JP2001189584A - Electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a PC server provided with a cooling mechanism capable of cooling efficiently heat generating parts in an apparatus with an air flow rate at a necessary minimum. SOLUTION: A PC server 1 comprises: an air intake 9 and an air outlet for leading a fresh air into a case 8; a cooling fan 11 provided near the air outlet 10; and a duct case 13 having a drift part 12 so as to supply the fresh air to be led into the case 8 by the cooling fan 11 distributively to a heat generating part 2 which is present in an upstream side region of a flow of the air, in other words, an upstream region thereof and a heat generating part 3 which is present in a downstream side region, in other words, a downstream region thereof. Thus, the heat generating part 2 in the upstream region is cooled with the fresh air aspirated from a lower step of the air intake 9, while the heat generating part 3 in the downstream region is cooled with the fresh air which is aspirated from an upper step of the air intake 9 and does not come into contact with the heat generating part 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic device such as a PC server having a cooling mechanism for cooling a plurality of electronic components such as an MPU (Micro Processing Unit) mounted in the device.

[0002]

2. Description of the Related Art Conventionally, a PC server or the like that provides various services (processes) to a plurality of personal computers (hereinafter, referred to as “PCs”) on a network includes an MPU or the like that generates a large amount of heat inside the device. Generally, a cooling mechanism is provided for cooling. As this cooling mechanism,
Various types have been developed according to the mechanical structure of electronic devices such as PC servers.

For example, a first type of cooling mechanism is shown in FIG.
As shown in the figure, the wiring board 1 built in the electronic device 101
02 is supplied along the substrate surface of the wiring substrate 102, and a plurality of heat generating components 10 mounted on the wiring substrate 102 are supplied.
4 and 105 are cooled. This cooling mechanism includes:
The air mixing plates 106 and 107 are provided between the upstream and downstream regions of the air flow in the electronic device 101.
Is provided. Air mixing plates 106 and 107
Agitates the air 103, which has taken the heat from the heat-generating component 104 in the upstream region and the temperature has been unevenly raised, in the middle flow region, and
This is to reduce the cooling effect on the heat-generating component 105 in the downstream region as much as possible by making the temperature of the heat-generating device uniform.

A second type of cooling mechanism is shown in FIG.
As shown in FIG. 7, a plurality of housing portions 11 for housing a plurality of wiring boards 109 on which the heat generating components 108 are mounted, respectively.
0a, and a cooling port 111 formed at a position facing the heat-generating component 108 on each wiring board 109 accommodated in each accommodating portion 110a of the frame 110. Heating component 10 across 111
A plurality of fan mounting plates 113 provided with a local cooling fan 112 provided with a heat sink provided at a position facing 8 and a whole cooling fan 114 mounted on a side surface of the frame 110. That is, this cooling mechanism is controlled by the local cooling fans 112 provided at positions facing the individual heat-generating components 108, respectively.
08 diffuses the locally generated heat and exhausts the diffused heat to the outside of the frame 110 by the entire cooling fan 114, thereby improving the cooling effect.

Further, a third type of cooling mechanism is shown in FIG.
As shown in the plan view of FIG. 3 and the cross-sectional view of FIG.
In each case, a fan 117 with a heat sink is attached, and a partition plate 119 having a cooling port 118 formed at a position facing the fan 117 with a heat sink, and partition plates 120 and 121, and an exhaust area below a heat generating component 116 is provided. 122 and an upper intake area 123 are physically partitioned. In other words, the cooling mechanism separates the intake region 123 and the exhaust region 122 having the heat-generating component 116, thereby making the temperature of the air in the upstream region and the downstream region of the air flow uniform, and increasing the temperature of the heat-generating component 116. The cooling efficiency is improved.

[0006]

However, such a conventional cooling mechanism has the following problems. That is, as shown in FIG. 11, the cooling mechanism of the first type uses the air mixing plates 106 and 107 to form the electronic device 1.
Although the temperature of the air in the middle area of the air flow in 01 is uniform, a substantial rise in the temperature of the air in the entire downstream area cannot be avoided as compared with the upstream area, and the heat generation in the downstream area The cooling effect on the part 105 was not sufficient.

A second type of cooling mechanism is shown in FIG.
As shown in FIG. 3, the air flowing in the lateral direction (vertical direction of the wiring board 109) generated by the local cooling fan 112 attached to the position facing each heat generating component 108,
Since the air flowing in the vertical direction (the direction along the substrate surface of the wiring board 109) generated by the overall cooling fan 114 attached to the nozzles 0 crosses, the flow rate of the air decreases due to the crossing and the crossed air collides. The noise generated at the time was a problem.

Further, the third type of cooling mechanism is shown in FIG.
As shown in FIG. 4, due to the interference of the flow of air between the fans 117 with heat sinks, the fans 117 with heat sinks located particularly downstream of the intake area 123 and upstream of the exhaust area 122 cannot perform sufficient ventilation. The heat-generating component 116 facing the fan could not be sufficiently cooled.

Here, in order to improve the cooling performance of each type of cooling mechanism described above, it is conceivable to increase the air volume of a fan of each type of cooling mechanism. It is necessary to use such a fan, and there is a problem in terms of cost or increase in noise.

The present invention has been made to solve these problems, and an object of the present invention is to provide an electronic device capable of efficiently cooling electronic components in the device with a minimum necessary air flow rate.

[0011]

In order to achieve the above object, an electronic apparatus according to a first aspect of the present invention includes a housing, an electronic component built in the housing, and air supplied to the electronic component. Cooling means for supplying and cooling, and dispersing means for dispersing and supplying the air supplied to the electronic component by the cooling means to an upstream region and a downstream region of an air flow in the housing. It is characterized by having.

According to the present invention, the air supplied to the electronic component can be dispersed and supplied to the upstream and downstream regions of the air flow in the housing. Even if, for example, a plurality of electronic components generating a large amount of heat are provided, the electronic components arranged in the downstream region by fresh air that does not take heat (no temperature rise) from the electronic components in the upstream region Can be cooled. Therefore, according to the electronic device of the first aspect, the electronic components in the device can be efficiently cooled with the minimum necessary air flow rate.

According to a second aspect of the present invention, there is provided an electronic device, comprising: a frame provided with a plurality of housing portions; a board on which electronic components housed in the housing portions are mounted; Cooling means for supplying air in a direction along a plane to cool the electronic component; and supplying the air supplied to the electronic component by the cooling means to an upstream region and a downstream region of an air flow in the housing portion. And a dispersing means for distributing and supplying the dispersion to the region.

According to the present invention, the air supplied to the electronic components on the substrate accommodated in the accommodating portion of the frame is dispersed into an upstream region and a downstream region of the air flow in the accommodating portion. Even if, for example, a plurality of electronic components that generate a large amount of heat are provided in the housing portion, they are arranged in the downstream region with fresh air that does not take heat from the electronic components in the upstream region. The cooled electronic components can be cooled. Therefore, according to the electronic device of the second aspect,
The electronic components in the device can be efficiently cooled with a minimum necessary air flow rate while minimizing noise such as wind noise.

Further, an electronic apparatus according to a third aspect of the present invention includes a housing, a plurality of electronic components built in the housing,
A plurality of cooling means for supplying and cooling air to the plurality of electronic components; and the air supplied to the plurality of electronic components by the plurality of cooling means are provided on an upstream side of an air flow in the housing. A first flow path for guiding the electronic component to the electronic component and cooling the electronic component; and supplying the air supplied to the plurality of electronic components by the plurality of cooling units to a downstream side of the flow of air in the housing. A second flow path for leading to the provided electronic component and cooling the electronic component.

According to the present invention, the air supplied to the electronic component in the housing by the plurality of cooling means is distributed and supplied to an upstream region and a downstream region of the air flow in the housing. Since the first and second flow paths are provided so as to be able to be provided, even when, for example, a plurality of electronic components generating a large amount of heat are provided in the housing, the air generated by the plurality of cooling means is provided. It is possible to suppress the flow interference and the like, and to cool the electronic components arranged in the downstream region with fresh air that does not take heat from the electronic components in the upstream region. Therefore, according to the electronic device of the third aspect, since the air efficiently flows through the housing without causing interference of the air flow and the like, the generation of noise and the decrease of the air volume are suppressed as much as possible with the minimum necessary air flow rate. In addition, the electronic components in the device can be efficiently cooled.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a side sectional view showing a PC server 1 as an electronic apparatus according to a first embodiment of the present invention.
FIG. 3 is a perspective view showing a cooling mechanism provided in the PC server 1.

As shown in these figures, the PC server 1 has a relatively large heat generation during operation among electronic components.
Heat generating components 2 and 3 such as PU, a printed wiring board 4 on which the heat generating components 2 and 3 are mounted, a power supply device 5 for supplying power to these electronic components 2 and 3 and the like, FD, CD-RO
Media drive 6 such as M, and H as an auxiliary storage device.
The DD 7 and the like are built in the housing 8.

Here, the cooling mechanism provided in the PC server 1 of the present embodiment will be described. That is, the PC server 1
Is provided with an intake port 9, an exhaust port 10 for introducing fresh air into the housing 8, and a cooling fan 11 near the exhaust port 10. Further, fresh air introduced into the housing 8 by the cooling fan 11 is supplied to the housing 8 of the PC server 1 by an area on the upstream side of the air flow, that is, the heat-generating component 2 in the upstream area, and the heating element 2 on the downstream side. A duct case 13 having a deflected air portion 12 is attached so as to be distributed and supplied to a region, that is, a heat generating component 3 in a downstream region.

The cooling mechanism will be described in detail with reference to FIG.
As shown in the cross-sectional plan view of FIG. 5 and the side cross-sectional views of FIGS. 4 and 6, the zigzag portion 12 provided in the central region of the air flow in the housing 8 has a zigzag shape. A plurality of upper deflecting holes 14 and lower deflecting holes 15 are drilled. That is,
As shown in FIG. 3 and FIG. 4, the duct case 13 uses the deflected air portion 12 to pass fresh air sucked from a lower stage in an upstream region of an air flow through an upper deflected air hole 14 to lower the air. It is provided to lead to the upper stage in the basin. As shown in FIGS. 5 and 6, the duct case 13 allows the fresh air sucked from the upper stage in the upstream region of the air flow to pass through the lower airflow hole 15 by using the airflow deviation part 12. It is provided to lead to the lower stage in the downstream area.

Therefore, the heat generating component 2 in the upstream area is
The heat-generating component 3 in the downstream area is cooled by the fresh air sucked from the lower stage of the intake port 9, while being cooled by the fresh air sucked from the upper stage of the intake port 9 and not touching the heat-generating component 2.

As described above, according to the PC server 1 of the present embodiment, the air supplied to the heat-generating components is distributed to the upstream area and the downstream area of the air flow in the housing 8. Since the air can be supplied, the electronic components 3 arranged in the downstream region can be cooled by fresh air that does not take heat from the heat generating components 2 in the upstream region (the temperature does not rise). Therefore, according to the PC server 1, the heat generating components 2 and 3 in the PC server can be efficiently cooled with a minimum necessary air flow rate.

(Second Embodiment) FIG. 7 is an exploded perspective view showing a PC server 21 according to a second embodiment, and FIG. 8 is a sectional view thereof.

As shown in these figures, this PC server 21 is a rack (shelf) provided with a plurality of accommodation sections 22.
23, a plurality of printed wiring boards 25 on which the heat-generating components 24 and 24a respectively housed in the housing portions 22 of the rack 23 are mounted, and an upper air inlet 26 from a lower air inlet 26 along the board surface of the printed wiring board 25. A cooling fan 28 for generating air flowing toward the exhaust port 27 to cool the heat generating components 24 and 24a;
And a duct plate 30 having a deflecting portion 29 for supplying the air supplied to the housing 23 to the upstream and downstream regions of the air flow in the housing portion 22 of the rack 23 in a distributed manner. .

The cooling mechanism provided in the PC server 21 will be described in detail. Each of the wind deflecting sections 29 provided in the central area of the air flow in the housing section 22 has the wind deflecting section of the first embodiment. As in the case of 12, a plurality of two types of deflecting holes are formed in a staggered manner.

The duct case 30 is, as shown in FIG.
Utilizing the deflecting portion 29 and the outer shape of the printed wiring board 25, fresh air sucked in from the left stage in the upstream region of the air flow, that is, below the housing portion 22, is used to deflect one type of deflecting hole. It is provided so as to be able to pass and to be guided to the right stage in the downstream area, that is, above the storage section 22. Further, the duct case 30 uses the deflecting portion 29 and the printed wiring board 25 to transfer the fresh air sucked from the right stage in the upstream region of the air flow (below the housing portion 22) to the other type. Is provided so as to be able to be guided to the left in the downstream area (above the accommodating portion 22) through the unbalanced hole.

Therefore, the heat-generating component 24 in the upstream area in the housing portion 22 of the frame 23 is cooled by the fresh air sucked from the left stage of the air inlet 22,
The heat-generating component 24a in the downstream area is cooled by the fresh air that has not been in contact with the heat-generating component 24 and that has been taken in from the right stage of the intake port 26.

As described above, the PC server 21 of the present embodiment
According to the above, the air supplied to the heat-generating components on the printed wiring board 25 housed in the housing section 22 of the frame 23 is
Since the air can be distributed and supplied to the upstream region and the downstream region of the air flow in the inside, the heat generating components 24 in the upstream region can be supplied.
The heat-generating component 24a disposed in the downstream area can be cooled by fresh air that does not take heat from the heat-generating component. Therefore, according to the PC server 21 of the present embodiment, the heat-generating components 24 and 24a in the PC server can be efficiently cooled with a minimum necessary air flow rate while minimizing noise such as wind noise.

(Third Embodiment) FIG. 9 is a plan view showing a cooling mechanism 42 of a PC server 41 according to a third embodiment.
FIG. 10 is a sectional view of the side surface.

As shown in these figures, the cooling mechanism 42 of the PC server 41 comprises a housing 43 having an entrance partition 43, a partition 45 having a plurality of openings 44 formed therein, and a plurality of openings 46. , And an internal partition plate 48
, A duct outer frame 49, a duct outer frame 50, and an outlet partition plate 51 to form a duct structure.
2. An intake port (lower) 53, an exhaust port (upper) 54, and an exhaust port (lower) 55 are formed.

In the housing of the cooling mechanism 42 having such a duct structure, the fans 58, 6 with heat sinks are provided.
The printed wiring board 56 is attached to a region on the upstream side of the flow of air generated by the fans 58 and 61. Further, the printed wiring board 56
A plurality of heat generating components 57 are mounted on the upper part so as to match the positions of the respective openings 44 of the partition plate 45. Further, the fan 58 with the heat sink is mounted on the upper part of the heat generating components 57. On the other hand, a printed wiring board 59 is attached to a region on the downstream side of the air flow, and a plurality of heat generating components 60 are mounted on the wiring board 61 so as to match the positions of the openings 46 of the partition plate 47. I have. Further, a fan 61 with a heat sink is attached to the upper part of these heat generating components 60.

Therefore, the heat generating component 57 in the upstream area of the air flow in the casing is sucked in from the suction port (lower stage) 53 and is supplied with fresh air introduced from each opening 44 of the partition plate 45, that is, the first flow. The heat generating component 60, which is cooled by the air flowing through the passage 62 and is located downstream of the flow of the air in the housing, is sucked in from the air inlet 52 (upper stage) and is separated from the partition plate 4.
7 is cooled by the fresh air introduced from each opening 46 and not touching the heat generating component 57, that is, the fresh air flowing through the second flow path 63.

As described above, the PC server 41 of the present embodiment
According to this configuration, the air supplied to the heat-generating components in the housing by the plurality of fans with heat sinks 58 and 61 can be distributed and supplied to the upstream region and the downstream region of the air flow in the housing. Since the first and second flow paths 62 and 63 are provided, interference of the flow of air generated by the fans 58 and 61 is suppressed, and fresh air which does not take heat from the heat generating component 57 in the upstream area. Thus, the heat generating component 60 arranged in the downstream area can be cooled. Therefore, according to the PC server 41, since the air efficiently flows through the housing without interference of the air flow and the like, the noise and the reduction of the air volume can be suppressed as much as possible with the minimum necessary air flow rate. The heat generating parts 57 and 60 can be efficiently cooled.

As described above, the present invention has been specifically described with reference to the embodiments. However, the present invention is not limited to these embodiments, and can be variously modified without departing from the gist thereof. For example, a PC as a client connected to the PC server of the present embodiment through a network
MCM (Multi-chip Module) with large heat generation
The present invention may be applied to any electronic device provided with the above.

[0036]

As described above, according to the first aspect of the present invention,
According to the electronic device according to the present invention, the air supplied to the electronic component can be distributed and supplied to the upstream region and the downstream region of the air flow in the housing. Even in the case where a plurality of electronic components generating a large amount of heat are provided, the electronic components arranged in the downstream region are cooled with fresh air that does not take heat (no temperature rise) from the electronic components in the upstream region. be able to. Therefore, according to the electronic device of the first aspect, the electronic components in the device can be efficiently cooled with the minimum necessary air flow rate.

According to the electronic device of the second aspect of the present invention, the air supplied to the electronic components on the substrate accommodated in the accommodating portion of the frame is supplied to the area on the upstream side of the air flow in the accommodating portion. Can be distributed to the downstream region and the downstream region. Therefore, even when, for example, a plurality of electronic components having a large calorific value are provided in the housing portion, heat is taken from the electronic components in the upstream region. Electronic components located downstream can be cooled with no fresh air. Therefore, claim 2
According to the electronic device of (1), it is possible to efficiently cool electronic components in the device with a minimum necessary air flow rate while minimizing noise such as wind noise.

Further, according to the electronic device of the third aspect of the present invention, the air supplied to the electronic components in the housing by the plurality of cooling means is divided into the upstream region and the downstream region of the air flow in the housing. Since the first and second flow paths are provided so as to be able to be distributed and supplied to the region, even when a plurality of electronic components having a large amount of heat generation are provided in the housing, for example, The interference of the flow of air generated by the plurality of cooling means is suppressed, and the electronic components arranged in the downstream region can be cooled by fresh air that does not take heat from the electronic components in the upstream region. Therefore, according to the electronic device of the third aspect, since the air efficiently flows through the housing without causing interference of the air flow and the like, the generation of noise and the decrease of the air volume are suppressed as much as possible with the minimum necessary air flow rate. In addition, the electronic components in the device can be efficiently cooled.

[Brief description of the drawings]

FIG. 1 is an exemplary sectional view showing a PC server according to a first embodiment of the present invention;

FIG. 2 is an exemplary perspective view showing a cooling mechanism included in the PC server of FIG. 1;

FIG. 3 is a cross-sectional view of a plane showing an upper stage side of the cooling mechanism of FIG. 2;

FIG. 4 is a side sectional view showing a structure of a duct case for sending air from a lower stage to an upper stage in the cooling mechanism of FIG. 2;

FIG. 5 is a sectional view of a plane showing a lower side of the cooling mechanism of FIG. 2;

FIG. 6 is a side sectional view showing a structure of a duct case for sending air from an upper stage to a lower stage in the cooling mechanism of FIG. 2;

FIG. 7 is an exploded perspective view of a PC server according to a second embodiment of the present invention.

FIG. 8 is a sectional view showing a cooling mechanism provided in the PC server of FIG. 7;

FIG. 9 is a plan view showing a cooling mechanism of a PC server according to a third embodiment of the present invention.

FIG. 10 is an exemplary sectional view showing a cooling mechanism of the PC server shown in FIG. 9;

FIG. 11 is a diagram schematically showing a cooling structure of a conventional electronic device.

FIG. 12 is an exploded perspective view showing a cooling structure of a conventional electronic device different from the cooling structure of the electronic device shown in FIG. 11;

13 is a plan view schematically showing a cooling structure of a conventional electronic device different from the cooling structure of the electronic device shown in FIG.

14 is a cross-sectional view showing a cooling structure of the electronic device shown in FIG.

[Description of Signs] 1, 21, 41 ... PC Servers 2, 3, 24, 24a, 57, 60 ... Heating Components 4, 25, 56, 59 ... Printed Wiring Board 8 ... Cases 9, 26, 52, 53 ... intake port 10, 27, 54, 55 ... exhaust port 11, 28 ... cooling fan 12, 29 ... deflecting part 13, 30 ... duct case 14 ... upper deflecting hole 15 ... lower part Baffle hole 22 ... accommodation part 23 ... frame (shelf) 42 ... cooling mechanism 43 ... inlet partition plate 44, 46 ... opening 45 ... partition plate 47, 48 ... internal partition plate 49, 50 ... duct Outer frame 51 Outlet partition plate 58, 61 Fan with heat sink 62 First flow path 63 Second flow path

Claims (3)

[Claims] A housing, an electronic component built in the housing, cooling means for supplying and cooling air to the electronic component, and the air supplied to the electronic component by the cooling means. An electronic apparatus, comprising: a dispersing unit that distributes and supplies the air to an upstream region and a downstream region of an air flow in a housing. 2. A rack provided with a plurality of housing portions, a board on which electronic components housed in the housing portions of the rack are mounted, and air supplied in a direction along a surface of the board to supply the electronic components. Cooling means for cooling components; and dispersing means for distributing the air supplied to the electronic component by the cooling means in an upstream area and a downstream area of an air flow in the housing. An electronic device comprising: 3. A housing, a plurality of electronic components built in the housing, a plurality of cooling units for supplying air to the plurality of electronic components to cool the plurality of electronic components, and the plurality of electronic devices by the plurality of cooling units. A first flow path for guiding the air supplied to the component to an electronic component provided on the upstream side of the flow of the air in the housing and cooling the electronic component; A second flow path for guiding the air supplied to the electronic component to the electronic component provided on the downstream side of the flow of the air in the housing and cooling the electronic component. Electronic equipment.