JPH073799B2 - IC test equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to means for connecting signals and the like between a test board and a test board having a plurality of ICs into which ICs to be tested are inserted and removed.

[0002]

2. Description of the Related Art Conventionally, the connection between the test board of the IC tester and the pin card of the test head uses a card edge type connector as shown in FIG. 7 in the early stage when the number of simultaneously measured test ICs is small. , As the number of ICs measured at the same time increases, as shown in FIG. 8, the so-called pogo pin method called POGO PIN (PO
Some have provided a signal pin 8 labeled GO PIN). That is, as shown in FIG. 8, a test consisting of the above-mentioned substrate 3 on which a plurality of IC sockets 2 into which the IC 1 to be tested is inserted and removed and a lower substrate 5 arranged below the upper substrate 3 via a supporting member 4 are provided. Board 6 and the test board 6
Has a pin card 10 of a test head arranged at the bottom of the pin board, and the signal pin 8 provided on a contact block 9 that is fastened to the side of the pin card 10 between the test board 6 and the pin card 10 has a lower board. 5, the signal pins of the test board 6, which are led from the respective IC sockets 2 by the wiring 7, are connected to the signal pins 8 corresponding to the pin cards 10 respectively. It was a thing. Note that FIG. 9 shows an outline of the apparatus, and a description thereof is omitted.

Further, there was an IC test device as shown in Japanese Examined Patent Publication No. 4-41950, but this device has a plurality of connector units 112 arranged on one surface of the IC test device as shown in FIG. Each connector 1 provided with one or more connectors 123 into / from which the IC socket board 114 is inserted / removed, and provided with an IC socket 72 for connecting to the terminal plate 74 having the connection terminal 74a on the connector 123
As 23, a connector 123 of a type that can open / close the contact in a connected state or a non-connected state by operating the operation portion is used.

[0004]

A large number of memory ICs are measured, and recently 32 ICs or 64 ICs are simultaneously measured.
Simultaneous measurement of individual pieces is also performed. In the so-called pogo pin method shown in FIG. 8, it is not uncommon for the number of pogo pins to greatly increase and exceed 2000 per test board. Test failures due to poor contact due to light dirt and the like, and the adverse effects of instability factors are increasing. In this type of device, high reliability of contact between individual terminals is required. There is a problem that it is difficult to improve the reliability with the method of 1. and the use of a connector with an opening / closing function is advantageous for attaching and detaching the test board as shown in FIG. Since the structure is such that it is in the contact state and the open state by the operation of closing and opening, it is easily affected by the contact failure due to dust and dirt, and there is a problem in the reliability of electrical connection.

[0005]

In order to solve the above problems, according to the present invention, there is provided a test board having a plurality of IC sockets into which ICs to be tested are inserted and removed, and a pin card of a test head arranged below the test board. In the connecting means, a contact portion having a predetermined shape is provided on a lower surface of the lower substrate of the pin card, and a contact means including a contactor made of an elastic member engaging with the contact portion and a contact block having a predetermined shape is provided. , Connecting the signal pins of the test board to the signal pins corresponding to each of the pin cards to move the test board horizontally and diagonally, and after moving horizontally, move it vertically to the original position. The IC test device according to claim 1, wherein the socket is fastened to the side surface of the pin card and is open at the top, and one end is attached to the pin card. At the same time, a contact of a thin metal elastic member having a predetermined portion of the other end formed in a hook shape and arranged above the socket, and a contact block of a predetermined shape provided on the inner bottom of the socket and guiding the contact are provided. Claim 2 of the contact means according to claim 1 provided and configured, and the contact means having a test board having a plurality of IC sockets into which ICs to be tested are inserted and removed, and a pin card of a test head arranged under the test board, In a cylindrical socket that is fastened to the upper part of the pin card and opens to the side, one end is fastened to the pin card, the other end is outside the socket, and a predetermined portion is formed in a triangular shape. Of the elastic member made of a thin plate protruding to a predetermined position outside of the test board, and a contact means made of a contact piece protruding a predetermined length below the lower board of the test board are formed. A means for solving the problems is created by the IC test apparatus according to claim 3, wherein the signal pins of the test board are connected to the signal pins corresponding to each of the pin cards by the means in the direction of movement. did.

[0006]

Since the present invention is constructed as described above, in the embodiment of claim 1, the contact means of claim 2 is provided to move the test board horizontally and obliquely and vertically after the horizontal movement. The cleaning action restores the original position. By moving in a predetermined direction, I / O signals to each signal pin of the test board, that is, each IC,
Since each terminal of the applied power supply and ground can be connected to the signal pin corresponding to each pin card by the contact corresponding to its movement, even if the number of contact pins increases, the IC test cannot be performed due to contact failure due to dust and light dirt. This eliminates the adverse effects such as, the high reliability of each contact, and the reliable connection and disconnection of the test head and test board.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a main part showing a part of an embodiment of the present invention in a horizontal movement, FIG. A is an illustration before the movement, FIG. B is an illustration after the movement, and FIG. In FIG. 1, 1 is an IC to be tested, 2 is I
The C sockets 3 are upper substrates and are patterned. Reference numeral 4 is a support member, and 5 is a lower substrate, which is patterned. 6 is a test board, 7 is wiring, and 9 is a contact protrusion. Upper substrate 3, supporting member 4, lower substrate 5, and wiring 7
The test board 6 is formed by. 10 is a pin card,
11 is a contact block, 12 is a contactor, 14 is a guide, 1
Reference numeral 5 is a contact means. The pin card 10 is provided on a test head (not shown). The contact means 15 is fastened to the upper side surface of the pin card 10 and has one end attached to the pin card 10 in a contact block 11 having an opened upper part, and a predetermined portion of the other end is formed into a hook shape as shown in the drawing.
A contact 12 of an elastic member made of a thin sheet metal, for example, phosphor bronze, is provided above the contact block 11, and an id 14 having a predetermined shape provided on the inner bottom portion of the contact block 11 and guiding the contact 12. And a contact block 11. Since the contactor 12 is made of an elastic member as described above, the contactor 9 contacts the contact protrusion 9 as the test board 6 moves in the horizontal direction, and the base contacts the guide surface of the guide 14 as shown in FIG. The hook portion is inclined so as to enter the hollow surface of the guide surface. FIG. C illustrates the relationship between the contact 12 and the guide 14 of the contact block 11.
2 is inclined as shown by the dotted line. The arrow (a) indicates the horizontal movement direction, but the structure for movement is omitted in the figure by known means (the same applies hereinafter).

FIG. 2 is a side view of a main part showing a part of the present invention which is vertically moved. FIG. 2a is a view before moving, FIG. 2b is after moving, and FIG. 2 is the same as that of FIG. 1, and the description thereof will be omitted (same below).

FIG. 3 is a side view of an essential part showing a part of the present invention in a diagonal movement, FIG. A is an illustration before the movement, FIG. B is an illustration after the movement, and FIG. The description of the configuration and operation of FIG. 3 is the same as that of FIG.

The structure and operation of moving the test board horizontally, then vertically, and then returning it to its original position can be understood from FIGS.

FIG. 4 is a side view of the essential part showing a part of another embodiment of the present invention in which the horizontal movement is carried out, FIG. Reference numeral 9-2 is an abutting piece that projects below the lower substrate 5 by a predetermined length. Reference numeral 11-1 is a contact block, which is formed in a tubular shape and has one end fastened to the pin card 10 and the other end opened. Reference numeral 12-1 is a contactor, one end of which is attached to the pin card 10 and the other end of which is outside the contact block 11-1, and a predetermined portion is formed in a triangular shape as shown in the drawing. Is an elastic member made of a thin plate that protrudes to a predetermined position outside the, for example, a contact made of phosphor bronze. As shown in Fig. A, the contact piece 9-2 of the test board 6 is separated from the contact 12-1 before the movement, but the horizontal movement causes the contact piece 9-2 to move into contact with the contact 12-. 1, the contactor 12-1 is deformed. Other configurations and operations are the same as those of the embodiment shown in FIG.

FIG. 5 is a side view of the essential part showing a part of another embodiment of the present invention in the diagonal direction movement indicated by the arrow (c), FIG. FIG. 5 refers to FIG. 1 and FIG. 4, and other description is omitted.

FIG. 6 is an external perspective view of an IC test apparatus using the embodiment of FIG. As shown, the IC under test 1
An upper substrate 3, a supporting member 4, and a lower substrate 5 on which a plurality of IC sockets 2 for inserting and removing are attached are shown, and the contact piece 9-2 and the contact 12-1 shown in FIG. The contact block 11-1 with is shown. Since other configurations are not directly related to the gist of the present invention, description thereof will be omitted.

By moving the test board 6 in the horizontal direction (a) and the vertical direction (b) and the oblique direction (c) indicated by the arrows, respectively, according to the embodiments of the present invention having the configurations shown in the above figures. As a result of the effect of the cleaning action in which the contactor 12 contacts the contact piece 9 while moving, an IC test device having little influence of contact failure due to dust or dirt and having high electrical reliability can be obtained.

[0015]

As described above, according to the invention of claim 1, the IC test is performed by providing the contact means including the contact made of the elastic member and the contact block having the predetermined shape between the pin card of the test head and the test board. Since I configured the device,
It is possible to move the test board laterally or diagonally, and with this configuration, the pushing force to the test board that causes warping on the test board can be removed, and the arc movement of the contact has a cleaning effect, There is an effect that it is possible to prevent the influence of poor contact due to dust and dirt. According to the second aspect of the present invention, one of the pin cards is opened, and the contact means is arranged so that the contact means and the contact surface of the test board facing the contact means are exposed. Therefore, even if the test board is moved laterally or obliquely. There is an effect that the contact means is maintained.
The invention of claim 3 has an effect that it is possible to employ a contactor having a simple shape. Furthermore, according to the present invention, the contact pressing force of the pin card is dispersed for each pin card,
The reinforcing frame receives the pressing force of each pin card, and the structure that the pressing force of the connection connector is not directly applied to the test board is possible, and the cleaning effect can be ensured by the test board setting operation, so the electrical There is an effect that it is possible to obtain a highly reliable IC test device.

[Brief description of drawings]

FIG. 1 is a side view of essential parts showing a lower portion of the present invention which is horizontally moved.

FIG. 2 is a side view of an essential part showing a part of the present invention which is vertically moved.

FIG. 3 is a side view of an essential part showing a part of the present invention that moves in an oblique direction.

FIG. 4 is a side view of an essential part showing a part of another embodiment of the present invention that moves in the horizontal direction.

FIG. 5 is a side view of an essential part showing a part of another embodiment of the present invention which moves in an oblique direction.

6 is an external perspective view of an IC test apparatus using the embodiment of FIG.

FIG. 7 is an explanatory view of a conventional card edge type connector.

FIG. 8 is a side view of a main part of a conventional pogo pin system.

FIG. 9 is an external perspective view of a conventional pogo pin type IC test device.

FIG. 10: Conventional I disclosed in Japanese Patent Publication No. 4-41950
It is a schematic perspective view of a C test device.

[Explanation of symbols]

1 IC to be tested 2 IC socket 3 Upper substrate 4 Support member 5 Lower substrate 6 Test board 7 Wiring 8 Signal pins 9, 9-1 Contact protrusion 10 Pin card 11, 11-1 Contact block 12, 12-1 Contact 14 Guide 15 Contact means 72 IC socket 74 Terminal plate 74a Contact terminal 112 Connector unit 114 IC socket board 123 Connector

Claims (3)

[Claims] 1. A test board comprising: an upper substrate having a plurality of IC sockets into which ICs to be tested are inserted and removed; and a lower substrate disposed below the upper substrate via a supporting member, and a test board of the test board. A pin card of a test head disposed at a lower portion, and contacted by contact means provided between the test board and the pin card, and each signal pin of the test board guided by wiring from each of the IC sockets is pinned. In the contact means adapted to be connected to the signal pin corresponding to each of the cards, a contact protrusion having a predetermined shape is provided on the lower surface of the lower substrate, and a contact made of an elastic member that engages with the contact protrusion and a predetermined contact. A contact means composed of a contact block having a shape is provided, and each signal pin of the test board is connected to a signal pin corresponding to each of the pin cards so that the test board is horizontally oriented. And an IC test device which is configured to move in an oblique direction, move horizontally and then vertically, and then return to the original position and move. 2. On a contact block which is fastened to the side surface of the pin card and has an open upper portion, one end is attached to the pin card and a predetermined portion of the other end is formed in a hook shape and is disposed above the contact block. The contact means according to claim 1, further comprising: a contact of an elastic member made of a thin plate metal; and a contact block provided in an inner bottom portion of the contact block and having a predetermined shape for guiding the contact. 3. A test board comprising: an upper substrate having a plurality of IC sockets into which ICs to be tested are inserted and removed; and a lower substrate provided below the upper substrate via a supporting member, and a test board of the test board. Each of the signal pins of the test board, which has a pin card of a test head arranged at a lower portion, is contacted by a contact means provided between the test board and the pin card, and is guided by wiring from each of the IC sockets. A contact means adapted to be connected to a signal pin corresponding to each of the pin cards, wherein the contact means is a cylindrical contact block which is fastened to the upper portion of the pin card and opens laterally, and one end of which is a pin. A contact of an elastic member made of a thin plate attached to the card, the other end of which is formed in a triangular shape outside the contact block and a predetermined portion of which is protruded to a predetermined position outside the contact block; The contact means is formed by an abutting piece projecting a predetermined length below the plate, and when the test board is moved in the horizontal direction and the oblique direction, and is moved vertically after the horizontal movement and then returned to the original position and moved, the contact means. An IC test device characterized by being configured to be connected by means of.