JPH07266767A - Non-contact ic card and production thereof - Google Patents

Abstract

PURPOSE:To obtain a non-contact IC card that hardly generates a failure, such as the ejection of electronic parts, and can be efficiently produced at a low cost and provide the production method thereof. CONSTITUTION:On a top surface of a circuit board 12 provided with electronic part-mounting parts, two or more structural members 11, 12 having one or more opening parts K11, K12 and the like corresponding to the aforesaid parts are laminated so that the opening parts K11, K12 are connected to each other to form one or more connecting hole K1 and the like. After that, an IC card is produced through processes of mounting an electronic part A1 and the like, sealing with a resin, disposing a skin material 51, and the like. The opening part K11 as and the like are provided in the structural member 11 and the like so that a step D1 can be formed on a part of an inner wall of at least one of the connecting hole K1 and the like in the presence of one or more of the opening part K11 and the like different in full peripheral length from the other opening part K12 and the like in the connecting hole. A resin sealing material forms a resin sealing layer having an outer peripheral surface along the wall surfaces of the connecting hole K1 and the like in substantially close contact state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card and a method for manufacturing the same, and more specifically, a non-contact type IC card which is less likely to cause problems such as popping-out of electronic parts and can be manufactured efficiently at low cost. Type IC card and a method of manufacturing such an IC card.

[0002]

2. Description of the Related Art In recent years, IC cards are used as bank cash cards, telephone cards, various credit cards, due to their large storage capacity and ease of use.
Widely used for various prepaid cards. The IC card includes a contact type in which electrodes (connection terminals) electrically connected to a terminal device such as a reader (reading lead) are substantially exposed on the surface of the card, and such an electrode. There is a non-contact type that is stored in the IC card. The latter IC card can effectively protect the electrodes (and thus the IC itself) from moisture and dust, and since the electrodes are not exposed on the surface of the card, they are not affected by static electricity and the like. Demand is gradually expanding because of its excellent appearance. (For example, it is suitable for prepaid cards for collecting lift fees at ski resorts.)

By the way, as these IC cards, as shown in FIG. 9, a circuit board made of polyester resin having electronic parts [IC (semiconductor chips), capacitors, wire coils, etc.] A ₉ attached to the upper surface side. 21f, an opening K ₉₁ for accommodating the electronic parts A _{9 and the} like, and a structural member 11f made of polyester resin to be joined to the upper surface side of the circuit board 21f and the opening K _{91 and the} like. An IC including a sealing layer (encapsulating agent layer) 6f for sealing electronic components A _{1 and the} like, and predetermined skin layers (vinyl chloride sheets) 51f, 52f
A card (personal data card) or the like can be used as an example (Japanese Patent Laid-Open No. Hei 4)
-286697 gazette). The IC card shown in the figure is a non-contact type, but the contact type is also the above-mentioned circuit board 21f, structural member 11f, except for structural differences such as the electrodes being exposed on the surface side. A similar configuration can be made using the skin material 51f and the like. This IC card has appropriate flexibility, durability, etc. and is relatively easy to use because the circuit board 2f and the structural member 11f (hereinafter referred to as "base portion") are made of polyester resin. It is a good one.

However, the encapsulating material layer 6f is formed as shown in FIG.
As shown in 0, only the substantially smooth (in) wall N ₉ of the opening K ₉₁ of the structural member 11f, it is arranged while being contacted with substantially smooth outer circumferential surface G ₉ of the enclosed sealing layer 6f Therefore, when the IC card is bent, the outer peripheral surface G ₉ is often peeled off (separated) from the wall surface N ₉ , or broken in the same layer 6 f, causing cracks, residual strain, and other problems.
Therefore, in this type of IC card, in use, some or all of the electronic components such A ₉ is or jump out from the base portion, bad connection of electronic components such A ₉ (hereinafter, simply referred to as "popping, etc.". ) May occur.

In order to prevent such "jumping out" or the like, (a) a reinforcing member H ₁ (H ₂ ) provided so as to project in the outer peripheral direction as shown in FIGS. 11 and (b) 12 is provided. An IC card having the IC module M ₁ (M ₂ ) included therein embedded in the base portion 9g (9h) (JP-A-62-27195), (c) “IC module mounting hole J ₃ as shown in FIG. The mounting hole J of the base portion 9m formed by penetrating
_The IC module M ₃ is built in ₃ , and the same mounting hole J ₃
A portable electronic device [IC card] in which reinforcing members H ₃ and H ₄ are arranged in both openings to sandwich the IC module M ₃ and these reinforcing members H ₃ and H ₄ are integrally connected by a connecting member R (Japanese Patent Application Laid-Open No. 61-204788)]], (d) "A hollow portion T is provided in the IC module M ₄ embedded in the base portion 9n as shown in FIG. the only tape carrier material L that is, connect the IC chip a _15, supporting, the same chip a ₁₅ I
C module M ₄ IC module disposed in the hollow state inside (JP 63-183892 JP) "M ₄ and the like have been proposed.

[0006]

[Problems to be Solved by the Invention]
The IC cards and IC modules shown in (a) to (d) are mainly intended for contact type IC cards, and cannot be manufactured inexpensively and efficiently for the following reasons. However, it cannot be said that the effect of preventing the above-mentioned "jumping out" is sufficient.

That is, the IC card as shown in the above (a) and (b) generally houses (mounts) predetermined electronic parts,
Moreover, after the IC module M ₁ (M ₂ ) having the reinforcing body H ₁ (H ₂ ) protruding in the outer peripheral direction is prepared in advance, (e) the module M ₁ is already prepared as shown in FIG. The assembled base portion (center cores 91g, 9g in the figure)
2 g and the upper oversheet 93 g are attached to each other) and are inserted into the module embedding hole J ₁ of 9 g,
(f) around the module M ₁ (M _2), partially to the corresponding insertion hole of the outer shape, such as the module M ₁ center core provided with the (opening) 91g (91h), 92g ( 92
h) and over sheet 93g (93h), 94g (9
4h) are individually arranged, the base portion 9g (9h) is completed, and the module M is inserted into the base material 9g (9h).
It is produced by a method of arranging ₁ (M ₂ ).

In this case, the IC module M
_It takes time and effort to manufacture ₁ (M ₂ ).
Refer to the specific example of the manufacturing method shown in "2-27195 gazette". Although it takes time to manufacture a normal module,
In the above (a) and (b), since the reinforcing members H ₁ and H ₂ are arranged, more labor is required. ), It is difficult to match the outer shape of the module M ₁ (M ₂ ) and the shape of the embedding hole J ₁ (or the shape of the center cores 91g, 91h, etc.) with high accuracy. In particular, when it is necessary to mount a plurality of electronic components such the IC card of each piece (if you need to mount a large number of the modules M _1, M ₂₎ has a plurality of modules M ₁ (M ₂₎ Since it is necessary to match the outer shape of the above and the shapes of the plurality of embedding holes J ₁ etc. at one time, the difficulty is further increased.

Further, in recent years, in the production of the IC card, the base portion 9g (9
h), after laminating a large number of film bases having a length and width of several pieces of the final product (or slightly larger than that) to form a film laminate for a base part,
It is often produced by cutting this into individual pieces. In this case, since a large “warpage” occurs in the same laminated body or the amount of the above “warpage” is often different for each divided piece, the outer shape of the module M ₁ (M ₂ ) It becomes more difficult to match the shapes of the buried hole J _{1 and the} like.

On the other hand, since it is difficult to fit the module M ₁ (M ₂ ) and the embedding hole J _{1 and the} like with high precision, a predetermined clearance is set between them and a predetermined adhesive is used. Placement and filling are also generally performed, but it is difficult to control the amount of adhesive (particularly around the reinforcing members H ₁ and H ₂ ), and the IC card is manufactured by adding such a troublesome process. It may cause a decrease in efficiency. Therefore, the IC cards of the above (a) and (b) are time-consuming and costly to manufacture, and easily form a gap between the module M ₁ (M ₂ ) and the embedding hole J _1, etc. ₁ location of (H _2), size, depending on the shape or the like module M ₁ (M ₂₎
Is more likely to pop out than the base portion 9g (9h) (for example,
In the case shown in FIG. 11, the module M ₁ is likely to be detached downward. )become.

Further, the above-mentioned (c) portable electronic device (IC card) has a complicated structure and requires the manufacturing work of the module M ₃ which requires the labor and cost as in the above (a) and (b). Becomes In particular, if the module shape is complicated or the number of modules to be placed in one IC card is large, the manufacturing labor and cost will increase as in the case of the IC cards of (a) and (b) above. Become. Furthermore, the IC shown in (d) above
Since the structure of the module M _{4 is} also complicated, it is particularly troublesome to manufacture the module M ₄ itself, and only the tape carrier material L arranged in the hollow portion T is used.
Since the C chip A ₁₅ is connected and supported, there is a risk that the IC chip A ₁₅ will be separated from the tape carrier material L due to vibration when the IC card is bent. Therefore, in order to use it for an IC card (for example, a bank cash card) that is used continuously for a long period of time,
Some problems remain in terms of reliability.

As described above, an IC card (particularly, a non-contact type IC card) which can be manufactured efficiently and inexpensively without increasing manufacturing labor and is less likely to cause problems such as popping out of the above electronic components. In addition, the manufacturing method of such an IC card has not been proposed yet.

The present invention has been made in view of the above viewpoints, satisfies the required performance of a conventional IC card, and is less likely to cause problems such as popping-out of electronic parts.
It is an object of the present invention to provide a non-contact type IC card which can be manufactured at low cost and efficiently, and a method of manufacturing such an IC card.

[0014]

Non-contact type I of the first invention of the present invention
The C card (hereinafter, referred to as “IC card”) has one or more electronic component attachment parts (hereinafter, “attachment parts”) on the upper surface side.
Say. ), And has one or more openings from the upper surface side to the lower surface side provided corresponding to each of the attachment sites on the upper surface side of the circuit board made of a polyester resin film. In addition, two or more structural members composed of a polyester resin film are laminated and arranged while allowing the openings corresponding to each attachment site to communicate with each other to form one or more communication holes. Further, after mounting the predetermined electronic components on the respective attachment parts, the resin-based encapsulant is filled in the respective communication holes to perform resin encapsulation, and then the lower surface side of the circuit board and the A non-contact type IC card manufactured by arranging at least a predetermined skin material on the upper surface side of the uppermost one of the structural members, the same in at least one of the communication holes. A communication hole in each opening forming the communication hole At least one of different openings of the overall length and shape of the other opening portion and the peripheral lines forming 1
One or more openings are provided in each of the structural members so that a step is provided on a part of the inner wall of the communication hole, and at least one opening is provided in each of the communication holes. The resin-based encapsulant forms a resin encapsulation layer having an outer peripheral surface in a state of being in close contact with the wall surface of each communication hole.

The number of the structural members to be laminated and arranged is not particularly limited as long as it is two or more, and the thickness of each structural member can be variously selected. However, due to a request for the specifications of the IC card that will be the final product [for example, a request for generalization (a request to use a common one in a wide range of domestic and overseas)],
Restrictions on the size of the card [For example, International Standards Organization (In
ternational Organization for Standardization: IS
O) defined standard (length: 85 mm = 3.37)
0 inch, width; 53 mm = 2.125 inch, thickness;
0.76 mm = 0.030 inch)], the number of the structural members is within the range of the restriction while considering the correlation with the thicknesses of the circuit board and the skin material. And it is preferable to determine the thickness of each structural member.

Further, since the IC card of the present invention is a non-contact type, the total thickness of the structural members (hereinafter referred to as "structural member laminated body") arranged in layers is not limited to each structural member and its table. It is preferable that the electronic components mounted on the circuit board can be almost completely hidden by an adhesive layer (used for bonding with the circuit board, the skin material, etc.) arranged on the back surface. The shape of each "opening" (the shape of the outer peripheral line) is not particularly limited, and may be circular or elliptical.
It may be a polygon such as a triangle, a quadrangle, or a pentagon. Further, it is not necessary that all the openings communicating with each other have the same shape (congruent shape, similar shape), and that the shapes of two or more openings provided in the same structural member are all the same. Absent.

In addition, in the case where the above-mentioned "at least one of the entire length and the shape of the outer peripheral line is different", for example, (1) the center points of the openings forming the predetermined communication holes are substantially on the same straight line (structural member laminated body). Are arranged on the same straight line in the thickness direction of the above, and the outer circumferences of the predetermined openings and the outer circumferences of the other openings have different total lengths (for example, the respective outer circumferences are substantially similar). ), The outer peripheral line of one opening is arranged within the outer peripheral line of the other opening (when the IC card is looked into from above or below, one outer peripheral line fits into the other outer peripheral line). Case) (see FIG. 3, which is an aspect of the second invention). Further, (2) even when the shapes of the respective outer peripheral lines are different and one outer peripheral line is arranged within the other outer peripheral line (see FIG. 4; this is also an aspect of the second invention). (3) The shape of each outer peripheral line may be different, and one outer peripheral line and the other outer peripheral line may intersect at several points (see FIG. 5).

Further, as described above, the openings (hereinafter, referred to as "discontinuous openings") having different lengths of the outer peripheral line and the like are arranged in (4) all the communication holes formed in the structural member laminate. (5) In particular, (5) it may be arranged only in the communication hole in which electronic parts having a shape that easily causes “jumping out” are stored. Further, (6) in each communication hole, all of the openings forming the same may be such discontinuous openings, or (7) between openings having the same overall length and shape of the outer peripheral line. In addition, such discontinuous openings may be sandwiched. In particular, as shown in the third aspect of the present invention, each outer peripheral line of each opening has substantially the same shape, and the total length of the outer peripheral line is large or small along the thickness direction of the structural member laminate, or in the order of small and large. In this case, a large number of flange-shaped steps can be present in each communication hole, and the above-mentioned "jumping out" can be more reliably prevented.

As described above, "circuit board" and "structural member"
"Made of polyester resin" means that the resin is a low-priced and flexible dielectric material compared to other resin materials such as polyimide, and that it is easy to emboss etc. and has an appropriate heat resistance. This is because it does not easily soften due to heat applied during mounting of electronic components. The "polyester resin" is meant to include polyester raw materials to which a predetermined plasticizer, stabilizer and the like are added.

The type of the "resin-based encapsulant" described above has a suitable fluidity and is a "resin-encapsulated material" having an outer peripheral surface shape that fits the wall shape (especially, the step portion) of each communication hole. There is no particular limitation as long as it can form a “layer”. The "resin system" is not limited to a resin such as an epoxy resin alone, but includes a sealing material formed by adding a predetermined additive to a resin such as a slurry made of ferrite particles and a soft epoxy resin. I mean However, as a resin or the like for sealing electronic components such as a semiconductor chip which is weak against impact, one having higher rigidity than the polyester resin constituting each structural member (for example, the above epoxy resin or the like) is used, and an IC card is used. It is preferable to protect the semiconductor chip and the like from the impact when the device is bent. On the other hand, in the case of sealing electronic parts such as wire coils that can appropriately cope with bending of the IC card, it is not always necessary to use such a resin having high rigidity.

Further, a predetermined label sheet (skin material layer) is arranged on each of the front and back surfaces of the IC card (the lower surface side of the circuit board and the upper surface side of the structural member layer body) to make a final product. Is common. In this case, if the label sheets on both the front and back sides are made to have the same material, thickness, and the like so as to match the thermal expansion characteristics between the two sheets, the "warpage" is unlikely to occur in the IC card. The purpose can be achieved more reliably. As the skin material, it is preferable to use a sheet (for example, PVC) made of a thermoplastic resin.

The above-mentioned "circuit board" and "structural member" are generally joined by using an adhesive or the like, and it is preferable to use a thermoplastic one as the adhesive. When a thermosetting adhesive is used, when the IC card is embossed, the adhesive layer may be cracked or peeled off, resulting in deterioration of the IC card performance. The shrinkage of the adhesive causes the IC card to warp easily.
On the other hand, when a thermoplastic adhesive is used, such a situation can be avoided and the adhered members (circuit board, structural member,
This is because it is possible to appropriately absorb the strain generated between the label sheets and the like and suppress the occurrence of warpage that may occur in each adherend member. It should be noted that it is preferable to use an ester adhesive or the like for adhering the polyester resin portions to each other.

Further, as shown in the fourth aspect of the present invention, the tensile strength of the polyester resin film forming each of the structural members is 200 kgf / mm ² or more than the tensile strength of the polyester resin film forming the circuit board. You can increase it. As a result, the IC card has a structure in which “sledding” does not easily occur (our application: Japanese Patent Application No. 5-35267).
(See No. 1), the production efficiency of the IC card can be made higher, and the above-mentioned "jumping out" can be prevented more reliably.

The method for providing the difference in the tensile strength of the films in this way is not particularly limited, but only the film constituting the circuit board is subjected to post-treatment such as heat treatment or irradiation of ultraviolet rays (structure When heat-treating a film that constitutes a member, it is effective to lower the tensile strength of the film that constitutes the circuit board by raising the heat-treatment temperature of the film or increasing the heat-treatment time). Is.
Generally, the thickness of the film used for the structural member (for example, about 350 μm) is thicker than the thickness of the film used for the circuit board (for example, about 125 to 127 μm). In this way, in a relatively thick film, generally, a relatively inexpensive film is inferior in performance such as tensile strength to a thin film, and a film having a performance equal to or higher than that of a thin film is generally used. Not a product, but expensive. Therefore, without using the above-mentioned post-treatment, etc., in the state where the film is still processed, the comparatively thick film used for the structural member is 200 kgf / mm thicker than the comparatively thin film used for the circuit board.
Providing a high tensile strength of mm ² or more is
This is because it is rather difficult and causes a high manufacturing cost of the IC card.

The conditions of the above-mentioned post-treatment can be variously selected in consideration of the thickness of the film to be treated, but in the case of heat treatment, it is generally 12 at a temperature of 150 ° C. or higher. It is preferable to carry out the treatment over a time period longer than that. For example, when a polyester resin film having a thickness of 125 μm is heat-treated at a temperature of 150 ° C. for 24 hours, the tensile strength can be reduced by about 10 to 20%. Further, in the case where each of the above polyester resin films is formed into a film by biaxial stretching or the like, it is subjected to a heat stabilization treatment to obtain a dimensional change amount in each direction including a longitudinal direction and a lateral direction (especially when heated). It is preferable to reduce the difference between Specifically, as shown in the fifth aspect of the present invention, the shrinkage ratio in the uninhibited state at 150 ° C. for 30 minutes is 0.
It is preferably less than 2%.

Further, as shown in the sixth aspect of the invention,
When the shrinkage rate in the non-inhibited state for 30 minutes is less than 0.1% in both the longitudinal direction and the lateral direction, the tensile strength of each polyester resin film forming the above-mentioned "structural member" and "circuit board" A sufficient effect can be obtained even if the difference is smaller than that of the fourth and fifth inventions (200 kgf / mm ² or less) or the tensile strengths of the polyester resin films are made equal.

However, the shrinkage ratio (less than 0.2% or less than 0.1%) in the present fifth and sixth inventions was determined under the above set conditions (150 ° C., non-inhibited state for 30 minutes). However, under different setting conditions, it is defined by different shrinkage rates. In the fourth to sixth inventions, it is preferable that the difference in shrinkage ratio between the stretching axes of the polyester resin films is less than 0.1%. Further, it is preferable that the difference in shrinkage ratio between the films constituting the “circuit board” and the “structural members” is also less than 0.1%.

As shown in the seventh aspect of the present invention, the outer shapes of the circuit board and the structural members are substantially rectangular, and the polyester resin films forming the circuit board and the structural members are formed. In the above, the axis of the predetermined orthogonal two axes having the larger tensile strength is made to substantially coincide with the longitudinal direction of the circuit board and the structural member, and the axis of the two axes having the smaller tensile strength is indicated. May be substantially aligned with the lateral direction of the circuit board and the structural member.

Most of the IC cards have a substantially rectangular planar shape, but in the present invention, the circuit board or the like, which is a main constituent member of such an IC card, is formed by the film as described above. By suppressing the "warpage" that may occur in the card, the object of the present invention can be achieved more reliably. In addition, as the above "biaxially orthogonal", when the polyester resin film is a biaxially stretched film, each stretching axis may be selected, or the above conditions are satisfied (tensile strength is different) and the like. It is also possible to select two axes.

Further, as shown in the eighth aspect of the present invention, mounting of predetermined electronic components on the respective attachment portions is performed on the lower surface side of the circuit board and the upper surface side of the structural member laminated on the uppermost part. Alternatively, it may be carried out without the adhesive, or as shown in the tenth aspect of the invention, it may be carried out with the adhesive on both sides. Further, as shown in the ninth aspect of the present invention, after the structural auxiliary member is arranged on the upper surface side of the structural member layer body, no adhesive is present on the lower surface side of the circuit board and the upper surface side of the structural auxiliary member. You may go in the state.

That is, in a normal IC card, electronic parts are mounted before the above skin material is bonded and arranged. At the stage of this mounting or the like, in the above eighth to tenth inventions,
The exposed surface of the circuit board and the uppermost structural member (structural auxiliary member) (that is, the surface on the side where the skin material such as the circuit board is arranged (hereinafter referred to as "skin material side surface")). It is intended to achieve the object of the present invention more surely by making an adhesive present or not in both of them. In the tenth aspect of the invention, it is particularly preferable that the adhesives arranged on the surface of each of the skin materials are the same or of the same kind, and the thicknesses thereof are substantially the same. Further, the adhesive arrangement of the "skin material" may be carried out only by the adhesive agent arranged on the surface of each skin material side, or by using this adhesive and another adhesive agent arranged on the skin material side. You may go.

The manufacturing method shown in the eleventh invention is the same as the first method.
The invention describes a method of manufacturing an IC card of the invention. still,
The method for laminating each member and the like in each of the above inventions is not limited to the commonly used hot pressing method, and other methods such as a laminating method using hot rolls may be used.

[0033]

In the IC card of the first aspect of the present invention, two or more structural members are laminated and arranged on the upper surface side of the circuit board, and after the electronic parts are mounted, the sealing step and further the skin material arranging step are performed. It is manufactured through the process. That is, it is not intended to pre-assemble an IC module containing electronic components therein and then mount the IC module on a base portion made of the above-mentioned circuit board, structural members, or complete the base portion around the IC module. For this reason, it is not necessary to manufacture the IC module alone, which is time-consuming and costly, and work for adjusting the outer shape of the IC module and the shape of the embedded hole or the like in which the IC module is housed is also unnecessary.

Further, in the two or more structural members, the openings corresponding to the respective attachment portions provided on the circuit board are communicated with each other to form one or more communication holes. At this time, in at least one of the communication holes, an opening having at least one of the entire length and the shape of the outer peripheral line different from the other openings forming the communication hole in the respective openings forming the communication hole. One or more of them are provided so that a step is provided on a part of the inner wall of the communication hole. Then, in order to arrange such a discontinuous opening, the total length and shape of the outer peripheral line of a predetermined opening provided in at least one of the structural members to be stacked are adjusted (for example, the same). A relatively simple operation such as changing the size and shape of the blade for punching the opening is sufficient. Therefore, there is almost no extra labor and cost in forming the step.

In addition to this, the sealing material filled in each of the communication holes is a resin type material having excellent fluidity. Therefore, this sealing material is present in the inner wall portion of the at least one communication hole (existing in the boundary portion of each wall surface of each opening portion) even if the step is slightly large or the shape is slightly complicated. , Firmly adheres to the inner wall of the same communication hole with almost no gap. As described above, in the present invention, it is easy to provide steps of various shapes and sizes in the communication hole, and
It is possible to provide a resin sealing layer (a layer formed by curing the sealing material) that is firmly adhered to each communication hole including the step.

Therefore, by bending the IC card, etc.
It is possible to suppress the resin sealing layer from being separated from the communication holes together with the electronic components by the locking action of the step.
The upper side of this sealing layer (the upper side of the structural member laminate)
Therefore, even if a fold, a crack, or the like progresses, it is possible to prevent the step from reaching below the step due to the action of the step. Furthermore, the ability to prevent this detachment, breakage, cracks, etc.
It can be easily controlled by the shape, size and number of the steps. Further, since the resin-based sealing material as described above is used, it is possible to positively form the communication hole having a slightly complicated shape and a large step, and it is possible to expand the degree of freedom in the design of the IC card.

In the IC card of the second aspect of the present invention, the outer peripheral line of the opening having at least one of the entire length and the shape of the outer peripheral line is arranged inside or outside the outer peripheral line of the other opening. The IC card of the present invention is one aspect of the first invention described above. For example, the center points of the openings forming the predetermined communication holes are made to substantially coincide with each other, and the respective outer peripheral lines are made similar to each other. It can be produced by In the present invention, since the step portion has a brim shape, the resin sealing layer can be locked substantially uniformly along the outer peripheral surface thereof.

In the third aspect of the invention, in at least one of the communication holes, the outer peripheral lines of the openings forming the respective communication holes have substantially the same shape, and the total length of each outer peripheral line is the same. Are arranged in the order of size along the thickness direction of the structural members arranged in layers. In the present invention, since two or more collar-shaped portions are arranged on the inner wall of the communication hole, it is possible to more reliably prevent the above-mentioned "pop-out" or the like.

In the fourth aspect of the present invention, the tensile strength of the polyester resin film forming each of the structural members is set to be 200 kgf / mm ² or more higher than the tensile strength of the polyester resin film forming the circuit board.
As a result, a structural member having high strength and a large thickness, even if thermal expansion or contraction occurs in each component due to a temperature change or the like due to a mounting process of electronic components or a change in use environment,
Since it is possible to suppress a large warpage in the entire IC card, the manufacturing efficiency of the IC card is further improved, and
It is possible to more reliably prevent the above-mentioned “jumping out”. In particular, when the “circuit board” or the like is formed of a biaxially stretched film having a small deformation amount (shrinkage ratio in each stretching axis direction) as in the fifth aspect of the invention, it is difficult to deform each film itself. Together with this, it is possible to more effectively suppress the occurrence of the “warpage”.

When a film which is more difficult to be deformed (shrinkage rate of half or less of the fifth invention) is used as in the sixth invention, the tensile strength of the film constituting the structural member is increased. The difference between the tensile strengths of the two films can be freely selected within a range that does not become smaller than the tensile strength of the film forming the film, and thus the object of the present invention can be achieved more effectively.

Further, in the seventh invention, a circuit board having a substantially rectangular outer shape in plan view, a structural member having the same plane shape, and polyester resin films constituting the same are provided with predetermined biaxial axes. The axis indicating the direction of high tensile strength is substantially aligned with the longitudinal direction of the circuit board and the structural member, and the axis indicating the direction of low tensile strength is substantially aligned with the lateral direction of the circuit board or the like.

As a result, in the IC card of the present invention, the axial line extending in the longitudinal direction is difficult to bend (warp), and the axial line extending in the lateral direction is easy to bend (warp). Therefore, in the IC card having a substantially rectangular plane shape according to the present invention, even if a warp that bends an axis line extending in the long direction of the line length is generated, I
Does not give a large deformation to the entire C card (same in the diagonal direction of the IC card, etc.). On the other hand, the axis line extending in the lateral direction bends more than the axis line extending in the longitudinal direction (per predetermined unit length), but due to the shortness of the line length,
Does not give large deformation to the entire IC card. Therefore, according to the present invention, a large warp that causes a trouble in use is not generated in the entire IC card, and the object of the present invention can be more effectively achieved.

In the IC card of the eighth aspect of the present invention, electronic components are mounted in a state where no adhesive is placed on the lower surface side of the circuit board and the upper surface side of the structural member laminate. Further, in the IC card of the ninth invention, on the upper surface side of the structural member laminate,
After arranging the structural auxiliary member, the same mounting is performed in a state where no adhesive is present on the lower surface side of the circuit board and the upper surface side of the structural auxiliary member. That is, in these IC cards, the surface side of the circuit board and the structural member laminate (structural auxiliary member) on the skin material side is
Higher hygroscopicity than each film that composes the same circuit board,
In addition, the electronic components are mounted in a state where there is no adhesive that particularly affects the shape change of those films. Therefore, even if a certain amount of heat is applied during this mounting step, a large "warpage" that would cause trouble in use in the IC card is not generated, and the object of the present invention can be achieved more effectively.

In the IC card of the tenth aspect of the present invention, the above-mentioned mounting is performed with the adhesive placed on the lower surface side of the circuit board and the upper surface side of the structural member laminate. That is, in the present invention, the adhesive is arranged in a substantially symmetrical position with the jointed article composed of the circuit board and the structural member laminate sandwiched therebetween. Therefore, even if these adhesives behave individually to change the shape of the same joint on the upper and lower surfaces of the same joint, one behavior is canceled by the other behavior (for example, structural member lamination). Even if the adhesive on the upper surface of the body acts to pull the member in the longitudinal direction, the adhesive on the lower surface of the circuit board also acts to pull the circuit board in the longitudinal direction. Does not occur
Even if it occurs, it will be smaller. ), Since the IC card does not cause a large "warpage" which may cause trouble in use, the object of the present invention can be achieved more effectively.

[0045]

EXAMPLES The present invention will be specifically described below with reference to examples. A. Example 1 As shown in FIG. 1, the IC card of this example has a circuit board 21.
A structural member laminated body 1 joined to the upper surface side thereof, a cover sheet 41 arranged at a predetermined portion on the upper surface side thereof, label sheets 51 and 52 constituting both surface layer portions,
Is equipped with.

The circuit board 21 is made of commercially available polyester resin (trade name "Lumirror"), and is composed of a film (85 mm × 53 mm × 175 μm) having a substantially rectangular planar shape. On the upper surface side of the circuit board 21, a predetermined amount (amount capable of forming the adhesive layer 34 in the final product) of an ester-based thermoplastic adhesive (trade name “A412”, manufactured by Scheldar Co.) was used. Predetermined conductive patterns d ₁ and d ₂ formed by etching after bonding the foils
And so on. The conductive patterns d ₁ , d ₂ , etc. are plated with gold or the like for the purpose of improving corrosion resistance. Further, on the circuit board 21, other electronic parts (not shown) such as a capacitor for transmitting data are arranged.

The structural member laminated body 1 is made of the same polyester resin as the circuit board 2 and is made of a film (85 mm × 53 mm × 160 μm) having a substantially rectangular planar shape. The second structural member 12 made of a substantially similar film is laminated. As shown in FIGS. 1 to 3, each of these structural members 11 and 12 is for accommodating electronic components mounted on the circuit board 21,
Four openings K ₁₁ , K _{12 and the} like extending from the upper surface side to the lower surface side are punched out. And both structural members 11,
When 12 are overlapped, the openings (adjacent openings such as K ₁₁ and K ₁₂ ) arranged at the positions corresponding to each other of the respective members 11 and 12 communicate with each other to form four sets of communication holes K _{1 and the} like. (In the same figure, one set of K ₁ is shown.), And at the boundary of both openings K ₁₁ , K _12, etc., a substantially collar-shaped step D _{1 is formed.}
And so on.

The outer peripheral lines of the openings K ₁₁ and K ₁₂ shown here are both substantially squares as shown in FIG. 3A, but the first structural member 11 arranged on the lower side has a substantially square shape. Opening K ₁₁
(One side: 10 mm, total length: 40 mm) is the opening K ₁₂ of the second structural member 12 arranged on the upper side (one side; 8 m)
m, total length; 32 mm). Therefore, if the communication hole K ₁ is observed from above,
The outer circumference of the latter opening K _{12 is set within} the outer circumference of the former opening K ₁₁ . The shape of the outer peripheral line of each opening is not particularly limited, and as shown in FIG.
Other shapes such as a circular shape may be used. Further, as shown in FIGS. 4A and 4B, etc., the shapes of both outer peripheral lines do not necessarily have to be the same (similar shapes). Further, as shown in (a) and (b) of FIG. 5, both outer peripheral lines intersect at several points, and one outer peripheral line fits inside the other outer peripheral line and outside the other outer peripheral line. The protruding portion may be mixed.

[0049] In this embodiment, each opening constituting another communication hole (not shown) in FIGS. 1-3 also, the opening K _11, K
_The same shape as ₁₂ (however, the total length of the peripheral line (size of the opening) is changed according to the size of the electronic components to be stored. ], And a positional relationship [a positional relationship in which the outer peripheral line of the opening of the second structural member shown in FIG. 3 (a) is inside the outer peripheral line of the first structural member]. However, as shown in the present embodiment, it is not necessary that the four sets of communication holes K ₁ and the like have the outer peripheral lines of the same shape and that the openings have the same positional relationship. In addition, at least one of the other communication holes (not shown) may not have the above-mentioned step. Further, the number of the communication holes K _{1 and the} like formed in the structural member laminate 1 is not particularly limited as long as it is one or more.

The cover sheet 41 and the like have the communication holes K.
_{1 and the} like can be substantially hidden from the upper side, and is made of a prepreg made of a cloth (thickness: 35 μm) impregnated with a partially cured epoxy resin. The label sheets 51 and 52 are both polyvinyl chloride sheets (85 mm × 53 mm × 25 μm). If the thickness of these label sheets 51 etc. is increased, IC
It is possible to more securely protect electronic components and the like arranged in the card from electrostatic discharge and dirt on the outside. In this case, the thickness of each of the structural members 11 and 21 is adjusted, Generally, the thickness of the entire IC card is set to the ISO standard.

The lower surface side of the circuit board 21 and the upper surface side of the second structural member 12, which are joint surfaces with the label sheets 51 and the like, are sand-matted. This is because the surface of the polyester resin film that constitutes the circuit board 1 and the like is very smooth, so that the surface to be joined with each label sheet 32 and the like is provided with irregularities as appropriate to improve the adhesion. . However, in the IC card of the present embodiment, such a treatment is not necessarily required because the resin encapsulant described later cures while sufficiently adhering to the lower surface side of the label sheet 51 and the like.

Then, the IC card configured as described above was manufactured as follows. First, in each case, a circuit board film (12) having a width and a length slightly larger than those in which 6 pieces of IC cards are arranged (however, 2 rows × 3 columns)
0 mm x 275 mm x 125 µm), a film for the first structural member (125 mm x 305 mm x 160 µm),
Film for the second structural member (125 mm x 305 mm x 1
60 μm) and two label sheet films (125 mm × 305 mm × 25 μm) were prepared.

However, the conductive patterns d have already been formed in the portions of the circuit board film corresponding to the six circuit boards 21.
₁ and d ₂ are formed respectively. On the other hand, a predetermined amount of the same ester-based thermoplastic adhesive as described above is formed on both surfaces of the film for the first structural member and the upper surface side of the second structural member (the adhesive layers 35, 36 and 33 are formed in the final product). The openings K ₁₁ and K ₁₂ are already formed in the portions corresponding to the six structural members 11 and 12 of the first and second structural member films. In this embodiment, several pieces (six pieces) of the final product, such as a film for a circuit board, are used in order to improve production efficiency. May be used.

Next, the lower surface side of the film for the first structural member is superposed on the upper surface side of the film for the first structural member, and further the film for the first structural member is superposed with the film for the circuit board. The lower surface side of the second structural member film was superposed on the upper surface side. Then, hot pressing (80 ° C., 40 kgf / cm ² ) was applied to these for about 10 minutes and then cooled to obtain a laminate.

Then, electronic components were mounted in the communication holes K _{1 and the} like existing on the upper surface side of this laminated body according to a conventional method, and other operations such as wire bonding were performed as necessary. Further, the inside of each of the communication holes K _{1 and the} like was filled with a slurry composed of ferrite particles and a soft epoxy resin. However, instead of the same slurry, the structural member 11 after curing is used.
You may fill with the epoxy resin whose hardness becomes higher than the polyester resin which comprises. Further, different communication materials (each piece) may be filled with different resin sealing materials. Then, these resin encapsulants form a resin encapsulation layer (encapsulant layer) 6 or the like for encapsulating the electronic components in the communication holes K _{1 and the} like after curing.

Next, the cover sheet 41 and the like were placed at predetermined positions surrounding the communication hole K _{1 and the} like. Furthermore,
On the lower surface of the label sheet film for forming the label sheet 51, a predetermined amount of the same adhesive as described above (amount capable of forming the adhesive layer 31 in the final product) is applied, and then, on the upper surface side of the laminate. I placed it. In addition, after applying a predetermined amount (amount capable of forming the adhesive layer 32 in the final product) of the same adhesive on the upper surface of the label sheet film for forming the label sheet 52, the same is applied to the lower surface side of the laminate. I placed it. And hot press (150 ℃,
40 kgf / cm ² ) was applied for about 10 minutes, followed by cooling.

Next, printing and punching of desired characters, numbers (for example, "bank name" when used as a cash card, etc.) etc. for each part of the surface of each label sheet film corresponding to each piece of the final product. Then, an IC card array plate having 6 pieces of IC cards was prepared. Then, this array plate is cut into pieces one by one according to a conventional method to manufacture the IC card of this embodiment. still,
This IC card is a standard defined by ISO (85 mm x 5
3 mm × 0.76 mm), and the adhesive layer 5 for adhering the structural member laminated body 1 and the circuit board 2 together.
The sum of the thicknesses of 2 is 450 μm.

In the IC card described above, it is not necessary to manufacture the IC module as a single unit, which is time-consuming and costly, and the outer shape of the IC module is matched with the shape of the embedding hole or the like in which the IC module is stored. This eliminates the need for troublesome work such as In addition, each structural member 1
A flange-shaped step D ₁ is provided on the inner wall of the communication hole K ₁ or the like by a simple operation of appropriately adjusting the sizes (total length of the outer circumference) of the openings K ₁₁ and K _{12 and the} like provided in 1 and 12. be able to. Further, the fluidity of the sealing material filled in each communication hole is excellent, and it is easy to change the shape according to various inner wall shapes of each communication hole K _{1 and the} like. Therefore, each communication hole K ₁ Regardless of whether or not there is a step D _{1 in} the inside, etc., the sealing layer 6 having the outer peripheral surface shape matching the inner walls of these is formed. Therefore, there is almost no gap between the inner wall of each communication hole K ₁ and the outer peripheral surface of the sealing material layer 6.

Therefore, even if the IC card is bent or the like, it is possible to prevent the "pop-out" or the like from occurring due to the action of firmly locking the sealing material layer 6 such as the step D ₁ . In addition, even if a fold, a crack or the like progresses from the upper side of the sealing layer 6 (the upper side of the structural member laminate),
Since the upper opening K ₁₂ is larger than the lower opening K ₁₁ , folds, cracks and the like are unlikely to progress to the wall surface side of the lower opening K ₁₁ (the lower opening K 11). _This is because even if it advances into the inside ₁₁ , it concentrates exclusively on the central portion.) Therefore, the encapsulating material layer 6 in the opening K ₁₁ in which the electronic parts are housed does not have a large break or crack. .

As a modification of this embodiment, an IC card shown in FIG. 6 can be cited. This IC card
Contrary to Example 1 described above, the length of the outer peripheral line of the opening K ₂₂ provided in the second structural member 12a is smaller than the length of the outer peripheral line of the opening K ₂₁ provided in the first structural member 11a. It is a big one. In this case, it is possible sufficiently exhibit the effect of preventing the "jumping out or the like", the part existing in the opening K ₂₂ of the sealing layer 6a, a large bending like covers its entire, cracks and the like Even if it occurs, the step portion D ₂ provided at the boundary with the first structural member 11a can substantially hold it.

B. Example 2 The IC card shown in this example is as shown in FIG. 7, and the first structural member 11b and the second structural member 11b similar to those in Example 1 are used.
A third structural member 13b similar to the first structural member 11b is further arranged on the structural member 12b (however, the thickness is 100 μm). In the IC card of the present embodiment, two brim-shaped steps D ₃ and D ₄ are continuously arranged in one communication hole K ₃ (the total length of the outer peripheral line of the opening is larger than that on the upper side). Since it is in the order of small and large), it is possible to further prevent the above-mentioned "jumping out".

As a modified example of this embodiment, an IC card as shown in FIG. 8 can be exemplified. In this IC card, the same first structural member 11c and second structural member 12c as those in the modification of the first embodiment (however, the thickness is 100 μm
m. ) Is further provided with a third structural member 13c similar to the first structural member 11c. Also in this case, two brim-shaped steps D ₅ and D ₆ are continuously arranged in one communication hole K ₄ (the total length of the outer peripheral line of the opening is smaller, larger, and smaller than the upper side). Therefore, it is possible to more reliably perform the action of substantially holding down the folds and cracks described in the modified example of the first embodiment.

The present invention is not limited to the specific examples described above, and various modifications may be made within the scope of the present invention depending on the purpose and application. That is,
In Examples 1 and 2 (also in these modifications), the structural member laminate has a two-layer or three-layer structure, but it may be composed of a structural member having four or more layers. Further, the tensile strength of the film forming each of the structural members is made larger than the tensile strength of the film forming the circuit board (corresponding to the fourth to seventh inventions), the lower surface side of the circuit board and the structure. By performing a mounting step (corresponding to the eighth to tenth aspects of the present invention) in a state where no adhesive is arranged on the upper surface side of the member laminated body, etc., the "amount of warpage" of the IC card itself
By reducing the value, it becomes easier and more efficient to manufacture the IC card, and it is possible to more reliably prevent the above-mentioned "jumping out".

[0064]

The IC card of the present invention is less likely to cause problems such as popping-out of electronic parts, and can be manufactured inexpensively and efficiently. Further, according to the manufacturing method of the eleventh invention, such an IC card can be manufactured inexpensively and efficiently.

[Brief description of drawings]

FIG. 1 is a partial cutaway view of an IC card according to a first embodiment.

FIG. 2 is an IC card of Example 1 (however, a skin material is omitted)
FIG.

FIG. 3A is a partial plan view for explaining the positional relationship of each opening in the IC card of the first embodiment, and FIG. 3B is a partial plan view showing a modification thereof ((b)). Is.

FIG. 4 is a partial plan view showing a modification of the positional relationship of the openings shown in FIG. 3 (a).

5 is a partial plan view showing a modification of the positional relationship of the openings shown in FIG. 3 (a).

FIG. 6 is an IC card according to a modification of the first embodiment (however,
It is a partial longitudinal cross-sectional view of a skin material).

FIG. 7 is an IC card of Example 2 (however, a skin material is omitted)
FIG.

FIG. 8 is an IC card according to a modified example of the second embodiment (however,
It is a partial longitudinal cross-sectional view of a skin material).

FIG. 9 is a partial cutaway view of a conventional IC card.

FIG. 10 IC card of a conventional example (however, a skin material is omitted)
FIG.

FIG. 11 is a conventional IC card (however, the skin material is omitted)
FIG.

FIG. 12 is an IC card of a conventional example (however, a skin material is omitted)
FIG.

FIG. 13 is a conventional IC card (however, the skin material is omitted)
FIG. 6 is a partial vertical cross-sectional view for explaining the manufacturing process of FIG.

FIG. 14 is an IC card of a conventional example (however, a skin material is omitted)
FIG.

FIG. 15 is a conventional IC card (however, the skin material is omitted)
FIG.

[Explanation of symbols]

1; Structural member laminate, 11; First structural member, 12; Second
Structural member, 13a; Third structural member, 21; Circuit board, 31
~ 36; adhesive layer, 41; cover sheets, 51, 52;
Label sheet (skin material), 6; resin sealing layer, K ₁₁ ,
K ₁₂ , K ₂₁ , K ₂₂ ; openings, K _{1 to} K ₄ ; communication holes, D ₁
~ D ₆ ; step.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01L 23/28 Z 8617-4M H05K 1/18 S 8718-4E

Claims (11)

[Claims] 1. An electronic component attachment portion is provided on the upper surface side, and each electronic component attachment portion is provided on the upper surface side of a circuit board made of a polyester resin film. Two or more structural members having one or more openings provided from the upper surface side to the lower surface side and made of a polyester resin film are provided for each electronic component attachment site. Connect each opening to
One or more communication holes are stacked and arranged, and further, after mounting the predetermined electronic components on the electronic component attachment sites, each of the communication holes is filled with a resin-based encapsulant to form a resin. A non-contact type IC card manufactured by sealing and then disposing at least a predetermined skin material on the lower surface side of the circuit board and the upper surface side of the uppermost one of the structural members. Then, in at least one of the communication holes, an opening having at least one of the entire length and shape of the outer peripheral line different from the other openings forming the communication hole in the respective openings forming the communication hole. One or more of the openings are provided in each of the structural members so that a step is provided on a part of the inner wall of the communication hole, and at least one opening is provided in each of the communication holes. The resin-based encapsulant is in close contact with the wall surface of each communication hole. Contactless IC card, characterized by forming the resin sealing layer having an outer peripheral surface of the state. 2. The non-contact type IC card according to claim 1, wherein the outer peripheral line of the opening having at least one of the entire length and the shape of the outer peripheral line is arranged inside or outside the outer peripheral line of the other opening. . 3. In at least one of the communicating holes, the outer peripheral lines of the openings forming the respective communicating holes have substantially the same shape, and the entire length of the outer peripheral lines is arranged in the laminated manner. The non-contact type IC card according to claim 1, wherein the structure members are arranged in the order of size along the thickness direction of each structural member, or in order of size. 4. The tensile strength of the polyester resin film forming each of the structural members is 2 more than the tensile strength of the polyester resin film forming the circuit board.
The non-contact type IC card according to claim 1, wherein the non-contact type IC card is larger than 00 kgf / cm ² . 5. The polyester resin films constituting the circuit board and the structural members are formed in one direction in each stretching axis direction.
Shrinkage rate of 0.2 at 50 ° C. for 30 minutes is 0.2
The non-contact type IC card according to any one of claims 1 to 4, wherein the non-contact type IC card is a film made of a biaxially stretched polyester resin of less than 10%. 6. The tensile strength of the polyester resin film forming each of the structural members is equal to or more than the tensile strength of the polyester resin film forming of the circuit board, and the circuit board and each of the structural members are arranged. Each of the polyester resin films constituting the film is a biaxially stretched polyester resin film having a shrinkage rate of less than 0.1% in a non-inhibited state at 150 ° C. for 30 minutes in each stretching axis direction. Non-contact type IC card. 7. The circuit board and the structural members have a substantially rectangular outer shape in plan view, and in each polyester resin film forming the circuit board and the structural members, a predetermined biaxial The axis indicating the direction of greater tensile strength is substantially aligned with the longitudinal direction of the circuit board and the structural member, and the axis indicating the direction of smaller tensile strength of the two axes is the circuit board and the structural member. 7. The non-contact type I according to claim 1, wherein the non-contact type I is made to substantially coincide with the lateral direction.
C card. 8. A state in which no adhesive is present on the lower surface side of the circuit board and the upper surface side of the structural member laminated on the uppermost part of the predetermined electronic parts to be mounted on the respective electronic parts attaching portions. 8. The non-contact type IC card according to claim 1, which is performed. 9. A structure auxiliary member is arranged on the upper surface side of the structural member laminated on the uppermost part, and then predetermined electronic components are mounted on the respective electronic component attaching portions of the circuit board. 8. The non-contact type IC card according to claim 1, wherein the non-contact type IC card is formed in a state where no adhesive is present on the lower surface side and the upper surface side of the structure auxiliary member. 10. Adhesives are mounted on the lower surface side of the circuit board and the upper surface side of the structural member laminated on the uppermost part to mount predetermined electronic components on the respective electronic component attachment sites. The non-contact type IC card according to claim 1, which is performed in a state. 11. An electronic component attachment site is provided on the upper surface side and corresponds to each electronic component attachment site on the upper surface side of a circuit board made of a polyester resin film. Two or more structural members having one or more openings provided from the upper surface side to the lower surface side and made of a polyester resin film are provided for each electronic component attachment site. The respective opening portions are communicated with each other so as to form one or more communication holes, and are stacked and arranged. Further, after mounting the predetermined electronic components on the electronic component attachment portions, the communication holes are formed in the communication holes. Is filled with a resin-based encapsulant to seal the resin, and then at least a predetermined skin material is placed on the lower surface side of the circuit board and the upper surface side of the uppermost one of the structural members. And a non-contact type IC card manufacturing method. In at least one of the communication holes, one opening in each opening forming the communication hole is different from other openings forming the communication hole in at least one of the entire length and shape of the outer peripheral line. The structural member is provided with the one or more openings so that a step is formed on a part of the inner wall of the communication hole, and the resin-based sealing material filled in the communication hole is present. A method for manufacturing a non-contact type IC card, which comprises forming a resin sealing layer having an outer peripheral surface which is in close contact with each other along a wall surface of each of the communication holes with a material.