion 6.
【０００４】含水吸着パッド22の下面にウエハ２を接触
させ、真空ポンプにより空気路6a,21a, 空気孔22a を介
して真空引きを行うことにより、ウエハ２は含水吸着パ
ッド22に吸着される。そして真空ポンプを停止するか、
又は送風により加圧を行うと、容易にウエハ２を取り外
すことができる。The wafer 2 is adsorbed to the water-containing adsorption pad 22 by bringing the wafer 2 into contact with the lower surface of the water-containing adsorption pad 22 and performing vacuuming through the air passages 6a, 21a and the air holes 22a by a vacuum pump. And stop the vacuum pump,
Alternatively, the wafer 2 can be easily removed by applying pressure by blowing air.
【０００５】図７は、特開平４−225229号公報に開示さ
れたウエハ搬送装置を示す模式的縦断面図である。ウエ
ハ受台31は水を介してウエハ２をフローティング保持し
ており、ウエハ受台31の一端側にはウエハ収納用のカセ
ット35が沈められた水槽33が設置されている。ウエハ受
台31には、ウエハ受台31とウエハ２との間に水を供給す
るための水噴射ノズル32が複数設けられており、ウエハ
受台31はその一端側に設けられた軸34を中心として垂直
方向に 180°回動するようになっている。FIG. 7 is a schematic vertical sectional view showing a wafer transfer device disclosed in Japanese Patent Laid-Open No. 4-225229. The wafer pedestal 31 holds the wafer 2 in a floating state via water, and a water tank 33 in which a cassette 35 for storing the wafer is submerged is installed at one end of the wafer pedestal 31. The wafer pedestal 31 is provided with a plurality of water jet nozzles 32 for supplying water between the wafer pedestal 31 and the wafer 2. The wafer pedestal 31 has a shaft 34 provided at one end thereof. It is designed to rotate 180 ° in the vertical direction as the center.
【０００６】研磨面を下にしてウエハ受台31上に保持さ
れていたウエハ２は、ウエハ受台31が 180°回動するこ
とにより、上下が逆になり水槽33内の水に浸漬される。
そしてこのとき水噴射ノズル32から水を供給するとウエ
ハ２はウエハ受台31から離脱し、その自重で水中を落下
する。このとき水槽33内の水流を任意の手段で制御する
ことにより、ウエハ２をカセット35に収納することがで
きる。The wafer 2 held on the wafer pedestal 31 with the polishing surface facing down is turned upside down by the 180 ° rotation of the wafer pedestal 31 and is immersed in the water in the water tank 33. .
Then, at this time, when water is supplied from the water jet nozzle 32, the wafer 2 is detached from the wafer receiving table 31 and falls in the water by its own weight. At this time, the wafer 2 can be stored in the cassette 35 by controlling the water flow in the water tank 33 by an arbitrary means.
【０００７】[0007]
【発明が解決しようとする課題】図６に示すウエハ搬送
装置では、ウエハ２は含水吸着パッド22に接触した状態
で保持されているので、含水吸着パッド22から取り外し
た後のウエハ２に含水吸着パッド22の吸着跡が残る。こ
の吸着跡は、例えばシリコン粒子又はシリコン微粒子が
付着したものであってウエハ２表面の汚染物となり、そ
の後の洗浄工程にとって大きな負担となる。またウエハ
搬送装置が研磨後のウエハ２を搬送する場合は、含水吸
着パッド22に研磨砥粒が付着しやすい。そしてウエハ２
の搬送を重ねると、含水吸着パッド22に研磨砥粒が堆積
し、その後にウエハ搬送装置が搬送するウエハ２の表面
を傷つける等、悪影響を及ぼすことがある。In the wafer transfer apparatus shown in FIG. 6, since the wafer 2 is held in contact with the water-containing adsorption pad 22, the water-containing adsorption is performed on the wafer 2 after being removed from the water-containing adsorption pad 22. The adsorption mark of the pad 22 remains. The adsorption traces are, for example, particles of silicon particles or silicon particles adhered, and become contaminants on the surface of the wafer 2, which imposes a heavy burden on the subsequent cleaning process. Further, when the wafer transfer device transfers the wafer 2 after polishing, the abrasive grains are likely to adhere to the water-containing adsorption pad 22. And wafer 2
If the conveyance is repeated, polishing abrasive particles may be deposited on the water-containing adsorption pad 22, and the surface of the wafer 2 conveyed by the wafer conveyance device may be damaged thereafter.
【０００８】また図７に示すウエハ搬送装置では、ウエ
ハ受台31を反転（回動）する機構が複雑である、水中を
落下しているウエハ２をカセット35へ収納するための水
流を与える機構が必要である等、多くの問題を有してい
る。Further, in the wafer transfer apparatus shown in FIG. 7, the mechanism for reversing (rotating) the wafer pedestal 31 is complicated, and a mechanism for giving a water flow for storing the wafer 2 falling in water in the cassette 35. There are many problems, such as
【０００９】本発明は、斯かる事情に鑑みてなされたも
のであり、凹状の面とウエハとを接触させ減圧すること
により、比較的簡単な構成でウエハ表面の汚染，損傷を
招来することなくウエハを搬送することが可能なウエハ
搬送装置を提供することを目的とする。また減圧を行い
ながら純水を供給する構成とすることにより、パーティ
クルの付着を防止し、洗浄効果が得られるウエハ搬送装
置を提供することを目的とする。The present invention has been made in view of such circumstances, and by bringing the concave surface into contact with the wafer to reduce the pressure, the surface of the wafer is not polluted or damaged with a relatively simple structure. An object is to provide a wafer transfer device capable of transferring a wafer. It is another object of the present invention to provide a wafer transfer device that can prevent particles from adhering and obtain a cleaning effect by supplying pure water while depressurizing.
【００１０】[0010]
【課題を解決するための手段】第１発明に係るウエハ搬
送装置は、減圧手段に接続された空気路を有するウエハ
保持部にてウエハを保持し、アーム部によりウエハ保持
部を回動させてウエハを搬送するウエハ搬送装置におい
て、前記ウエハ保持部は、ウエハと対向する面が凹状を
なしており、前記空気路が前記面まで達することを特徴
とする。A wafer transfer apparatus according to a first aspect of the present invention holds a wafer by a wafer holding section having an air passage connected to a pressure reducing means, and rotates the wafer holding section by an arm section. In the wafer transfer device for transferring a wafer, a surface of the wafer holding unit facing the wafer has a concave shape, and the air passage reaches the surface.
【００１１】第２発明に係るウエハ搬送装置は、第１発
明において、前記面の、前記ウエハと接触する部分は弾
性体で形成されていることを特徴とする。A wafer transfer device according to a second aspect of the present invention is characterized in that, in the first aspect, a portion of the surface that comes into contact with the wafer is formed of an elastic body.
【００１２】第３発明に係るウエハ搬送装置は、第１発
明において、前記面に対向するウエハの表面に純水を供
給する純水供給手段を備えることを特徴とする。A wafer transfer apparatus according to a third aspect of the present invention is characterized in that, in the first aspect of the present invention, there is provided pure water supply means for supplying pure water to the surface of the wafer facing the surface.
【００１３】第４発明に係るウエハ搬送装置は、第１発
明において、その先端から純水を供給することが可能な
支持棒が、前記面から前記ウエハの近傍まで突出形成さ
れていることを特徴とする。A wafer transfer apparatus according to a fourth aspect of the present invention is the wafer transfer apparatus according to the first aspect of the present invention, wherein a support rod capable of supplying pure water from the tip thereof is formed to project from the surface to the vicinity of the wafer. And
【００１４】[0014]
【作用】第１発明にあっては、凹状の面でウエハを保持
するので、ウエハ保持部とウエハとの接触面積が従来よ
り大幅に縮小されて、ウエハ表面の汚染及び損傷を防止
することができる。According to the first aspect of the present invention, since the wafer is held by the concave surface, the contact area between the wafer holding portion and the wafer is significantly reduced as compared with the conventional case, and the contamination and damage of the wafer surface can be prevented. it can.
【００１５】第２発明にあっては、第１発明の作用に加
えて、凹状の面の、ウエハとの接触部分を弾性体で形成
してあることにより、減圧時の、ウエハ保持部，ウエハ
間の密着性が向上し、より安定にウエハを保持すること
ができる。According to the second aspect of the invention, in addition to the operation of the first aspect of the invention, the contact portion of the concave surface with the wafer is formed of an elastic material, so that the wafer holding portion and the wafer during depressurization The adhesiveness between them is improved, and the wafer can be held more stably.
【００１６】第３発明にあっては、第１発明の作用に加
えて、ウエハの表面にパーティクルが付着することを防
止したり、例えば研磨が施された表面の洗浄が行える等
の効果が得られる。According to the third aspect of the invention, in addition to the action of the first aspect of the invention, it is possible to obtain the effect of preventing particles from adhering to the surface of the wafer, cleaning the polished surface, and the like. To be
【００１７】第４発明にあっては、第１発明の作用に加
えて、ウエハを減圧保持する際に、ウエハが凹状の面に
沿って撓むことを防止し、ひいては割れを防止すること
ができる。またこのとき支持棒の先端から純水が供給さ
れるので、支持棒とウエハとが直接接することはない。
これにより従来のような吸着跡は残らない。According to the fourth aspect of the invention, in addition to the function of the first aspect of the invention, when the wafer is held under reduced pressure, it is possible to prevent the wafer from bending along the concave surface and to prevent cracking. it can. Further, at this time, since pure water is supplied from the tip of the supporting rod, the supporting rod and the wafer do not come into direct contact with each other.
As a result, no adsorption mark as in the conventional case remains.
【００１８】[0018]
【実施例】以下、本発明をその実施例を示す図面に基づ
き具体的に説明する。 実施例１．図１は、本発明に係るウエハ搬送装置の実施
例１を示す模式的断面図である。ウエハ搬送装置５は、
略コの字型をなすステンレス鋼製のアーム部６と、平面
視で矩形又は円形をなす樹脂製（例えば塩化ビニル，ア
クリル，テフロン等）のウエハ保持部７とを備える。ウ
エハ保持部７の上面側にアーム部６の一端が接続されて
おり、アーム部６の他端を回動軸としてウエハ保持部７
が水平方向での回動が可能なようになしてある。アーム
部６は減圧機８に接続された空気路6aを備え、ウエハ保
持部７は空気路6aと連通された複数の空気路11a を備え
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings showing the embodiments. Example 1. 1 is a schematic cross-sectional view showing a first embodiment of a wafer transfer device according to the present invention. The wafer transfer device 5 is
It is provided with a substantially U-shaped stainless steel arm portion 6 and a wafer holding portion 7 made of resin (for example, vinyl chloride, acrylic, Teflon, etc.) which is rectangular or circular in plan view. One end of the arm portion 6 is connected to the upper surface side of the wafer holding portion 7, and the other end of the arm portion 6 is used as a rotation axis for the wafer holding portion 7.
Is designed to be rotatable in the horizontal direction. The arm portion 6 has an air passage 6a connected to the decompressor 8, and the wafer holding portion 7 has a plurality of air passages 11a communicating with the air passage 6a.
【００１９】ウエハ保持部７の下面は断面視円弧状の凹
面7aとなしてあり、複数の空気路11a の端部は凹面7aま
で達している。凹面7aは水に対する濡れ性が良好な樹脂
等の材料で形成されているか、又は表面の濡れ性を良く
するためのコーティングがその表面に施されている。凹
面7aの周縁部にはウエハ２の縁部を嵌入するための切り
欠き7bが設けられており、ウエハ２はその縁部のみが接
触した態様で凹面7aに保持されるようになっている。The lower surface of the wafer holder 7 is a concave surface 7a having an arcuate shape in cross section, and the ends of the plurality of air passages 11a reach the concave surface 7a. The concave surface 7a is formed of a material such as a resin having good wettability with water, or a coating for improving the wettability of the surface is applied to the surface. A notch 7b for fitting the edge of the wafer 2 is provided on the peripheral edge of the concave surface 7a, and the wafer 2 is held by the concave surface 7a in a state where only the edge is in contact.
【００２０】次にウエハ搬送装置５によるウエハ２の搬
送方法について説明する。図５に示す搬送ライン１で搬
送されてきたウエハ２は指定箇所で停止し、ウエハ２と
ウエハ搬送装置５のウエハ保持部７との位置を合わせ、
ウエハ保持部７を降下させて両者を接触させる。そして
減圧機８にて減圧吸引を行うことにより、ウエハ２と凹
面7aとの間の空気が減圧されてウエハ２はウエハ保持部
７の凹面7aに吸着される。この状態でウエハ２を持ち上
げ、ウエハ保持部７を回動させて回転テーブル３の所定
位置（例えば図５のウエハ保持台４）まで移動させる。
ウエハ保持部７を回転テーブル３に接触するまで降下さ
せ減圧機８の減圧吸引を停止すると、ウエハ２はウエハ
保持部７の凹面7aから離脱し回転テーブル３のウエハ保
持台４に載置される。減圧吸引の停止は、減圧機８をオ
フするか、又は減圧機８との間の配管を閉じるかのいず
れでもよい。Next, a method of transferring the wafer 2 by the wafer transfer device 5 will be described. The wafer 2 transferred on the transfer line 1 shown in FIG. 5 is stopped at a designated position, the wafer 2 and the wafer holding portion 7 of the wafer transfer device 5 are aligned,
The wafer holder 7 is lowered to bring them into contact with each other. Then, the air between the wafer 2 and the concave surface 7a is decompressed by performing decompression suction by the decompressor 8, and the wafer 2 is adsorbed to the concave surface 7a of the wafer holding portion 7. In this state, the wafer 2 is lifted and the wafer holder 7 is rotated to move it to a predetermined position on the rotary table 3 (for example, the wafer holder 4 in FIG. 5).
When the wafer holder 7 is lowered until it comes into contact with the rotary table 3 and the vacuum suction of the decompressor 8 is stopped, the wafer 2 is detached from the concave surface 7a of the wafer holder 7 and placed on the wafer holder 4 of the rotary table 3. . The decompression suction may be stopped by turning off the decompressor 8 or closing a pipe connected to the decompressor 8.
【００２１】本発明では搬送時にウエハ２はその周縁部
のみでウエハ保持部７と接触し、その面積は従来より大
幅に縮小されているので、ウエハ２表面の汚染又は損傷
を防止することができる。また搬送作業の繰り返しによ
るパーティクルの再付着も防止することができる。In the present invention, the wafer 2 contacts the wafer holding portion 7 only at the peripheral edge portion during transfer, and the area thereof is significantly reduced as compared with the conventional case, so that the surface of the wafer 2 can be prevented from being contaminated or damaged. . Further, it is possible to prevent particles from re-adhering due to repeated transportation work.
【００２２】実施例２．図２は、本発明の実施例２にお
けるウエハ搬送装置の要部を示す拡大断面図である。本
実施例では、ウエハ保持部７の、ウエハ２と接触する切
り欠き7bの近傍部分が、摩擦係数が大きいゴム等の弾性
体９で形成されている。その他の構成は図１に示すもの
と同様である。Example 2. FIG. 2 is an enlarged cross-sectional view showing a main part of the wafer transfer device according to the second embodiment of the present invention. In this embodiment, a portion of the wafer holding portion 7 near the notch 7b that contacts the wafer 2 is formed of an elastic body 9 such as rubber having a large friction coefficient. Other configurations are similar to those shown in FIG.
【００２３】このように構成することにより、減圧機８
による減圧時の、ウエハ保持部７，ウエハ２間の密着性
が向上し、ウエハ２がウエハ保持部（凹面7a）に安定良
く保持される。With this structure, the pressure reducer 8
The adhesiveness between the wafer holding portion 7 and the wafer 2 at the time of depressurization by is improved, and the wafer 2 is stably held in the wafer holding portion (concave surface 7a).
【００２４】実施例３．図３は、本発明の実施例３にお
けるウエハ搬送装置を示す模式的縦断面図である。本実
施例では、純水を供給するための配管12と連結された支
持棒10が、凹面7aの中央部からウエハ２の表面近傍まで
突出している。支持棒10へはポンプ13にて配管12を介し
て純水を供給することが可能なようになしてある。その
他の構成は図１に示すものと同様である。Example 3. FIG. 3 is a schematic vertical sectional view showing a wafer transfer device according to a third embodiment of the present invention. In this embodiment, the support rod 10 connected to the pipe 12 for supplying pure water projects from the central portion of the concave surface 7a to the vicinity of the surface of the wafer 2. Pure water can be supplied to the support rod 10 by a pump 13 through a pipe 12. Other configurations are similar to those shown in FIG.
【００２５】図４は支持棒10を示す横断面図である。純
水を供給するための孔10a は、図４(a) に示す如く１個
でもよく、図４(b) に示す如く複数個でもよい。FIG. 4 is a cross-sectional view showing the support rod 10. The hole 10a for supplying pure water may be one as shown in FIG. 4 (a), or may be plural as shown in FIG. 4 (b).
【００２６】ウエハ２を吸引保持する場合は、減圧機８
にて常時減圧し、それと同時に支持棒10から絶えず純水
を供給する。ウエハ２を離脱させる場合は減圧吸引及び
純水供給を停止する。When the wafer 2 is held by suction, the decompressor 8 is used.
At that time, the pressure is constantly reduced, and at the same time, pure water is continuously supplied from the support rod 10. When removing the wafer 2, the vacuum suction and the pure water supply are stopped.
【００２７】本実施例では減圧によってウエハ２が凹面
7aに沿って撓んでも支持棒10の存在により割れを防止す
ることができる。このとき支持棒10の先端から純水が噴
出しているので、支持棒10とウエハ２とが直接接するこ
とはない。またウエハ２の表面が絶えず純水と接触して
いるので、その後の工程である洗浄の負担が軽減され
る。さらに研磨砥粒等のパーティクルの除去効果及び再
付着防止効果も得られる。In this embodiment, the wafer 2 is concave due to the reduced pressure.
Even if it bends along 7a, the presence of the support rod 10 can prevent cracking. At this time, since pure water is ejected from the tip of the supporting rod 10, the supporting rod 10 and the wafer 2 do not come into direct contact with each other. Further, since the surface of the wafer 2 is constantly in contact with pure water, the burden of cleaning in the subsequent steps is reduced. Furthermore, the effect of removing particles such as abrasive grains and the effect of preventing redeposition can be obtained.
【００２８】なお図３では支持棒10が１本である場合を
示しているが、複数本であってもよい。ただしこの場合
は、ウエハ２との直接接触を避けるために、全ての支持
棒10から純水を供給することができるような構成とする
必要がある。Although FIG. 3 shows the case where the number of the supporting rods 10 is one, it may be plural. However, in this case, in order to avoid direct contact with the wafer 2, pure water must be supplied from all the support rods 10.
【００２９】[0029]
【発明の効果】以上のように本発明に係るウエハ搬送装
置は、凹状の面とウエハとを接触させ減圧することによ
り、ウエハとウエハ保持部との接触面積が縮小されるの
で、ウエハ表面の汚染，損傷を招来することなく、また
複雑な機構を必要とすることなくウエハを搬送すること
が可能となる。減圧を行いながら純水を供給する構成と
することにより、パーティクルの付着を防止し、洗浄効
果が得られ、純水を介してウエハと接触する支持棒を備
えることにより、割れを防止することができる等、本発
明は優れた効果を奏する。As described above, in the wafer transfer apparatus according to the present invention, the contact area between the wafer and the wafer holding portion is reduced by bringing the concave surface into contact with the wafer to reduce the pressure. The wafer can be transferred without causing contamination or damage and without requiring a complicated mechanism. By supplying deionized water while depressurizing, particles can be prevented from adhering and a cleaning effect can be obtained. By providing a supporting rod that comes into contact with the wafer through deionized water, cracking can be prevented. That is, the present invention has excellent effects.
【図１】本発明に係るウエハ搬送装置の実施例１を示す
模式的縦断面図である。FIG. 1 is a schematic vertical sectional view showing a first embodiment of a wafer transfer device according to the present invention.
【図２】本発明の実施例２におけるウエハ保持部を示す
拡大断面図である。FIG. 2 is an enlarged cross-sectional view showing a wafer holder according to a second embodiment of the present invention.
【図３】本発明の実施例３におけるウエハ搬送装置を示
す模式的縦断面図である。FIG. 3 is a schematic vertical sectional view showing a wafer transfer device according to a third embodiment of the present invention.
【図４】図３に示す支持棒の横断面図である。4 is a cross-sectional view of the support rod shown in FIG.
【図５】半導体製造ラインの要部を示す模式的平面図で
ある。FIG. 5 is a schematic plan view showing a main part of a semiconductor manufacturing line.
【図６】従来のウエハ搬送装置を示す模式的縦断面図で
ある。FIG. 6 is a schematic vertical sectional view showing a conventional wafer transfer device.
【図７】従来のウエハ搬送装置を示す模式的縦断面図で
ある。FIG. 7 is a schematic vertical sectional view showing a conventional wafer transfer device.
１ 搬送ライン ２ ウエハ ３ 回転テーブル ５ ウエハ搬送装置 ６ アーム部 6a，11a 空気路 ７ ウエハ保持部 7a 凹面 7b 切り欠き ８ 減圧機 ９ 弾性体 10 支持棒 10a 孔 12 配管 13 ポンプ 1 Transfer Line 2 Wafer 3 Rotary Table 5 Wafer Transfer Device 6 Arm 6a, 11a Air Path 7 Wafer Holding 7a Concave 7b Cutout 8 Pressure Reducer 9 Elastic Body 10 Support Rod 10a Hole 12 Piping 13 Pump
Claims (4)
エハ保持部にてウエハを保持し、アーム部によりウエハ
保持部を回動させてウエハを搬送するウエハ搬送装置に
おいて、前記ウエハ保持部は、ウエハと対向する面が凹
状をなしており、前記空気路が前記面まで達することを
特徴とするウエハ搬送装置。1. A wafer transfer device in which a wafer is held by a wafer holding part having an air passage connected to a pressure reducing means, and the arm is rotated to transfer the wafer. A wafer transfer device, wherein a surface facing the wafer has a concave shape, and the air passage reaches the surface.
弾性体で形成されていることを特徴とする請求項１記載
のウエハ搬送装置。2. The wafer transfer apparatus according to claim 1, wherein a portion of the surface that comes into contact with the wafer is formed of an elastic body.
供給する純水供給手段を備えることを特徴とする請求項
１記載のウエハ搬送装置。3. The wafer transfer apparatus according to claim 1, further comprising a pure water supply unit that supplies pure water to the surface of the wafer facing the surface.
な支持棒が、前記面から前記ウエハの近傍まで突出形成
されていることを特徴とする請求項１記載のウエハ搬送
装置。4. The wafer transfer apparatus according to claim 1, wherein a support rod capable of supplying pure water from the tip thereof is formed to project from the surface to the vicinity of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28835794A JP3082603B2 (en) | 1994-11-22 | 1994-11-22 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28835794A JP3082603B2 (en) | 1994-11-22 | 1994-11-22 | Wafer transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08148541A true JPH08148541A (en) | 1996-06-07 |
| JP3082603B2 JP3082603B2 (en) | 2000-08-28 |
Family
ID=17729163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28835794A Expired - Fee Related JP3082603B2 (en) | 1994-11-22 | 1994-11-22 | Wafer transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3082603B2 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185522A (en) * | 1999-12-24 | 2001-07-06 | Shibaura Mechatronics Corp | Apparatus for treating rectangular substrate |
| WO2002065510A1 (en) * | 2000-12-22 | 2002-08-22 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
| JP2003100848A (en) * | 2001-09-25 | 2003-04-04 | Applied Materials Inc | Substrate holder |
| JP2004040011A (en) * | 2002-07-08 | 2004-02-05 | Toyo Kohan Co Ltd | Tool, apparatus, and method for supplying and taking out substrate |
| US6709267B1 (en) | 2002-12-27 | 2004-03-23 | Asm America, Inc. | Substrate holder with deep annular groove to prevent edge heat loss |
| JP2004241616A (en) * | 2003-02-06 | 2004-08-26 | Shin Etsu Handotai Co Ltd | Wafer holder and method for transferring wafer |
| JP2005045122A (en) * | 2003-07-24 | 2005-02-17 | Daifuku Co Ltd | Plate-like body unloading device |
| JP2005306582A (en) * | 2004-04-23 | 2005-11-04 | Murata Mfg Co Ltd | Transfer method for card-like sheet and transfer device |
| US7033445B2 (en) | 2001-12-27 | 2006-04-25 | Asm America, Inc. | Gridded susceptor |
| JP2012089627A (en) * | 2010-10-18 | 2012-05-10 | Disco Abrasive Syst Ltd | Wafer transfer mechanism |
| US9359672B2 (en) | 2005-01-18 | 2016-06-07 | Asm America, Inc. | Reaction system for growing a thin film |
| JP2017011076A (en) * | 2015-06-19 | 2017-01-12 | リンテック株式会社 | Holding device and method for separation |
| US10872804B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
| US10872803B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
| CN112276792A (en) * | 2019-07-11 | 2021-01-29 | 株式会社迪思科 | Wafer conveying mechanism and grinding device |
| US11450549B2 (en) | 2019-12-27 | 2022-09-20 | Samsung Electronics Co., Ltd. | Substrate transfer apparatus and substrate transfer system using the same |
-
1994
- 1994-11-22 JP JP28835794A patent/JP3082603B2/en not_active Expired - Fee Related
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185522A (en) * | 1999-12-24 | 2001-07-06 | Shibaura Mechatronics Corp | Apparatus for treating rectangular substrate |
| JP4482188B2 (en) * | 1999-12-24 | 2010-06-16 | 芝浦メカトロニクス株式会社 | Rectangular substrate processing equipment |
| US6729875B2 (en) | 2000-12-22 | 2004-05-04 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
| US6840767B2 (en) | 2000-12-22 | 2005-01-11 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
| WO2002065510A1 (en) * | 2000-12-22 | 2002-08-22 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
| US6634882B2 (en) | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
| JP2003100848A (en) * | 2001-09-25 | 2003-04-04 | Applied Materials Inc | Substrate holder |
| US7033445B2 (en) | 2001-12-27 | 2006-04-25 | Asm America, Inc. | Gridded susceptor |
| JP2004040011A (en) * | 2002-07-08 | 2004-02-05 | Toyo Kohan Co Ltd | Tool, apparatus, and method for supplying and taking out substrate |
| US6709267B1 (en) | 2002-12-27 | 2004-03-23 | Asm America, Inc. | Substrate holder with deep annular groove to prevent edge heat loss |
| JP2004241616A (en) * | 2003-02-06 | 2004-08-26 | Shin Etsu Handotai Co Ltd | Wafer holder and method for transferring wafer |
| JP2005045122A (en) * | 2003-07-24 | 2005-02-17 | Daifuku Co Ltd | Plate-like body unloading device |
| JP2005306582A (en) * | 2004-04-23 | 2005-11-04 | Murata Mfg Co Ltd | Transfer method for card-like sheet and transfer device |
| US9359672B2 (en) | 2005-01-18 | 2016-06-07 | Asm America, Inc. | Reaction system for growing a thin film |
| US10468291B2 (en) | 2005-01-18 | 2019-11-05 | Asm America, Inc. | Reaction system for growing a thin film |
| CN102456600A (en) * | 2010-10-18 | 2012-05-16 | 株式会社迪思科 | Wafer transfer mechanism |
| JP2012089627A (en) * | 2010-10-18 | 2012-05-10 | Disco Abrasive Syst Ltd | Wafer transfer mechanism |
| JP2017011076A (en) * | 2015-06-19 | 2017-01-12 | リンテック株式会社 | Holding device and method for separation |
| US10872804B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
| US10872803B2 (en) | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
| US11626313B2 (en) | 2017-11-03 | 2023-04-11 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
| CN112276792A (en) * | 2019-07-11 | 2021-01-29 | 株式会社迪思科 | Wafer conveying mechanism and grinding device |
| CN112276792B (en) * | 2019-07-11 | 2024-03-12 | 株式会社迪思科 | Wafer conveying mechanism and grinding device |
| US11450549B2 (en) | 2019-12-27 | 2022-09-20 | Samsung Electronics Co., Ltd. | Substrate transfer apparatus and substrate transfer system using the same |
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| Publication number | Publication date |
|---|---|
| JP3082603B2 (en) | 2000-08-28 |
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