JP2965174B2 - Semiconductor device inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection device, and more particularly to a semiconductor device inspection device for inspecting electrical performance of a large number of semiconductor device circuits formed on a semiconductor wafer.

[0002]

2. Description of the Related Art A semiconductor element is manufactured by forming a plurality of required identical electric element circuits on a substantially disk-shaped thin plate of a predetermined size, called a wafer, which is aligned vertically and horizontally. These manufactured wafers are inspected and inspected for good or bad for each element by a semiconductor element inspection device called a wafer prober to inspect the formation quality of the element circuit before dividing the element into individual chips. Is done. As shown in FIG. 4, the semiconductor device inspection apparatus 10 includes a table 1
2 and a head stage 14 and the like.
Perform horizontal movement in the Y direction and vertical movement in the Z direction. The head stage 14 is disposed above the table 12, and is provided with probe needles 18, 18,...
The circuit of each element is sequentially inspected and determined via the probe card 20 for fixing.

The probe card 20 is provided with a dedicated probe card 20 for each type of element to be measured. The dedicated probe card 20 has a number for identifying the type of the card, and further has a device electrode. Are in an arrangement state corresponding to each electrode of the semiconductor element. Therefore, every time the type of the element to be inspected is changed, it is necessary to attach the dedicated probe card 20 to the ring-shaped member 22 mounted on the head stage 14.

[0004]

On the other hand, the head stage 14 has a test head 24,
When the pivot 4 rotates about the pin 26 in the direction of the arrow, the test head 24 is attached to the head stage 22.
In this case, the ring-shaped member 2 mounted on the head stage 14
2 are connected to pogo pins 24A of the test head 24. As a result, the ring-shaped member 22 and the test head 24 are electrically connected to each other and set in a state in which inspection is possible.

However, when the pogo pins 24A, 24A... Of the test head 24 are connected to the insert ring 22, the insert ring 22 bends downward due to the pressing force of the pogo pins 24A, 24A. The probe card 20 attached to the ring-shaped member 22 also bends similarly and
The positions of 8, 18, ... are shifted. Therefore, the alignment between the wafer and the probe needles 18, 18,... Needs to be performed with the probe needles 18, 18,... Shifted, that is, with the test head 24 attached to the ring-shaped member 22.

For this reason, a microscope hole for confirming the alignment is formed in the test head 24, and the wafer 16 and the probe needles 18, 18... Are visually aligned through the microscope hole 30 from above the test head 24. Therefore, there is a problem that alignment is difficult.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a semiconductor device inspection apparatus capable of easily performing alignment between a wafer and a probe needle.

[0008]

SUMMARY OF THE INVENTION The present invention provides a test head in which a tester is electrically connected to an insert ring provided with a probe card, and electrically connects a probe needle of the probe card to the tester. A semiconductor inspection device for affixing a probe needle of a probe card to an electrode of a semiconductor element and applying an electric signal to the electrode from a tester to inspect the semiconductor element for quality; and a guide member provided on the insert ring; A connecting member movably provided on the member and disposed between the test head and the insert ring; a locking position where the connecting member floats from the insert ring; and an unlocking position where the connecting member is mounted on the insert ring. A lock mechanism for moving the connecting member; and electrically connecting the connecting member to the insert ring. A flexible cable having a connecting member movable between a locked position and an unlocked position, wherein the test head and the connecting member are electrically connected in the locked position. The probe needle of the probe card is electrically connected to the tester, and the electrical connection between the test head and the connecting member is released at the unlock position.

[0009]

According to the present invention, the guide member is provided on the insert ring, the connecting member is movably provided on the guide member, and is disposed between the test head and the insert ring. The connecting member is moved by a lock mechanism between a lock position floating from the insert ring and an unlock position placed on the insert ring. The connecting member and the insert ring are electrically connected by a flexible cable. As a result, the test head and the connecting member are electrically connected at the locked position to electrically connect the probe needle of the probe card to the tester, and the electrical connection between the test head and the connecting member is released at the unlocked position. I do.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a schematic diagram showing a state where the lock mechanism of the semiconductor device inspection apparatus 50 according to the present invention is released, and FIG. 2 is a schematic diagram showing a state where the lock mechanism is operated.

Test head 5 of semiconductor device inspection apparatus 50
2 has a left end rotatably provided on a main body 56 via a pin 54, and an angle 52A mounted on the main body 56 is fixed to a right end of the test head 52. Test head 5
Are provided at the lower end of the pair 2. Support members 62 of the lock mechanism 60 are provided on both sides of the pogo pins 58, 58. The support member 62 has a lock member 62A on the side facing the pogo pins 58, 58. The lock member 62A is moved in the left-right direction by a moving means (not shown) such as an air cylinder. The moving means is not limited to an air cylinder, and other means such as a motor may be used.

The head stage 57 is provided with an insert ring 64. At the lower end of the insert ring 64, pogo pins 66, 66... Are planted, and at the upper end, guide pins 68, 68. Guide pin 6
Openings 70A, 70A,... Of the connecting member 70 formed in a ring shape are fitted into 8, 68,. Further, the connecting member 70 is formed with a tapered portion 70B, and the upper end tapered surface of the tapered portion 70B is
A is located slightly above A.

Therefore, when the lock members 62A move in the direction of the tapered portion 70B, they come into contact with the tapered surface of the tapered portion 70B. And furthermore, the lock members 62A, 62A
Is moved in the same direction, the connecting member 70 rises, and the contact board mounted on the upper part of the connecting member 70 comes into contact with the pogo pins 58 of the test head 52. In this case, since the connecting member 70 is disposed at a position away from the insert ring 64, the pogo pins 58, 58 of the test head 52 are
Are not transmitted to the insert ring 64.

Further, the connecting member 70 and the insert ring 6
4 are electrically connected via cables 76, 76,.... The cable 76 is formed in a flexible type so that the connecting member 70 moves in the vertical direction. A probe card 74 is provided at the lower end of the insert ring 64.
Are attached, and the pogo pins 66 of the insert ring 64 are in contact with the pads of the probe card 74. Thus, the probe needles 74A of the probe card 74 are electrically connected to the test head 52 via the cables 76, 76, and the like.

FIG. 3 shows reference pins 78 for positioning the connecting member 70. As shown in the figure, the reference pins 78 are implanted at the lower end of the test head 52, and the reference pins 78 are movably fitted into positioning portions 80 formed on the connecting member 70. ing. Thereby, the connecting member 70 is connected to the test head 52.
Is performed.

When inspecting the quality of a semiconductor device with the semiconductor device inspection apparatus 50 constructed as described above, first, the lock mechanism 60 is operated to electrically connect the connecting member 70 and the test head 52, and the probe card Are electrically connected to the test head 52. Since a tester (not shown) is electrically connected to the test head 52, the probe needles 74A, 74A,... And the tester (not shown) are electrically connected. In this state, the probe needles 74A of the probe card 74 are brought into contact with the electrodes of the semiconductor element,
An electric signal is applied to the electrodes from a tester to check the quality of the semiconductor element.

In the above embodiment, the test head 52 and the insert ring 64 are provided with the pogo pins 58, 58,... And the pogo pins 66, 66, respectively, so as to contact the contact board of the connecting member 70 and the pad of the probe card 74. But,
However, the mounting relationship between the pogo pins 66, 66... And the contact pads, and the pogo pins 58, 58. In the above embodiment, the connecting member 70 and the insert ring 64 are electrically connected by the cable 76. However, the present invention is not limited to this, and another flexible electric connecting member may be used.

[0018]

As described above, according to the semiconductor device inspection apparatus of the present invention, the probe of the probe card is electrically connected to the test head and the connecting member at the lock position where the connecting member is lifted from the insert ring. The needle and the tester are electrically connected. Therefore, when the probe needle and the tester are electrically connected, the pressing force of the pogo pin of the test head is not transmitted to the insert ring, so that the probe needle of the probe card does not shift. For this reason, since the test head can be removed from the insert ring and the wafer and the probe needle can be aligned, the alignment can be easily performed.

Further, since there is no need to visually position the test head from above through the microscope hole of the test head, the microscope hole can be removed.

[Brief description of the drawings]

FIG. 1 is a schematic view of a semiconductor device inspection apparatus according to the present invention in a state where a lock mechanism is released.

FIG. 2 is a schematic diagram showing a state in which a lock mechanism of the semiconductor device inspection apparatus according to the present invention is locked.

FIG. 3 is an enlarged view of a main part of the semiconductor device inspection apparatus according to the present invention.

FIG. 4 is a schematic diagram showing a configuration of a conventional semiconductor device inspection apparatus.

[Explanation of symbols]

 Reference Signs List 50 semiconductor device inspection device 52 test head 60 locking mechanism 64 insert ring 68 guide member 70 connecting member 74 probe card 74A probe needle 76 cable

Claims (1)

(57) [Claims] 1. A test head in which a tester is electrically connected to an insert ring provided with a probe card, the probe needle of the probe card is electrically connected to the tester, and the probe needle of the probe card is connected to a semiconductor. In a semiconductor inspection device which abuts on an electrode of an element and applies an electric signal from a tester to the electrode to inspect the semiconductor element for quality, a guide member provided on the insert ring, and a movable member provided on the guide member A connecting member disposed between the test head and the insert ring; and a lock mechanism for moving the connecting member to a locked position where the connecting member floats from the insert ring and an unlocked position where the connecting member is placed on the insert ring. A flexible cable for electrically connecting the connecting member and the insert ring And a flexible cable in which the connecting member is movable between a locked position and an unlocked position. And an electrical connection between the test head and the connecting member at the unlocked position.