JPH08137579A - Cooling structure for electronic equipment - Google Patents

Abstract

PURPOSE: To improve the packaging density of an electronic equipment, to make the whole device small in size and to surely cool a circuit board or the like required for cooling. CONSTITUTION: Between each of a CPU unit 2 and a DKU 3 which are arranged in a vertical direction at the inside of a housing 1 of an electronic equipment device and are forcedly cooled by air flow passing respectively in the vertical direction by cooling fans 5a and 5b, an inclined ventilation control plate 4a dividing the cooling flow passage formed by cooling fans 5a and 5b is arranged. A DC/DC converter unit 4 is constituted by fitting a DC/DC converter power circuit board 4b to the ventilation control plate 4a. The DC/DC converter power circuit board 4b is cooled by the air flow flowing along the ventilation control plate 4a and a maintenance management is executed by drawing the DC/DC converter unit 4 to the outside through a front surface door 1a of the housing 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling and mounting structure in an electronic device such as a computer, and more particularly, to provide a means for improving the mounting density in the device and realizing the miniaturization of the entire device, It is intended to provide means for surely cooling a substrate or the like having a necessary heating element.

[0002]

2. Description of the Related Art In the prior art, for example, Japanese Patent Application Laid-Open No. 6-
As disclosed in Japanese Patent Publication No. 177561, a power supply unit (substrate) such as a DC / DC converter for supplying power to a printed circuit board having a heating element such as an IC chip or an LSI package needs to be cooled. Because I
The structure is such that an IC chip, an LSI package, and the like are cooled by an air-cooling fan while being mounted on a backboard together with a printed circuit board having a C chip, an LSI package, and the like.

[0003]

In the above-mentioned conventional method, if there are many substrates having IC chips, LSI packages, etc. mounted on the backboard surface, DC / DC on the same surface.
There is no space to install a power supply unit such as a converter, which makes it difficult to install. Also, I
When mounted on a backboard opposite to the mounting surface of a substrate having a C chip, an LSI package, etc., the air of an air cooling fan provided for cooling the IC chip, the LSI package, etc. cannot be sufficiently obtained. However, there arise problems that the air-cooling performance is deteriorated and that replacement and maintenance work cannot be performed when a power supply unit such as a DC / DC converter fails. Further, there arises a problem that the depth dimension of the entire apparatus needs to be increased more than necessary so as not to interfere with other units mounted on the rear side in space.

The object of the present invention is to improve the mounting density of electronic equipment in the device, realize the miniaturization of the entire device, and to simplify the operation of the power supply board and the reliability of the operation by maintaining the necessary air cooling performance. An object of the present invention is to provide a cooling technology for electronic devices that can realize the improvement of

[0005]

In the present invention, for example,
A ventilation control plate which is arranged between a unit having a substrate having an IC chip, an LSI package, etc. mounted inside the backplane and a unit having other functions, and which functions to divide a cooling flow path. A power supply board such as a DC / DC converter is attached to the device, and the ventilation control plate can be removed from the front side of the device.

[0006]

By attaching a power supply board such as a DC / DC converter to the ventilation control plate that divides the cooling flow path, the power supply board such as a DC / DC converter is attached to a backplane on which a board having an IC chip, an LSI package, etc. is mounted. The area to be arranged can be omitted, and sufficient cooling performance of the power supply board can be ensured by the cooling air flowing along the ventilation control plate. Particularly, in the structure in which the two cooling flow paths are controlled by the ventilation control plate, it becomes possible to cool both the front and back surfaces of the power supply board such as the DC / DC converter.
With sufficient cooling, the reliability of operation can be ensured.

Further, by making the ventilation control plate detachable from the front side of the device, replacement and maintenance work can be facilitated when the power supply board such as the DC / DC converter is out of order.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing a partially broken structure of a cooling structure for an electronic apparatus according to an embodiment of the present invention.
2 is a vertical sectional view thereof, and FIG. 3 is a horizontal sectional view thereof.

A front door 1a is provided on the side surface of the housing 1 of the electronic equipment. Inside the housing 1, a CPU unit 2 and a DKU unit 3 are vertically arranged at a position facing the front door 1a. Are arranged. Also, behind these CPU unit 2 and DKU unit 3,
A plurality of rear units 6 are provided at predetermined intervals.

As illustrated in FIG. 3, the CPU unit 2 is surrounded by a CPU rack 2a and a CPU backplane 2b, and inside the U-shaped area opened to the side of the front door 1a, A plurality of CPU boards 2c supported by the CPU backplane 2b and a plurality of LSI mounting boards 2d supported by the CPU board 2c are housed in a posture in which air passages are formed in the vertical direction.

Further, in the DKU unit 3, for example, a plurality of magnetic disk drive devices are housed, similarly to the CPU unit 2, with a gap in which an air passage is formed in the vertical direction.

CPU unit 2 and DKU unit 3
A cooling fan 5a and a cooling fan 5b are provided in the upper part of each unit, and a cooling flow path that is a passage for the cooling air is formed in the inside of each unit so as to face substantially vertically downward.

A ventilation control plate 4a is provided between the CPU unit 2 and the DKU unit 3 so as to descend from the front door 1a side toward the rear unit 6 side, and each cooling fan is provided. (A) 5a and the cooling fan (B) 5b, the flow paths of the cooling air are independently formed like the cooling flow paths (A) 7a and the cooling flow paths (B) 7b. It is configured to improve the cooling efficiency in.

In this case, the CPU unit 2 and the DKU
The DC / DC converter power supply board 4b that supplies DC power to each device included in the unit 3 and the rear unit 6 is I
LSI having a heating element such as a C chip or an LSI package
It is attached to the ventilation control plate 4a which divides the cooling flow path between the CPU unit 2 in which the mounting board 2d is provided inside and the DKU unit 3 in which the magnetic disk drive is provided into the cooling flow path 7a and the cooling flow path 7b, and is integrated with the ventilation control plate 4a. Is converted into a DC / DC converter unit 4. Also, this DC / D
The entire C converter unit 4 can be removed by pulling it out from the front door 1a side.

Integrated ventilation control plate 4a and DC / DC
On the converter power supply board 4b, the wind of the cooling flow path 7a sent from the cooling fan 5a is directed to the upper surface side, and the cooling fan 5b is supplied.
Since the wind of the cooling flow path 7b that is further drawn flows to the lower surface side, the DC / DC converter power supply board 4b is sufficiently cooled, so that the occurrence of troubles due to poor cooling or the like is avoided, and the reliability of operation is improved. Is improved.

The ventilation control plate 4a and the DC / DC converter power supply board 4b are the DC / DC converter unit 4
As a result, since the front door 1a of the housing 1 of the electronic device can be opened and removed from the front side, replacement and maintenance work at the time of failure of the DC / DC converter power supply board 4b is easy.

As described above, DC / DC is provided on the ventilation control plate 4a.
By installing the converter power supply board 4b, DC /
It is not necessary to secure an area for disposing the DC converter power supply board 4b, the mounting efficiency is good, and it is suitable for downsizing the entire apparatus, and it is also good in terms of cooling performance and maintainability.

On the other hand, for reference, in the configuration of this embodiment (the reference numerals of the respective parts used in FIGS. 4 and 5 below are the reference numerals of the corresponding portions in the case of the present embodiment of FIGS. 1 to 3). "10" is added to the head of the CPU and detailed description is omitted to avoid duplication.) Assuming a case where a conventional mounting method is applied, as shown in FIG. CP on the backplane 102b
When the DC / DC converter power supply board 104b is mounted in the same manner as the U board 2c, the LSI mounting board 102
There is a concern that it may interfere with d, and as shown in FIG.
If it is mounted on the back surface of the CPU backplane 102b, the cooling air sent from the cooling fan 105a (A) cannot be received, and there is a concern that the required cooling performance cannot be satisfied. Further, the DC / DC converter power supply board 1
It becomes difficult to perform replacement maintenance work when 04b fails. further,
By mounting on the back surface of the CPU backplane 102b, it is necessary to pay attention to interference with the rear unit 106, and in some cases, it is necessary to increase the depth dimension of the entire device.

On the other hand, as described above, according to the configuration of the present embodiment, it is possible to solve the above-mentioned problems of the prior art.

[0021]

According to the cooling of the electronic device of the present invention, the mounting density of the electronic device in the device is improved, the miniaturization of the entire device is realized, and the simple maintenance work of the power supply board and the required air cooling performance are realized. It is possible to obtain the effect that the reliability of the operation can be improved by maintaining the above.

[Brief description of drawings]

FIG. 1 is a perspective view showing a partially broken structure of a cooling structure for an electronic device according to an embodiment of the present invention.

FIG. 2 is a vertical sectional view of a cooling structure for an electronic device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a cooling structure for an electronic device that is an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing an example of a conventional cooling structure for electronic equipment.

FIG. 5 is a vertical cross-sectional view showing an example of a conventional cooling structure for an electronic device.

[Explanation of symbols]

1 ... Housing, 1a ... Front door, 2 ... CPU unit, 2a ...
CPU rack, 2b ... CPU backplane, 2c ... C
PU board, 2d ... LSI mounting board, 3 ... DKU unit, 4 ... DC / DC converter unit, 4a ... Ventilation control board, 4b ... DC / DC converter power supply board, 5a ... Cooling fan, 5b ... Cooling fan, 6 ... Rear part Unit, 7a
... Cooling channel, 7b ... Cooling channel.

Claims (1)

[Claims] 1. A plurality of units for accommodating electronic devices, and a ventilation control plate for dividing the direction of the ventilation passage in each unit into a system for each unit between the units. A cooling structure for an electronic device,
A cooling structure for an electronic device, wherein a power supply board for supplying power to the electronic device is disposed integrally with the ventilation control plate, and the ventilation control plate is detachable from the unit.